JPH0714629A - Chip jumper and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a low-cost chip jumper and a manufacturing method thereof in simple constitution in the chip jumper used for jumper connection on a printed board. CONSTITUTION:A heat resistant resin adhesive tape having an insulating characteristic is wound at constant intervals round a copper or aluminium wire, and a protective film 12 is formed, and after this is formed as a conductor element 11 of a rectangular cross section by rolling work by passing it between a pair of rotating rollers, it is cut in a prescribed length so that the protective film 12 becomes the central part in the lengthwise direction. Thereby, a conductor element 11 whose electrode part 11a is exposed to both ends is obtained. By constituting in this way, an extremely low-cost chip jumper can be obtained in simple constitution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip jumper which has a resistance value of 0Ω among chip resistors and is used for connecting a jumper on a printed circuit board, and a manufacturing method thereof.

[0002]

2. Description of the Related Art A conventional chip jumper of this type will be described with reference to the drawings.

FIG. 17 is a sectional view showing the structure of a conventional chip jumper, in which a silver-based electrode 93 is formed on an alumina substrate 91.
Is applied, and glass 92 is printed and baked on this to form an insulating coating, and further copper underplating 95 is formed on both electrode portions 94, and subsequently tin or solder plating 96 is applied to form the electrode solder plating portion 96a. It was configured to be electrically conductive through the silver-based electrode 93 by being soldered to the pattern of the printed board.

Further, in this conventional chip jumper, printing and firing are repeated a plurality of times on the front and back surfaces of the alumina substrate 91 according to the above-described configuration, and first slit processing is performed to the width of the chip jumper, and the electrodes on the end faces are further processed. In order to form the chip, printing and firing are performed, and then secondary slit processing is performed to form the chip jumper.

[0005]

However, the above-mentioned conventional chip jumper and the manufacturing method thereof have a complicated structure because they are manufactured by repeating printing and firing using the alumina substrate 91, and many steps are required. Therefore, there is a problem in that the cost is high because of the above.

SUMMARY OF THE INVENTION The present invention is intended to solve such a conventional problem, and an object of the present invention is to provide a chip jumper having a simple structure, a small number of steps, a low equipment cost and a low product cost, and a manufacturing method thereof. Is.

[0007]

In order to solve the above problems, a chip jumper and a method for manufacturing the same according to the present invention have a chip jumper main body made of a metal material such as iron, copper, brass or aluminum having a rectangular cross section. Composed of elements,
A heat-resistant resin adhesive tape having insulating properties, a heat-resistant heat-shrinkable tube, a heat-resistant resin, or the like is provided on the central portion of the length direction of the protective film.

[0008]

[Function] With this configuration, iron, copper, brass having a rectangular cross section,
Alternatively, it is possible to obtain a chip jumper having an extremely simple structure in which both end portions of a conductor element made of a metal material such as aluminum are left as electrode portions, and a protective film having an insulating property is formed in the central portion, and the manufacturing method is also easy. The number of manufacturing facilities can be simplified, and the cost can be significantly reduced.

[0009]

(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the structure of a chip jumper according to the first embodiment. In FIG. 1, reference numeral 11 is a conductor element of the chip jumper in which electrode portions 11a are exposed at both ends in the lengthwise direction, and a cross section thereof is shown. It is made of a metal material such as iron, copper, brass, or aluminum which is formed in a rectangular shape. Reference numeral 12 is a protective film, which is formed using a heat-resistant resin adhesive tape having insulating properties.

2A to 2G are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the above-mentioned embodiment,
First, as shown in FIG. 2A, the iron wound on the bobbin 13,
A wire rod 14 made of copper, brass, or aluminum is prepared. Figure 2
FIG. 2B is an enlarged view of this wire rod 14.
As shown in (c), the heat-resistant resin adhesive tape 12a is attached to the wire material 14 at regular intervals, and the protective film 12 is formed as shown in FIG. 2 (d).

Next, as shown in FIG. 2E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 12 formed thereon.
By passing between b, the conductor element 11 having a rectangular cross section as shown in FIG. 2 (f) is rolled, and the protective film 12 is provided at the center in the longitudinal direction as shown in FIG. 2 (g). The chip jumper is obtained by cutting it into a predetermined length.

The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 12 may be formed by rolling the conductor element 11 having a rectangular cross section with 5a and 15b.

As described above, the chip jumper according to the first embodiment of the present invention is composed only of the wire material 14 of iron, copper, brass, or aluminum and the heat-resistant resin adhesive tape 12a. The manufacturing method is also shown in FIG.
As shown in (a) to (g), the wire material 14 is wrapped with a heat-resistant resin adhesive tape 12a, rolled into a rectangular cross section, and cut at a predetermined pitch. , Simple configuration, less man-hours, equipment,
It is possible to realize a chip jumper with low product cost.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 is a perspective view showing the structure of a chip jumper according to the second embodiment of the present invention, in which reference numeral 21 is a conductor element of the chip jumper in which electrode portions 21a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 22 denotes a protective film, which is formed using a heat-resistant heat-shrinkable tube having insulating properties.

FIGS. 4A to 4G are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the embodiment. First, as shown in FIG. 4A, iron, copper,
A brass or aluminum wire 14 is prepared. Figure 4
FIG. 4B is an enlarged view of the wire rod 14.
As shown in (c), the outer periphery of the wire 14 is covered with heat-resistant heat-shrinkable tubes 22a at regular intervals, and as shown in FIG. 4 (d), the heat-resistant heat-shrinkable tubes 22a are heated by hot air 26 to shrink them. The protective film 22 is formed.

Next, as shown in FIG. 4E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 22 formed thereon.
By passing between b, the conductor element 21 having a rectangular cross section as shown in FIG. 4 (f) is rolled, and as shown in FIG. 4 (g), the protective film 22 is formed on the central portion in the longitudinal direction. The chip jumper is obtained by cutting it into a predetermined length.

The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 22 may be formed by rolling the conductor element 21 having a rectangular cross section with 5a and 15b.

Further, the effect of this embodiment is the same as the effect of the above-mentioned first embodiment, and detailed description thereof will be omitted.

(Third Embodiment) A third embodiment of the present invention will be described below with reference to the drawings.

FIG. 5 is a perspective view showing the structure of the chip jumper according to the third embodiment of the present invention. In FIG. 5, 31 is a conductor element of the chip jumper in which electrode portions 31a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 32 denotes a protective film, which is made of a heat-resistant resin or ceramic having insulating properties.

FIGS. 6 (a) to 6 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the embodiment. First, as shown in FIG. 6 (a), iron, copper, and bobbin 13 wound around the bobbin 13 are used.
A brass or aluminum wire 14 is prepared. Figure 6
FIG. 6B is an enlarged view of this wire rod 14. FIG.
As shown in (c), the outer periphery of the wire 14 is coated with a heat resistant resin 32a at regular intervals, and as shown in FIG. 6 (d), a protective film 32 made of this heat resistant resin 32a is formed.

Next, as shown in FIG. 6E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 32 formed thereon.
By passing between b, the conductor element 31 having a rectangular cross-section as shown in FIG. 6 (f) is rolled, and the protective film 32 is formed at the center in the longitudinal direction as shown in FIG. 6 (g). The chip jumper is obtained by cutting it into a predetermined length.

The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 32 may be formed by rolling the conductor element 31 having a rectangular cross section with 5a and 15b.

Further, the effect of this embodiment is the same as the effect of the above-mentioned first embodiment, and detailed description thereof will be omitted.

(Embodiment 4) A fourth embodiment of the present invention will be described below with reference to the drawings.

FIG. 7 is a perspective view showing the structure of a chip jumper according to the fourth embodiment of the present invention. In FIG. 7, reference numeral 41 is a conductor element of the chip jumper in which electrode portions 41a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 42 denotes a protective film, which is formed of a heat-resistant resin having an insulating property, forms groove portions 41b on the upper and lower surfaces of the conductor element 41 in the width direction, and the protective film 42 is formed on the groove portions 41b.
Is formed.

FIGS. 8 (a) to 8 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 8 (a), iron, copper,
A brass or aluminum wire rod 44 is prepared. Figure 8
FIG. 8B is an enlarged view of this wire rod 44.
As shown in (c), the outer peripheral surface has a convex cross section (see FIG. 8).
(G) shows the main part in an enlarged manner) Rotating 1
By passing it between the pair of rollers 45a and 45b, as shown in FIG.
As shown in (d), the conductor element 41 having a rectangular cross section is formed by rolling a continuous groove portion 41b on the upper and lower surfaces of the central portion in the length direction.

Next, as shown in FIG. 8 (e), the groove 4 is formed.
1b is coated with heat resistant resin 42a to form a protective film 42
After forming, the chip jumper is obtained by cutting into a predetermined length as shown in FIG.

In addition to the effect (omitted) of the first embodiment, the effect of this embodiment is stable because the protective film 42 is formed on the same surface as the conductor element 41, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.

(Fifth Embodiment) A fifth embodiment of the present invention will be described below with reference to the drawings.

FIG. 9 is a perspective view showing the structure of a chip jumper according to the fifth embodiment of the present invention. In FIG. 9, 51 is a conductor element of the chip jumper in which electrode portions 51a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 52 denotes a protective film, which is formed of a heat-resistant resin having an insulating property, has groove portions formed on the upper and lower surfaces and both side surfaces of the conductor element 51 in the width direction, and the protective film 52 is formed on the groove portions.

FIGS. 10 (a) to 10 (h) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 10 (a), iron wound on the bobbin 13,
A wire rod 54 of copper, brass, or aluminum is prepared. Figure 1
0 (b) is an enlarged view of this wire 54, and the outer peripheral surface has a convex cross-section as shown in FIG. 10 (c) (see FIG. 1).
By passing between a pair of rotating rollers 45a and 45b, the upper and lower surfaces of the central portion as shown in FIG. 10 (d) are shown in FIG. 10 (d). Is rolled into a conductor element 51 having a rectangular cross section in which a continuous groove portion 51b is formed.

Next, as shown in FIG. 10 (e), the punch 5 is used.
7, the groove 51b is perforated at regular intervals to form holes 51c, and then the groove 51b is coated with a heat resistant resin 52a to form a protective film 52 as shown in FIG. 10 (f). As shown in (g), the hole 51c
The chip jumper is obtained by cutting the center of the device to a predetermined length.

In addition to the effect (omitted) of the first embodiment, the effect of this embodiment is stable because the protective film 52 is formed on the same surface as the conductor element 51, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.

Further, the protective film 52 is formed on the upper and lower sides and on both side surfaces.
Since it is formed on the surface, the effect of improving the insulating property is also obtained.

(Embodiment 6) A sixth embodiment of the present invention will be described below with reference to the drawings.

FIG. 11 is a perspective view showing the structure of a chip jumper according to the sixth embodiment of the present invention. In FIG. 11, reference numeral 61 is a conductor element of the chip jumper in which electrode portions 61a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 62 denotes a protective film, which is formed of a heat-resistant resin having insulating properties, forms groove portions 61b on the upper and lower surfaces of the conductor element 61 in the width direction, and the protective film 6 is formed in the groove portions 61b.
2 is formed.

FIGS. 12 (a) to 12 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 12 (a), iron wound on the bobbin 13,
A wire rod 64 of copper, brass, or aluminum is prepared. Figure 1
2 (b) is an enlarged view of the wire 64. As shown in FIG. 12 (c), a plurality of protrusions are provided in a gear shape on the outer peripheral surface (the main part thereof is shown in FIG. 12 (g)). By enlarging between a pair of rotating rollers 65a and 65b, a plurality of groove portions 61b are formed at regular intervals in the length direction as shown in FIG. 12 (d). Conductor element 6
Roll to 1.

Next, as shown in FIG. 12 (e), the groove 61b is coated with a heat resistant resin 62a to form a protective film 6.
2 is formed, the groove 6 is formed as shown in FIG.
The chip jumper is obtained by cutting into a predetermined length such that 1b is the center in the length direction.

In addition to the effect (omitted) of the first embodiment, the effect of the present embodiment is stable because the protective film 62 is formed on the same surface as the conductor element 61, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.

(Embodiment 7) A seventh embodiment of the present invention will be described below with reference to the drawings.

FIG. 13 is a perspective view showing the structure of the chip jumper in the seventh embodiment. In FIG.
Is an electrode portion 71 whose both ends in the length direction are plated with solder.
It is a conductor element of a chip jumper with a exposed, and is made of iron, copper, brass, or aluminum processed into a rectangular cross-section. Reference numeral 72 denotes a protective film, which is formed using a heat resistant resin having insulating properties.

FIGS. 14 (a) to 14 (e) are manufacturing process diagrams showing the method of manufacturing the chip jumper according to the above-mentioned embodiment. First, as shown in FIG. 14 (a), the solder-plated iron wire wound around the bobbin 13 is used. Wire rod 7 made of solder-plated square copper wire, solder-plated square brass wire, or solder-plated aluminum wire 7
Prepare 4. Here, when the wire rod 74 is a round wire, it is made into a square wire by a roll or a die. FIG. 14B is an enlarged view of the wire rod 74. Figure 2 (c)
As shown in FIG. 3, the cutting groove 74a is formed on one side or both sides of the wire rod 74 substantially at the center in the longitudinal direction by using the cutters 75a and 75b. This is because the cross section is made rectangular and the solder plating on the groove surface is removed to be the material surface of the conductor element.

Next, as shown in FIG. 14 (d), the cutting groove 74a is coated with a heat resistant resin 72a to form a protective film 72, which is cut into a predetermined length as shown in FIG. 14 (e). And get a chip jumper.

As described above, the chip jumper according to the seventh embodiment of the present invention is made of solder-plated iron as a material,
Copper, brass, or aluminum wire 74 and heat-resistant resin 72
Since it is configured only by a, its manufacturing method is simple as shown in FIGS. 14 (a) to 14 (e), has a small number of steps, and can be constructed by a consistent facility from material input to product removal. It is possible to realize a chip jumper that is possible and has a low product cost.

(Embodiment 8) An eighth embodiment of the present invention will be described below with reference to the drawings.

FIG. 15 is a perspective view showing the structure of the chip jumper according to the eighth embodiment of the present invention.
Is an electrode portion 81 whose both ends in the length direction are plated with solder.
It is a conductor element of a chip jumper with a exposed, and is made of iron, copper, brass, or aluminum processed into a rectangular cross-section. Reference numeral 82 denotes a protective film, which is formed using a heat resistant resin having insulating properties.

FIGS. 16 (a) to 16 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the above-described embodiment. First, as shown in FIG. 16 (a), a bare copper plate wound around a bobbin 13 is first shown. A wire or a bare-angle brass wire 84 is prepared.
Here, when the wire rod 84 is a round wire, it is made into a square wire by a roll or a die. FIG. 16B is an enlarged view of the wire rod 84. As shown in FIG. 16C, a groove 84a having a concave cross-section is formed on one side or both sides of the wire 84 approximately at the center in the longitudinal direction by a roller or a die.

Next, solder plating is applied to the entire surface, as shown in FIG. 16 (d).
Of the solder plated wire 84b. It can be easily inferred that the same result can be obtained by subjecting the above-mentioned bare copper wire or the bare brass wire to the solder-plated copper wire or the solder-plated brass wire to have the groove having the concave cross-section. Further, as shown in FIG. 16 (e), a cutting process is performed to remove the solderable surface treatment layer only in the groove having a concave cross section
And This is because the surface treatment layer on the groove surface is removed and used as the material surface of the conductor element.

Next, as shown in FIG. 16 (f), the cutting groove 84c is coated with a heat resistant resin 82a to form a protective film 82, which is cut into a predetermined length as shown in FIG. 16 (g). And get a chip jumper.

As described above, the chip jumper according to the eighth embodiment of the present invention is made of only the iron, copper, brass, or aluminum square wire rod 84 and the heat-resistant resin 82a, and is manufactured. The method requires a small number of man-hours and can realize a chip jumper that is low in product cost and equipment cost.

In the first to eighth embodiments, the conductor element is made of a metal material such as iron, copper, brass, or aluminum, and the protective film is a heat-resistant resin adhesive tape having insulating properties.
Although the heat-resistant heat-shrinkable tube, the heat-resistant resin, and the ceramic are used, the present invention is not limited to this, and any conductive metallic material can be used as a conductor element, and has insulation and heat-resistant properties. It goes without saying that any of the above can be used as a material for the protective film.

Similarly, in the above embodiment, an example in which the groove portions are provided on both surfaces of the conductor element has been shown, but the present invention is not limited to this, and the purpose is to provide the groove portions on at least one surface of the conductor element. It goes without saying that it will be achieved.

[0056]

As described above, according to the chip jumper and the method for manufacturing the same of the present invention, both ends of a conductor element made of a metal material having a rectangular cross section, such as iron, copper, brass, or alumina, are left as electrode portions and the center portion is left. It is possible to obtain a chip jumper having an extremely simple structure in which a protective film made of any one of a heat-resistant resin adhesive tape having an insulating property, a heat-resistant heat-shrinkable tube, a heat-resistant resin, and a ceramic is formed on a part.

Further, the number of man-hours for the manufacturing method is small, the manufacturing equipment can be simplified, and the material cost and the man-hour can be greatly reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a chip jumper according to a first embodiment of the present invention.

FIG. 2 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 3 is a perspective view showing a chip jumper according to a second embodiment of the present invention.

FIG. 4 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 5 is a perspective view showing a chip jumper according to a third embodiment of the present invention.

FIG. 6 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 7 is a perspective view showing a chip jumper according to a fourth embodiment of the present invention.

FIG. 8 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 9 is a partially cutaway perspective view showing a chip jumper according to a fifth embodiment of the present invention.

FIG. 10 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 11 is a perspective view showing a chip jumper according to a sixth embodiment of the present invention.

FIG. 12 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 13 is a perspective view showing a chip jumper according to a seventh embodiment of the present invention.

FIG. 14 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 15 is a perspective view showing a chip jumper according to an eighth embodiment of the present invention.

FIG. 16 is a manufacturing process diagram of the chip jumper according to the embodiment.

FIG. 17 is a sectional view showing a conventional chip jumper.

[Explanation of symbols]

 11 Chip Jumper Conductor Element 11a Electrode Part 12 Protective Film 12a Heat Resistant Resin Adhesive Tape 13 Bobbin 14 Wires 15a, 15b Roller 21 Chip Jumper Conductor Element 21a Electrode Part 22 Protective Film 22a Heat Resistant Heat Shrink Tube 26 Hot Air 31 Chip Jumper Conductor element 31a Electrode section 32 Protective film 32a Heat resistant resin 41 Chip jumper conductor element 41a Electrode section 41b Groove section 42 Protective film 42a Heat resistant resin 44 Wire material 45a, 45b Roller 51 Chip jumper conductor element 51a Electrode section 51b Groove section 51c hole 52 Protective film 52a Heat resistant resin 54 Wire material 57 Punch 61 Chip jumper conductor element 61a Electrode part 61b Groove part 62 Protective film 62a Heat resistant resin 64 Wire material 65a, 65b Roller 71 Chip jumper conductor element 71a electrode 72 protective film 72a heat-resistant resin 74 wire material 74a cut grooves 75a, 75b cutter 81 tip conductor element 81a electrode 82 protective film 82a heat-resistant resin 84 wire rod 84a machined groove 84b solder plated wire 84c cut groove jumper

Front page continuation (72) Inventor Takeshi Yoshinaka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Masamoto 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (10)

[Claims] 1. A heat-resistant resin pressure-sensitive adhesive tape, a heat-resistant heat-shrinkable tube, and a heat-resistant adhesive tape, which has an insulating property in the central portion in the length direction of a conductor element made of a metal material such as iron, copper, brass, or aluminum having a rectangular cross section. Chip jumper with a protective film made of either conductive resin or ceramic. 2. The chip jumper according to claim 1, wherein a groove is provided on at least one surface of a conductor element made of a metal material such as iron, copper, brass, or aluminum having a rectangular cross section, and a protective film is formed on the groove. . 3. A protective film is formed on a metal wire such as iron, copper, brass, or aluminum at regular intervals and is rolled into a conductor element having a rectangular cross section through a pair of rotating rollers. 2. The method of manufacturing a chip jumper according to claim 1, wherein the protective film is cut into a predetermined length so that the protective film is located at the center. 4. A rectangular cross section in which a metal wire made of iron, copper, brass, aluminum, or the like is provided between a pair of rotating rollers having at least one outer peripheral surface having a convex cross section so as to be continuous in the lengthwise direction. 3. The method for manufacturing a chip jumper according to claim 2, wherein the conductor element having a shape is rolled, a protective film is formed in the groove portion, and then the conductor element is cut into a predetermined length. 5. A rectangular cross section in which a metal wire such as iron, copper, brass, or aluminum is provided between a pair of rotating rollers having at least one outer peripheral surface having a convex cross section so as to be continuous in the longitudinal direction through a pair of rotating rollers. 3. A conductor element having a shape is rolled, and holes are formed at regular intervals in the longitudinal direction of the groove, and then a protective film is formed in the groove to cut the center of the hole to a predetermined length. Manufacturing method of the described chip jumper. 6. A rectangular cross section in which a groove is provided at a constant interval through a pair of rotating rollers having a plurality of metal-made wires such as iron, copper, brass, or aluminum provided with a plurality of protrusions in a gear shape on at least one side. 3. The method of manufacturing a chip jumper according to claim 2, wherein the conductor element is rolled, a protective film is formed on the groove, and then the groove is cut so as to become the center in the length direction. 7. A metal such as iron, copper, brass, or aluminum having a rectangular cross section, which is provided with a groove having a concave cross section on at least one surface at the center in the lengthwise direction and which is subjected to solder plating on the entire surface excluding this groove. A chip jumper composed of a conductor element made of a material and a protective film made of any one of a heat-resistant resin adhesive tape having insulating properties, a heat-resistant resin, and a ceramic formed in the groove of the conductor element. 8. A groove having a concave cross-section in the linear direction on at least one surface of the conductor element, which has been subjected to surface treatment capable of being soldered in advance on the conductor element made of a linear metal material such as iron, copper, brass, or aluminum. After processing and removing the surface treatment layer, a protective film made of a heat-resistant resin adhesive tape having an insulating property, a heat-resistant resin, or a ceramic is formed in the groove, and then the linear conductor element is formed into a predetermined shape. 8. The method for manufacturing a chip jumper according to claim 7, wherein the chip jumper is obtained by cutting the chip jumper into the length dimension. 9. A conductor element made of a linear metal material such as iron, copper, brass, or aluminum is preliminarily subjected to surface treatment capable of being soldered, and at least one surface of the conductor element is linearly rolled or pressed by a roller or a press. After making a groove with a concave cross-section and removing the surface treatment layer of this groove, a protective film made of a heat-resistant resin adhesive tape having insulating properties, a heat-resistant resin, or a ceramic is formed in this groove, 8. The method of manufacturing a chip jumper according to claim 7, wherein a linear conductor element is cut into a predetermined length dimension to obtain a chip jumper. 10. A conductor element made of a linear metal material such as iron, copper, brass, or aluminum is formed on at least one surface thereof in a linear direction by a groove having a concave cross-section by a roller or a press, and then the conductor element is formed. The surface treatment layer is removed only on the groove after performing a solderable surface treatment, or the conductor element excluding the groove is subjected to a solderable surface treatment, and then the groove is provided with an insulating property. The chip jumper according to claim 7, wherein a protective film made of any one of the heat-resistant resin adhesive tape, the heat-resistant resin, and the ceramic is formed, and the linear conductor element is cut into a predetermined length dimension to obtain a chip jumper. Manufacturing method.