JPH07115075A - Dicing equipment for wafer - Google Patents

Abstract

PURPOSE:To prevent the contamination of a wafer surface by water containing chips immediately after cutting by separating the water containing chips immediately after cutting from the wafer surface to a rear portion in the rotating direction of a blade. CONSTITUTION:At a rear portion in the rotating direction of a blade 23, a separating plate 35 extending upward diagonally is provided in such a manner that its front end can be located close to a space between the blade 23 and the surface of a wafer 2. This separating plate 35 is for separating the water 30 containing scattering chips at the rear portion in the rotating direction of the blade 23 during the dicing from the surface of the wafer 2. By doing this, the scattering region of the water 30 containing chips immediately after cutting during the dicing of the wafer 2 can be separated from the surface of the wafer 2, and then the water 30 containing chips will not stick to the surface of the wafer 2. Because of this, contamination of the surface of the wafer 2 by the water containing chips immediately after cutting can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for dicing a wafer such as glass or semiconductor.

[0002]

2. Description of the Related Art In manufacturing a semiconductor integrated circuit, a liquid crystal display device, or the like, a semiconductor wafer after elements are formed, or a glass wafer after forming thin film transistors and pixel electrodes is rotated at a high speed. Are diced into chips.

3 and 4 show a conventional dicing apparatus. In the figure, 1 is the whole wafer dicing apparatus, and 2 is the wafer to be diced. The dicing apparatus 1 includes a table 3 on which a wafer 2 to be diced is placed, a blade 4 supported by a supporting portion and rotating at a high speed, and a flange cover 5 arranged so as to surround the outer periphery of the blade portion of the blade 4. It has a blade cooling nozzle 7 for injecting cooling water 6 toward the blade edge portion, and a cutting nozzle 10 for injecting cutting water 9 from the front side to the rear side of the cutting point of the blade 4 on the wafer 2.

The wafer 2 is attached to the dicing tape 11 via an adhesive, and the dicing tape 11 is set on the table 3. Blade cooling nozzle 7
Is a plurality of conduits that extend horizontally through threaded joints 8 on both sides of the lower portion of the blade 4 that contacts the wafer 2.
It is configured by forming two slits 12. Reference numeral 13 is a supply pipe for supplying the cooling water 6 to the blade cooling nozzle 7,
Reference numeral 4 denotes a supply pipe for supplying the cutting water 9 to the cutting nozzle 10.

In this dicing device 1, each nozzle 7,
While supplying cooling water 6 and cutting water 9 from 10, a blade 4 and a wafer 2 which rotate at high speed (for example, 30,000 rpm)
Is relatively moved, and in the illustrated example, the blade 4 is fixed and the table 3 is moved in the direction of arrow a to dice the wafer 2. In this dicing, as shown in FIG. 5, the wafer 2 is completely cut so as to reach the dicing tape 11 through the adhesive 15.

[0006]

By the way, in the above-mentioned conventional dicing apparatus 1, the contaminated water 17 including chips (adhesive, wafer, etc.) immediately after cutting the wafer during dicing causes the contaminated water 17 to move backward in the rotating direction of the blade 4. Scatter onto the wafer surface after cutting.

In particular, when dicing a glass wafer having a thin film transistor and a pixel electrode used in a liquid crystal display device, the glass wafer has a good surface accuracy and is smooth, so that the glass wafer is coated with an adhesive having a strong adhesive force. Attached to the dicing tape. Therefore, the chips contained in the contaminated water 17 immediately after cutting the glass wafer are strongly attached to the wafer surface, and the degree of contamination of the wafer surface after drying becomes large.

Various measures have been taken to prevent such contamination. For example, as shown in FIG. 4, a notch 18 is formed in the rear portion of the flange cover 5 in the blade rotation direction,
It is considered that the contaminated water 17 immediately after cutting is escaped from the cutout portion 18 to prevent the water from flowing around inside the flange cover 5. However, the contaminated water 17 scattered to the rear and adhering to the wafer surface cannot be sufficiently washed off, and satisfactory contamination prevention has not been obtained yet.

In view of the above points, the present invention provides a dicing apparatus capable of sufficiently preventing contamination of a wafer surface by water containing chips immediately after cutting.

[0010]

SUMMARY OF THE INVENTION The present invention is a dicing apparatus for dicing a wafer 2 with a blade 23. Separation for separating water 30 containing chips immediately after cutting from the wafer surface at the rear portion in the rotational direction of the blade 23. Means 3
5 (or 40).

[0011]

In the dicing apparatus of the present invention, during the dicing of the wafer 2, the water 30 containing chips immediately after cutting is scattered behind the blade 23, but the separating means provided at the rear portion in the rotating direction of the blade 23. By 35 (or 40), the scattered region of the water 30 containing chips is separated from the wafer surface, and the water 30 containing chips does not adhere to the wafer surface. Therefore, the wafer surface is not contaminated with the water 30 containing chips after cutting.

[0012]

Embodiments of the dicing apparatus of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of a dicing apparatus according to the present invention. In the figure, 21 is the whole dicing apparatus according to the present invention, and 2 is a wafer to be diced. The dicing device 21 uses the wafer 2 to be diced.
A table 22 on which the blade is mounted, a blade 23 attached to a supporting portion so as to be rotatable at high speed, a flange cover 24 arranged so as to surround the outer periphery of the blade portion of the blade 23, and cooling toward the blade blade portion. A blade cooling nozzle 25 for jetting water and cutting water 27 for the wafer 23 of the blade 23
And a cutting nozzle 28 for injecting.

The blade cooling nozzle 25 includes a blade 23.
A plurality of slits 29 for ejecting cooling water (not shown because it is the same as FIG. 4) in a fan shape toward the blade blade in the conduit extending to both sides of the lower part facing the wafer 2 of the present invention. Three slits 29A are provided in the conduit part extending obliquely upward from the horizontal conduit part and one slit 29A is provided.
B is formed together. By providing this slit 29B, it is possible to improve the cooling effect and the cleaning effect on the wafer surface.

On the other hand, the flange cover 24 is used for the wafer 2
Is disposed so as to surround the blade blade portion except for the portion facing the blade and the rear portion in the rotational direction of the blade. In particular, the rear portion of the flange cover 24 is cut short so that water (so-called contaminated water) 30 containing tangential chips that are rolled up backward by the rotation of the blade immediately after cutting can be scattered outward. Reference numeral 31 is the excised portion. Then, for example, L which extends horizontally to the rear so as to be continuous with the excision portion 31
The character-shaped guide member 32 is attached to the flange cover 24.

Reference numeral 33 is a supply pipe for supplying cooling water to the blade cooling nozzle 25, and 34 is a supply pipe for supplying cutting water to the cutting nozzle 28.

In this example, however, in this dicing device 21, a separating plate 35 extending obliquely upward is provided at the rear portion in the rotating direction of the blade 23 so that the front end is close to between the blade blade and the wafer surface. Set up. This separating plate 35
Is for separating the water 30 containing chips scattered on the rear portion in the rotation direction of the blade 23 during dicing from the wafer surface. The separation plate 35 is integrally attached to the flange cover 24 via the attachment member 36.

Next, a method of dicing the wafer 2 using the dicing device 21 will be described. The wafer 2 adhered to the dicing tape 11 via the adhesive is placed and fixed on the table 22 of the dicing device 21, and the blade 23 is rotated at a high speed at a rotation speed of, for example, 30000 rpm to relatively move the blade 23 and the wafer 2. That is, in this example, the blade 24 is fixed and the table 2 is fixed.
Dicing is performed while moving 2 in the direction of arrow a.

At this time, each slit 2 of the cooling nozzle 25
Cooling water is supplied to the blade blades from 9A and 29B, and cutting water 27 is supplied from the cutting nozzle 28. As a result, the blade edge portion is cooled and good cutting is performed. In the dicing, as shown in FIG. 5, the wafer 2 is completely cut so as to reach the dicing tape 11 through the adhesive 15.

The water 30 containing chips (adhesives, wafers, etc.) immediately after cutting is scattered to the rear of the rotating direction of the blade 23. At this time, the water 30 does not flow on the upper surface of the wafer 2 and the separating plate. It is discharged to the outside of the wafer through 35 and is sucked by an existing duct (not shown).

FIG. 2 shows another example of the dicing apparatus according to the present invention. In this example, as a separating means for separating the water 30 containing chips from the upper surface of the wafer, a cover-like separating plate 40 that covers the entire wafer 2 and the table 22 is arranged at the rear portion of the blade 23 in the rotation direction. Constitute. The cover-shaped separation plate 40 is fixed to the base side of the dicing device 41, and is configured so that the wafer 2 enters the cover-shaped separation plate 40 together with the table 22. Other configurations are
Since it is the same as in FIG. 1, the corresponding parts are designated by the same reference numerals, and the duplicate description will be omitted.

Also in this dicing device 41, the water 30 containing chips immediately after cutting does not flow on the upper surface of the wafer 2, passes through the cover-shaped separating plate 40, is discharged to the outside of the wafer, and is sucked by the duct.

As described above, according to the present embodiment, when the wafer 2 is diced, the water 30 containing chips splashed to the rear of the rotating direction of the blade 23 is separated by the separating plate 35.
Or, it is sucked to the outside through 40 and does not adhere to the wafer surface. Therefore, the yield of dicing of the wafer 2 can be improved.

Further, in the conventional example shown in FIG. 3, the chips accidentally peeled off from the dicing tape 11 during dicing were caught by the blade 4 and the blade 23 was damaged. However, in this embodiment, since the rear portion of the flange cover 24 is largely cut off, even if the chip is peeled off from the dicing tape, the chip does not escape from the cutout portion 31 rearward and damage the blade 23. Therefore, blade damage can be reduced.

Further, conventionally, as shown in FIG. 3, the blade cooling nozzle 7 is attached via a joint 8 made of a screw, so that water 17 containing chips enters the joint 8 to cause clogging. It was necessary to remove this clogging,
However, in this embodiment, since the blade cooling nozzle 25 is integrally formed from above as shown in FIG. 1, the above clogging does not occur, and the maintenance of the so-called dicing device 21 is simplified.

Further, since the rear portion of the flange cover 24 in the blade rotation direction is cut short and a guide member 32 extending horizontally so as to be continuous with the cut portion 31 is provided, it is tangentially flipped up behind the blade. The water 30 containing chips is scattered without being disturbed by the flange cover 24 and is discharged to the outside through the space between the guide member 32 and the separation plate 30. Therefore, it is possible to prevent the water containing chips from hitting the inner surface of the flange cover and dropping to contaminate the wafer surface.

The dicing devices 21 and 41 of this embodiment are
It is suitable for dicing semiconductor wafers, glass wafers in liquid crystal display devices, and the like.

[0028]

According to the dicing apparatus of the present invention, since the separating means for separating the wafer surface and the water splash area containing the chips is provided at the rear of the rotating direction of the blade, the chips immediately after cutting are included. Water does not adhere to the wafer surface,
The contamination of the wafer surface can be reduced. Therefore, the yield of dicing can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an example of a dyne sig apparatus according to the present invention.

FIG. 2 is a configuration diagram showing another example of a dicing apparatus according to the present invention.

FIG. 3 is a configuration diagram of a conventional dicing device.

FIG. 4 is a side view of a conventional dicing device.

FIG. 5 is an explanatory view showing a dicing state of a wafer.

[Explanation of Codes] 1,21,41 Dicing Device 2 Wafer 3,22 Table 4,23 Blade 5,24 Flange Cover 6 Cooling Water 7,25 Blade Cooling Nozzle 9,27 Cutting Water 10,28 Cutting Nozzle 17,30 Chips Water containing water 35,40 Separation plate

Claims (1)

[Claims] 1. A dicing device for dicing a wafer with a blade, comprising separation means for separating water containing chips immediately after cutting from the surface of the wafer at a rear portion in the rotation direction of the blade. Wafer dicing equipment.