JPH07162112A - Laminated board for printed circuit - Google Patents
Laminated board for printed circuitInfo
- Publication number
- JPH07162112A JPH07162112A JP30207993A JP30207993A JPH07162112A JP H07162112 A JPH07162112 A JP H07162112A JP 30207993 A JP30207993 A JP 30207993A JP 30207993 A JP30207993 A JP 30207993A JP H07162112 A JPH07162112 A JP H07162112A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- inorganic filler
- intermediate layer
- printed circuit
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ドリル加工性、打抜加
工性に優れた印刷回路用積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit laminate having excellent drilling workability and punching workability.
【０００２】[0002]
【従来の技術】印刷回路用の銅張積層板は、その印刷回
路板への加工工程中におけるコストの削減の目的のた
め、従来の銅メッキによるスルーホールの形成に代わっ
て、銀ペーストによるスルーホールの形成が導入され、
フェノール樹脂積層板においては十数年前より実施され
ているが、回路の精密化のため、そして積層板の臭気の
問題からエポキシ樹脂コンポジット基材銅張積層板（以
下、ＣＥＭ−３という）においても使用され始めてい
る。しかしながら、フェノール樹脂銅張積層板（以下、
ＰＬＣという）ではドリル穴開けにおけるドリルライフ
が１００００ショット程度であるのに対して、従来のＣ
ＥＭ−３では、２０００ショット程度しかなく、また、
打抜加工性が劣り端面の欠けや穴周りの白化現象などが
発生するという不具合があった。2. Description of the Related Art Copper clad laminates for printed circuits have been replaced with conventional silver plated through-holes instead of conventional copper-plated through-holes for the purpose of cost reduction during the process of manufacturing the printed circuit boards. Hole formation was introduced,
It has been practiced in phenol resin laminates for more than a dozen years, but because of circuit refinement and the problem of odor of laminates, epoxy resin composite substrate copper clad laminates (hereinafter referred to as CEM-3) are used. Is also starting to be used. However, phenol resin copper clad laminate (hereinafter,
In PLC), the drill life in drilling is about 10,000 shots, whereas the conventional C
With EM-3, there are only about 2000 shots,
There was a problem that the punching processability was poor and chipping of the end face and whitening around the hole occurred.
【０００３】一方、ＣＥＭ−３はＰＬＣで発生する臭気
がないこと、大型部品を搭載可能なこと、電気絶縁信頼
性がＰＬＣに比べて大幅に優れていること、更に印刷回
路板の小型化に対応できることから注目をあびている
が、上記のような問題のため大幅に実用化されるに至っ
ていない。On the other hand, CEM-3 has no odor generated by PLC, can mount large parts, and has significantly higher electrical insulation reliability than PLC, and further can be used for downsizing printed circuit boards. Although it is attracting attention because it can handle it, it has not been put to practical use because of the above problems.
【０００４】ところで、一般にＣＥＭ−３は、中間層に
はガラス不織布が基材として用いられ、含有する無機フ
ィラーは水酸化アルミニウム（モース硬度３）であり、
ドリル穴開け時のドリル磨耗が大きいためドリルライフ
が短い欠点がある。また、従来のＣＥＭ−３は銅スルホ
ール用に厚み方向の線膨張率を抑えるために、フィラー
の含有率を大きくしていることより、積層板が剛直とな
り打抜性が悪くなる傾向にあった。Generally, in CEM-3, a glass non-woven fabric is used as a base material for the intermediate layer, and the inorganic filler contained is aluminum hydroxide (Mohs hardness 3).
There is a drawback that the drill life is short due to the large wear of the drill when drilling. Further, in the conventional CEM-3, since the content of the filler is increased in order to suppress the linear expansion coefficient in the thickness direction for copper through holes, the laminated plate tends to be rigid and the punchability tends to deteriorate. .
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記のよう
な問題点を解決するために種々検討の結果なされたもの
で、ドリル加工性及び打抜加工性が良好であり、加工コ
ストが低減できる印刷回路用積層板を提供することにあ
る。The present invention has been made as a result of various studies in order to solve the above problems, and has good drilling workability and punching workability and a reduction in working cost. Another object of the present invention is to provide a laminated board for a printed circuit.
【０００６】[0006]
【課題を解決するための手段】本発明は、エポキシ樹脂
ワニスを含浸したガラス織布を表面層とし、エポキシ樹
脂と無機フィラーを含有したワニスを含浸したガラス不
織布を中間層とし、これらを加熱加圧成形してなる印刷
回路用積層板であって、中間層におけるエポキシ樹脂の
固形分と無機フィラーとの体積比率が、エポキシ樹脂／
無機フィラー＝０．７〜１．２５であり、かつ、無機フ
ィラーがモース硬度２〜３のものとモース硬度１〜１．
５のものとの混合物であり、その重量比率が(前者)／
(後者)＝１．５〜３．８であることを特徴とする印刷回
路用積層板に関するものである。According to the present invention, a glass woven fabric impregnated with an epoxy resin varnish is used as a surface layer, and a glass nonwoven fabric impregnated with a varnish containing an epoxy resin and an inorganic filler is used as an intermediate layer. A printed circuit laminate obtained by pressure molding, wherein the volume ratio of the solid content of the epoxy resin and the inorganic filler in the intermediate layer is epoxy resin /
Inorganic filler = 0.7 to 1.25, and the inorganic filler has a Mohs hardness of 2 to 3 and a Mohs hardness of 1 to 1.
It is a mixture with 5 and its weight ratio is (the former) /
(Latter) = 1.5 to 3.8 The present invention relates to a printed circuit laminate.
【０００７】本発明において、表面ガラス織布層におい
て、用いるエポキシ樹脂は臭素化エポキシ樹脂、非臭素
化エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂いず
れであってもよく、それらの混合であってもよいが、好
ましくは、ビスフェノールＡ型エポキシ樹脂及びノボラ
ック型エポキシ樹脂を主成分とするエポキシ樹脂であ
る。In the present invention, the epoxy resin used in the surface glass woven fabric layer may be any of brominated epoxy resin, non-brominated epoxy resin and bisphenol A type epoxy resin, or a mixture thereof. , And preferably an epoxy resin containing bisphenol A type epoxy resin and novolac type epoxy resin as main components.
【０００８】中間層は表面層と同様のエポキシ樹脂に無
機質フィラーが含有されているエポキシ樹脂ワニスを含
浸したガラス不織布からなり、その無機質フィラーを含
有したエポキシ樹脂は、エポキシ樹脂／無機フィラーの
体積比率が０．７〜１．２５、好ましくは、０．９５〜
１．２である。無機フィラーの体積は重量をタップ密度
により換算した値である。また、モース硬度が２〜３の
比較的硬いフィラーとモース硬度が１〜１．５である軟
質のフィラーを併用し、その重量比は１．５〜３．８で
あり、より好ましくは１．８〜３．０である。The intermediate layer is made of a glass nonwoven fabric impregnated with an epoxy resin varnish containing the same epoxy resin as the surface layer and an inorganic filler, and the epoxy resin containing the inorganic filler has a volume ratio of epoxy resin / inorganic filler. Is 0.7 to 1.25, preferably 0.95
1.2. The volume of the inorganic filler is a value obtained by converting the weight into a tap density. Further, a relatively hard filler having a Mohs hardness of 2 to 3 and a soft filler having a Mohs hardness of 1 to 1.5 are used together, and the weight ratio thereof is 1.5 to 3.8, and more preferably 1. It is 8 to 3.0.
【０００９】エポキシ樹脂／無機フィラーの体積比率が
０．７以下では打抜加工性が低下すし、１．２５以上で
は積層板におけるエポキシ樹脂の比率が増大し材料のコ
ストが大きくなり、トータルの印刷回路板の加工コスト
が増大することとなる。次に、モース硬度が２〜３の無
機フィラーとモース硬度が１〜１．５の無機フィラーと
の重量比を１．５以下とすると打抜加工時端面の白化の
幅が大きくなり、４．０以上とするとドリル磨耗に対す
る効果が小さくなる。When the volume ratio of epoxy resin / inorganic filler is 0.7 or less, the punching workability is deteriorated, and when it is 1.25 or more, the ratio of epoxy resin in the laminated plate is increased and the material cost is increased, resulting in total printing. The processing cost of the circuit board will increase. Next, if the weight ratio of the inorganic filler having a Mohs hardness of 2 to 3 and the inorganic filler having a Mohs hardness of 1 to 1.5 is set to 1.5 or less, the width of whitening of the end surface during punching becomes large, and If it is 0 or more, the effect on drill wear is reduced.
【００１０】モース硬度１〜１．５の無機フィラーとし
ては、カオリンクレー、タルク、パイロフイライト、バ
ーベギュライト、グラファイトなどがあり、モース硬度
２〜３の無機フィラーとしては、石膏、水酸化アルミニ
ウム、マイカ、クロライト、ブルーサイトなどがある。Examples of the inorganic filler having a Mohs hardness of 1 to 1.5 include kaolin clay, talc, pyrophyllite, barbegulite, graphite and the like, and examples of the inorganic filler having a Mohs hardness of 2 to 3 include gypsum and aluminum hydroxide. , Mica, chlorite, brucite, etc.
【００１１】[0011]
【作用】本発明の印刷回路用積層板は、無機フィラーの
適切な体積含有割合と軟質のフィラーを適当量併用する
ことによって、印刷回路板への加工工程中のコストを低
減することが可能となる。より具体的には、ドリル磨耗
率を大幅に減少させることによって、ドリルライフを２
０００ショット程度から４０００ショット程度に長くす
ることが可能となった。また、打抜加工性においても従
来のＣＥＭ−３より向上する。The printed circuit laminate of the present invention can reduce the cost during the process of processing the printed circuit board by using an appropriate volume ratio of the inorganic filler and an appropriate amount of the soft filler. Become. More specifically, by significantly reducing the drill wear rate, the drill life is increased by 2
It has become possible to increase the length from about 000 shots to about 4000 shots. Further, the punching workability is also improved as compared with the conventional CEM-3.
【００１２】[0012]
【実施例】以下に本発明の実施例および比較例（従来
例）を示す。「部」は「重量部」を表す。EXAMPLES Examples of the present invention and comparative examples (conventional examples) are shown below. "Part" means "part by weight".
【００１３】《実施例１》表面層及び中間層のエポキシ
樹脂ワニスの組成は次の通りである。 （１）臭素化エポキシ樹脂（油化シェル製 Ep-1046） ８０部 （２）ノボラック型エポキシ樹脂（油化シェル製 Ep-152) ２０部 エポキシ樹脂の比重による体積換算：７４ （３）ジシアンジアミド ４部 （４）２エチル４メチルイミダゾール ０.１５部 （５）メチルセロソルブ ３６部 （６）アセトン ６０部 前記材料を混合して均一なエポキシ樹脂ワニスを調製し
た。Example 1 The composition of the epoxy resin varnish for the surface layer and the intermediate layer is as follows. (1) Brominated epoxy resin (Ep-1046 made by Yuka Shell) 80 parts (2) Novolac type epoxy resin (Ep-152 made by Yuka Shell) 20 parts Volume conversion by specific gravity of epoxy resin: 74 (3) Dicyandiamide 4 Parts (4) 2 ethyl 4-methyl imidazole 0.15 parts (5) methyl cellosolve 36 parts (6) acetone 60 parts The above materials were mixed to prepare a uniform epoxy resin varnish.
【００１４】このエポキシ樹脂ワニスをガラス織布（日
東紡 WE-18KRB-84）に樹脂含有量が３５〜５０％になる
ように含浸乾燥してガラス織布プリプレグ（Ａ）を得
た。続いて、上記のエポキシ樹脂ワニスに樹脂分１００
部対し次の配合の無機フィラーを添加し、撹拌混合して
無機フィラー含有ワニスを調製した。 （１）ギブサイト型水酸化アルミニウム（モース硬度３） ５０部 （昭和電工製 ハイジライト H-141） （２）カオリンクレー（モース硬度１） ２０部 タップ密度による体積換算：６６.７ 無機フィラー重量比率 （１）／（２）＝２．５ エポキシ樹脂／無機フィラー体積比率 ７４／６６.７＝１.１１A glass woven fabric prepreg (A) was obtained by impregnating and drying this epoxy resin varnish in a glass woven fabric (Nitto Bosh WE-18KRB-84) so that the resin content was 35 to 50%. Then, add 100 parts of resin to the above epoxy resin varnish.
An inorganic filler having the following composition was added to a part and mixed with stirring to prepare a varnish containing an inorganic filler. (1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 50 parts (Showa Denko's Heidilite H-141) (2) Kaolin clay (Mohs hardness 1) 20 parts Volume conversion by tap density: 66.7 Inorganic filler weight ratio (1) / (2) = 2.5 Epoxy resin / inorganic filler volume ratio 74 / 66.7 = 1.11.
【００１５】この無機フィラー含有ワニスをガラス不織
布（日本バイリーン製 EP-4075）にエポキシ樹脂及び無
機フィラーの含有量が９０％になるように含浸乾燥し
て、ガラス不織布プリプレグ（Ｂ）を得た。次に、前記
ガラス不織布プリプレグ（Ｂ）を３枚重ねて中間層と
し、上下表面層に前記ガラス織布プリプレグ（Ａ）を各
１枚配置し、更にその両面に厚さ１８μｍの銅箔を配置
し、成形温度１６５℃、圧力６０kg／cm2 で９０分間積
層成形して厚さ１．６mmの銅張積層板を得た。A glass nonwoven fabric prepreg (B) was obtained by impregnating a glass nonwoven fabric (EP-4075 manufactured by Japan Vilene) with this varnish containing an inorganic filler so that the epoxy resin content and the inorganic filler content would be 90%. Next, three glass non-woven fabric prepregs (B) are stacked to form an intermediate layer, one glass woven fabric prepreg (A) is placed on each of the upper and lower surface layers, and a copper foil having a thickness of 18 μm is placed on both sides thereof. Then, lamination molding was performed at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to obtain a copper clad laminate having a thickness of 1.6 mm.
【００１６】《実施例２》表面層プリプレグは実施例１
と同様に作製した。中間層用無機フィラー含有エポキシ
樹脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部
に対し次の配合の無機フィラーを添加し、撹拌混合して
調製した。 （１）ギブサイト型水酸化アルミニウム（モース硬度３） ３０部 （昭和電工製 ハイジライト H-141） （２）含水ケイ酸マグネシウム（モース硬度１） １５部 タップ密度による体積換算：７５.５ 無機フィラー重量比率 （１）／（２）＝２．０ エポキシ樹脂／無機フィラー体積比率 ７４／７５.５＝０.９８<< Example 2 >> The surface layer prepreg was prepared as in Example 1.
Was prepared in the same manner as in. The inorganic filler-containing epoxy resin varnish for the intermediate layer was prepared by adding the following inorganic filler to 100 parts of the resin content of the epoxy resin varnish and stirring and mixing. (1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 30 parts (Showa Denko's Heidilite H-141) (2) Hydrous magnesium silicate (Mohs hardness 1) 15 parts Volume conversion by tap density: 75.5 Inorganic filler Weight ratio (1) / (2) = 2.0 Epoxy resin / inorganic filler volume ratio 74 / 75.5 = 0.98
【００１７】この無機フィラー含有エポキシ樹脂ワニス
をガラス不織布（日本バイリーン製EP-4075）にエポキ
シ樹脂及び無機フィラーの含有量が ７５〜８５％にな
るように含浸乾燥して、ガラス不織布プリプレグ
（Ｂ'）を得た。次に、前記ガラス不織布プリプレグ
（Ｂ')を３枚重ねて中間層とし、上下表面層に前記ガラ
ス織布プリプレグ（Ａ）を各１枚配置し、更にその両面
に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧
力６０kg／cm2 で９０分間積層成形して厚さ１．６mmの
銅張積層板を得た。This inorganic filler-containing epoxy resin varnish is impregnated into a glass non-woven fabric (EP-4075 manufactured by Japan Vilene) so that the content of the epoxy resin and the inorganic filler is 75 to 85% and dried to obtain a glass non-woven prepreg (B '). ) Got. Next, three glass non-woven fabric prepregs (B ') are laminated to form an intermediate layer, and one glass woven fabric prepreg (A) is placed on each of the upper and lower surface layers, and a copper foil having a thickness of 18 μm is placed on both surfaces thereof. It was placed and subjected to lamination molding at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
【００１８】《比較例１》表面層プリプレグは実施例１
と同様に作製した。中間層用無機フィラー含有エポキシ
樹脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部
に対し次の配合の無機フィラーを添加し、撹拌混合して
調製した。 （１）ギブサイト型水酸化アルミニウム（モース硬度３） ８０部 （昭和電工製 ハイジライト H-141） （２）含水ケイ酸マグネシウム（モース硬度１） ２０部 タップ密度による体積換算：１３５.６ 無機フィラー重量比率 （１）／（２）＝４．０ エポキシ樹脂／無機フィラー体積比率 ７４／１３５.６＝０.５５<< Comparative Example 1 >> The surface layer prepreg was prepared as in Example 1.
Was prepared in the same manner as in. The inorganic filler-containing epoxy resin varnish for the intermediate layer was prepared by adding the following inorganic filler to 100 parts of the resin content of the epoxy resin varnish and stirring and mixing. (1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 80 parts (Showa Denko's Heidilite H-141) (2) Hydrous magnesium silicate (Mohs hardness 1) 20 parts Volume conversion by tap density: 135.6 Inorganic filler Weight ratio (1) / (2) = 4.0 Epoxy resin / inorganic filler volume ratio 74 / 135.6 = 0.55
【００１９】この無機フィラー含有エポキシ樹脂ワニス
をガラス不織布（日本バイリーン製EP-4075）にエポキ
シ樹脂及び無機フィラーの含有量が ７５〜８５％にな
るように含浸乾燥して、ガラス不織布プリプレグ（Ｂ")
を得た。次に、前記ガラス不織布プリプレグ（Ｂ")を３
枚重ねて中間層とし、上下表面層に前記ガラス織布プリ
プレグ（Ａ）を各１枚配置し、更にその両面に厚さ１８
μｍの銅箔を配置し、成形温度１６５℃、圧力６０kg／
cm2 で９０分間積層成形して厚さ１．６mmの銅張積層板
を得た。A glass nonwoven fabric (EP-4075 manufactured by Nippon Vilene) was impregnated with this inorganic filler-containing epoxy resin varnish so that the content of the epoxy resin and the inorganic filler was 75 to 85% and dried to obtain a glass nonwoven fabric prepreg (B "). )
Got Next, the glass non-woven fabric prepreg (B ")
One sheet is laminated on each of the above-mentioned glass woven prepregs (A) on the upper and lower surface layers to form an intermediate layer.
Place copper foil of μm, molding temperature 165 ℃, pressure 60kg /
Lamination molding was performed for 90 minutes at a cm 2 to obtain a copper-clad laminate having a thickness of 1.6 mm.
【００２０】得られたそれぞれの銅張積層板について、
ドリル摩耗性、曲げ強さ及び打抜加工性を測定した。そ
の結果を表１に示す。For each of the resulting copper clad laminates,
The drill wear resistance, bending strength and punching workability were measured. The results are shown in Table 1.
【表１】 [Table 1]
【００２１】[0021]
【発明の効果】前記結果からも明らかなように、本発明
の印刷回路用積層板は、印刷回路板への加工時におい
て、ドリル磨耗が改善され、且つ打抜加工性が改善され
る。As is clear from the above results, the printed circuit laminate of the present invention has improved drill wear and punching workability during processing into a printed circuit board.
Claims (1)
布を表面層とし、エポキシ樹脂と無機フィラーを含有し
たワニスを含浸したガラス不織布を中間層とし、これら
を加熱加圧成形してなる印刷回路用積層板であって、中
間層におけるエポキシ樹脂の固形分と無機フィラーとの
体積比率が、エポキシ樹脂／無機フィラー＝０．７〜
１．２５であり、かつ、無機フィラーがモース硬度２〜
３のものとモース硬度１〜１．５のものとの混合物であ
り、その重量比率が(前者)／(後者)＝１．５〜３．８で
あることを特徴とする印刷回路用積層板。1. A printed circuit, comprising a glass woven fabric impregnated with an epoxy resin varnish as a surface layer, a glass non-woven fabric impregnated with a varnish containing an epoxy resin and an inorganic filler as an intermediate layer, and heat-pressing them. A laminated plate, wherein the volume ratio of the solid content of the epoxy resin and the inorganic filler in the intermediate layer is epoxy resin / inorganic filler = 0.7 to
1.25 and the inorganic filler has a Mohs hardness of 2 to
No. 3 and a Mohs hardness of 1 to 1.5, and the weight ratio thereof is (former) / (latter) = 1.5 to 3.8. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30207993A JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30207993A JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07162112A true JPH07162112A (en) | 1995-06-23 |
| JP3578476B2 JP3578476B2 (en) | 2004-10-20 |
Family
ID=17904673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30207993A Expired - Fee Related JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3578476B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003033997A (en) * | 2001-07-25 | 2003-02-04 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminated sheet |
| JP2012057051A (en) * | 2010-09-09 | 2012-03-22 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition for circuit board |
-
1993
- 1993-12-01 JP JP30207993A patent/JP3578476B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003033997A (en) * | 2001-07-25 | 2003-02-04 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminated sheet |
| JP2012057051A (en) * | 2010-09-09 | 2012-03-22 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition for circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3578476B2 (en) | 2004-10-20 |
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