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JPH0668024B2 - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPH0668024B2
JPH0668024B2 JP16466886A JP16466886A JPH0668024B2 JP H0668024 B2 JPH0668024 B2 JP H0668024B2 JP 16466886 A JP16466886 A JP 16466886A JP 16466886 A JP16466886 A JP 16466886A JP H0668024 B2 JPH0668024 B2 JP H0668024B2
Authority
JP
Japan
Prior art keywords
group
bis
phenyl
thermosetting resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16466886A
Other languages
Japanese (ja)
Other versions
JPS6354435A (en
Inventor
典正 山谷
信史 古賀
正博 太田
彰宏 山口
Original Assignee
三井東圧化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井東圧化学株式会社 filed Critical 三井東圧化学株式会社
Priority to JP16466886A priority Critical patent/JPH0668024B2/en
Priority to CA000541494A priority patent/CA1270998A/en
Priority to US07/071,161 priority patent/US4831102A/en
Priority to EP87306106A priority patent/EP0253586B1/en
Priority to DE3751839T priority patent/DE3751839T2/en
Priority to DE8787306106T priority patent/DE3781843T2/en
Priority to AU75523/87A priority patent/AU589020B2/en
Priority to EP91203079A priority patent/EP0480543B1/en
Priority to KR1019870007622A priority patent/KR910004043B1/en
Publication of JPS6354435A publication Critical patent/JPS6354435A/en
Priority to US07/304,558 priority patent/US4960852A/en
Publication of JPH0668024B2 publication Critical patent/JPH0668024B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は耐衝撃性と可撓性に優れた新規な熱硬化性樹脂
組成物に関する。
The present invention relates to a novel thermosetting resin composition having excellent impact resistance and flexibility.

〔従来の技術〕[Conventional technology]

従来から、イミド構造を有する熱硬化性樹脂は電気絶縁
性、耐熱性、成形品の寸法安定性に優れた性能を有する
為、産業上広く利用されている。
BACKGROUND ART Conventionally, a thermosetting resin having an imide structure has been widely used in industry because it has excellent electrical insulation properties, heat resistance, and dimensional stability of molded products.

然しながら、芳香族系ビスマレイミドを使用してなる熱
硬化性樹脂は不溶不融で、しかも耐熱性に優れた素材で
あるが、耐衝撃性及び可撓性に乏しいという欠点があっ
た。
However, the thermosetting resin using the aromatic bismaleimide is a material that is insoluble and infusible and has excellent heat resistance, but has a drawback that it is poor in impact resistance and flexibility.

この為、芳香族系ビスマレイミドの耐衝撃性及び可撓性
を改良する方法として、芳香族系ビスマレイミドに芳香
族系ジアミンを使用する試みがある。例えば、N,N′−
(4,4′−メチレンジフェニレン)ビスマレイミドと4,
4′−ジアミノジフェニルメタンとからなるポリアミノ
ビスマレイミド樹脂(ローヌ・プーラン社製、商品名
ケルイミド)は耐衝撃性及び可撓性が芳香族系ビスマレ
イミド単独のものよりも優れている為、含浸ワニス、積
層板、成形品等に広く用いられている。
Therefore, as a method for improving the impact resistance and flexibility of the aromatic bismaleimide, there is an attempt to use an aromatic diamine for the aromatic bismaleimide. For example, N, N′−
(4,4'-methylenediphenylene) bismaleimide and 4,
Polyamino bismaleimide resin consisting of 4'-diaminodiphenylmethane (Rhone Poulenc Company, trade name
Kelimide) is more widely used for impregnating varnishes, laminates, molded products, etc., because it is superior in impact resistance and flexibility to aromatic bismaleimide alone.

しかしながら、これらの熱硬化性樹脂は、未だ耐衝撃性
及び可撓性の面から満足のいくものではなかった。
However, these thermosetting resins have not been satisfactory in terms of impact resistance and flexibility.

〔発明が解決しようとしている問題点〕[Problems that the invention is trying to solve]

本発明の目的は、従来の耐熱性を維持し、然も耐衝撃性
及び可撓性に優れた、強靱性を有する熱硬化性樹脂を提
供することにある。
It is an object of the present invention to provide a thermosetting resin that maintains the conventional heat resistance, is excellent in impact resistance and flexibility, and has toughness.

〔問題点を解決するための手段〕[Means for solving problems]

本発明者らは、前記目的を達成するために鋭意研究を行
った結果、新規なビスマレイミド化合物と特定量のジア
ミン化合物よりなる熱硬化性樹脂組成物が、特に有効で
あることを見出し、本発明を完成させた。
As a result of intensive studies to achieve the above objects, the present inventors have found that a thermosetting resin composition comprising a novel bismaleimide compound and a specific amount of a diamine compound is particularly effective, and Completed the invention.

すなわち、本発明の熱硬化性樹脂組成物は (1)一般式(I) (式中、Rは よりなる2価の基を表わし、Xは直結、炭素数1〜10の
2価の炭化水素基、六フッ素化されたイソプロピリデン
基、カルボニル基、チオ基、スルフィニル基、スルホニ
ル基又はオキシドから成る群より選ばれた基を表わ
す。) にて表わされるビスマレイミド化合物と 一般式(II) (式中、Rは よりなる2価の基を表わし、Xは直結、炭素数1〜10の
2価の炭化水素基、六フッ素化されたイソプロピリデン
基、カルボニル基、チオ基、スルフィニル基、スルホニ
ル基又はオキシドから成る群より選ばれた基を表わ
す。) にて表わされるジアミン化合物とを含み、かつビスマレ
イミド化合物(I)とジアミン化合物(II)のモル比が1
0:1〜1:1.2の範囲の組成比であることを特徴と
する熱硬化性樹脂組成物である。
That is, the thermosetting resin composition of the present invention is (1) the general formula (I) (In the formula, R is Represents a divalent group consisting of, X is a direct bond, a divalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide. Represents a group selected from the group. ) And a bismaleimide compound represented by the general formula (II) (In the formula, R is Represents a divalent group consisting of, X is a direct bond, a divalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide. Represents a group selected from the group. ) And the molar ratio of the bismaleimide compound (I) and the diamine compound (II) is 1
A thermosetting resin composition having a composition ratio in the range of 0: 1 to 1: 1.2.

前記一般式(I)で表わされる新規なビスマレイミド化合
物は通常公知の方法により前記一般式(II)で表わされる
ジアミン化合物と無水マレイン酸を縮合・脱水反応させ
て、容易に製造でき具体的には、1,3−ビス(3−マレ
イミドフェノキシ)ベンゼン、ビス〔4−(3−マレイ
ミドフェノキシ)フェニル〕メタン、1,1−ビス〔4−
(3−マレイミドフェノキシ)フェニル〕エタン、1,2
−ビス〔4−(3−マレイミドフェノキシ)フェニル〕
エタン、2,2−ビス〔4−(3−マレイミドフェノキ
シ)フェニル〕プロパン、2,2−ビス〔4−(3−マレ
イミドフェノキシ)フェニル〕ブタン、2,2−ビス〔4
−(3−マレイミドフェノキシ)フェニル〕1,1,1,3,3,
3−ヘキサフルオロプロパン、4,4′−ビス(3−マレイ
ミドフェノキシ)ビフェニル、ビス〔4−(3−マレイ
ミドフェノキシ)フェニル〕ケトン、ビス〔4−(3−
マレイミドフェノキシ)フェニル〕スルフィド、ビス
〔4−(3−マレイミドフェノキシ)フェニル〕スルホ
キシド、ビス〔4−(3−マレイミドフェノキシ)フェ
ニル〕スルホン、ビス〔4−(3−マレイミドフェノキ
シ)フェニルエーテル等があげられ、これらは単独ある
いは二種以上混合して用いられる。
The novel bismaleimide compound represented by the general formula (I) can be easily produced by subjecting a diamine compound represented by the general formula (II) and maleic anhydride to a condensation / dehydration reaction by a generally known method. Is 1,3-bis (3-maleimidophenoxy) benzene, bis [4- (3-maleimidophenoxy) phenyl] methane, 1,1-bis [4-
(3-maleimidophenoxy) phenyl] ethane, 1,2
-Bis [4- (3-maleimidophenoxy) phenyl]
Ethane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] propane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] butane, 2,2-bis [4
-(3-maleimidophenoxy) phenyl] 1,1,1,3,3,
3-hexafluoropropane, 4,4'-bis (3-maleimidophenoxy) biphenyl, bis [4- (3-maleimidophenoxy) phenyl] ketone, bis [4- (3-
Maleimidophenoxy) phenyl] sulfide, bis [4- (3-maleimidophenoxy) phenyl] sulfoxide, bis [4- (3-maleimidophenoxy) phenyl] sulfone, bis [4- (3-maleimidophenoxy) phenyl ether and the like. These may be used alone or in admixture of two or more.

本発明で使用されるジアミン化合物は具体的には、1,3
−ビス(3−アミノフェノキシ)ベンゼン、ビス〔4−
(3−アミノフェノキシ)フェニル〕メタン、1,1−ビ
ス〔4−(3−アミノフェノキシ)フェニル〕エタン、
1,2−ビス〔4−(3−アミノフェノキシ)フェニル〕
エタン、2,2−ビス〔4−(3−アミノフェノキシ)フ
ェニル〕プロパン、2,2−ビス〔4−(3−アミノフェ
ノキシ)フェニル〕ブタン、2,2−ビス〔4−(3−ア
ミノフェノキシ)フェニル〕1,1,1,3,3,3−ヘキサフル
オロプロパン、4,4′−ビス(3−アミノフェノキシ)
ビフェニル、ビス〔4−(3−アミノフェノキシ)フェ
ニル〕ケトン、ビス〔4−(3−アミノフェノキシ)フ
ェニル〕スルフィド、ビス〔4−(3−アミノフェノキ
シ)フェニル〕スルホキシド、ビス〔4−(3−アミノ
フェノキシ)フェニル〕スルホン、ビス〔4−(3−ア
ミノフェノキシ)フェニル〕エーテル等があげられ、こ
れらは単独あるいは二種以上混合して用いられる。
The diamine compound used in the present invention is specifically 1,3
-Bis (3-aminophenoxy) benzene, bis [4-
(3-aminophenoxy) phenyl] methane, 1,1-bis [4- (3-aminophenoxy) phenyl] ethane,
1,2-bis [4- (3-aminophenoxy) phenyl]
Ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] butane, 2,2-bis [4- (3-amino) Phenoxy) phenyl] 1,1,1,3,3,3-hexafluoropropane, 4,4'-bis (3-aminophenoxy)
Biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl] sulfoxide, bis [4- (3 -Aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] ether and the like can be mentioned, and these can be used alone or in admixture of two or more.

これらのジアミン化合物は、それぞれ対応するビスフェ
ノール類とm−ジニトロベンゼンを非プロトン性極性溶
媒中、塩基の存在下に縮合後、還元することにより高純
度、高収率で工業的に有利に製造できる(特願昭60-325
68、特願昭60-59560)。
These diamine compounds can be industrially advantageously produced in high purity and high yield by condensing the corresponding bisphenols and m-dinitrobenzene in an aprotic polar solvent in the presence of a base and then reducing the condensation. (Japanese Patent Application Sho 60-325
68, Japanese Patent Application 60-59560).

上記式(I)で表わされるビスマレイミド化合物と式(I
I)で表わされるジアミン化合物より熱硬化性樹脂組成物
を得るが、この場合、以下に示す各種の方法が使用でき
る。
The bismaleimide compound represented by the above formula (I) and the formula (I
A thermosetting resin composition is obtained from the diamine compound represented by I). In this case, various methods shown below can be used.

(1)ビスマレイミドとジアミンを固体状で粉砕混合した
もの、あるいはこれを加熱処理して、プレポリマーとし
た後、粉砕してペレット又は粉状にする。この場合の加
熱条件はプレポリマーの段階まで部分硬化させる条件が
よく、一般には70〜220℃の温度で5〜240分、望ましく
は80〜200℃の温度で10〜180分とすることが適当であ
る。
(1) Bismaleimide and diamine are pulverized and mixed in a solid state, or this is heat-treated into a prepolymer and then pulverized into pellets or powder. In this case, the heating condition is preferably such that the prepolymer stage is partially cured. Generally, the temperature is 70 to 220 ° C. for 5 to 240 minutes, and the temperature is preferably 80 to 200 ° C. for 10 to 180 minutes. Is.

(2)ビスマレイミドとジアミンを有機溶媒に溶解させ、
次いで貧溶媒中に排出し析出してきた結晶をロ過乾燥し
てペレット又は粉状とするか、又は有機溶媒に溶解後、
加熱処理によりプレポリマーの段階まで部分硬化させた
後、貧溶媒中に排出し析出してきた結晶をロ過乾燥して
ペレット又は粉状とする。この場合の条件も(1)に準ず
る。使用可能な有機溶媒としては両成分と実質的に反応
しない溶媒という点で制限を受けるが、このほかに両反
応成分に対する良溶媒であることが望ましい。通常、用
いられる反応溶媒は塩化メチレン、ジクロロエタン、ト
リクロロエチレンなどのハロゲン化炭化水素、アセト
ン、メチルエチルケトン、シクロヘキサノン、ジイソプ
ロピルケトンなどのケトン類、テトラヒドロフラン、ジ
オキサン、メチルセロソルブなどのエーテル類、ベンゼ
ン、トルエン、クロロベンゼンなどの芳香族化合物、ア
セトニトリル、N,N−ジメチルホルムアミド、N,N−ジメ
チルアセトアミド、ジメチルスルホキシド、N−メチル
−2−ピロリドン、1,3−ジメチル−2−イミダゾリジ
ノンなどの非プロトン性極性溶媒などである。
(2) dissolving bismaleimide and diamine in an organic solvent,
Next, the crystals that have been discharged and precipitated in a poor solvent are filtered and dried into pellets or powder, or after being dissolved in an organic solvent,
After partially curing to the prepolymer stage by heat treatment, the crystals are discharged into a poor solvent and precipitated to dry them into pellets or powder. The conditions in this case also conform to (1). The usable organic solvent is limited in that it does not substantially react with both components, but it is desirable that it is a good solvent for both reaction components. Usually, reaction solvents used are halogenated hydrocarbons such as methylene chloride, dichloroethane and trichloroethylene, ketones such as acetone, methyl ethyl ketone, cyclohexanone and diisopropyl ketone, ethers such as tetrahydrofuran, dioxane and methyl cellosolve, benzene, toluene and chlorobenzene. Aprotic polar solvents such as aromatic compounds, acetonitrile, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone And so on.

なお、本発明によるビスマレイミドとジアミンよりなる
組成物に、本発明の目的をそこなわない範囲で酸化防止
剤および熱安定剤、紫外線吸収剤、難燃助剤、帯電防止
剤、滑剤、着色剤などの通常の添加剤を1種以上添加す
ることができる。
In addition, in the composition consisting of bismaleimide and diamine according to the present invention, an antioxidant and a heat stabilizer, an ultraviolet absorber, a flame retardant aid, an antistatic agent, a lubricant, and a colorant within a range that does not impair the object of the present invention. One or more of the usual additives such as can be added.

また、他の熱硬化性樹脂(例えば、フェノール樹脂、エ
ポキシ樹脂など)熱可塑性樹脂(例えば、ポリエチレ
ン、ポリプロピレン、ポリアミド、ポリカーボネート、
ポリサルホン、ポリエーテルサルホン、ポリエーテルエ
ーテルケトン、変性ポリフェニレンオキシド、ポリフェ
ニレンサルファイドなど)または、ガラス繊維、炭素繊
維、芳香族ポリアミド繊維、アルミナ繊維、チタン酸カ
リウム繊維などの補強材やクレー、マイカ、シリカ、グ
ラファイト、ガラスビーズ、アルミナ、炭酸カルシウム
などの充填材もその目的に応じて適当量を配合すること
も可能である。
In addition, other thermosetting resins (for example, phenol resin, epoxy resin, etc.), thermoplastic resins (for example, polyethylene, polypropylene, polyamide, polycarbonate,
Polysulfone, polyethersulfone, polyetheretherketone, modified polyphenylene oxide, polyphenylene sulfide, etc.) or reinforcing materials such as glass fiber, carbon fiber, aromatic polyamide fiber, alumina fiber, potassium titanate fiber, clay, mica, silica Fillers such as graphite, glass beads, alumina, and calcium carbonate can also be added in appropriate amounts according to the purpose.

式(I)で表わされるビスマレイミド化合物と式(II)で表
わされるジアミン化合物の使用割合はモル比10:1〜
1:1.2の範囲で使用するのが好ましい。ジアミン化合
物の使用割合が少ないと、硬化物にした場合、良好な耐
衝撃性及び可撓性を有するものが得られない。逆に多す
ぎると硬化物の耐熱性に悪影響を与える。
The molar ratio of the bismaleimide compound represented by the formula (I) to the diamine compound represented by the formula (II) is 10: 1 to 1: 1.
It is preferably used in the range of 1: 1.2. When the proportion of the diamine compound used is small, a cured product cannot have good impact resistance and flexibility. On the contrary, if the amount is too large, the heat resistance of the cured product is adversely affected.

本発明の熱硬化性樹脂組成物は、圧縮成形法、トランス
ファー成形法、押出成形法、射出成形法等公知の成形法
により成形され実用に供される。
The thermosetting resin composition of the present invention is molded by a known molding method such as a compression molding method, a transfer molding method, an extrusion molding method, and an injection molding method, and put into practical use.

〔実施例〕〔Example〕

以下、本発明を実施例により説明する。 Hereinafter, the present invention will be described with reference to examples.

合成例−1 攪拌機、温度計を装備した反応フラスコに、無水マレイ
ン酸43.2g(0.44モル)とアセトン130gを装入し溶解
する。これに4,4′−ビス(3−アミノフェノキシ)ビ
フェニル73.6g(0.2モル)をアセトン515gに溶解した
溶液を室温で滴下し、さらに、23〜27℃で3時間攪拌す
る。反応終了後、生成した結晶を濾過、アセトン洗浄
後、乾燥してビスマレアミド酸を黄色結晶として得た。
Synthesis example-1 A reaction flask equipped with a stirrer and a thermometer is charged with 43.2 g (0.44 mol) of maleic anhydride and 130 g of acetone and dissolved. A solution of 73.6 g (0.2 mol) of 4,4'-bis (3-aminophenoxy) biphenyl dissolved in 515 g of acetone was added dropwise thereto at room temperature, and the mixture was further stirred at 23 to 27 ° C for 3 hours. After the reaction was completed, the generated crystals were filtered, washed with acetone, and dried to obtain bismaleamic acid as yellow crystals.

収量110.6g(収率98.0%)、mp183〜185℃ IR(KBr,cm-1):1720(カルボニル基)、1255(エーテル
結合) このようにして得られたビスマレアミド酸112gをアセ
トン300gに懸濁させ、トリエチルアミン9.6gを添加
し、室温で30分間攪拌する。
Yield 110.6g (Yield 98.0%), mp183-185 ℃ IR (KBr, cm -1 ): 1720 (carbonyl group), 1255 (ether bond) 112 g of the bismaleamic acid thus obtained was suspended in 300 g of acetone, 9.6 g of triethylamine was added, and the mixture was stirred at room temperature for 30 minutes. To do.

酸化マグネシウム(II)0.4g、酢酸コバルト(II)・4H2O
0.04gを添加後、無水酢酸52.0gを25℃で30分かけて滴
下し、更に3時間攪拌する。反応終了後、生成した結晶
を濾過、洗浄後、乾燥して4,4′−ビス(3−マレイミ
ドフェノキシ)ビフェニルを淡黄色結晶として得た。
Magnesium (II) oxide 0.4g, Cobalt (II) acetate ・ 4H 2 O
After adding 0.04 g, 52.0 g of acetic anhydride is added dropwise at 25 ° C. over 30 minutes, and the mixture is further stirred for 3 hours. After the reaction was completed, the formed crystals were filtered, washed and dried to obtain 4,4'-bis (3-maleimidophenoxy) biphenyl as pale yellow crystals.

収量84.5g(収率80.0%)、mp207〜209℃ IR(KBr,cm-1):1720と1710(イミド結合)、1250(エー
テル結合) MS(FD法、m/e):528(M+) 5%重量減少温度(空気中):459℃ 合成例−2 攪拌機、温度計を装備した反応フラスコに、無水マレイ
ン酸10.8g(0.11モル)とアセトン32gを装入し溶解す
る。これに2,2−ビス〔4−(3−アミノフェノキシ)
フェニル〕プロパン20.5g(0.05モル)をアセトン41g
に溶解した溶液を室温で滴下し、さらに、23〜27℃で3
時間攪拌する。反応終了後、生成した結晶を濾過、アセ
トン洗浄後、乾燥してビスマレアミド酸を黄色結晶とし
て得た。
Yield 84.5g (Yield 80.0%), mp207-209 ℃ IR (KBr, cm -1 ): 1720 and 1710 (imide bond), 1250 (ether bond) MS (FD method, m / e): 528 (M + ) 5% weight loss temperature (in air): 459 ° C Synthesis Example-2 A reaction flask equipped with a stirrer and a thermometer was charged with 10.8 g (0.11 mol) of maleic anhydride and 32 g of acetone and dissolved. 2,2-bis [4- (3-aminophenoxy)]
Phenyl] propane 20.5 g (0.05 mol) with acetone 41 g
The solution dissolved in was added dropwise at room temperature, and at 3
Stir for hours. After the reaction was completed, the generated crystals were filtered, washed with acetone, and dried to obtain bismaleamic acid as yellow crystals.

収量29.7g(収率98.0%)、mp169〜171℃ IR(KBr,cm-1):3280と3220(NH)、1700(カルボキシル
基)、1580と1550(アミド結合) MS(FD法、m/e):608(M+2)、510、491、411 このようにして得られたビスマレアミド酸38gをアセト
ン92gに懸濁させ、トリエチルアミン3gを添加し、室温
で30分攪拌する。
Yield 29.7g (Yield 98.0%), mp169-171 ℃ IR (KBr, cm -1 ): 3280 and 3220 (NH), 1700 (carboxyl group), 1580 and 1550 (amide bond) MS (FD method, m / e): 608 (M + 2), 510, 491, 411 38 g of the bismaleamic acid thus obtained is suspended in 92 g of acetone, 3 g of triethylamine is added, and the mixture is stirred at room temperature for 30 minutes.

酸化マグネシウム(II)0.13g、酢酸コバルト(II)・4H2O
0.013gを添加後、無水酢酸16gを25℃で30分かけて滴
下し、更に4時間攪拌する。反応終了後、生成した結晶
を濾過、メタノール洗浄後、40℃で減圧乾燥して2,2−
ビス〔4−(3−マレイミドフェノキシ)フェニル〕プ
ロパンを淡黄色結晶として得た。
Magnesium (II) oxide 0.13g, cobalt (II) acetate ・ 4H 2 O
After adding 0.013 g, 16 g of acetic anhydride is added dropwise at 25 ° C. over 30 minutes, and the mixture is further stirred for 4 hours. After the reaction was completed, the formed crystals were filtered, washed with methanol, and dried under reduced pressure at 40 ° C. for 2,2-
Bis [4- (3-maleimidophenoxy) phenyl] propane was obtained as pale yellow crystals.

収量30g(収率83.9%)、mp161〜164℃ IR(KBr,cm-1):1775と1715(イミド結合)1255(エーテ
ル結合) MS(FD法、m/e):571(M+1) 5%重量減少温度(空気中):447℃ 合成例−3 攪拌機、温度計を装備した反応フラスコに、無水マレイ
ン酸37.8g(0.385モル)とアセトン113gを装入し溶解
する。これにビス〔4−(3−アミノフェノキシ)フェ
ニル〕スルフィド70g(0.1 75モル)をアセトン140g
に溶解した溶液を室温で滴下し、さらに、25℃で3時間
攪拌する。生成した結晶を濾過、洗浄後、乾燥してビス
マレアミド酸を淡黄色結晶として得た。
Yield 30g (Yield 83.9%), mp 161-164 ℃ IR (KBr, cm -1 ): 1775 and 1715 (imide bond) 1255 (ether bond) MS (FD method, m / e): 571 (M + 1) 5% weight loss temperature (in air): 447 ° C Synthesis Example 3 A reaction flask equipped with a stirrer and a thermometer was charged with 37.8 g (0.385 mol) of maleic anhydride and 113 g of acetone and dissolved. 70 g (0.175 mol) of bis [4- (3-aminophenoxy) phenyl] sulfide was added to 140 g of acetone.
The solution dissolved in is added dropwise at room temperature and further stirred at 25 ° C. for 3 hours. The produced crystals were filtered, washed, and dried to obtain bismaleamic acid as pale yellow crystals.

収量104g(収率99.6%)、mp202〜204℃ IR(KBr,cm-1):3280(NH)、1690(カルボニル基)、1240
(エーテル結合) MS(FD法、m/e):596、400 攪拌機、温度計を装備した反応フラスコに、このように
して得られたビスマレアミド酸104gをアセトン300gに
懸濁させる。
Yield 104g (Yield 99.6%), mp202-204 ℃ IR (KBr, cm -1 ): 3280 (NH), 1690 (carbonyl group), 1240
(Ether bond) MS (FD method, m / e): 596, 400 In a reaction flask equipped with a stirrer and a thermometer, 104 g of the bismaleamic acid thus obtained is suspended in 300 g of acetone.

トリエチルアミン8.4gを添加後、25℃で30分間攪拌す
る。
After adding 8.4 g of triethylamine, the mixture is stirred at 25 ° C. for 30 minutes.

酸化マグネシウム(II)0.35g、酢酸コバルト(II)・4H2O
0.035gを添加後、無水酢酸45.5gを滴下し、更に25℃
で2時間攪拌する。
Magnesium (II) oxide 0.35g, Cobalt (II) acetate ・ 4H 2 O
After adding 0.035 g, add 45.5 g of acetic anhydride dropwise and further at 25 ° C.
Stir for 2 hours.

反応終了後、反応液を水1中に攪拌しながら滴下す
る。生成した結晶を濾過、水洗後、乾燥してビス〔4−
(3−マレイミドフェノキシ)フェニル〕スルフィドを
淡黄色結晶として得た。
After completion of the reaction, the reaction solution is dropped into water 1 with stirring. The formed crystals are filtered, washed with water, dried and then bis [4-
(3-Maleimidophenoxy) phenyl] sulfide was obtained as pale yellow crystals.

収量92g(収率93.8%)、 この結晶をアセトンより再結晶して純品を得た。Yield 92 g (yield 93.8%). This crystal was recrystallized from acetone to obtain a pure product.

mp:64〜67℃ IR(KBr,cm-1):1770shと1730(イミド結合1260(エーテ
ル結合)、 MS(FD法,m/e):560 5%重量減少温度(空気中):434℃ 実施例−1〜4 攪拌機、還流冷却器および窒素導入管を備えたステンレ
ス製容器に、4,4′−ビス(3−マレイミドフェノキ
シ)ビフェニルと4,4′−ビス(3−アミノフェノキ
シ)ビフェニルを各々表−1に示した仕込みモル比で装
入し、180℃で20分加熱溶融反応した。その後、室温ま
で冷却し、褐色透明なガラス状に固化した反応生成物を
砕いて取り出し、さらに乳鉢で粉砕して60メッシュのフ
ルイに通し、部分硬化したポリアミノビスマレイミド型
熱硬化性樹脂組成物を得た。
mp: 64-67 ℃ IR (KBr, cm −1 ): 1770sh and 1730 (imide bond 1260 (ether bond), MS (FD method, m / e): 560 5% weight loss temperature (in air): 434 ° C. Examples-1 to 4 In a stainless steel container equipped with a stirrer, a reflux condenser and a nitrogen inlet tube, 4,4'-bis (3-maleimidophenoxy) biphenyl and 4,4'-bis (3-aminophenoxy) biphenyl are shown in Table-1. The charged molar ratio shown was charged, and the mixture was heated and melted for 20 minutes at 180 ° C. Then, cooled to room temperature, the reaction product solidified into a brown transparent glass was crushed and taken out, and further crushed in a mortar to 60 It was passed through a mesh screen to obtain a partially cured polyamino bismaleimide type thermosetting resin composition.

該組成物を180℃に熱した金型(10×80×4mm)に加熱
溶融されながら、充填した後、圧力50kg/cm2、200℃で3
0分保持し、圧縮成形した。その後室温まで冷却した
後、金型内より一次成形物を取り出し、さらに250℃の
熱風ギャーオーブン中で4時間ポストキュアーして、ア
イゾット衝撃試験片及び曲げ試験片を得た。アイゾット
衝撃試験(ノッチ無し)はASTMD-256に、曲げ試験はAST
MD-790に準じて行い、合わせて成形試験片の5%重量減少
温度を測定したところ表−1の結果を得た。
The composition was charged while being heated and melted in a mold (10 × 80 × 4 mm) heated to 180 ° C., and then the pressure was 50 kg / cm 2 , and the temperature was 3 at 200 ° C.
It was held for 0 minutes and compression molded. Then, after cooling to room temperature, the primary molded product was taken out from the mold and post-cured for 4 hours in a hot air gear oven at 250 ° C. to obtain an Izod impact test piece and a bending test piece. Izod impact test (without notch) is ASTM D-256, bending test is AST
According to MD-790, the 5% weight loss temperature of the molded test piece was also measured and the results shown in Table-1 were obtained.

実施例−5 攪拌機、還流冷却器および窒素導入管を備えたステンレ
ス製容器に、4,4′−ビス(3−マレイミドフェノキ
シ)ビフェニルと4,4′−ビス(3−アミノフェノキ
シ)ビフェニルを各々表−1に示した仕込みモル比で装
入し、これに樹脂濃度が55重量%になる量のN−メチル
−2−ピロリドンを注入して、両成分を溶解した後、13
0℃で50分加熱反応した。得られた褐色透明ワニスを攪
拌している水中に滴下した後、析出した沈殿をロ過、水
洗し、80℃15時間熱風乾燥した。これを110℃で20分、
更に130℃で20分乾燥した後、乳鉢で粉砕して、60メッ
シュのフルイに通し、部分硬化したポリアミノビスマレ
イミド型熱硬化性樹脂組成物を得た。
Example-5 4,4'-bis (3-maleimidophenoxy) biphenyl and 4,4'-bis (3-aminophenoxy) biphenyl were placed in a stainless steel container equipped with a stirrer, a reflux condenser and a nitrogen inlet tube, respectively. After charging with the charging molar ratio shown in Table-1, and injecting N-methyl-2-pyrrolidone in an amount such that the resin concentration becomes 55% by weight to dissolve both components, 13
The reaction was carried out by heating at 0 ° C for 50 minutes. The brown transparent varnish obtained was dropped into water with stirring, and the deposited precipitate was filtered, washed with water, and dried with hot air at 80 ° C. for 15 hours. 20 minutes at 110 ℃,
After further drying at 130 ° C. for 20 minutes, it was ground in a mortar and passed through a 60-mesh sieve to obtain a partially cured polyamino bismaleimide type thermosetting resin composition.

以下実施例−1〜4と同様の操作をして表−1の結果を
得た。
Then, the same operation as in Examples-1 to 4 was performed to obtain the results shown in Table-1.

実施例−6〜20及び比較例−1〜2 表−1に示したビスマレイミドとジアミンを用いて、表
−1に示した仕込みモル比で実施例−1〜4と同様の操
作をして表−1の結果を得た。
Examples-6 to 20 and Comparative Examples-1 to 2 Using bismaleimide and diamine shown in Table-1, the same operation as in Examples-1 to 4 was carried out at the charged molar ratio shown in Table-1. The results shown in Table 1 were obtained.

表−1の結果より本発明による熱硬化性樹脂組成物はア
イゾット衝撃値が高く、しかも曲げ強度、曲げ弾性率も
高く、耐衝撃性と可撓性に優れた材料であり、さらに5
%重量減少温度も390℃以上と優れた耐熱性を有してい
る。
From the results in Table 1, the thermosetting resin composition according to the present invention is a material having a high Izod impact value, a high bending strength and a high bending elastic modulus, and excellent impact resistance and flexibility.
It also has excellent heat resistance with a% weight loss temperature of 390 ° C or higher.

〔発明の効果〕 本発明の熱硬化性樹脂は優れた耐熱性、耐衝撃性及び可
撓性を有しており、電気、電子部品、各種構造部材、摺
動部品など広くその用途が期待され、産業上の利用効果
は大きい。
[Advantages of the Invention] The thermosetting resin of the present invention has excellent heat resistance, impact resistance and flexibility, and is expected to be widely used for electric, electronic parts, various structural members, sliding parts and the like. The industrial use effect is great.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】一般式(I) (式中、Rは よりなる2価の基を表し、Xは直結、炭素数1〜10の2
価の炭化水素基、六フッ素化されたイソプピリデン基、
カルボニル基、チオ基、スルフィニル基、スルホニル基
又はオキシドから成る群より選ばれた基を表す。) にて表されるビスマレイミド化合物と、 一般式(II) (式中、Rは よりなる2価の基を表し、Xは直結、炭素数1〜10の2
価の炭化水素基、六フッ素化されたイソプピリデン基、
カルボニル基、チオ基、スルフィニル基、スルホニル基
又はオキシドから成る群より選ばれた基を表す。) にて表されるジアミン化合物とを含み、かつビスマレイ
ミド化合物(I)とジアミン化合物(II)のモル比が10:
1〜1:1.2の範囲の組成比であることを特徴とする
熱硬化性樹脂組成物。
1. A general formula (I) (In the formula, R is Represents a divalent group consisting of, X is a direct bond, 2 having 1 to 10 carbon atoms
Valent hydrocarbon group, hexafluorinated isopylidene group,
It represents a group selected from the group consisting of a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group and an oxide. ) And a bismaleimide compound represented by the general formula (II) (In the formula, R is Represents a divalent group consisting of, X is a direct bond, 2 having 1 to 10 carbon atoms
Valent hydrocarbon group, hexafluorinated isopylidene group,
It represents a group selected from the group consisting of a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group and an oxide. ) And the molar ratio of the bismaleimide compound (I) and the diamine compound (II) is 10:
A thermosetting resin composition having a composition ratio in the range of 1 to 1: 1.2.
JP16466886A 1986-07-15 1986-07-15 Thermosetting resin composition Expired - Fee Related JPH0668024B2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP16466886A JPH0668024B2 (en) 1986-07-15 1986-07-15 Thermosetting resin composition
CA000541494A CA1270998A (en) 1986-07-15 1987-07-07 Thermosetting resin composition
US07/071,161 US4831102A (en) 1986-07-15 1987-07-08 Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine
DE8787306106T DE3781843T2 (en) 1986-07-15 1987-07-10 COMPOSITION FOR HEAT-RESISTABLE RESIN.
DE3751839T DE3751839T2 (en) 1986-07-15 1987-07-10 Curable resin composition
EP87306106A EP0253586B1 (en) 1986-07-15 1987-07-10 Thermosetting resin composition
AU75523/87A AU589020B2 (en) 1986-07-15 1987-07-10 Thermosetting resins derived from bismaleimides and diamines
EP91203079A EP0480543B1 (en) 1986-07-15 1987-07-10 Thermosetting resin composition
KR1019870007622A KR910004043B1 (en) 1986-07-15 1987-07-15 Thermosetting resin composition
US07/304,558 US4960852A (en) 1986-07-15 1989-02-01 Thermosetting resin compostion from bis, maleimide and bis (meta-amino phenoxy) compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16466886A JPH0668024B2 (en) 1986-07-15 1986-07-15 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS6354435A JPS6354435A (en) 1988-03-08
JPH0668024B2 true JPH0668024B2 (en) 1994-08-31

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Country Status (1)

Country Link
JP (1) JPH0668024B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068312B2 (en) * 1981-01-29 1994-02-02 藤沢薬品工業株式会社 New peptide manufacturing method
GR79114B (en) * 1981-01-29 1984-10-02 Fujisawa Pharmaceutical Co
JPS6426668A (en) * 1987-04-22 1989-01-27 Mitsui Toatsu Chemicals Thermosetting polymer composition
JPS6454063A (en) * 1987-05-06 1989-03-01 Mitsui Toatsu Chemicals Thermosetting resin composition
JPH01252662A (en) * 1987-05-06 1989-10-09 Mitsui Toatsu Chem Inc Thermosetting resin composition
JP2002105201A (en) * 2000-10-02 2002-04-10 Mitsui Chemicals Inc Varnish and prepreg impregnated it

Also Published As

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