JPH06320738A - Method for bonding printing head for ink jet printing - Google Patents
Method for bonding printing head for ink jet printingInfo
- Publication number
- JPH06320738A JPH06320738A JP11301693A JP11301693A JPH06320738A JP H06320738 A JPH06320738 A JP H06320738A JP 11301693 A JP11301693 A JP 11301693A JP 11301693 A JP11301693 A JP 11301693A JP H06320738 A JPH06320738 A JP H06320738A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- solder
- thickness
- thin plate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インクジェットプリン
タに用いられる薄板積層プリントヘッドの接合方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining a thin plate print head used in an ink jet printer.
【０００２】[0002]
【従来の技術】従来、ステンレス製の厚さ１０〜５０μ
ｍの薄板からなるインクジェットプリンタ用プリントヘ
ッドの接合は、有機系接着剤を用いて行ってきた。2. Description of the Related Art Conventionally, stainless steel has a thickness of 10 to 50 .mu.m.
The joining of the print head for an inkjet printer made of a thin plate of m has been performed using an organic adhesive.
【０００３】[0003]
【発明が解決しようとする課題】前記した従来技術によ
れば、有機系の接着剤がインク及び熱サイクルにより劣
化し、インク漏れを生じる等、耐久性に問題があった。According to the above-mentioned prior art, there is a problem in durability such that the organic adhesive is deteriorated by the ink and the heat cycle, causing ink leakage.
【０００４】そして、この問題を解決するためには、半
田付けによる接合が考えられる。しかし、薄板積層構造
物であるプリントヘッドには高精度が要求され、穴形状
も複雑であり、薄板がＮｉ製のものは直接半田層を形成
できるが、ステンレス製の場合はＮｉメッキを介する必
要があり、またこれらを接合した時、一般のＳｎを含有
する半田の場合、接合時の加熱によりＳｎがＮｉ側に拡
散し、半田の組成が変化して融点が上昇し、所定の温度
で接合できなくなる。In order to solve this problem, joining by soldering can be considered. However, a thin plate laminated structure requires high precision and the hole shape is complicated. A thin Ni plate can directly form a solder layer, but a stainless steel plate requires Ni plating. In addition, when these are joined, in the case of general solder containing Sn, Sn diffuses to the Ni side due to the heating at the time of joining, the composition of the solder changes and the melting point rises, and the solder is joined at a predetermined temperature. become unable.
【０００５】なお、この問題を解決するためには、抵抗
加熱法等により急加熱する方法も考えられるが、特殊な
装置が必要となり、被接合物の形状も制限されることに
なる。また、半田層を厚くすることも考えられるが、寸
法精度及びインクの通り穴の目詰りの面から問題があ
る。一方、ろう付けの場合は、接合温度が高く、被接合
物に与える熱的ダメージが大きい問題がある。In order to solve this problem, a method of rapidly heating by a resistance heating method or the like can be considered, but a special device is required and the shape of the article to be joined is limited. Further, it is possible to make the solder layer thick, but there is a problem in terms of dimensional accuracy and clogging of ink passage holes. On the other hand, in the case of brazing, there is a problem that the joining temperature is high and the thermal damage to the objects to be joined is large.
【０００６】本発明の目的は、簡単な接合方法で熱的ダ
メージを与えることなく、インク及び熱サイクルに対し
て耐久性に優れたインクジェットプリンタ用プリントヘ
ッドを提供することにある。An object of the present invention is to provide a printhead for an ink jet printer which is excellent in durability against ink and thermal cycles without causing thermal damage by a simple joining method.
【０００７】[0007]
【課題を解決するための手段】前記目的は、薄板積層構
造のプリントヘッドを有するインクジェットプリンタ用
プリントヘッドの接合方法において、前記薄板はＳｎ拡
散防止層を有し、半田で接合することによって達成され
る。The above object is achieved by a method of joining a print head for an ink jet printer having a print head having a laminated thin plate structure, wherein the thin plate has an Sn diffusion preventing layer and is joined by soldering. It
【０００８】これを具体例に基づいて説明すると、プリ
ントヘッド用薄板は、図１に示すような断面構造をして
おり、これはステンレス製薄板上にＮｉメッキを施した
後、Ｓｎ拡散防止層としてＰｄまたはＣｏを０．１μｍ
以上形成し、その上に半田層を形成する。Ｎｉ製薄板の
場合はＮｉメッキは省く。なお、前記半田層は、接合す
る面の両側もしくはいずれか片側のみでも良い。This will be explained based on a concrete example. The thin plate for print head has a cross-sectional structure as shown in FIG. 1. This is obtained by plating a stainless thin plate with Ni and then Sn diffusion preventing layer. Pd or Co as 0.1 μm
The above is formed, and the solder layer is formed thereon. In the case of a Ni thin plate, Ni plating is omitted. The solder layer may be on both sides of the surface to be joined or only on one side.
【０００９】前記半田は、接合性の面からＡｕ−Ｓｎ系
またはＰｂ−Ｓｎ系が良く、その組成は、Ａｕ−Ｓｎ半
田の場合Ｓｎ含有量を１５〜４０ｗｔ％、Ｐｂ−Ｓｎ半
田の場合Ｓｎ含有量を５〜６５ｗｔ％とし、これらの薄
板を真空中あるいは不活性ガス中で加熱、加圧して接合
する。The solder is preferably Au-Sn type or Pb-Sn type in terms of bondability. The composition of the solder is 15 to 40 wt% Sn content in the case of Au-Sn solder and Sn in the case of Pb-Sn solder. The content is set to 5 to 65 wt%, and these thin plates are heated and pressurized in vacuum or in an inert gas to bond them.
【００１０】ここで、Ｓｎ拡散防止層のＰｄまたはＣｏ
の厚さを０．１μｍ以上としたのは、０．１μｍ以下で
はＳｎが下地のＮｉに拡散する場合があり、半田の濡れ
性も下地のＮｉの影響を受けて低下するためであり、
０．１μｍ以上の厚さであればその効果は十分である。Here, Pd or Co of the Sn diffusion prevention layer is used.
Has a thickness of 0.1 μm or more, because Sn may diffuse into the underlying Ni when the thickness is 0.1 μm or less, and the wettability of the solder is also affected by the underlying Ni, so that
If the thickness is 0.1 μm or more, the effect is sufficient.
【００１１】前記半田組成によれば、Ｓｎ拡散による融
点の変化が大きいので拡散防止層の効果が大きくなり、
融点も４００℃以下でプリントヘッド用薄板に熱的ダメ
ージを与えない。According to the above solder composition, since the melting point changes largely due to Sn diffusion, the effect of the diffusion prevention layer is increased,
It has a melting point of 400 ° C. or less and does not cause thermal damage to the print head thin plate.
【００１２】[0012]
【作用】前記接合方法を採用する本発明によれば、薄板
積層構造のプリントヘッドは、その薄板積層構造物の中
にＳｎ拡散防止層を有しているから、簡単な接合方法で
熱的ダメージを与えることなく、インク及び熱サイクル
に対して耐久性に優れた接合部を得ることができる。According to the present invention employing the above-mentioned joining method, the print head having the thin plate laminated structure has the Sn diffusion preventing layer in the thin plate laminated structure. It is possible to obtain a bonded portion having excellent durability against ink and thermal cycles without giving the above.
【００１３】これを具体例に基づいて説明すると、Ｓｎ
拡散防止のＰｄまたはＣｏを０．１μｍ以上形成し、前
記半田組成のもので接合されたプリントヘッドは、加熱
接合中の化合物生成に起因して半田中のＳｎ濃度が低下
して融点が上昇することがないため、接合中に十分な融
液を生じて高い接合強度が得られる。This will be explained based on a concrete example. Sn
In a print head in which Pd or Co for preventing diffusion is formed in a thickness of 0.1 μm or more and which is bonded with the solder composition, the Sn concentration in the solder is lowered and the melting point is increased due to the formation of a compound during heating and bonding. Therefore, a sufficient melt is generated during the joining, and a high joining strength can be obtained.
【００１４】また、Ｓｎ拡散がないので半田層厚さも薄
くて良く、プリントヘッドの目詰りをも防ぐことができ
る。Further, since there is no Sn diffusion, the thickness of the solder layer may be thin and clogging of the print head can be prevented.
【００１５】さらに、Ｐｂ及びＣｏは、Ｓｎ拡散防止効
果とともに前記組成からなる半田との濡れ性に優れてい
るため、真空中または不活性ガス中においてフラックス
レスで均一に接合し、接合不良によるインクの混色がな
い。Further, since Pb and Co are excellent in Sn diffusion preventing effect and have good wettability with the solder having the above composition, they are uniformly bonded in a fluxless manner in a vacuum or in an inert gas, and ink due to bonding failure. There is no color mixture.
【００１６】そして、これらは金属的な接合であるた
め、有機系接着剤に比べてインク及び熱サイクルに対す
る耐熱性に優れている。Since these are metallic joints, they are superior in heat resistance to ink and thermal cycles as compared with organic adhesives.
【００１７】[0017]
【実施例】以下、図面を参照して本発明を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.
【００１８】〔実施例１〕図１は本発明になる接合方法
を適用したプリントヘッド用薄板の断面構造図、図２は
同プリントヘッド用薄板の外観形状図、図３は本発明に
なる接合方法を適用したプリントヘッド用薄板の加熱、
加圧方法の一例を説明する図である。[Embodiment 1] FIG. 1 is a sectional structural view of a thin plate for a print head to which a joining method according to the present invention is applied, FIG. 2 is an external shape diagram of the thin plate for a print head, and FIG. 3 is a joining according to the present invention. Heating of thin plate for print head applying the method,
It is a figure explaining an example of a pressurizing method.
【００１９】図２には、プリントヘッドの一部を構成す
るダイアフラム６（ＳＵＳ３０４製、厚さ１０μｍ）、
リストリクタ７（ＳＵＳ３０４製、厚さ５０μｍ）、フ
ィルタ８（Ｎｉ製、厚さ２０μｍ）の３枚の薄板を接合
した場合が示されている。In FIG. 2, a diaphragm 6 (made of SUS304, thickness 10 μm) which constitutes a part of the print head,
The case where three thin plates of a restrictor 7 (made of SUS304, thickness 50 μm) and a filter 8 (made of Ni, thickness 20 μm) are joined is shown.
【００２０】ここで、本実施例の薄板の断面構造を図１
により説明する。ダイアフラム６及びリストリクタ７
は、図１の構造であり、Ｎｉメッキ３を１μｍ、Ｓｎ拡
散防止層４としてＰｄメッキを０．２μｍ、半田層５と
してＰｂ−５０ｗｔ％Ｓｎメッキを５μｍ施した。Here, the sectional structure of the thin plate of this embodiment is shown in FIG.
Will be described. Diaphragm 6 and restrictor 7
1 has a structure shown in FIG. 1, in which Ni plating 3 is 1 μm, Sn diffusion preventing layer 4 is Pd plating 0.2 μm, and solder layer 5 is Pb-50 wt% Sn plating 5 μm.
【００２１】次に、前記３枚の薄板を位置合わせし、図
３に示すように加熱、加圧治具１０、１０間にセット
し、図示しない接合室内で、真空中で３００℃に加熱す
るとともに、図示しない加圧装置で５ｋｇｆ／ｃｍ2の
加圧力を加え、冷却後、接合室内を大気リークして被接
合物を取り出した。Next, the three thin plates are aligned, set between heating and pressing jigs 10 and 10 as shown in FIG. 3, and heated to 300 ° C. in a vacuum in a bonding chamber (not shown). At the same time, a pressure of 5 kgf / cm 2 was applied by a pressure device (not shown), and after cooling, the inside of the joining chamber was leaked to the atmosphere and the article to be joined was taken out.
【００２２】なお、本実施例では、被接合物の接合雰囲
気を真空とした場合について例示したが、これに代えて
不活性ガス雰囲気としても良い。In this embodiment, the case where the bonding atmosphere of the objects to be bonded is made vacuum has been exemplified, but instead of this, an inert gas atmosphere may be used.
【００２３】〔実施例２〕実施例１と同様の接合方法で
Ｓｎ拡散防止層４のＰｄ及びＣｏの厚さを０．０５、
０．１、０．３及び０．５μｍと変えて接合した。その
後、被接合物の接合部を切断し、断面の濃度分布を調
べ、ＳｎとＮｉとの化合物形成層の厚さを求めた。[Embodiment 2] The thickness of Pd and Co of the Sn diffusion preventing layer 4 is set to 0.05 by the same joining method as in Embodiment 1.
Bonding was performed while changing the thicknesses to 0.1, 0.3 and 0.5 μm. After that, the joint portion of the object to be joined was cut, the concentration distribution in the cross section was examined, and the thickness of the compound forming layer of Sn and Ni was obtained.
【００２４】その結果を図４に示す。本結果から、拡散
防止層４の厚さが０．１μｍ以上あればＮｉとの反応を
抑止できることが判る。The results are shown in FIG. From this result, it is understood that the reaction with Ni can be suppressed if the thickness of the diffusion preventing layer 4 is 0.1 μm or more.
【００２５】[0025]
【発明の効果】本発明によれば、薄板積層構造のプリン
トヘッドを有するインクジェットプリンタ用プリントヘ
ッドの接合において、前記薄板はＳｎ拡散防止層を有し
ているから、簡単な接合方法で熱的ダメージを与えるこ
となく、インク及び熱サイクルに対して耐久性に優れた
接合部を得ることができる。According to the present invention, when a print head for an ink jet printer having a print head having a laminated thin plate structure is joined, since the thin plate has an Sn diffusion preventing layer, thermal damage is caused by a simple joining method. It is possible to obtain a bonded portion having excellent durability against ink and thermal cycles without giving the above.
【００２６】これを具体例に基づいて説明すると、厚さ
１０〜５０μｍのステンレス製及びＮｉ製の薄板の組合
せからなる被接合物をＰｂまたはＣｏのＳｎ拡散防止層
を介し、Ｐｂ−５〜６５ｗｔ％ＳｎまたはＡｕ−１５〜
４０ｗｔ％Ｓｎの半田によって真空中または不活性ガス
中で加熱、加圧接合することで薄板に熱的ダメージを与
えず、インク及び熱サイクルに対して耐久性に優れた接
合部を得ることができた。This will be described with reference to a specific example. An article to be joined made of a combination of thin plates made of stainless steel and Ni and having a thickness of 10 to 50 μm is Pb-5 to 65 wt% through a Sn diffusion preventing layer of Pb or Co. % Sn or Au-15-
By heating and pressure bonding with 40 wt% Sn solder in a vacuum or in an inert gas, it is possible to obtain a bonded part having excellent durability against ink and thermal cycles without causing thermal damage to the thin plate. It was
【図１】本発明になる接合方法を適用したプリントヘッ
ド用薄板の断面構造図である。FIG. 1 is a cross-sectional structural diagram of a print head thin plate to which a joining method according to the present invention is applied.
【図２】本発明になる接合方法を適用したプリントヘッ
ド用薄板の外観形状図である。FIG. 2 is an external shape diagram of a thin plate for a print head to which the joining method according to the present invention is applied.
【図３】本発明になる接合方法を適用したプリントヘッ
ド用薄板の加熱、加圧方法の一例を説明する図である。FIG. 3 is a diagram illustrating an example of a method of heating and pressing a thin plate for a print head to which the joining method according to the present invention is applied.
【図４】Ｓｎ拡散防止層の厚さとＮｉ−Ｓｎ化合物層厚
さとの関係を示す図である。FIG. 4 is a diagram showing the relationship between the thickness of a Sn diffusion preventing layer and the thickness of a Ni—Sn compound layer.
１はステンレス製薄板、２はＮｉ製薄板、３はＮｉメッ
キ、４はＳｎ拡散防止層、５は半田層、６はダイアフラ
ム、７はリストリクタ、８はフィルタ、９はインク流
路、１０は加熱、加圧治具である。1 is a stainless thin plate, 2 is a Ni thin plate, 3 is Ni plated, 4 is a Sn diffusion preventing layer, 5 is a solder layer, 6 is a diaphragm, 7 is a restrictor, 8 is a filter, 9 is an ink flow path, 10 is It is a heating and pressing jig.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２３Ｋ 35/30 ３１０ Ａ (72)発明者 堀野 正也 茨城県土浦市神立町502番地 株式会社日 立製作所機械研究所内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number in the agency FI Technical indication location B23K 35/30 310 A (72) Inventor Masaya Horino 502 Kandachi-cho, Tsuchiura-shi, Ibaraki Japan Co., Ltd. Tate Seisakusho Mechanical Research Center
Claims (4)
ンクジェットプリンタ用プリントヘッドの接合方法にお
いて、前記薄板はＳｎ拡散防止層を有し、半田で接合す
ることを特徴とするインクジェットプリンタ用プリント
ヘッドの接合方法。1. A method of joining a print head for an ink jet printer having a print head having a laminated thin plate structure, wherein the thin sheet has an Sn diffusion preventing layer and is joined by soldering. Method.
テンレス薄板上に形成され、ＰｄまたはＣｏで、厚さ
０．１μｍ以上であることを特徴とする請求項１記載の
インクジェットプリンタ用プリントヘッドの接合方法。2. The printhead for an ink jet printer according to claim 1, wherein the Sn diffusion preventing layer is formed on a Ni-plated stainless thin plate and is made of Pd or Co and has a thickness of 0.1 μm or more. How to join.
４０ｗｔ％以下のＡｕ−Ｓｎ半田、もしくはＳｎ含有量
が５ｗｔ％以上６５ｗｔ％以下のＰｂ−Ｓｎ半田である
ことを特徴とする請求項１記載のインクジェットプリン
タ用プリントヘッドの接合方法。3. The solder composition is an Au—Sn solder having a Sn content of 15 wt% or more and 40 wt% or less, or a Pb—Sn solder having a Sn content of 5 wt% or more and 65 wt% or less. 2. A method for joining print heads for an inkjet printer according to 1.
活性ガス中で加熱、加圧することを特徴とする請求項１
記載のインクジェットプリンタ用プリントヘッドの接合
方法。4. The pudding head is joined by heating and pressurizing in vacuum or in an inert gas.
A method for joining print heads for an inkjet printer as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11301693A JPH06320738A (en) | 1993-05-14 | 1993-05-14 | Method for bonding printing head for ink jet printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11301693A JPH06320738A (en) | 1993-05-14 | 1993-05-14 | Method for bonding printing head for ink jet printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06320738A true JPH06320738A (en) | 1994-11-22 |
Family
ID=14601330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11301693A Pending JPH06320738A (en) | 1993-05-14 | 1993-05-14 | Method for bonding printing head for ink jet printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06320738A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001054851A3 (en) * | 2000-01-31 | 2002-03-14 | Picojet Inc | Microfluid device and ultrasonic bonding process |
-
1993
- 1993-05-14 JP JP11301693A patent/JPH06320738A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001054851A3 (en) * | 2000-01-31 | 2002-03-14 | Picojet Inc | Microfluid device and ultrasonic bonding process |
| US6464324B1 (en) | 2000-01-31 | 2002-10-15 | Picojet, Inc. | Microfluid device and ultrasonic bonding process |
| US6530653B2 (en) | 2000-01-31 | 2003-03-11 | Picojet, Inc. | Ultrasonic bonding of ink-jet print head components |
| US6783213B2 (en) | 2000-01-31 | 2004-08-31 | Picojet, Inc. | Microfluid device and ultrasonic bonding process |
| US6928731B2 (en) | 2000-01-31 | 2005-08-16 | Picojet, Inc. | Ultrasonic bonding process for making a microfluid device |
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| Date | Code | Title | Description |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20011016 |