JPH0714673U - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] In a hybrid integrated circuit board using a printing method, a hybrid integrated circuit board intended to improve defects due to misalignment of surface mount components. [Structure] In the case where there are two soldering electrode parts on the substrate, a dummy printing tolerance part is provided at a position symmetrical to the printing tolerance part with the longitudinal center of the surface mount component as a line symmetry axis. In the case of one soldering electrode portion, a dummy printing tolerance portion was provided at a position symmetrical to the printing tolerance portion with the center of the surface mount component as a point symmetry point. In both cases, the printing tolerance portion and the dummy printing tolerance portion have the same area.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a soldering pattern for surface mounting components of a hybrid integrated circuit board.

[Prior art]

 The soldering pattern of the conventional hybrid integrated circuit board is as shown in FIGS. 3 and 4, in which the circuit wiring conductor 2 and the soldering electrode portion 5 are simultaneously formed by the printing method, and in the next step, solder flow prevention and circuit An overglass 3 is printed to protect the wiring conductor 2. As described above, since the circuit wiring conductor 2 and the overglass 3 are formed by using the printing method, some printing misalignment may occur and the overglass 3 may be applied to the soldering electrode portion 5. Therefore, the printing of the overglass 3 is formed at a distance of 50 μm or more from the soldering electrode portion 5 in consideration of the normal printing tolerance. (2)

After that, cream solder is printed on the soldering electrode portion 5, and the square surface mounting component 6 and the round surface mounting component 7 are mounted on the solder and soldering is performed. (In the future, square surface-mounted components will be abbreviated as square components and round surface-mounted components will be abbreviated as round components, but it should be understood that this method can be applied to square surface-mounted components as long as they are vertically and horizontally symmetrical. Normally, it will settle in place due to the self-alignment effect of the solder 9, but in reality the solder 9 also flows into the print tolerance section 8 and the surface-mounted components are also pulled to the print tolerance section 8 by the solder 9 as described above. There were cases where defective products were generated due to misalignment.

[0003]

[Means for Solving the Problems]

 In the case of a rectangular component, the present invention is provided with a print tolerance portion 8 and a dummy print tolerance portion 4 having a shape and an area approximate to the line symmetrical position with the longitudinal direction of the soldering electrode portion 5 as the line symmetry axis. Further, in the case of a round-shaped component, a dummy printing tolerance portion 4 having a shape and an area which is approximate to the printing tolerance portion 8 in point symmetry is provided with the center of the soldering electrode portion 5 as a point symmetry point.

[0004]

[Action]

 Conventionally, the surface-mounted components may be attracted and misaligned when the solder 9 flows into the print tolerance section 8, but by providing the dummy print tolerance section 4 at a position line symmetrical or point symmetrical with the print tolerance 8. Since the solder also flows into the dummy printing tolerance section, both the printing tolerance 8 and the dummy printing tolerance section 4 are well balanced, and defects due to component misalignment do not occur.

[0005]

【Example】

 1 and 2 show an embodiment of the present invention. In the method of manufacturing the hybrid integrated circuit board according to the present invention, the circuit wiring conductor 2 and the soldering electrode portion 5 are first formed by a printing method. At this time, the dummy printing tolerance section 4 is also printed at the same time. In the next step, an overglass 3 is formed by printing in order to prevent the flow of solder and protect the conductor 2 for circuit wiring. At this time, it is formed at a distance of 50 microns or more from the soldered electrode portion 5 in consideration of printing tolerance. At this time, the shape and the area of the print tolerance portion 8 not covered with the overprint glass 3 need to be substantially equal to the dummy print tolerance portion 4.

After that, cream solder is printed on the soldering electrode portion 5, and the square-shaped component 6 and the round-shaped component 7 are mounted thereon to perform soldering. Since the shape and area of the printing tolerance portion 8 not provided with the overglass 3 are almost the same as those of the dummy printing tolerance portion 4, the self-alignment effect of the solder 9 works in a well-balanced manner, and the surface-mounted components are fixed in place.

The soldering patterns for mounting the square-shaped components and the round-shaped components are the same in the manufacturing process, although the number and location of the dummy printing tolerance portions are different.

[0008]

[Effect of device]

 It is possible to prevent the displacement of surface-mounted components, which contributes to the improvement of yield, and has great industrial utility value.

[Brief description of drawings]

[Fig. 1] Square type component Example of the present invention

[Fig. 2] Circular parts Example of the present invention

FIG. 3 Conventional example of square-shaped component

[Figure 4] Conventional example of round type parts

[Explanation of symbols]

 1 Insulating Substrate 2 Circuit Wiring Conductor 3 Over Glass 4 Dummy Printing Tolerance Section 5 Soldering Electrode Section 6 Square Surface Mount Electronic Component 7 Round Surface Mount Electronic Component 8 Printing Tolerance Section (4) 9 Solder

Claims (2)

[Scope of utility model registration request] 1. A soldering pattern in which two or more soldering electrode portions are provided on an insulating substrate and circuit wiring conductors connected to the soldering electrode portions are overglassed while leaving at least 50 μm or more. Of the circuit wiring conductor with the longitudinal direction of the soldering electrode portion as a line symmetry axis.
A hybrid integrated circuit board in which conductor parts of the same shape are provided at positions symmetrical with respect to a print tolerance part which is not overglassed. 2. A soldering pattern in which one portion of a soldering electrode portion is provided on an insulating substrate, and a circuit wiring conductor connected to the soldering electrode portion is overglassed while leaving at least 50 μm or more. A hybrid integrated circuit board in which a conductor portion having the same shape is provided at a point symmetrical position with respect to a printing tolerance portion of the conductor for circuit wiring which is not overglassed with the center point of the soldering electrode portion as a point symmetrical point.