JPH0714878A - Mounting method for electronic component - Google Patents

Abstract

PURPOSE:To enable a defective electronic component, which is found defective by an electric check made after the electronic component is mounted, to be easily replaced. CONSTITUTION:In a process wherein an electronic component 1 is mounted on a board 9 preceding an electric test process which is carried out before an electronic component outer lead bonding process, a first sub-process wherein the surface of the board 9 on which the electronic component 1 is mounted or the surface of the electronic component 1 confronting the board 9 is coated with adhesive agent 12 or an adhesive sheet, a second sub-process wherein the tip 8 of the electronic component lead and a board electrode 10 are aligned with each other and tentatively fixed, and a third sub-process wherein an electric power is applied to the board 9 as it is kept in this state to electrically check the electronic component 1 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting of electronic components such as semiconductor elements and magnetic elements having surface mount type lead electrodes on a circuit board before the electrical inspection step of the electronic components before the outer lead bonding step. It is about the method.

[0002]

2. Description of the Related Art Electronic components with surface mount type leads such as tape carrier package type and flat package type are
It is widely used as a device that enables high-density mounting in various fields from consumer equipment to industrial equipment.

As an example, FIG. 7 shows a process of mounting a tape carrier package on a circuit board.

In the electronic component 1, the tip portion of the lead 7 extending into the opening 5 formed in the base portion made of the resin film 4 of the tape carrier 3 and the protruding electrode 2 of the electronic component 1 are joined together. It is supplied to the mounting process (see FIG. 7A).

First, by cutting the lead 6, the electronic component 1 is separated from the tape carrier 3 with the lead 7 attached to the electronic component 1 (see FIG. 7B). Next, the lead 7 is molded so that the other tip of the lead 7 is substantially flush with the bottom surface (mounting surface) of the electronic component 1 (see FIG. 7C). The tip portion 8 of the lead 7 thus formed serves as a connection portion with the circuit board electrode 10. Next, the tip 8 of the lead 7 is aligned with the electrode 10 of the circuit board 9, and in this state, the lead 7 and the electrode 10 are bonded to each other by thermocompression bonding (see FIG. 7D).

Further, in Japanese Patent Application No. 3-80549, an adhesive material is formed on the bottom surface of an electronic component in advance and inner lead bonding is performed, and then the entire surface of the back surface of the electronic component of the circuit board on which the electronic component is mounted is described. A method has been proposed in which an adhesive material is previously formed on the facing surface, the electronic component is adhered to the circuit board, and outer lead bonding is performed.

[0007]

However, when the electronic component 1 is mounted by the above-mentioned method, a defect of the electronic component 1 is found by the electrical inspection after mounting, and it becomes necessary to replace the mounted electronic component. In this case, it is very difficult to replace the lead 7 and the electrode 10 because the metal 7 is firmly bonded to each other, and the expensive circuit board and other electronic components mounted thereon are also discarded. There are things that must be done.

The present invention has been devised in view of the above circumstances, and provides a method for mounting a leaded device capable of easily replacing a defective electronic component found by an electrical inspection before the outer lead bonding step. Is intended.

[0009]

[Means for Solving the Problems] In a step of mounting an electronic component, a step of previously applying an adhesive material to a circuit board mounting surface of the electronic component or a mounting surface of the electronic component of the circuit board is performed. A step of temporarily fixing the surface mount type lead of the electronic component on the circuit board by the adhesive material, and then an electrical inspection of the electronic component that energizes the circuit board in the temporarily fixed state. And
Then, an outer lead bonding process is performed.

[0010]

With the adhesive material adhered to the electronic component mounting surface of the substrate or the surface of the electronic component facing the substrate, the electronic component can be temporarily fixed on the substrate, and even if a defective electronic component is found, the lead portion is Since it is not bonded to the circuit board, it can be easily removed and remounted.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the first and second embodiments shown in the drawings. This does not limit the invention.

FIG. 1 shows a step of separating a leaded electronic component from a tape carrier to form a lead portion in a first embodiment of the present invention.

The electronic component 1 is made of silicon, gallium arsenide,
A ferrite or the like is used as a main substrate, and a circuit element (not shown) and a protruding electrode 2 made of gold for connecting it to an external electrode are formed on the main surface.

The tape carrier 3 is based on a resin film 4 such as polyimide having a thickness of 25 μm to 150 μm, and an opening 5 is formed in a region where the electronic component 1 is to be mounted. There is. And on the resin film 4, 10 micrometer to 3
On the surface of copper having a thickness of about 5 μm, wiring 6 plated with gold, tin, solder or the like is formed, and the wiring 6 extends to the opening 5 of the resin film 4. The lead 7 is formed. Then, the protruding electrodes 2 of the electronic component 1 and the tips of the leads 7 of the tape carrier 3 are connected by metal-to-metal bonding (see FIG. 1A).

First, by cutting the lead 7, the electronic component 1 is separated from the tape carrier 3 with the lead 7 attached to the electronic component 1 (see FIG. 1B).

Next, the lead 7 is attached so that the tip 8 of the lead 7 contacts the substrate electrode 10 below the bottom surface (mounting surface) of the electronic component 1 by several tens of micrometers (that is, d = several tens of micrometers). Mold (see FIG. 1C). The tip portion 8 of the lead 7 formed in this manner serves as a connection portion with the circuit board 10.

FIG. 2 shows schematic cross-sectional views (A) and (B) of a circuit board on which electronic components are mounted. On the circuit board 9,
An electrode 10 to which the lead 7 is connected and an inspection electrode 11 for performing an electrical inspection after mounting the electronic component 1 are formed, and the surface thereof is plated with gold, tin, solder or the like as necessary. (See FIG. 2A).

Next, the adhesive 12 is applied to the electronic component 1 mounting surface on the circuit board 9 (see FIG. 2B). The adhesive 12 is not particularly limited as long as it is a non-corrosive resin having a relatively high viscosity at room temperature, but a thermosetting system containing epoxy, acrylic, urethane, silicone, etc. as a main component. If a solvent-soluble resin or the like containing resin, polyimide, rubber or the like as a main component is used, it may be solidified after the bonding step of the electronic component lead 7 and the circuit board electrode 10 described later, if necessary. It is possible.

Next, the leads 7 are placed on the electrodes 10 of the circuit board 9.
The tip end portion 8 of the above is aligned, and the pressing jig 13 presses the electronic component 1 onto the circuit board 9 via the adhesive 12. Through this step, the lead tip portion 8 of the electronic component 1 is also pressed by the circuit board electrode 10 and held in contact with the circuit board electrode 10 (see FIG. 3A).

Next, the pressure applied to the pressing jig 13 is removed.
Since the electronic component 1 is fixed on the circuit board 9 by the adhesive 12 even after the pressure is removed, the lead tip 8 of the electronic component 1 is also pressed by the circuit board electrode 10 and is in contact with the circuit board electrode 10. It is held at (see FIG. 3B).

Next, in this state, electricity is applied to the inspection electrode 11 of the circuit board 9 to perform an electrical inspection of the electronic component 1.

If a good result is obtained in this electrical inspection, the lead tip portion 8 and the electrode 10 are connected to the heating tool 1 or the like.
Metal-to-metal bonding is performed by thermocompression bonding according to No. 4 (see FIG. 3C).

On the other hand, when a defect is confirmed by the electrical inspection, it is necessary to remove the mounted electronic component 1 and mount another electronic component 1 again.

Next, a method of replacing the electronic component 1 mounted as described above will be described with reference to FIG. First, the upper surface of the electronic component 1 mounted on the circuit board 9 is attached to the suction jig 15
And the jig 15 is pulled up to remove the electronic component 1 from the circuit board 9 (see FIG. 4A).
Since the electronic component 1 is only fixed to the circuit board 9 with the adhesive 12, it can be easily removed by this method.

Next, the adhesive 12 is newly replenished on the electronic component 1 mounting area on the circuit board 9, and the electronic component 1
New electronic parts are mounted according to the mounting method of (Fig. 4
(See (B)).

[0026]

[Embodiment 2] FIG. 5 is a schematic sectional view showing each step of a method of mounting an electronic component with leads according to a second embodiment of the present invention. In this embodiment, a case will be described in which a resin-sealed package device with leads 16 is mounted as an electronic component.

The lead 7 extends horizontally from the side surface of the package device 16, and the tip portion 8 thereof contacts the substrate electrode 10 several tens of micrometers below the bottom surface (mounting surface) of the package device 16 (that is, d = several). 10 micron meter). The lead 7 is made of copper, iron, having a thickness of about 35 μm to 150 μm.
Based on nickel or an alloy containing any of them as a main component, its surface is plated with gold, tin, solder or the like (see FIG. 5A).

On the other hand, on the circuit board 9, an electrode 10 to which the lead 7 is connected and an inspection electrode 11 for carrying out an electrical inspection after mounting the package device 16 are formed, and the surface thereof is, if necessary. Are plated with gold, tin, solder or the like (see FIG. 5B).

First, the adhesive sheet 17 is attached to the surface of the package device 16 facing the circuit board 9 (FIG. 5C).
reference). This adhesive sheet 17 is used for the package device 1
6 is used for fixing on the circuit board 9, and its components are not particularly limited as long as it has the minimum necessary adhesive force for this purpose.

Next, the leads 7 are placed on the electrodes 10 of the circuit board 9.
The tip end portion 8 of the device is aligned, and the pressing jig 13 presses the package device 16 onto the circuit board 9 via the adhesive sheet 17. Through this step, the lead tip portion 8 of the package device 16 is also pressed against the circuit board electrode 10 and held in contact with the circuit board electrode 10 (see FIG. 5D). Next, the pressure applied to the pressing jig 13 is removed. Since the package device 16 is fixed on the circuit board 9 by the adhesive sheet 17 even after the pressure is removed, the lead tip portion 8 of the package device 16 is also pressed by the circuit board electrode 10 and is in contact with the circuit board electrode 10. Are held at (see FIG. 6A).

Next, in this state, the package electrodes 16 are electrically inspected by energizing the inspection electrodes 11 of the circuit board 9.

If a good result is obtained in this electrical inspection, the lead tip portion 8 and the electrode 10 are connected to the heating tool 1 or the like.
Metal-to-metal bonding is performed by thermocompression bonding according to No. 4, and mounting is completed (see FIG. 6B).

When a defect is confirmed by the electrical inspection, the package device 16 mounted in the same manner as in the first embodiment is removed, and another package device 16 is newly mounted again. Implement according to the method.

[0034]

According to the present invention, an adhesive is applied to the electronic component mounting surface of the substrate or the surface of the electronic component facing the substrate, whereby the electronic component is temporarily fixed on the substrate and leads and electrodes are formed. Even if it becomes necessary to replace the mounted electronic component, the electrical inspection of the electronic component is performed by electrically contacting the The defective electronic component can be easily removed and a new electronic component can be remounted.

[Brief description of drawings]

FIG. 1 is a process drawing (A), (B), (C) of separating a leaded electronic component from a tape carrier to form a lead portion in an embodiment of the present invention.

FIG. 2 is a sectional view (A) of a circuit board according to an embodiment of the present invention, and a view (B) showing a state in which an adhesive material is applied on the circuit board.

FIG. 3 is a process diagram (A), (B), (C) of mounting an electronic component according to an embodiment of the present invention.

FIG. 4 is process diagrams (A) and (B) showing a method of replacing an electronic component according to an embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view (A) showing each step of the method for mounting the electronic component with leads according to the second embodiment of the present invention,
(B), (C), and (D).

FIG. 6 is a schematic cross-sectional view (A) showing each step of the method for mounting the electronic component with leads according to the second embodiment of the present invention,
(B).

FIG. 7 is schematic cross-sectional views (A), (B), (C), (D) showing respective steps of a conventional method for mounting an electronic component with leads.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Projection electrode 3 Tape carrier 4 Resin film 5 Opening 6 Wiring 7 Lead 8 Lead tip 9 Circuit board 10 Electrode 11 Inspection electrode 12 Adhesive 13 Holding jig 14 Heating tool 15 Adsorption jig 16 Package device 17 Adhesive sheet

Claims (1)

[Claims] 1. A step of mounting an electronic component on a circuit board mounting surface of an electronic component or a mounting surface of an electronic component of a circuit board with an adhesive material in advance, and then the surface of the electronic component. A step of temporarily fixing the mounting type lead on the circuit board with the adhesive material is performed, and then an electrical inspection of an electronic component that energizes the circuit board in the temporarily fixed state is performed. An electronic component mounting method, which comprises performing an outer lead bonding step.