JPH0711485Y2 - Device for connecting and fixing chip parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device for connecting and fixing chip parts, and more specifically, for electrically contacting an electric chip part such as a chip diode to another conductor without soldering. The present invention relates to a device that is securely connected and attached.

[Prior Art] As a connecting and fixing device for this type of chip component, there is a device described in, for example, Japanese Utility Model Publication No. 58-12971.

This conventional technique elastically fits a current-carrying metal fitting that directly elastically contacts the electrical coating of the chip piece to both ends of the piece, and connects the chip-material piece to a required portion of the printed board through the current-carrying metal fitting. It is a mounting bracket for a chip element, characterized in that it is mounted by soldering on.

[Problems to be Solved by the Invention] In the above-mentioned conventional technique, the chip pieces are soldered and fixed to the conductive pattern of the printed circuit board through the metal fittings sandwiched between the electrical coating portions of the chip pieces. Therefore,
It requires a high temperature heating process called soldering, it cannot be used for chip parts that are vulnerable to heat, it is difficult to automate the connection work, and the soldering position can not be accurately determined without using a positioning jig, soldering A misconnection accident due to a defect may occur.

In addition, since the chip part is placed and fixed on the surface of the printed board, the chip parts stick out on the board and are in a protruding state, which hinders the flattening of the device and the chip part Since the lower surface of the device is in close contact with the substrate, there is a problem that ventilation is poor and an accident due to poor heat dissipation easily occurs.

In order to eliminate the above-mentioned problems, the present invention has a small-width conductive member in which chip parts are arranged on both sides of opposing projecting pieces projecting on both sides of a hole (hole) of an insulating substrate by means of electrode pieces thereof without soldering. By tightly press-fitting between the opposite bent pieces of the plate, the connection can be fixed, and the mounting position of the chip component on the insulating substrate is strictly regulated so that the chip component does not protrude from the surface of the substrate and heat dissipation. The purpose is to improve.

[Means for Solving the Problems] The above-mentioned object of the present invention is to form a hole (hole) in a plastic molded insulating substrate, and to project an opposing bullet piece in the insulating substrate with the hole (hole) sandwiched therebetween. At the same time, a bending piece and a stopper portion along the opposing bullet piece are formed on opposite sides of a pair of small-width conductive plates arranged on both sides of each of the opposing bullet pieces, and these bending pieces are formed by the opposing bullet pieces. And facing each other, and projecting at least one hook-shaped projecting piece on the insulating base in the lower part of the hole (hole), and through the hook-shaped projecting piece between each of the bent pieces. This is accomplished by press-fitting a chip component such as a chip diode on the outer surfaces of the pair of electrode pieces so as to electrically connect and attach the electrode pieces to the narrow conductive plate.

[Operation] The chip component is bent by the electrode piece between the opposite bending pieces of the small-width conductive plate arranged along the facing bullet pieces protruding on both sides of the hole of the insulating base. By tightly press-fitting against the elastic force with the pieces, it is possible to connect and fix them tightly due to the synergistic effect of the elastic return force of each of these pieces, eliminating the need for soldering and mounting chip parts in the holes. By doing this, the mounting horizontal position is accurately determined,
The mounting depth is strictly regulated by the stopper portion below the facing bent piece of the narrow conductive plate.

Further, since the lower part of the chip component is exposed to the atmosphere and an air flow due to a slight gap around the chip component is generated, the air permeability is good, and therefore the heat dissipation to the chip piece is good.

When the chip part is inserted between the opposite bent pieces of the narrow conductive plate, first, the hook-shaped bullets bend outward at the side edges of the chip part against its elasticity, and the upper edge of the chip part is When the hook-shaped bullet piece is disengaged from the hook portion, the hook-shaped bullet piece snaps back by its elasticity, and the hook portion presses the upper edge of the chip component to lock its levitation.

[Examples] Examples will be described with reference to the drawings.

First, the basic structure of this invention is to form a hole (hole) 2 as shown in FIGS. 1, 3 and 4 in a plastic molded insulating substrate 1, and sandwich the hole (hole) 2 to sandwich it. As shown in FIGS. 2 and 5, small width conductive plates 3, 3 made of a good conductor metal strip such as copper or brass are arranged on the insulating substrate 1 as shown in FIGS. 2 and 5.

That is, opposing bullets 2a, 2a are provided on the insulating substrate 1 so as to sandwich the hole (hole) 2 and the opposing bullets 2a, 2a are provided.
Bending pieces 4, 4 and stopper portions 4a, 4a along the opposing bullet pieces 2a, 2a on opposite sides of a pair of narrow conductive plates 3, 3 arranged on both sides of
And the bent pieces 4, 4 are arranged facing each other along the opposing bullet pieces 2a, 2a as shown in FIG.

Then, at least one hook-shaped bullet piece a is projectingly provided on the insulating substrate 1 below the hole 2, and each of the bent pieces 4,
By inserting the chip component 5 such as a chip diode between the four through the hook-shaped bullet piece a on the outer surfaces of the pair of electrode pieces 6 and 6 through the state shown in FIG.
Is electrically connected to the narrow conductive plates 3, 3 and the chip component 5 is attached to the insulating substrate 1 by the elastic return locking action of the hook-shaped bullet piece a as shown in FIG.

1 and 4, reference numeral 1a is a rib for positioning the narrow conductive plate 3.

When the chip component 5 is inserted into the hole (hole) 2 of the insulating substrate 1, first, the hook-shaped bullet piece a is pushed by the side edge of the chip component 5 while being slightly spread outward against the elasticity. The upper edge of the component 5 is disengaged from the hook portion a'of the hook-shaped bullet piece a, and the hook-shaped bullet piece a is snapped back by its elasticity as shown in FIG. The upper edge can be pressed down and locked as shown in FIG.

Note that the chip component 5 can be locked even if only one hook-shaped bullet piece a is used by protruding from the insulating substrate 1 as shown in FIG.

Further, in each of the above embodiments, the periphery of the chip component 5 and the hole 2
If even a small gap is provided between and, the ventilation is further improved and the heat dissipation is also improved.

[Advantages of the Invention] Since the present invention is configured as described above, it has the following effects.

In the chip component connecting and fixing device according to claim 1, the chip component 5 is opposed to a small-width conductive plate disposed along the opposing projecting pieces projecting on both sides of the hole (hole) of the insulating substrate by its electrode piece. By tightly pressing the elastic force between the opposing projecting piece and the opposing bending piece between the pieces, it is possible to strictly connect and fix them by the synergistic effect of the elastic return force of each piece, and the soldering becomes unnecessary. Since the chip component is mounted in the hole, the mounting horizontal position is accurately determined, and the mounting depth is strictly regulated by the stopper portion below the facing bent piece of the narrow conductive plate.

Further, since the lower part of the chip component is exposed to the atmosphere and an air flow due to a slight gap around the chip component is generated, the air permeability is good, and therefore the heat dissipation to the chip piece is good.

When the chip component is inserted between the opposite bent pieces of the narrow conductive plate, first, the hook-shaped bullet a at the side edge of the chip component bends outwards against its elasticity, and the upper edge of the chip component is bent. When is released from the hook portion of the hook-shaped bullet piece, the hook-shaped bullet piece snaps back due to its elasticity, and the upper edge of the chip component can be pressed by the hook portion to lock its levitation.

The chip component can be tightly press-fitted between the opposing bent pieces of the narrow conductive plate disposed opposite to the hole (hole) of the insulating substrate by the electrode piece, and the chip component can be mounted with the electrode piece connected to the narrow conductive plate. Since it can be attached to the insulating substrate with a one-touch operation in a so-called "cassette pon" type, the assembling property of the electrical equipment is remarkably improved and the assembling can be easily automated.

Further, in particular, in this invention, since the chip component is mounted in the hole of the base, the chip component does not stick out from the surface of the base, the device can be flattened, and the heat dissipation of the chip component can be improved. Have.

[Brief description of drawings]

Each of the drawings shows an embodiment of the present invention. FIG. 1 is a perspective view showing a state in which each component element is separated, and FIG. 2 is a state in which a bending piece is arranged to face a hole (hole) of an insulating base. FIG. 3 is a plan view showing a state in which a chip component is mounted on the same, FIG.
FIG. 5 is a cross-sectional view showing a state in which bending pieces are arranged opposite to each other on an insulating substrate and a chip component is attached thereto. FIG. Sixth
The figure is a cross-sectional view of the state in the middle of mounting the chip component above,
FIG. 7 is a sectional view showing a state in which the same is attached. DESCRIPTION OF SYMBOLS 1 ... Insulating substrate, 4a ... Stopper part 2 ... Hole (hole), 5 ... Chip component 2a ... Opposing bullet piece, 6 ... Electrode piece 3 ... Small width conductive plate, a ... Hook-like bullet piece 4 ... Bending piece

Claims (1)

[Scope of utility model registration request] 1. A hole (hole) 2 is formed in a plastic-molded insulating substrate 1, and opposing bullets 2a, 2a are provided projecting from the insulating substrate 1 with the hole (hole) 2 sandwiched therebetween. A pair of narrow conductive plates 3, 3 arranged on both sides of the bullets 2a, 2a
Bending pieces 4, 4 along the opposing bullets 2a, 2a and stopper portions 4a, 4a are formed on opposite sides of the above, and these bending pieces 4, 4 are arranged along the opposing bullets 2a, 2a. The holes (holes) 2 arranged so as to face each other
At least one hook-shaped bullet a on the insulating substrate 1 in the lower part of the
And a chip component 5 such as a chip diode is press-fitted tightly onto the outer surface of the pair of electrode pieces 6 and 6 via the hook-shaped bullet piece a between the bent pieces 4 and 4. A connecting and fixing device for chip parts, in which electrode pieces (6, 6) are electrically connected and attached to the narrow conductive plates (3, 3).