JPH0687393B2 - Method for manufacturing barrier of plasma display panel - Google Patents

Description

Detailed Description of the Invention a. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a barrier for a plasma display panel, and more particularly to a method of manufacturing a barrier that is narrower than before and capable of handling a large screen.

2. Description of the Related Art As shown in FIG. 3, a plasma display panel is composed of a substrate for anode 10 (front plate 11), a substrate for cathode 12 (rear plate 13) and a barrier 14. It emits light by causing a discharge in the space. At this time, a black barrier 14 is provided in order to prevent light crosstalk (crosstalk) and to create a screen contrast. The barrier has a width of about 100 μm and a height of about 1
The size is 00 μm or more, and in the case of an A4 size panel, about 640 barriers are formed. Conventionally, this barrier is formed by patterning a paste in which ceramic powder is mixed with an organic binder, a solvent, etc. by a thick film printing method, and then drying and firing.

However, such a manufacturing method generally has the following problems.

(1) Since it is formed by the thick film printing method, the thickness that can be formed by one printing is at most ten and several μm.
Repeated printing about 10 times or more was required to obtain a height of m or more. For this reason, it is very important to perform the alignment every time, which is a factor that deteriorates the yield.

(2) Since it is manufactured by repeating thick film printing, the barrier width is limited to about 100 μm, and it is difficult to cope with future fine patterning of 640 lines (barrier width of 100 μm or less).

(3) Since it is manufactured by thick film printing using a stainless mesh, the printing area is restricted by the mesh original plate.
It becomes difficult to deal with large screens that exceed the size.

An object of the present invention is to solve the above-mentioned problems of the prior art, that is, a narrow barrier can be reliably formed, and
It is intended to provide a method of forming a barrier for a plasma display that can cope with future large screens.

B. Means for Solving the Problems The first aspect of the present invention is to coat a glass substrate with a slip composed of 20 to 100 parts by weight of an ultraviolet-curable resin with respect to 100 parts by weight of ceramic powder, and to coat the non-slip layer of the coating layer. A plasma display panel, which is formed by masking the exposed portion and exposing, and repeating the above steps once or several times to form a barrier layer having a required height, patterning by development, and baking. It is a method of manufacturing a barrier.

A second aspect of the present invention is a step of coating the transfer paper with the slip, overcoating the coating layer with a resin to form a transfer film on the transfer paper, and peeling the transfer paper in water to form the transfer film. Is transferred onto a glass substrate and dried, the overcoat resin is peeled off, a non-exposed portion is masked and exposed to form a first layer, and a solvent for strengthening the interlayer adhesive force is formed directly on the first layer. A method of manufacturing a barrier for a plasma display panel, characterized in that the coating step and the above step are repeated several times to form a barrier layer having a required height, patterning by development, and baking to form the barrier layer. .

Operation First, a method of manufacturing a barrier for a plasma display panel according to the first aspect of the present invention will be described with reference to FIGS.

In FIG. A, a slip prepared by mixing a ceramic powder, an ultraviolet curable resin and a solvent is coated on a glass substrate 1 to form a coating layer 2 in an unexposed portion and dried.

In FIG. B, the glass mask 3 is used to selectively expose a part of the barrier to form an exposed portion 4 of the coating layer.

In FIG. C, a second coating layer is formed on the exposed coating layer in the same manner as the first layer, dried, and exposed.

In FIG. D, the process of FIG. C is repeated many times to form a coating layer to a required height.

In FIG. E, patterning is completed by selectively eluting the non-exposed area 5 with one development of the laminated area. Although FIG. D shows four layers, it may have five layers if necessary.

In FIG. F, the barrier 6 for the plasma display panel is formed by baking the patterned substrate.

Next, the manufacturing method according to the second invention will be described with reference to FIGS.
Will be explained.

In FIG. A, a slip obtained by mixing ceramic powder, an ultraviolet curable resin and a solvent is coated on dextrin and dried on a transfer paper 7 serving as a mount, and dried to form a coating layer 2 in the non-exposed portion.

In FIG. B, the release type overcoat resin 8 is coated directly on the coating layer 2 and dried to form a transfer film 9 on the transfer paper.

In FIG. C, the coating layer 2 reinforced by the peelable overcoat resin 8 peeled from the transfer paper by immersing the product formed in FIG. B in water is transferred onto the glass substrate 1 and dried to form the first unexposed portion. Form the layers.

In FIG. D, after peeling off the overcoat resin 8, the glass mask 3 is used to selectively expose a part of the barrier to form an exposed part 4.

In FIG. E, an interlayer adhesion strengthening solvent (not shown) is applied directly on the exposed first layer. The second layer is transferred onto the first layer in the same process as the first layer, dried, and then exposed to the coating layer from which the overcoat is peeled off to apply a solvent.

In FIG. F, the process of FIG. E is repeated many times to form a stack up to the required thickness. Of course, it is not necessary to apply a solvent for strengthening the interlayer adhesion on the uppermost layer.

In FIG. G, the entire stack is developed at one time, and the non-exposed areas are selectively eluted to complete the patterning.

In FIG. H, the barrier 6 for the plasma display panel is formed by baking the patterned substrate.

The first and second aspects of the present invention include forming a coating layer on a glass substrate by a doctor blade method and a roll coater method (first
Invention) or transfer method (second invention),
The common point is that after the multi-layer exposure is performed, it is developed and patterned at one time.

Further, according to the present method, it is needless to say that a stepped pattern can be formed by using glass masks having different intervals between unexposed portions.

The ceramic powder of the present invention may have a composition that is black and densified after firing and has an insulating property.

The present invention will be described in more detail with reference to examples below.

Example 1. Weight% SiO ₂ 15%, Al ₂ O ₃ 20%, Fe ₂ O ₃ 10%, Cr ₂ O ₃ 3.
%, MnO7%, CoO2%, PbO35%, to 100 parts by weight of ceramic powder of black consisting of B ₂ O ₃ 8%, 5~140 parts by weight ultraviolet curable resin and a mixture of solvents as shown in Table 1, the slip It was created.

LR-350R (manufactured by San Nopco Ltd.) was used as the ultraviolet curable resin. In the present invention, as the ultraviolet curing agent to be used, a resin composition obtained by blending a photoinitiator with a resin component having a function capable of being ultraviolet-cured by a photoinitiator, and further adding various additives as necessary is used. To do.

Although butyl cellosolve acetate was used as the solvent, a solvent such as ethyl cellosolve may be used.

After the slip was dried on a glass substrate, the first layer of the coating film was formed so as to have a thickness of 30 to 50 μm. The coating method may be either a doctor blade method or a roll coater method.

Next, after exposing the non-exposed portion of the first layer with a glass mask in advance, it was irradiated with ultraviolet rays using a high pressure mercury lamp to cure the exposed portion. The irradiation amount varies depending on the type of the ultraviolet curable resin used, but it is sufficient that the irradiation amount is such that the bottom of the coating layer is cured.

Then, coating, drying and exposure of the second to fifth layers were repeated to obtain a forming layer having a dry thickness of 150 to 200 μm. Next, the patterning is completed by developing the above-mentioned formation layer at once and eluting the non-exposed areas.

Although trichloroethane was used as the developing solution, it may be selected depending on the kind of the ultraviolet curable resin.

Next, the patterned glass substrate was heated at 10 ° C./mm and baked at 580 ° C. to form a barrier for a plasma display panel having a thickness of 100 to 120 μm. The firing temperature varies depending on the ceramic powder used and the material of the glass substrate, but may be any temperature at which the insulating paste is black and sufficiently densified. As shown in Table 1, when the amount of the ultraviolet curable resin with respect to the ceramic powder was less than 20%, peeling of the exposed cured portion occurred during patterning, and patterning was impossible. Further, when the amount of the UV resin exceeds 100%, swelling occurs during firing, and it is impossible to form a barrier. Therefore, the amount of the ultraviolet curable resin to be blended is set to 20 to 100 parts by weight with respect to 100 parts by weight of the ceramic powder.

Regarding the formation width, as shown in Table 1, when the glass mask width (ultraviolet ray passage width) is 100 μm, the line width (barrier width) is 110 μm, and when it is 50 μm, it is 60 μm, which is slightly smaller than the used glass mask width. However, a barrier with a width of about 1/2 of the conventional minimum width of 100 μm could be formed. Furthermore, in the conventional photolithography technology, when ceramic powder is mixed, the aspect ratio (height / width)
However, the present invention made it possible to form a pattern having an aspect ratio of 1 or more.

Example 2 The same slip as in Example 1 was printed and dried on a transfer paper by a thick film printing method to form a coating layer consisting of 30 to 50 μm ceramic powder and an ultraviolet curable resin. The coating method may be a roll coater method, a doctor blade method, or the like.

As the transfer paper, water-absorbent paper coated with dextrin of about 20 to 30 μm and dried was used. Next, apply an overcoat resin of approximately 100 to 150 μm directly on the coating layer and dry it.
It was used as a transfer film.

It is immersed in water, the transfer film is peeled off from the transfer paper, transferred onto a glass substrate, and dried. Further, after removing the overcoat resin from the transfer film, the glass mask was used to prevent the non-exposed areas from being exposed to light, and the coating layer was cured by irradiation with ultraviolet rays. When performing the transfer,
A solvent was applied between the layers. This is for the purpose of improving the adhesive strength between the layers, and in the case of those not coated with a solvent, line peeling was observed between the layers during development. As the solvent, acetone, methyl ethyl ketone or the like is used.

The transfer of the second layer to the fifth layer, drying, peeling of the overcoat resin, and solvent coating were repeated to obtain a forming layer having a dry thickness of 150 to 200 μm.

As the overcoat resin, it is sufficient if it does not dissolve the ultraviolet curable resin layer, and in this embodiment, LR-701 manufactured by Mitsubishi Rayon.
And LR-702 were used.

Next, the formation layer is developed at one time, and the non-exposed portions are eluted to complete the patterning. The patterned glass substrate is baked at 580 ℃ for 1 hour to 100-120μ
An m-thick barrier for a plasma display panel was formed. Regarding the UV curable resin amount and line width,
This was the same as in Example 1.

C. EFFECTS OF THE INVENTION According to the present invention, patterning with a narrow width, which is difficult with the conventional technique, and patterning with a high aspect ratio, which has been impossible even with the conventional ultraviolet curing technique, have become possible. In addition, since the photolithography method is used for line formation, it is possible to deal with large screens without being restricted by the mesh original plate like the printing method.

[Brief description of drawings]

FIG. 1 shows an example of the first manufacturing method of the present invention in A to F. FIG. 2 shows an example of the second manufacturing method of the present invention in A to H. FIG. 3 is an example of the structure of a plasma display. 1.Glass substrate, 2.Coating layer (unexposed part), 3.Glass mask, 4.Coating layer (exposed part), 5.Coating layer (non-exposed part), 6.Barrier, 7.Transfer paper, 8. Release type overcoat resin, 9. Transfer film, 10. Anode, 11. Front plate, 12. Cathode, 13. Back plate, 14. Barrier.

Claims (2)

[Claims] 1. A step of coating a glass substrate with a slip comprising an ultraviolet curable resin amount of 20 to 100 parts by weight with respect to 100 parts by weight of a ceramic powder, masking an unexposed portion of the coating layer, and exposing the same. A method of manufacturing a barrier for a plasma display panel, which comprises stacking the steps one or several times to form a barrier layer having a required height, patterning by development, and baking to form a barrier layer. 2. A step of coating the slip according to claim 1 on a transfer paper, overcoating the coating layer with a resin to form a transfer film on the transfer paper, and peeling the transfer paper in water to perform the transfer. After transferring the film for use on a glass substrate and drying, peeling off the overcoat resin, exposing the non-exposed portion with a mask to form a first layer, and
It is characterized in that it is formed by repeating a step of applying a solvent for strengthening interlayer adhesion and a step of repeating the above steps several times to form a barrier layer having a required height immediately above the layer, patterning by development, and baking. A method for manufacturing a plasma display panel barrier.