JPH0645303A - Substrate cleaning apparatus - Google Patents

Abstract

PURPOSE:To enable execution of cleaning within the predetermined period and improve space factor and flexibility of the cleaning process without bringing about enlargement of the apparatus. CONSTITUTION:A brush cleaning apparatus 2 is provided with a substrate transfer arm 5 for clamping and transferring a glass substrate 4 for LCDs. Moreover, many front surface cleaning brushes 6, rear surface cleaning brushes 7 and pure water supply nozzles are provided at the upper and lower portions in both sides the transfer path of the glass substrate 4 for LCD. The substrate transfer arm 5 repeats the reciprocal motion as required in the transfer direction to execute the cleaning of the glass substrate 4 for LCDs for the predetermined period.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a liquid crystal display (LCD), a substrate cleaning device using a cleaning brush, a so-called scrubber, has been used for cleaning an LCD glass substrate or the like.

In such a conventional substrate cleaning apparatus, a roller transport mechanism composed of a plurality of rollers is provided so as to form a predetermined substrate transport path, and a plurality of substrate transport paths are sandwiched between these rollers. Cleaning brushes are arranged. Then, while the glass substrate for LCD or the like is transported in one direction by the roller transport mechanism, the substrate surface is rubbed with a cleaning brush to perform cleaning.

[0004]

In the above-mentioned conventional substrate cleaning apparatus, it is necessary to slow the transfer speed in order to lengthen the cleaning time, but there is a limit to such minimum transfer speed. Therefore, a large number of cleaning brushes are arranged along the transfer path, and the length of the brush cleaning portion is lengthened to lengthen the cleaning time. In such a case, the substrate cleaning apparatus becomes large. There was a problem.

The present invention has been made in consideration of such a conventional situation, and it is possible to carry out cleaning for a desired time without increasing the size of the apparatus, improving the space factor and the flexibility of the cleaning process. An object of the present invention is to provide a substrate cleaning device capable of improving the viability.

[0006]

That is, the substrate cleaning apparatus according to claim 1 cleans both surfaces of the substrate to be cleaned.
A brush cleaning mechanism in which a plurality of cleaning brushes are arranged with a substrate transfer path sandwiched between them, while holding the substrate to be cleaned and transferring it along the substrate transfer path, while moving the substrate to be cleaned back and forth in the transfer direction. And a substrate transfer mechanism configured to be capable of performing cleaning for a desired time by the brush cleaning mechanism.

According to another aspect of the present invention, there is provided a substrate cleaning apparatus, which holds a substrate to be cleaned, and a brush cleaning mechanism in which a plurality of cleaning brushes are arranged so as to sandwich a substrate transfer path so as to clean both sides of the substrate to be cleaned. And a substrate transport mechanism configured to be capable of performing cleaning for a desired time by the brush cleaning mechanism while transporting the substrate to be cleaned back and forth in the transport direction while transporting the substrate along the substrate transport path. And a mechanism for cleaning the cleaning brush by supplying water from substantially the center of the cleaning brush.

[0008]

In the substrate cleaning apparatus of the present invention having the above construction, the brush cleaning mechanism can perform cleaning for a desired time while the substrate transfer mechanism moves the substrate to be cleaned back and forth in the transfer direction. Therefore, cleaning can be performed for a long time without increasing the length of the apparatus, and the space factor and the flexibility of the cleaning process can be improved.

Further, in the substrate cleaning apparatus according to claim 2,
In addition to the above mechanism, a mechanism for supplying water from almost the center of the cleaning brush to clean the cleaning brush when not cleaning is provided. Therefore, the cleaning brush can be cleaned without supplying pure water from the rinse nozzle for cleaning the substrate, and the deformation of the cleaning brush due to the water pressure of the high-pressure pure water from the rinse nozzle for cleaning the substrate is prevented. can do. As a result, running costs and maintenance frequency can be reduced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a substrate cleaning apparatus for cleaning a glass substrate for LCD will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, the substrate cleaning unit 1 includes a brush cleaning device (scrubber) 2 for brush cleaning, and a high-pressure / ultrasonic cleaning device 3 for cleaning with a high-pressure jet water stream and ultrasonic waves. Are provided integrally.

The brush cleaning device 2 is provided with a substrate transfer arm 5 for locking the LCD glass substrate 4 and transferring it linearly (left and right in the drawing).
A large number of front surface cleaning brushes 6 and rear surface cleaning brushes 7 and a rinse liquid supply nozzle (not shown) are provided above and below so as to sandwich the conveyance path of the LCD glass substrate 4 by. Also,
At the carry-in position of the LCD glass substrate 4, there is provided a substrate holding mechanism 8 which is structured such that the LCD glass substrate 4 is suction-held by a vacuum chuck and is vertically movable and rotatable by 90 degrees.

As shown in FIG. 3, two substrate transfer arms 5 are provided so as to hold both end portions of the lower surface of the LCD glass substrate 4, and these substrate transfer arms 5 are provided.
The linear guide 10 guides the timing belt 11, the pulley 12, the shaft 13 and the like, and the arm driving motor 14 transmits the driving force of the arm driving motor 14. The substrate transfer arm 5 and the timing belt 11 are fastened by a fastening member 11a. Further, the arm drive motor 14 is controlled by the control device 100 including a CPU and the like, repeats reciprocating motions in the carrying direction as desired, and is controlled for a predetermined time LC.
The cleaning is performed so that the D glass substrate 4 can be cleaned.

As shown in FIG. 4, double side walls 2b and 2c are built on the floor 2a of the brush cleaning device 2, and the timing belt 11, the pulley 12 and the like are provided between the double side walls 2b and 2c. Is housed. The linear guide 10 and the arm drive motor 14 are fixed to the inner wall 2c.
The substrate transfer arm 5 is supported by a support slider 10a, and the support slider 10a is slidably attached to the linear guide 10 through an opening 2d of an inner wall 2c. The shaft 13 penetrates the pair of inner side walls 2c, and the large and small pulleys 12a and 12b are attached to one end thereof. The bearing 13a of the shaft 13 is attached to the inner wall 2c.

As shown in FIGS. 5 and 6, the small pulley 12
The timing belt 11 is stretched between b and the pulley 12. Large pulley 12a and drive pulley 14
The timing belt 11 is also stretched around a. The linear guide 10 and the opening 2d are provided from the side wall 2e to the side wall 2f.

As shown in FIG. 5, holding projections 5a and 5b extending inward are provided at the front end and the base end of the substrate transfer arm 5.
Are provided, and recesses 5c for pressing the four corners of the LCD glass substrate 4 are formed.

Next, the front surface cleaning brush 6 and the back surface cleaning brush 7 will be described.

As shown in FIG. 2, each of the front surface cleaning brush 6 and the back surface cleaning brush 7 is composed of a brush group arranged in two rows, and the front surface cleaning brush 6 group and the back surface cleaning brush 7 group are arranged alternately. Has been done. Each brush is made of nylon or mohair fibers. Figure 7
As shown in FIG. 5, the timing belt 20 is wound around each of the base bodies 30 of the front surface cleaning brush 6 and the back surface cleaning brush 7. When the timing belt 20 is moved by the drive shaft 21 of the motor (not shown), Cleaning brush 6
Each of the back surface cleaning brush 7 and the back surface cleaning brush 7 is adapted to rotate about its axis. The front surface cleaning brush 6 and the back surface cleaning brush 7 are each supported by an elevating mechanism (not shown).

The front surface cleaning brush 6 and the back surface cleaning brush 7 are formed in a cylindrical outer shape. As shown in FIG. 8, the front surface cleaning brush 6 has a rinse liquid flow path in the central portion of the substrate 30. 31 and a nozzle hole 31a are formed. In addition, a brush 32 is planted in an annular shape on the base body 30. The rinse liquid flow path 31 communicates with a rinse liquid supply source via a pressurizing pump. In addition, since the ejection port of each nozzle hole 31a is open toward the brush 32, the brush 32 itself can be cleaned, and the brush 32 can be cleaned.
Can be prevented from drying.

Further, the rinse liquid flow path 3 is provided by a pressurizing pump.
It is desirable that the rinse liquid supplied to No. 1 has a pressure of 10 to ²⁰ kg / cm ² (relatively low pressure). This is because the brush 32 is deformed when the supply pressure of the rinse liquid is too high. It is desirable to use pure water as such a rinse liquid.

The back surface cleaning brush 7 has the same structure. Further, since the back surface cleaning brush 7 is arranged upward, pure water or the like can be supplied to the back surface cleaning brush 7 from a supply nozzle (not shown) provided on the upper side (the surface cleaning brush 6 side). It may be configured as follows. Such a supply nozzle is provided separately from the rinse liquid supply nozzle for cleaning the LCD glass substrate 4, and supplies pure water or the like at a lower pressure than the rinse liquid supply nozzle for cleaning the LCD glass substrate 4. As a result, it is possible to prevent the front surface cleaning brush 6 and the back surface cleaning brush 7 from being deformed by water pressure.

Next, the high pressure / ultrasonic cleaning device 3 will be described.

As shown in FIG. 9, the lower portion of the high-pressure / ultrasonic cleaning device 3 is surrounded by a container 200, and the waste liquid in the container 200 is drained through a drain 201. LC through the central opening of the container 200
A substrate holding mechanism 202 that holds the D glass substrate 4 is provided. The shaft 203 of the substrate holding mechanism 202 is the bearing 20.
A block 205 rotatably supports the block 205. The lower end of the shaft 203 is connected to the drive shaft of the motor 206. Further, a rod 208 of an air cylinder 207 is connected to the body of the motor 206, so that the substrate holding mechanism 202 is lifted to the position L or the position H.

A plurality of posts 211 are erected on the disc stage 210. Post 211 is LCD
It is a member that comes into contact with the end faces of the four corners of the glass substrate for use 4.
The disk stage 210 is rotatably attached to the fixed block 213 via a pair of bearings 212.
A driving force transmitting member 215 of a driving device 214 is connected to a lower portion of the disc stage 210,
0 is rotatable at about 3000 rpm.

As shown in FIG. 10, the substrate holding mechanism 202
Has a disk shape, on which three projections 220 are provided. As shown in FIG. 11, each projection 220 is provided with an exhaust passage 221 that opens upward. As shown in FIG. 9, the exhaust passage 221 communicates with the exhaust device 222 via the motor 206. When the exhaust passage 221 is exhausted, the LCD glass substrate 4 is adsorbed and held by the protrusion 220. The protrusion 220 is made of a corrosion-resistant resin (for example, Delrin) or ceramics. The substrate holding mechanism 8 of the brush cleaning device 2 has the same structure as the substrate holding mechanism 202.

Next, the rinse liquid supply mechanism and the high-pressure water / ultrasonic cleaning mechanism will be described.

As shown in FIGS. 2 and 9, a nozzle unit 230 of a rinse liquid supply mechanism and a nozzle unit 231 of a high pressure water / ultrasonic cleaning mechanism are provided on both sides of the high pressure / ultrasonic cleaning device 3. . The two nozzle units 230, 231 are configured to be moved in the Y-axis direction by a drive mechanism 232, and the nozzle units 230, 231 pass through the side openings 233 and the respective nozzle units 230, 231 are rinsed.
It is provided so that it may come in and go out of 34. The nozzle units 230 and 231 extend in the X-axis direction.

The nozzle unit 230 has two systems of nozzles 235. The nozzle 235 of each system is connected to the conduit 2
Each of the two pressure pumps 237 communicates with each other via the pressure pumps 237, and the two pressure pumps 237 communicate with the rinse liquid supply source 238. The rinse liquid supply source 238 stores pure water as a rinse liquid.

The nozzle unit 231 has two systems of nozzles 239 and 240. The nozzle 239 is connected to the conduit 2
The nozzle 240 communicates with the high-pressure jet device 242 via 41, and the nozzle 240 uses the ultrasonic water flow supply device 244 via the conduit 243.
Is in communication with. The high pressure jet device 242 is 100 to 1
It has a built-in supply source of high-pressure jet water of 50 kg / cm ² . Further, the ultrasonic water flow supply device 244 has a frequency of 1M.
It contains a vibrator that generates ultrasonic waves of Hz and a water supply source that supplies pure water. The ultrasonic frequency is 1M
Although it is preferably in Hz, it can be used in the range of 1 ± 0.2 MHz.

The rinse liquid supply source 238, the pressure pump 237, the high-pressure jet device 242, and the ultrasonic water flow supply device 244 are controlled by the control device 100 based on predetermined recipes.

FIG. 12 shows the substrate cleaning unit 1 having the above structure.
1 shows a configuration of a substrate processing system in which is arranged. In this substrate processing system, a cassette station 60 configured to be able to mount a plurality of cassettes 4a accommodating the LCD glass substrate 4 is provided at one end, and a side of the cassette station 60 is Main arm 6 for transporting LCD glass substrate 4 in the center
1. The processing units are arranged on both sides of the main arm 61.

As a processing device, the substrate cleaning unit 1 including the brush cleaning device 2 and the high pressure / ultrasonic cleaning device 3 is located at the side of the cassette station 60.
Two sets are provided so as to sandwich the main arm 61, and two heating devices 62 are arranged side by side on one of the substrate cleaning units 1 so as to be stacked.

Further, on the side of these devices, an adhesion processing device 64 for hydrophobicizing the photoresist before applying it to the LCD glass substrate 4 via the connection unit 63, and this adhesion processing device. 64
A cooling device 65 arranged below the substrate, a resist coating device 66 for coating photoresist on the LCD glass substrate 4, a total of four heating devices 62 arranged in a stack of two, and a developing device 67. It is arranged.

In the substrate processing system configured as described above, the LCD glass substrate 4 is processed as follows.

The LCD glass substrate 4 in the cassette 4a, which has been transported from the previous step and placed on the cassette station 60, is first taken out by the transport tweezers (not shown), and then the main arm via the transfer section 60A. 6
1 and is conveyed to the brush cleaning device 2 of the substrate cleaning unit 1.

In the brush cleaning device 2, as shown in FIG. 1, the LCD glass substrate 4 held at the carry-in position by the main arm 61 is sucked and held by the substrate holding mechanism 8 and is lifted. 61 is evacuated. Next, while lowering the substrate holding mechanism 8 while rotating,
The LCD glass substrate 4 is rotated by 90 degrees and transferred to the substrate transfer arm 5 with its long side facing the substrate transfer arm 5 side, for example.

After that, the LCD is moved by the substrate transfer arm 5.
The glass substrate 4 is transported between the front surface cleaning brush 6 and the back surface cleaning brush 7, and a rinsing liquid such as pure water is ejected while rotating these brushes. Then, the motor 14 is alternately rotated in the forward direction and the reverse direction, for example, from 0.05 m / min.
The glass substrate 4 for LCD is washed (scrubbing) by slowly moving back and forth at a speed of about 0.15 m / min.
At this time, if the cleaning time is long according to the preset cleaning time, the LCD glass substrate 4 is reciprocated many times to perform cleaning. Even after the front surface cleaning brush 6 and the back surface cleaning brush 7 are separated from the LCD glass substrate 4, the cleaning liquid may be kept flowing to rinse the LCD glass substrate 4.

After the cleaning by the front surface cleaning brush 6 and the back surface cleaning brush 7 for a predetermined time in this way, the glass substrate 4 for LCD is placed in the rinsing chamber 234 of the high-voltage and ultrasonic cleaning apparatus 3 by the substrate transfer arm 5. Transport to.

In the high-pressure / ultrasonic cleaning device 3, as shown in FIG. 9, the glass substrate 4 for LCD positioned at the carry-in height L.
Are held by suction while raising the substrate holding mechanism 202 to the height of H, and in this state, the substrate transfer arm 5 is retracted. Then, the substrate holding mechanism 202 is lowered to L
The glass substrate 4 for CD is transferred to the disc stage 210.

After this, the nozzle unit 231 is moved above the LCD glass substrate 4, and either or both of the high-pressure jet water flow and the ultrasonic water flow are supplied to the LCD glass substrate 4, and a cleaning process is performed. At this time, the processing is performed while rotating the LCD glass substrate 4 at a low speed. The pressure of the high-pressure jet water flow is 100 to 150 Kg / cm ² , and the maximum flow rate thereof is 0.5 liter / minute. Further, stop the oscillation of ultrasonic waves, water pressure 10-20Kg / c
The glass substrate 4 for LCD may be rinsed under the conditions of m ² and a flow rate of 2 to 10 liters / minute.

Next, the nozzle unit 231 is installed in the rinse chamber 2
34, and the nozzle unit 230 is moved to the rinse chamber 2
It is carried in into 34. And the water pressure is 10 to 20 Kg / cm
^2. Rinse the glass substrate 4 for LCD with pure water at a flow rate of 2 to 10 liters / minute. In the case of this rinsing treatment, the water pressure may be a low pressure of 1 to ² Kg / cm ² .

When the cleaning process is completed, the LCD glass substrate 4 is rotated at a high speed to perform drying, and the nozzle unit 231 is returned to the standby position. When the drying is completed, the LCD glass substrate 4 is lifted to the H position by the substrate holding mechanism 202, the main arm 61 is inserted below the LCD glass substrate 4, and then the substrate holding mechanism 202 is lowered. Glass substrate 4
To the main arm 61.

After that, the glass substrate 4 for LCD is conveyed to the heating device 64, dried there, and then subjected to the hydrophobic treatment by the adhesion treatment device 66 and the cooling device 67.
Cooling by, a photoresist coating device 68 for resist coating, and a heating device 64 for baking treatment. Then, after that, it is conveyed to an exposure device (not shown),
After being exposed here, a developing process is performed by the developing device 67, and the main arm 61 conveys it to the cassette station 60.

According to the first embodiment described above, the glass substrate 4 for LCD is supported and transported on the substrate transport arm 5, and is reciprocated between the front surface cleaning brush 6 and the back surface cleaning brush 7 for LCD. Since the glass substrate 4 is cleaned, the cleaning can be carried out for a desired time without increasing the size of the apparatus, and it is possible to improve the space factor and the flexibility of the cleaning process.

Further, since the front surface cleaning brush 6 and the back surface cleaning brush 7 can be cleaned and dried without being applied with high-pressure pure water or the like used for cleaning the LCD glass substrate 4, the front surface cleaning brush by water pressure. 6 and the back surface cleaning brush 7 can be prevented from being deformed, and the maintenance frequency and the running cost can be reduced by extending the life of the brush.

Next, referring to FIG. 13 to FIG.
An example will be described. The description of the parts of the second embodiment common to the first embodiment will be omitted.

As shown in FIG. 13, the substrate transfer mechanism of the second embodiment has upper and lower rollers 71 and 72. The plurality of upper and lower rollers 71, 72 are arranged in the scrubber chamber 7
They are arranged horizontally and alternately at 0. Upper and lower rollers 71,
A substrate holding mechanism 79 is provided on the upstream side of the substrate transfer path consisting of 72.
Is provided, and the lift holder 77 is provided on the downstream side of the substrate transfer path.
Is provided. The substrate holding mechanism 79 has the same configuration as the substrate holding mechanisms 8 and 202 described above. Lift holder 77
Is moved in the X-axis direction and the Z-axis direction by the drive mechanism 80, and the groove 87 which is the suction portion shown in FIGS. 17 and 18 is exhausted.

As shown in FIG. 14, the upper brush 73 and the lower brush 7 are provided between the lower roller 71 and the upper roller 72.
4 are provided respectively. The upper brush 73 and the lower brush 74 are respectively arranged in two horizontal rows, the upper brush 73 faces the lower roller 71, and the lower brush 74 faces the upper roller 72. Further, each of the upper brush 73 and the lower brush 74 can be rotated about a vertical axis.

As shown in FIG. 15, the upper and lower rollers 71, 7
A pair of O-rings 75 are respectively fitted on the peripheral surfaces of 2,
The O-ring 75 is adapted to directly contact the peripheral edges of both sides of the substrate 4. The O-ring 75 is made of fluorine rubber, FP
Made of M, propylene hexafluoride, or vinylidene fluoride copolymer. Further, guides 76 are attached to both ends of the lower roller 71, and the substrates 4 are guided by the guides 76 to the center of the transport path. The shaft of the lower roller 71 is connected to a drive motor (not shown), but the upper roller 72 is supported so as to idle. In this case, the upper roller 72 may also be rotationally driven.

As shown in FIG. 16, the lift holder 77
Is driven by the members 81, 82, 83, 84.
Is connected to a movable member (not shown). A pair of holding members 85 are attached to the lower surface of the lift holder 77,
The peripheral portion of the substrate 4 is inserted into the recess of each holding member 85. In this case, the peripheral edge of the substrate 4 is inserted into the recess of the holding member 85 by about 100 mm from the end face. The lift holder 77 is located slightly above the level of the lower roller 71, and the substrate 4 is transported at this position.

As shown in FIGS. 17 and 18, the holding member 8
A groove 87 is formed on the holding surface 86 of the recess of No. 5, and the opening 88 a of the internal passage 88 is opened in this groove 87. The internal passage 88 communicates with an exhaust device (not shown) via a connecting member 89 and a hose (not shown).

[0052]

As described above, according to the substrate cleaning apparatus of the present invention, cleaning can be performed for a desired time without increasing the size of the apparatus, improving the space factor and cleaning processing. Flexibility can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a substrate cleaning unit according to an embodiment of the present invention.

FIG. 2 is a diagram showing a top configuration of the substrate cleaning unit of FIG.

FIG. 3 is a diagram showing a configuration of main parts of the substrate cleaning unit of FIG.

FIG. 4 is a diagram showing a configuration of a main part of the substrate cleaning unit of FIG.

5 is a diagram showing a main part configuration of the substrate cleaning unit of FIG.

FIG. 6 is a diagram showing a configuration of a main part of the substrate cleaning unit of FIG.

FIG. 7 is a diagram showing a main configuration of the substrate cleaning unit of FIG.

FIG. 8 is a diagram showing a main configuration of the substrate cleaning unit shown in FIG.

FIG. 9 is a view showing a main configuration of the substrate cleaning unit shown in FIG.

FIG. 10 is a diagram showing a configuration of main parts of the substrate cleaning unit of FIG.

FIG. 11 is a diagram showing a configuration of a main part of the substrate cleaning unit of FIG.

12 is a diagram showing a configuration of a substrate processing system in which the substrate cleaning unit of FIG. 1 is arranged.

FIG. 13 is a diagram showing a top surface configuration of a substrate cleaning unit according to another embodiment.

FIG. 14 is a view showing a main configuration of the substrate cleaning unit shown in FIG.

FIG. 15 is a view showing a main configuration of the substrate cleaning unit shown in FIG.

16 is a diagram showing a configuration of a main part of the substrate cleaning unit of FIG.

FIG. 17 is a diagram showing a configuration of main parts of the substrate cleaning unit of FIG.

FIG. 18 is a diagram showing a configuration of a main part of the substrate cleaning unit of FIG.

[Explanation of symbols]

 1 Substrate Cleaning Unit 2 Brush Cleaning Device 3 High Pressure / Ultrasonic Cleaning Device 4 LCD Glass Substrate 5 Substrate Transfer Arm 6 Front Surface Cleaning Brush 7 Backside Cleaning Brush 8 Substrate Holding Mechanism

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Noriyuki Anai, Noriyuki Anai, 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture, Tokyo Electron Saga Co., Ltd., Kumamoto Office (72) Inzo, Sato, 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Saga Co., Ltd., Kumamoto Plant (72) Inventor Takayuki Tomoe, 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Saga Corp., Kumamoto Plant, (72) Tatsuya Iwasaki, 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Saga Kumamoto Plant (72) Inventor Kengo Mizozaki 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Electron Saga Kumamoto Plant

Claims (2)

[Claims] 1. A brush cleaning mechanism in which a plurality of cleaning brushes are arranged so as to sandwich both sides of a substrate transfer path so as to clean both sides of a substrate to be cleaned, and the cleaning target substrate is held and transferred along the substrate transfer path. In addition, the substrate cleaning apparatus comprises a substrate transfer mechanism configured to be able to perform cleaning for a desired time by the brush cleaning mechanism while moving the substrate to be cleaned back and forth in the transfer direction. 2. A brush cleaning mechanism in which a plurality of cleaning brushes are arranged so as to sandwich a substrate transfer path so as to clean both sides of a substrate to be cleaned, and the cleaning target substrate is held and transferred along the substrate transfer path. In addition, the substrate transfer mechanism is configured so that the brush cleaning mechanism can perform cleaning for a desired time while moving the substrate to be cleaned back and forth, and water is supplied from almost the center of the cleaning brush when not cleaning. And a mechanism for cleaning the cleaning brush.