JPH07136603A - Cleaning device - Google Patents
Cleaning deviceInfo
- Publication number
- JPH07136603A JPH07136603A JP28787693A JP28787693A JPH07136603A JP H07136603 A JPH07136603 A JP H07136603A JP 28787693 A JP28787693 A JP 28787693A JP 28787693 A JP28787693 A JP 28787693A JP H07136603 A JPH07136603 A JP H07136603A
- Authority
- JP
- Japan
- Prior art keywords
- water
- cleaning
- concentration
- tank
- cleaning liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、水系の洗浄液を使用す
る洗浄装置に関し、特に水によるすすぎ洗浄を行うよう
にした洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning device using a water-based cleaning liquid, and more particularly to a cleaning device adapted to be rinsed with water.
【0002】[0002]
【従来の技術】従来、プリント基板や電子部品などを洗
浄する場合、洗浄液としてフロンや1.1.1トリクロ
ロエタンなどの塩素系有機溶剤が使用されてきた。これ
らの有機溶剤は、蒸留による再生が容易に可能である。
図3は、従来の有機溶剤洗浄装置を説明する図である。
図において、36、37、38はそれぞれ第1、第2、
最終洗浄槽、39は第1洗浄槽からの洗浄液を溜める予
備タンク、40は送液ポンプ、41は蒸留再生装置、4
3は洗浄液を気化するためのヒーター、42は液化する
ための凝縮コイル、44は水分離器である。2. Description of the Related Art Conventionally, when cleaning a printed circuit board or electronic parts, a chlorofluorocarbon-based organic solvent such as CFC or 1.1.1 trichloroethane has been used as a cleaning liquid. These organic solvents can be easily regenerated by distillation.
FIG. 3 is a diagram illustrating a conventional organic solvent cleaning device.
In the figure, 36, 37 and 38 are the first, second and
Final cleaning tank, 39 is a reserve tank for storing the cleaning liquid from the first cleaning tank, 40 is a liquid-sending pump, 41 is a distillation regenerator, 4
3 is a heater for vaporizing the cleaning liquid, 42 is a condensing coil for liquefying, and 44 is a water separator.
【0003】図3に示すように、洗浄槽を幾つかに分
け、蒸留再生装置41で蒸留再生された液を最終洗浄槽
38へ供給し、洗浄液を順に第2、第1洗浄槽37、3
6へとオーバーフローさせることにより、常に新しい液
での洗浄が可能であった。また、揮発性も高いことか
ら、洗浄液単体での洗浄も可能である。As shown in FIG. 3, the cleaning tank is divided into several parts, and the liquid regenerated by distillation by the distillation regenerator 41 is supplied to the final cleaning tank 38, and the cleaning liquids are sequentially supplied to the second and first cleaning tanks 37 and 3.
By overflowing to 6, it was always possible to wash with a new liquid. Further, since it has high volatility, it is possible to perform cleaning with a cleaning liquid alone.
【0004】[0004]
【発明が解決しようとする課題】しかし、従来使用され
ている塩素系有機溶剤については、近年、大気中のオゾ
ン層破壊や地下水汚染などの環境問題が指摘され、世界
的にその使用が禁止される方向にある。これに伴い、他
の洗浄液(代替洗浄液)への転換が必要になってきた。However, regarding the chlorine-based organic solvents that have been used conventionally, environmental problems such as ozone depletion in the atmosphere and groundwater pollution have been pointed out in recent years, and their use is prohibited worldwide. There is a direction. Along with this, it has become necessary to switch to another cleaning liquid (alternative cleaning liquid).
【0005】ところが、代替洗浄液のほとんどは、再生
が困難、揮発性が悪い、残渣信頼性が乏しいなどの点か
ら、純水などにより、洗浄液を洗い落すすすぎ洗浄が必
要となる。However, since most of the alternative cleaning liquids are difficult to regenerate, have poor volatility, and have poor residue reliability, it is necessary to rinse and wash the cleaning liquid with pure water.
【0006】また、被洗浄物の品質を安定させるには、
すすぎ水の清浄度が重要となるため、すすぎ水の処理や
再生再利用が不可欠となり、そのためコストが大幅に増
加するという問題が生じる。In order to stabilize the quality of the object to be cleaned,
Since cleanliness of rinsing water is important, treatment of rinsing water and recycling / reuse are indispensable, which causes a problem of significant increase in cost.
【0007】さらに、代替洗浄液は、そのほとんどが引
火性の溶剤であるので、不燃性液体である水を何%か加
えることにより、引火性をなくする方法が採られてい
て、火災、爆発などの危険性を防止するために、洗浄液
中の水の管理と水の補給が必要となる。Further, since most of the alternative cleaning liquids are flammable solvents, a method of eliminating the flammability by adding some% of water which is a nonflammable liquid has been adopted. In order to prevent the risk of the above, it is necessary to manage and replenish the water in the cleaning liquid.
【0008】しかし、洗浄液中の水は、主成分である高
級アルコールより沸点が低いため蒸発などにより減少し
やすく、また、洗浄性を高めるために液温を上げたり、
スプレー洗浄を行うと、洗浄液中の水が短時間で低下す
るために、常に水の補給が必要になるという問題があっ
た。However, since the boiling point of water in the cleaning liquid is lower than that of the higher alcohol, which is the main component, the water tends to decrease due to evaporation or the like, and the liquid temperature may be raised to improve the cleaning property.
When the spray cleaning is performed, the water in the cleaning liquid drops in a short time, and there is a problem that it is always necessary to replenish the water.
【0009】本発明の目的は、水の再利用を洗浄装置内
で行うことにより、コストを低減した洗浄装置を提供す
ることにある。It is an object of the present invention to provide a cleaning device with reduced cost by reusing water in the cleaning device.
【0010】[0010]
【課題を解決するための手段】前記目的を達成するため
に、本発明では、水分を含む洗浄液と洗浄後のすすぎ水
を使用する洗浄装置において、該洗浄液中の水分濃度を
測定する手段と、該水分濃度が所定値以下のとき、前記
すすぎ水を前記洗浄液に補給する手段と、該補給による
すすぎ水の減少分を水で補給する手段を備えたことを特
徴としている。In order to achieve the above object, in the present invention, in a cleaning device using a cleaning liquid containing water and rinse water after cleaning, means for measuring the water concentration in the cleaning liquid, When the water concentration is equal to or lower than a predetermined value, a means for replenishing the rinsing water to the cleaning liquid and a means for replenishing a reduced amount of the rinsing water by the replenishment with water are provided.
【0011】[0011]
【作用】水分濃度測定器は洗浄液の水分の低下を検出す
ると、すすぎ槽からのすすぎ水を洗浄槽へ補給する。補
給水は、水分濃度測定器で正常な値となるまで給水する
方法やタイマーなどで常に一定量給水する方法などで補
給される。すすぎ槽では、洗浄槽へ補給した水量分の純
水を最終すすぎ槽へ供給し、オーバーフロー方式やポン
プ方式などで第1すすぎ槽へと順に送り込む。各すすぎ
槽は、後の槽より洗浄液濃度の低い水が混入してくるの
で、洗浄液濃度が下がる。これにより、すすぎ槽の洗浄
液濃度は常に低く抑えることができるので、再生装置の
負荷が低減され、また産業廃棄排水量が低減され、コス
ト低減が可能となる。When the moisture concentration measuring device detects a decrease in the water content of the cleaning liquid, it supplies the rinse water from the rinse tank to the cleaning tank. The make-up water is supplied by a method of supplying water until a normal value is obtained by a water concentration measuring device or a method of constantly supplying a constant amount of water with a timer or the like. In the rinse tank, pure water corresponding to the amount of water supplied to the cleaning tank is supplied to the final rinse tank and is sequentially sent to the first rinse tank by an overflow method or a pump method. Since each rinse tank is mixed with water having a lower cleaning solution concentration than the subsequent tanks, the cleaning solution concentration is lowered. As a result, the concentration of the cleaning liquid in the rinsing tank can be always kept low, so that the load on the regenerator is reduced, the industrial waste water discharge amount is reduced, and the cost can be reduced.
【0012】[0012]
【実施例】以下、本発明の一実施例を図面を用いて具体
的に説明する。図2は、本発明の洗浄装置の全体の構成
を示し、フラックス除去を主たる目的としたプリント基
板洗浄装置の構成図である。図において、1、2は、そ
れぞれ第1、第2の洗浄室であり、図の矢印方向から搬
入され、搬送コンベア16に載せられたプリント基板
は、洗浄室1、2に設けられたスプレーノズル18から
噴射される洗浄液によって洗浄される。8、9は、第
1、第2の洗浄槽、20はスプレー用のポンプ、21は
フィルタである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 2 shows the overall configuration of the cleaning apparatus of the present invention, and is a configuration diagram of a printed circuit board cleaning apparatus whose main purpose is flux removal. In the figure, reference numerals 1 and 2 respectively denote a first cleaning chamber and a second cleaning chamber, and a printed board loaded in the direction of an arrow in the drawing and placed on a conveyor 16 is a spray nozzle provided in the cleaning chambers 1 and 2. It is cleaned by the cleaning liquid sprayed from 18. Reference numerals 8 and 9 are first and second cleaning tanks, 20 is a spray pump, and 21 is a filter.
【0013】洗浄されたプリント基板は、さらに搬送コ
ンベア16で搬送され、第1すすぎ室3、第2すすぎ室
4、第3すすぎ室5、そして最終すすぎ室6を経てすす
がれ、乾燥室7内のヒーター32で乾燥された後、搬出
される。10、11、12、13は、それぞれ第1、第
2、第3、最終すすぎ槽、14はすすぎ水の再生処理を
行う高濃度水再生装置、15はすすぎ水の再生処理を行
う低濃度水再生装置、24は、第1、第2の洗浄槽8、
9の水分濃度を測定する水分濃度測定器、25は制御
器、26、29はポンプ、27はフィルタ、28aは第
1洗浄槽8用の補給水バルブ、28bは第2洗浄槽9用
の補給水バルブ、31は純水供給バルブである。The cleaned printed circuit board is further conveyed by a conveyor 16 to be rinsed through the first rinsing chamber 3, the second rinsing chamber 4, the third rinsing chamber 5, and the final rinsing chamber 6, and then in the drying chamber 7. After being dried by the heater 32, it is carried out. 10, 11, 12, and 13 are the first, second, third, and final rinsing tanks, 14 is a high-concentration water regenerator that regenerates rinse water, and 15 is low-concentration water that regenerates rinse water. The regeneration device 24 includes the first and second cleaning tanks 8,
A water concentration measuring device for measuring the water concentration of 9, a controller 25, a pump 26, 29, a filter 27, a make-up water valve for the first cleaning tank 8, 28a a supply for the second cleaning tank 9. A water valve 31 is a pure water supply valve.
【0014】上記したように、本発明の洗浄装置は、洗
浄液洗浄部が2槽(1、2)と、水によるすすぎ洗浄部
が4槽(3、4、5、6)と、乾燥部7から構成されて
いる。洗浄液は、高級アルコールを主成分とした液で、
引火性をなくするために約7%の水を含有している。洗
浄方式はスプレー方式であり、第1洗浄槽8と第2洗浄
槽9の間には液の持出し量を低下させるため、エアーに
よる液切りを行うための液切り室17が設けられてい
る。また、洗浄液は洗浄性を高めるために、50度C〜
60度Cにし、洗浄液中の水分は、フィルターリング配
管系に設置した水分濃度測定器24で管理されている。As described above, in the cleaning apparatus of the present invention, the cleaning liquid cleaning section is two tanks (1, 2), the water rinse cleaning section is four tanks (3, 4, 5, 6), and the drying section 7 is provided. It consists of The cleaning liquid is a liquid mainly composed of higher alcohol,
It contains about 7% water to eliminate flammability. The cleaning method is a spray method, and between the first cleaning tank 8 and the second cleaning tank 9, a liquid draining chamber 17 is provided between the first cleaning tank 8 and the second cleaning tank 9 in order to reduce the amount of liquid taken out. In addition, the cleaning liquid may have a temperature of 50 ° C to improve the cleaning property.
The water content in the cleaning liquid is controlled to 60 ° C. and is controlled by a water concentration measuring device 24 installed in the filter ring piping system.
【0015】また、すすぎ水には、洗浄液および洗浄液
が混入した水が、基板や洗浄治具、搬送コンベアなどに
より持ち込まれるために、洗浄を重ねる毎に洗浄液濃度
が高くなっていく。一般的に洗浄液濃度は、第1すすぎ
槽10が最も高くなり、次に第2すすぎ槽11、第3す
すぎ槽12と後の槽へ行くほどその濃度が低くなる。基
板の品質、信頼性を安定させるためには、すすぎ水の水
質が重要となり、そのためには水を再生し、再利用する
システムが必要となる。Further, since the cleaning liquid and the water mixed with the cleaning liquid are brought into the rinse water by the substrate, the cleaning jig, the conveyor, etc., the concentration of the cleaning liquid increases every time the cleaning is repeated. Generally, the concentration of the cleaning liquid is highest in the first rinsing bath 10, then becomes lower in the second rinsing bath 11, the third rinsing bath 12 and the subsequent baths. In order to stabilize the quality and reliability of the substrate, the water quality of rinse water is important, and for that purpose, a system for regenerating and reusing water is required.
【0016】そこで、本実施例では、第1すすぎ槽1
0、第2すすぎ槽11の洗浄液が高濃度で含まれる水
は、蒸留方式による高濃度水再生装置14ですすぎ水の
再生処理を行い、第3すすぎ槽12、最終すすぎ槽13
の液濃度が低い水は、活性炭、イオン交換樹脂による低
濃度水再生装置15ですすぎ水の再生処理を行ってい
る。Therefore, in this embodiment, the first rinsing tank 1 is used.
0, the water containing a high concentration of the cleaning liquid in the second rinse tank 11 is subjected to a regeneration treatment of the rinse water in the high-concentration water regenerator 14 by the distillation method, and the third rinse tank 12 and the final rinse tank 13
The water having a low liquid concentration is rinsed with a low-concentration water regenerator 15 using activated carbon or ion exchange resin.
【0017】すすぎ水の液濃度は、前述したように、洗
浄する度に少しづつ上昇してくるので、水再生装置への
負荷が次第に増加し、産業廃棄排水量の増加や活性炭、
イオン交換樹脂の消耗率の上昇などの問題が生じる。As described above, the liquid concentration of rinsing water increases little by little with each washing, so the load on the water regenerator gradually increases, increasing the amount of industrial waste water discharged and activated carbon.
Problems such as an increase in the wear rate of the ion exchange resin occur.
【0018】なお、本実施例の水再生方式は一例であっ
て、これに限定されるものではなく、例えば、生物処理
方式によるものや再生装置を使用しないで液濃度で管理
する方式など種々の方式を採ることができる。The water regeneration system of this embodiment is an example, and the present invention is not limited to this. For example, various methods such as a biological treatment system or a system in which liquid concentration is controlled without using a regenerator are used. The method can be adopted.
【0019】図1は、本実施例の洗浄装置における水循
環系の詳細構成を示す図である。以下、図1を参照して
動作を説明すると、まず、洗浄液中の水分濃度は、水分
濃度測定器24で各槽(8、9)交互に測定され、例え
ば、第1洗浄槽8の水分濃度がある設定値(例えば5
%)以下になると、水分濃度測定器24は、制御器25
に対して信号を出力する。FIG. 1 is a diagram showing the detailed construction of the water circulation system in the cleaning apparatus of this embodiment. The operation will be described below with reference to FIG. 1. First, the water concentration in the cleaning liquid is alternately measured by the water concentration measuring device 24 in each tank (8, 9). There is a set value (for example, 5
%) Or less, the water concentration measuring device 24
Signal is output to.
【0020】制御器25は、その信号を受信すると、水
分が低下した第1洗浄槽8の補給水バルブ28aを開
け、第1すすぎ槽10からの補給水ポンプ26を動作さ
せる。補給は、洗浄槽液量、補給水量、ポンプ送水能力
などにより補給時間を求め、一定時間経過した後に、ポ
ンプ26を停止させ、バルブ28aを閉める。When the controller 25 receives the signal, the controller 25 opens the makeup water valve 28a of the first washing tank 8 in which the water content has dropped, and operates the makeup water pump 26 from the first rinse tank 10. For replenishment, the replenishment time is obtained from the amount of cleaning tank liquid, the amount of replenished water, the pump water supply capacity, etc., and after a certain time has elapsed, the pump 26 is stopped and the valve 28a is closed.
【0021】洗浄槽8への補給水量によって、第1すす
ぎ槽10の水量が徐々に減少していくので、その水位が
低下する。水位低下がある一定量になると、低水位セン
サー33がそれを検出して、制御器35に信号を送出す
る。信号を受信した制御器35は、純水供給バルブ31
と、第3すすぎ槽12と第2すすぎ槽11間のオーバー
フロー用バルブ30を開ける。これにより、最終すすぎ
槽13に純水が供給され、オーバーフローした水が前槽
へと送られるため、第1すすぎ槽10の水位は上昇す
る。第1すすぎ槽10の水が定水位になると、定水位セ
ンサー34はそれを検出し、制御器35へ信号を出力
し、制御器35は、純水供給バルブ31とオーバーフロ
ー用バルブ30を閉じる。Since the amount of water supplied to the cleaning tank 8 gradually decreases, the water level of the first rinse tank 10 decreases. When the water level drop reaches a certain amount, the low water level sensor 33 detects it and sends a signal to the controller 35. Upon receiving the signal, the controller 35 determines the pure water supply valve 31.
Then, the overflow valve 30 between the third rinse tank 12 and the second rinse tank 11 is opened. As a result, pure water is supplied to the final rinse tank 13 and the overflowed water is sent to the previous tank, so that the water level in the first rinse tank 10 rises. When the water in the first rinsing tank 10 reaches a constant water level, the constant water level sensor 34 detects it and outputs a signal to the controller 35, and the controller 35 closes the pure water supply valve 31 and the overflow valve 30.
【0022】このように、本実施例によれば、洗浄液の
混入したすすぎ水を、洗浄液への水分補給に利用し、本
来洗浄槽へ補給されるべき純水を、最終すすぎ槽へ供給
することで、すすぎ槽の洗浄液濃度を低下させ、水再生
装置の負荷や産業廃棄排水量などを低減させることがで
きる。As described above, according to the present embodiment, the rinse water mixed with the cleaning liquid is used to replenish the cleaning liquid with water, and the pure water which should be supplied to the cleaning tank is supplied to the final rinse tank. Thus, it is possible to reduce the concentration of the cleaning liquid in the rinsing tank and reduce the load on the water reclamation device and the amount of industrial waste water discharged.
【0023】なお、本発明は上記した実施例に限定され
るものではなく、例えば洗浄液の補給水はどのすすぎ槽
からでもよく、水再生装置から補給してもよい。また、
すすぎ槽への給水も最終すすぎ槽だけではなく他のすす
ぎ槽であってもよい。そして、その給水方式も常に一定
量を給水する方式など種々の方式を採ることが可能であ
る。The present invention is not limited to the above-mentioned embodiment, and for example, the makeup water for the cleaning liquid may be supplied from any rinse tank or may be supplied from the water regenerator. Also,
The water supply to the rinse tank may be not only the final rinse tank but other rinse tanks. As the water supply method, various methods such as a method of always supplying a fixed amount of water can be adopted.
【0024】[0024]
【発明の効果】以上、説明したように、本発明によれ
ば、洗浄液の水分濃度の低下に応じて、すすぎ水を洗浄
液への水分補給に使用しているので、水再生装置の負荷
が低減され、また産業廃棄排水の発生量が低減され、こ
れにより代替洗浄で最もコストがかかる水処理部のコス
トを大幅に削減することが可能となる。As described above, according to the present invention, since the rinse water is used for supplying water to the cleaning liquid in response to the decrease in the water concentration of the cleaning liquid, the load on the water regenerator is reduced. In addition, the amount of industrial waste water generated is reduced, which makes it possible to significantly reduce the cost of the water treatment section, which is the most expensive alternative cleaning.
【図1】本発明の洗浄装置における水循環系の詳細構成
を示す図である。FIG. 1 is a diagram showing a detailed configuration of a water circulation system in a cleaning apparatus of the present invention.
【図2】本発明の洗浄装置の全体の構成を示す。FIG. 2 shows the overall configuration of the cleaning apparatus of the present invention.
【図3】従来の有機溶剤洗浄装置を説明する図である。FIG. 3 is a diagram illustrating a conventional organic solvent cleaning device.
1 第1洗浄室 2 第2洗浄室 3 第1すすぎ室 4 第2すすぎ室 5 第3すすぎ室 6 最終すすぎ室 7 乾燥室 8 第1洗浄槽 9 第2洗浄槽 10 第1すすぎ槽 11 第2すすぎ槽 12 第3すすぎ槽 13 最終すすぎ槽 14 高濃度水再生装置 15 低濃度水再生装置 16 搬送コンベア 17 液切り室 18 スプレーノズル 19 エアーナイフ 20 スプレー用ポンプ 21、23、27 フィルター 22 フィルターリング用ポンプ 24 水分濃度測定器 25、35 制御器 26 補給水用ポンプ 28a 第1洗浄槽用補給水バルブ 28b 第2洗浄槽用補給水バルブ 30 オーバーフロー用バルブ 31 純水供給バルブ 32 ヒーター 33 低水位センサー 34 定水位センサー 1 1st cleaning room 2 2nd cleaning room 3 1st rinsing room 4 2nd rinsing room 5 3rd rinsing room 6 Final rinsing room 7 Drying room 8 1st rinsing tank 9 2nd rinsing tank 10 1st rinsing tank 11 2nd Rinse tank 12 Third rinse tank 13 Final rinse tank 14 High-concentration water regenerator 15 Low-concentration water regenerator 16 Conveyor conveyor 17 Draining chamber 18 Spray nozzle 19 Air knife 20 Spray pump 21, 23, 27 Filter 22 For filter ring Pump 24 Moisture concentration measuring device 25, 35 Controller 26 Makeup water pump 28a First washing tank make-up water valve 28b Second washing tank make-up water valve 30 Overflow valve 31 Pure water supply valve 32 Heater 33 Low water level sensor 34 Constant water level sensor
Claims (1)
使用する洗浄装置において、該洗浄液中の水分濃度を測
定する手段と、該水分濃度が所定値以下のとき、前記す
すぎ水を前記洗浄液に補給する手段と、該補給によるす
すぎ水の減少分を水で補給する手段を備えたことを特徴
とする洗浄装置。1. A cleaning device using a cleaning liquid containing water and rinse water after cleaning, a means for measuring the water concentration in the cleaning liquid, and the rinsing water containing the cleaning liquid when the water concentration is below a predetermined value. And a means for replenishing the reduced amount of rinse water due to the replenishment with water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28787693A JP3296379B2 (en) | 1993-11-17 | 1993-11-17 | Cleaning equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28787693A JP3296379B2 (en) | 1993-11-17 | 1993-11-17 | Cleaning equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07136603A true JPH07136603A (en) | 1995-05-30 |
JP3296379B2 JP3296379B2 (en) | 2002-06-24 |
Family
ID=17722882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28787693A Expired - Lifetime JP3296379B2 (en) | 1993-11-17 | 1993-11-17 | Cleaning equipment |
Country Status (1)
Country | Link |
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JP (1) | JP3296379B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007063746A1 (en) * | 2005-11-30 | 2007-06-07 | Tokyo Electron Limited | Cleaning apparatus and method of cleaning |
JP2019048255A (en) * | 2017-09-08 | 2019-03-28 | 大同特殊鋼株式会社 | Cleaning method and cleaning device for metal chip |
-
1993
- 1993-11-17 JP JP28787693A patent/JP3296379B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007063746A1 (en) * | 2005-11-30 | 2007-06-07 | Tokyo Electron Limited | Cleaning apparatus and method of cleaning |
JP2019048255A (en) * | 2017-09-08 | 2019-03-28 | 大同特殊鋼株式会社 | Cleaning method and cleaning device for metal chip |
Also Published As
Publication number | Publication date |
---|---|
JP3296379B2 (en) | 2002-06-24 |
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