JPH0697686A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH0697686A JPH0697686A JP22243992A JP22243992A JPH0697686A JP H0697686 A JPH0697686 A JP H0697686A JP 22243992 A JP22243992 A JP 22243992A JP 22243992 A JP22243992 A JP 22243992A JP H0697686 A JPH0697686 A JP H0697686A
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- metal case
- semiconductor circuit
- circuit board
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は混成集積回路装置に関す
るものである。FIELD OF THE INVENTION The present invention relates to a hybrid integrated circuit device.
【０００２】[0002]
【従来の技術】従来、この種の混成集積回路装置は、図
３，図４に示すような構成であった。図において、両端
にアースパターンを設けた回路基板１に半導体回路素子
２および受動回路素子３が実装され、回路基板１にリー
ド端子４を接続し、上記回路基板１をシールドを目的と
した金属ケース５で覆い、回路基板１の両端に設けたア
ースパターンと金属ケース５は、はんだ付けにより接続
する構成であった。2. Description of the Related Art Conventionally, a hybrid integrated circuit device of this type has a structure as shown in FIGS. In the figure, a semiconductor circuit element 2 and a passive circuit element 3 are mounted on a circuit board 1 having ground patterns on both ends, lead terminals 4 are connected to the circuit board 1, and the circuit board 1 is a metal case for the purpose of shielding. 5, the ground patterns provided on both ends of the circuit board 1 and the metal case 5 were connected by soldering.
【０００３】[0003]
【発明が解決しようとする課題】混成集積回路装置が動
作状態にあると、半導体回路素子２が発熱し、半導体回
路素子２の温度が上昇する。When the hybrid integrated circuit device is in an operating state, the semiconductor circuit element 2 generates heat and the temperature of the semiconductor circuit element 2 rises.
【０００４】このような従来の構成では、発生した熱の
伝わる経路は以下の四通りあり、第一に半導体回路素子
２から回路基板１、金属ケース５内の空気、金属ケース
５、金属ケース５の周囲の空気という経路と、第二に半
導体回路素子２から金属ケース５内の空気、金属ケース
５、金属ケース５の周囲の空気という経路と、第三に半
導体回路素子２から回路基板１、金属ケース５、金属ケ
ース５の周囲の空気という経路と、第四に半導体回路素
子２から回路基板１、リード端子４、外部回路装置とい
う経路がある。しかし、混成集積回路装置は一般には小
形であり、熱を放熱しにくく、更に、回路基板１は薄
く、リード端子４は細いため構造上、第三および第四の
経路では熱は伝わりにくい。第一および第二の経路で
は、熱の伝わりにくい金属ケース５内の空気に伝わるた
め、熱が金属ケース５の中にこもり、半導体回路素子２
の使用温度範囲を越えてしまうという課題があった。In such a conventional structure, there are the following four paths through which the generated heat is transmitted. First, the semiconductor circuit element 2 to the circuit board 1, the air in the metal case 5, the metal case 5, and the metal case 5 are provided. The air around the semiconductor circuit element 2, the air inside the metal case 5 from the semiconductor circuit element 2, the air around the metal case 5 and the metal case 5, and the third path from the semiconductor circuit element 2 to the circuit board 1. There is a path of the metal case 5 and air around the metal case 5, and a fourth path of the semiconductor circuit element 2 to the circuit board 1, the lead terminal 4 and the external circuit device. However, since the hybrid integrated circuit device is generally small in size, it is difficult to dissipate heat, and further, since the circuit board 1 is thin and the lead terminals 4 are thin, heat is difficult to be transferred through the third and fourth paths due to the structure. In the first and second paths, heat is transferred to the air in the metal case 5 where heat is difficult to transfer, so that heat is trapped in the metal case 5 and the semiconductor circuit element 2
There was a problem that the operating temperature range was exceeded.
【０００５】本発明は、このような課題を解決するもの
で、混成集積回路装置の半導体回路素子より発生される
熱を金属ケース外へ放熱し、半導体回路素子の温度を使
用温度範囲以下に抑えた混成集積回路装置を構成するこ
とを目的とするものである。The present invention solves such a problem by radiating the heat generated by the semiconductor circuit element of the hybrid integrated circuit device to the outside of the metal case and keeping the temperature of the semiconductor circuit element within the operating temperature range. It is intended to form a hybrid integrated circuit device.
【０００６】[0006]
【課題を解決するための手段】この課題を解決するため
に本発明は、半導体回路素子および受動回路素子が実装
された回路基板にリード端子を接続し、上記回路基板を
シールドを目的とした金属ケースで覆い、回路基板の両
端に設けたアースパターンと金属ケースをはんだ付けに
より接続し、半導体回路素子の外装樹脂と金属ケースと
の間に面接続される金属板を挿入し、半導体回路素子の
外装樹脂と金属板は熱伝導性のよい樹脂で接着し、金属
ケースと金属板をはんだで接続したものである。In order to solve this problem, the present invention is to connect a lead terminal to a circuit board on which a semiconductor circuit element and a passive circuit element are mounted and to connect the circuit board to a metal for the purpose of shielding. Cover with a case, connect the earth pattern provided on both ends of the circuit board to the metal case by soldering, insert the metal plate to be surface-connected between the exterior resin of the semiconductor circuit element and the metal case, The exterior resin and the metal plate are bonded with a resin having good thermal conductivity, and the metal case and the metal plate are connected by solder.
【０００７】[0007]
【作用】この構成により、半導体回路素子より発生され
る熱は、面接続される金属板から金属ケースへ伝わり、
放熱性に優れた経路ができるため、シールド効果を保
ち、更に半導体回路素子の温度を使用温度範囲以下に抑
えられることとなる。With this configuration, the heat generated from the semiconductor circuit element is transferred from the metal plate to be surface-connected to the metal case,
Since a path having excellent heat dissipation is formed, the shielding effect is maintained, and the temperature of the semiconductor circuit element can be suppressed within the operating temperature range.
【０００８】[0008]
【実施例】図１は本発明の一実施例による混成集積回路
装置の構造を示す図である。図１の実施例において、回
路基板１１には半導体回路素子１２および受動回路素子
１３が実装され、そして回路基板１１の端子取付部には
リード端子１４が接続されている。上記回路基板１１は
金属ケース１５で覆われ、そして回路基板１１の両端に
設けたアースパターン１１ａと金属ケース１５がはんだ
で接続されている。また、半導体回路素子１２の外装樹
脂と金属ケース１５との間には面接続される金属板１６
が挿入され、半導体回路素子２の外装樹脂と金属板１６
とは熱伝導性のよい樹脂１７で接着されている。さら
に、金属ケース１５の金属板１６上の部分には、金属板
１６より小さな穴１５ａをあけ、金属ケース１５の穴１
５ａと金属板１６は、はんだ１８により接続されてい
る。1 is a diagram showing the structure of a hybrid integrated circuit device according to an embodiment of the present invention. In the embodiment of FIG. 1, the semiconductor circuit element 12 and the passive circuit element 13 are mounted on the circuit board 11, and the lead terminals 14 are connected to the terminal mounting portions of the circuit board 11. The circuit board 11 is covered with a metal case 15, and the ground patterns 11a provided at both ends of the circuit board 11 are connected to the metal case 15 by soldering. Further, a metal plate 16 is surface-connected between the exterior resin of the semiconductor circuit element 12 and the metal case 15.
Is inserted, the exterior resin of the semiconductor circuit element 2 and the metal plate 16
Are bonded with a resin 17 having good thermal conductivity. Further, a hole 15a smaller than the metal plate 16 is formed in a portion of the metal case 15 on the metal plate 16 so that the hole 1
5a and the metal plate 16 are connected by a solder 18.
【０００９】以上のように、本実施例によれば、半導体
回路素子１２の外装樹脂と金属ケース１５との間に面接
続される金属板１６を挿入することにより、半導体回路
素子１２より発生される熱が、面接続される金属板１６
から金属ケース１５へ伝わり、金属ケース１５外の空気
中へ放熱されるという放熱性に優れた経路ができるた
め、シールド効果を保ち、半導体回路素子１２の温度を
使用温度範囲以下に抑えられた混成集積回路装置を構成
することができる。As described above, according to the present embodiment, by generating the metal plate 16 which is surface-connected between the exterior resin of the semiconductor circuit element 12 and the metal case 15, the semiconductor circuit element 12 is generated. Heat is generated by the surface connection of the metal plate 16
From the metal case 15 to the metal case 15 to be radiated into the air outside the metal case 15, and thus a path with excellent heat dissipation is formed, so that the shielding effect is maintained and the temperature of the semiconductor circuit element 12 is kept within the operating temperature range. An integrated circuit device can be constructed.
【００１０】[0010]
【発明の効果】以上のように本発明によれば、半導体回
路素子および受動回路素子が実装された回路基板に、リ
ード端子を接続し、上記回路基板を金属ケースで覆い半
導体回路素子の外装樹脂と金属ケースとの間に面接続さ
れる金属板を挿入し、半導体回路素子の外装樹脂と金属
板は熱伝導性のよい樹脂で接着するとともに金属ケース
と金属板をはんだで接続することにより、放熱性に優れ
た経路ができるため、シールド効果を保ち、半導体回路
素子の温度を使用温度範囲以下に抑えられた混成集積回
路装置を構成することができるという効果が得られる。As described above, according to the present invention, the lead terminal is connected to the circuit board on which the semiconductor circuit element and the passive circuit element are mounted, and the circuit board is covered with the metal case. By inserting a metal plate that is surface-connected between the metal case and the metal case, by bonding the outer resin of the semiconductor circuit element and the metal plate with a resin having good thermal conductivity, and by connecting the metal case and the metal plate with solder, Since a path excellent in heat dissipation is formed, the effect of being able to configure a hybrid integrated circuit device in which the shielding effect is maintained and the temperature of the semiconductor circuit element is suppressed within the operating temperature range can be obtained.
【図１】本発明の一実施例による混成集積回路装置の構
造を示す断面図FIG. 1 is a sectional view showing the structure of a hybrid integrated circuit device according to an embodiment of the present invention.
【図２】同斜視図FIG. 2 is a perspective view of the same.
【図３】従来の混成集積回路装置の構造を示す断面図FIG. 3 is a cross-sectional view showing the structure of a conventional hybrid integrated circuit device.
【図４】同斜視図FIG. 4 is a perspective view of the same.
【符号の説明】 １１ 回路基板 １２ 半導体回路素子 １３ 受動回路素子 １５ 金属ケース １６ 金属板 １７ 樹脂 １８ はんだ[Explanation of reference numerals] 11 circuit board 12 semiconductor circuit element 13 passive circuit element 15 metal case 16 metal plate 17 resin 18 solder
───────────────────────────────────────────────────── フロントページの続き (72)発明者 遊佐 克彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuhiko Yusa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (1)
子および受動回路素子が実装された回路基板と、この回
路基板と外部回路装置とを接続するためのリード端子
と、上記回路基板を覆う金属ケースと、この金属ケース
と上記半導体回路素子の外装樹脂との間に配設された金
属板とから構成され、上記回路基板の両端のアースパタ
ーンと金属ケースをはんだにより接続し、かつ上記半導
体回路素子の外装樹脂に金属板を樹脂により結合すると
ともに、金属ケースと金属板とをはんだにより接続した
混成集積回路装置。1. A circuit board having a ground pattern on both ends, on which a semiconductor circuit element and a passive circuit element are mounted, lead terminals for connecting the circuit board and an external circuit device, and a metal case for covering the circuit board. And a metal plate disposed between the metal case and the exterior resin of the semiconductor circuit element, the ground patterns on both ends of the circuit board and the metal case are connected by solder, and the semiconductor circuit element A hybrid integrated circuit device in which a metal plate is bonded to the exterior resin by a resin and the metal case and the metal plate are connected by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22243992A JPH0697686A (en) | 1992-08-21 | 1992-08-21 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22243992A JPH0697686A (en) | 1992-08-21 | 1992-08-21 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0697686A true JPH0697686A (en) | 1994-04-08 |
Family
ID=16782422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22243992A Pending JPH0697686A (en) | 1992-08-21 | 1992-08-21 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697686A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093208A (en) * | 1996-09-18 | 1998-04-10 | Mitsubishi Cable Ind Ltd | Circuit board for optical communication |
| WO2016147345A1 (en) * | 2015-03-18 | 2016-09-22 | 株式会社テーケィアール | Power supply module and air conditioner outdoor unit using same |
| EP3107361A1 (en) * | 2014-03-18 | 2016-12-21 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
-
1992
- 1992-08-21 JP JP22243992A patent/JPH0697686A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093208A (en) * | 1996-09-18 | 1998-04-10 | Mitsubishi Cable Ind Ltd | Circuit board for optical communication |
| EP3107361A1 (en) * | 2014-03-18 | 2016-12-21 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
| EP3107361A4 (en) * | 2014-03-18 | 2017-03-29 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
| US10103087B2 (en) | 2014-03-18 | 2018-10-16 | Huawei Device (Dongguan) Co., Ltd. | Heat dissipation assembly and electronic device |
| US10497641B2 (en) | 2014-03-18 | 2019-12-03 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
| WO2016147345A1 (en) * | 2015-03-18 | 2016-09-22 | 株式会社テーケィアール | Power supply module and air conditioner outdoor unit using same |
| JPWO2016147345A1 (en) * | 2015-03-18 | 2018-01-18 | 株式会社テーケィアール | Power supply module and air conditioner outdoor unit using the same |
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