JPH063124A - Equipment of visual inspection of wire bonding - Google Patents
Equipment of visual inspection of wire bondingInfo
- Publication number
- JPH063124A JPH063124A JP18609792A JP18609792A JPH063124A JP H063124 A JPH063124 A JP H063124A JP 18609792 A JP18609792 A JP 18609792A JP 18609792 A JP18609792 A JP 18609792A JP H063124 A JPH063124 A JP H063124A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- lead frame
- wire bonding
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Closed-Circuit Television Systems (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Optical Communication System (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【産業上の利用分野】本発明は、集積回路チップと該集
積回路チップが搭載されているリードフレームとをワイ
ヤーボンディングで接続した被検査物の外観を検査する
ワイヤーボンディング外観検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding visual inspection apparatus for inspecting the external appearance of an inspected object in which an integrated circuit chip and a lead frame on which the integrated circuit chip is mounted are connected by wire bonding.
【従来の技術】一般に、集積回路チップ（ベアチップ）
と該集積回路チップが搭載されているリードフレームと
を細い導体ワイヤーで接続するワイヤーボンディング工
程は、ワイヤーボンダーで実行されるが、後工程で樹脂
モールド等の処理を施す前に、ワイヤーボンディング工
程の良否を検査する必要がある。従来は、ワイヤーボン
ディング工程の外観検査は、検査員の目視により実施さ
れていたが、本出願人によりワイヤーボンディング工程
の外観検査の自動化が検討されている。2. Description of the Related Art Generally, an integrated circuit chip (bare chip)
The wire bonding step of connecting the lead frame on which the integrated circuit chip is mounted with a thin conductor wire is performed by a wire bonder, but before performing a process such as resin molding in a later step, the wire bonding step of the wire bonding step is performed. It is necessary to inspect the quality. Conventionally, the visual inspection of the wire bonding process has been performed visually by an inspector, but the present applicant is studying automation of the visual inspection of the wire bonding process.
【発明が解決しようとする課題】ところで、外観検査の
自動化に際し、集積回路チップ及びリードフレームのワ
イヤーボンディング部分を撮像するためにテレビカメラ
を利用することが考慮されるが、そのテレビカメラで正
確な画像を取り込むためにはワイヤーボンディング部分
の照明に工夫を要する。例えば、テレビカメラの光軸と
照明光とが非平行である場合、集積回路チップとリード
フレームとを接続した導体ワイヤーの影、当該ワイヤー
接合端部のボンディングボールの影等が生じ、この影の
影響で正確なワイヤー及びボンディングボールの位置、
形状並びに大きさを認識できなくなる問題が出てくる。
また、集積回路チップとリードフレームとを接続した導
体ワイヤーのボンディングボールやループ高さ（リード
フレーム面に垂直方向の高さ）の測定は、図８のよう
に、照明器６を集積回路チップ２の搭載されたリードフ
レーム３の側方に配置するとともに、リードフレーム３
の反対側にテレビカメラ４を配置し、照明器６による透
過照明で撮像することで導体ワイヤー５のボンディング
ボール高さやループ高さを認識できる。しかし、被検査
物が、図９のように、リードフレーム３上に複数個の集
積回路チップ２が搭載されているものであるときには、
図８の照明及びカメラ配置では矢印Ｐ，Ｑのいずれか一
方の向きでの測定しかできない。実際には、リードフレ
ーム３の長手方向に沿った方向での導体ワイヤー５のボ
ンディングボール高さやループ高さの検査も必要とされ
るため、図８の従来構成では対応できない。本発明は、
上記の点に鑑み、反射鏡の配置を工夫することにより、
導体ワイヤー接合端部のボンディングボールの位置、形
状並びに大きさ、あるいは導体ワイヤーのループ高さや
ボンディングボール高さを正確に認識できるワイヤーボ
ンディング外観検査装置を提供することを目的とする。By the way, in automating the visual inspection, it is considered to use a television camera to image the wire bonding portion of the integrated circuit chip and the lead frame. In order to capture an image, it is necessary to devise lighting for the wire bonding portion. For example, when the optical axis of the television camera and the illumination light are not parallel to each other, a shadow of the conductor wire connecting the integrated circuit chip and the lead frame, a shadow of the bonding ball at the wire joining end, and the like are generated, Accurate position of wire and bonding ball due to influence,
There is a problem that the shape and size cannot be recognized.
In addition, as shown in FIG. 8, the illuminator 6 and the integrated circuit chip 2 are used to measure the bonding ball and loop height (height in the direction perpendicular to the lead frame surface) of the conductor wire that connects the integrated circuit chip and the lead frame. The lead frame 3 mounted on the side of the lead frame 3
By arranging the television camera 4 on the side opposite to the above, and taking an image with transmitted illumination by the illuminator 6, the height of the bonding ball and the height of the loop of the conductor wire 5 can be recognized. However, when the object to be inspected is one in which a plurality of integrated circuit chips 2 are mounted on the lead frame 3 as shown in FIG.
With the illumination and camera arrangement shown in FIG. 8, measurement can be performed only in one of the directions of arrows P and Q. Actually, since it is also necessary to inspect the bonding ball height and the loop height of the conductor wire 5 in the direction along the longitudinal direction of the lead frame 3, the conventional configuration of FIG. The present invention is
In consideration of the above points, by devising the arrangement of the reflecting mirror,
It is an object of the present invention to provide a wire bonding visual inspection device capable of accurately recognizing the position, shape and size of a bonding ball at a conductor wire joining end, or the loop height of a conductor wire and the height of a bonding ball.
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る請求項１の発明は、集積回路チップと
該集積回路チップが搭載されているリードフレームとを
ワイヤーボンディングで接続した被検査物の外観を検査
する場合において、前記集積回路チップ及びリードフレ
ームにテレビカメラを対向配置し、該テレビカメラと前
記集積回路チップとの間に部分反射鏡を傾斜させて配設
するとともに、該部分反射鏡に向けて光を照射する照明
手段を配設し、該照明手段から照射された光が前記部分
反射鏡で反射されて前記集積回路チップ及びリードフレ
ームを上方から照らす構成となっている。また、本発明
に係る請求項２の発明は、集積回路チップと該集積回路
チップが搭載されているリードフレームとをワイヤーボ
ンディングで接続した被検査物の外観を検査する場合に
おいて、前記集積回路チップの両側に当該集積回路チッ
プを挟んで傾斜した反射面が相互に対向する如く少なく
とも一対の反射鏡を配設し、それら一対の反射鏡のうち
の一方の反射鏡に照明手段を対向配置するとともに、他
方の反射鏡にテレビカメラを対向配置し、前記照明手段
から照射された光が一方の反射鏡で反射されて前記集積
回路を側方から照らす構成となっている。In order to achieve the above object, the invention of claim 1 according to the present invention connects an integrated circuit chip and a lead frame on which the integrated circuit chip is mounted by wire bonding. In the case of inspecting the appearance of an object to be inspected, a television camera is arranged to face the integrated circuit chip and the lead frame, and a partial reflecting mirror is arranged to be inclined between the television camera and the integrated circuit chip. Illumination means for irradiating light toward the partial reflection mirror is provided, and light emitted from the illumination means is reflected by the partial reflection mirror to illuminate the integrated circuit chip and the lead frame from above. There is. According to a second aspect of the present invention, in the case of inspecting the appearance of an inspected object in which an integrated circuit chip and a lead frame on which the integrated circuit chip is mounted are connected by wire bonding, the integrated circuit chip is provided. At least a pair of reflecting mirrors are arranged on both sides of the reflecting circuit so that the reflecting surfaces inclined with the integrated circuit chip sandwiched therebetween face each other, and the illuminating means is arranged to face one of the pair of reflecting mirrors. A television camera is arranged opposite to the other reflecting mirror, and the light emitted from the illuminating means is reflected by the one reflecting mirror to illuminate the integrated circuit from the side.
【作用】本発明のワイヤーボンディング外観検査装置で
は、反射鏡の配置を工夫することで、テレビカメラの光
軸に略平行に入射する反射光又は透過光を用いて被検査
物を撮像でき、導体ワイヤー接合端部のボンディングボ
ールの位置、形状並びに大きさ、あるいは導体ワイヤー
のループ高さやボンディングボール高さを正確に認識で
きる。In the wire bonding visual inspection apparatus of the present invention, by devising the arrangement of the reflecting mirror, the object to be inspected can be imaged by using the reflected light or the transmitted light which is incident substantially parallel to the optical axis of the television camera. The position, shape and size of the bonding ball at the wire joining end, or the loop height of the conductor wire and the bonding ball height can be accurately recognized.
【実施例】以下、本発明に係るワイヤーボンディング外
観検査装置の実施例を図面に従って説明する。図１は本
発明の第１実施例を示す。この図において、被検査物
は、リードフレーム３上に集積回路チップ（ベアチッ
プ）２を載置固定し、図３のように細い導体ワイヤー５
を用いたワイヤーボンディングにより集積回路チップ２
上のボンディングパッド１１とリードフレーム３の電極
１２とを接続したものである。テレビカメラ４は、被検
査物、すなわち集積回路チップ２及びリードフレーム３
の上方に対向配置され、該テレビカメラ４と被検査物間
に部分反射平面鏡（ハーフミラー）１３が配設されてい
る。該部分反射平面鏡１３の側方には照明器１が配設さ
れている。ここで、テレビカメラ４の光軸Ｒはリードフ
レーム３の置かれた面に垂直であり、部分反射平面鏡１
３はリードフレーム上面に対して約４５度をなしてい
る。テレビカメラ４の出力であるビデオ信号は、画像処
理装置１４に入力されるようになっている。なお、照明
器１、テレビカメラ４及び部分反射平面鏡１３の３者
は、例えば、相互の位置関係を一定に保持した状態で、
水平面内のＸ方向及び水平面内でＸ方向に直交するＹ方
向及び水平面に垂直なＺ方向に移動する支持手段にて支
えられている。この第１実施例の構成において、照明器
１から照射された光は、部分反射平面鏡１３で下方に反
射されてテレビカメラ４の光軸Ｒと同軸方向（下方）に
進んで被検査物、すなわち集積回路チップ２及びその周
辺のリードフレーム３を照らす。ここで、部分反射平面
鏡１３は光を完全に反射してしまわないで一部を透過さ
せる性質をもっているため、テレビカメラ４では同軸落
射照明で照らされた集積回路チップ２及びその周辺を正
確に撮像することができる。画像処理装置１４では、テ
レビカメラ４のビデオ信号を２値化又は多値化処理する
ことで、図３の（Ａ）に示される如き、導体ワイヤー５
のボンディングパッド１１に対する接合端部のボンディ
ングボール２０の縦寸法ａ及び横寸法ｂを測定すること
ができる。同様に、図３の(Ｂ)に示された、導体ワイヤ
ー５のリードフレーム電極１２に対する接合端部のステ
ィッチ（stich)２１の幅寸法ｃ及び要部長さ寸法ｄを測
定することができる。また、これらの寸法ａ乃至ｄの測
定とともに各ボンディングボール２０及びスティッチ２
１の位置も計測する。図４は本発明の第２実施例を示
す。この図において、被検査物は、第１実施例の場合と
同様にリードフレーム３上に集積回路チップ２を搭載
し、図３のように細い導体ワイヤー５を用いたワイヤー
ボンディングにより集積回路チップ２上のボンディング
パッド１１とリードフレーム側電極１２とを接続したも
のであり、導体ワイヤー５のボンディングパッド１１に
対する接合端部のボンディングボール２０の高さ及び導
体ワイヤー５のループ高さ（いずれもチップ上面基準）
を測定するために集積回路チップ２を取り囲む如く反射
器３０が配置される。図５の如く、反射器３０は正四角
錐状の凹面を成すように４個の平面鏡（完全反射平面
鏡）３１を反射面が傾斜状態で対向するように４個組み
合わせ一体化したものであり、各平面鏡３１の反射面は
リードフレーム上面に対して４５度よりも僅かに大きな
角度をなしている。照明器４１及びテレビカメラ４は下
方に向けて、すなわち被検査物である集積回路チップ２
及びリードフレーム３に対向するように回転ステージ３
２に取り付けられている。測定時において、照明器４１
は集積回路チップ２を挟んで対向する一対の平面鏡３１
の一方のものの真上に位置し、テレビカメラ４は他方の
ものの真上に位置する。前記ステージ３２はＸ，Ｙ，Ｚ
方向に移動自在で、回転中心Ｓを持つものである。した
がって、ステージ３２が９０度毎回転することで、テレ
ビカメラ４は、４個の平面鏡３１でそれぞれ反射された
画像を順次取り込むことができる。なお、反射器３０は
上下手段により支えられており、測定時以外では上昇位
置となって被検査物の搬送の妨げとならないようになっ
ている。この第２実施例の構成において、照明器４１か
ら下方に照射された光は、一方の平面鏡３１でリードフ
レーム３に沿った横方向に反射されて集積回路チップ２
を通過する透過光となり、該透過光はさらに他方の平面
鏡３１で反射されてテレビカメラ４の光軸Ｒと同軸方向
（上方）に進行する。この結果、テレビカメラ４では横
方向の透過光で照射された集積回路チップ２及びその周
辺を正確に撮像することができる。その際、各平面鏡３
１の反射面は、リードフレーム上面に対して４５度より
も僅かに大きな角度をなしているから、集積回路チップ
２の下部を通過する光も発生でき、集積回路チップ２の
下部の画像も良好に取り込むことができる。画像処理装
置１４では、テレビカメラ４のビデオ信号を２値化又は
多値化処理することで、図６に示す集積回路チップ２の
上面を基準としたボンディングボール２０の高さ寸法ｅ
及び導体ワイヤー５のループ高さ寸法ｆを測定すること
ができる。このような測定を、ステージ３２を９０度毎
回転して集積回路チップ２の４つの側面について順次実
行する。図７は本発明の第３実施例であって、第１及び
第２実施例を組み合わせた構成を示す。この場合、ステ
ージ３２に取り付けられた照明器４１及びテレビカメラ
４と、被検査物である集積回路チップ２及びリードフレ
ーム３との間に部分反射平面鏡１３が配設され、該部分
反射平面鏡１３の側方に照明器１が配設されている。そ
の他の構成は、前述の第２実施例と同様である。この第
３実施例の構成において、集積回路チップ２の上方から
みた図２のボンディングボール２０やスティッチ２１の
位置や大きさの測定時には照明器１をオン、照明器４１
はオフとし、かつテレビカメラ４を集積回路チップ２の
真上に配置して図１の第１実施例と同様の計測動作を実
行する。また、集積回路チップ２の側面からみた図６の
ボンディングボール２０の高さや導体ワイヤー５のルー
プ高さの測定時には、照明器１をオフ、照明器４１をオ
ンとし、かつ照明器４１及びテレビカメラ４を図７に図
示の位置として図４の第２実施例と同様の計測動作を実
行すればよい。なお、集積回路チップの形状に対応させ
て、第２実施例の反射器３０を正四角錐状凹面以外の正
多角錐状凹面を持つ構成とすることもできる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a wire bonding visual inspection apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. In this figure, the inspected object has an integrated circuit chip (bare chip) 2 mounted and fixed on a lead frame 3 and has a thin conductor wire 5 as shown in FIG.
Integrated circuit chip 2 by wire bonding using
The upper bonding pad 11 and the electrode 12 of the lead frame 3 are connected. The TV camera 4 includes an object to be inspected, that is, the integrated circuit chip 2 and the lead frame 3.
A partial reflection plane mirror (half mirror) 13 is arranged between the television camera 4 and the object to be inspected. The illuminator 1 is arranged on the side of the partial reflection plane mirror 13. Here, the optical axis R of the television camera 4 is perpendicular to the surface on which the lead frame 3 is placed, and the partial reflection plane mirror 1
3 is about 45 degrees with respect to the upper surface of the lead frame. The video signal output from the television camera 4 is input to the image processing device 14. In addition, the three members of the illuminator 1, the television camera 4, and the partial reflection plane mirror 13 are, for example, in a state where the mutual positional relationship is kept constant,
It is supported by a support means that moves in the X direction in the horizontal plane, the Y direction orthogonal to the X direction in the horizontal plane, and the Z direction perpendicular to the horizontal plane. In the structure of the first embodiment, the light emitted from the illuminator 1 is reflected downward by the partial reflection plane mirror 13 and advances in the direction coaxial with the optical axis R of the television camera 4 (downward), that is, the object to be inspected. The integrated circuit chip 2 and the lead frame 3 around it are illuminated. Here, since the partially reflecting plane mirror 13 has a property of partially transmitting the light without completely reflecting it, the television camera 4 accurately captures the integrated circuit chip 2 and its periphery illuminated by the coaxial epi-illumination. can do. In the image processing device 14, the video signal of the television camera 4 is binarized or multi-valued so that the conductor wire 5 as shown in FIG.
It is possible to measure the vertical dimension a and the horizontal dimension b of the bonding ball 20 at the bonding end with respect to the bonding pad 11. Similarly, the width c and the length d of the main part of the stitch 21 at the joint end of the conductor wire 5 to the lead frame electrode 12 shown in FIG. 3B can be measured. Further, the bonding balls 20 and the stitches 2 are measured together with the measurement of these dimensions a to d.
The position of 1 is also measured. FIG. 4 shows a second embodiment of the present invention. In this figure, the object to be inspected has the integrated circuit chip 2 mounted on the lead frame 3 as in the case of the first embodiment, and the integrated circuit chip 2 is formed by wire bonding using a thin conductor wire 5 as shown in FIG. The upper bonding pad 11 and the lead frame side electrode 12 are connected to each other. The height of the bonding ball 20 at the bonding end of the conductor wire 5 with respect to the bonding pad 11 and the loop height of the conductor wire 5 (both are chip top surfaces). Standard)
A reflector 30 is arranged so as to surround the integrated circuit chip 2 for measuring As shown in FIG. 5, the reflector 30 is formed by combining four plane mirrors (completely reflecting plane mirrors) 31 so as to form a regular quadrangular pyramid-shaped concave surface so that the reflecting surfaces face each other in an inclined state. The reflecting surface of the plane mirror 31 forms an angle slightly larger than 45 degrees with the upper surface of the lead frame. The illuminator 41 and the television camera 4 face downward, that is, the integrated circuit chip 2 which is the inspection object.
And the rotary stage 3 so as to face the lead frame 3.
It is attached to 2. At the time of measurement, the illuminator 41
Is a pair of flat mirrors 31 facing each other with the integrated circuit chip 2 in between.
It is located directly above one of the things, and the TV camera 4 is located just above the other. The stage 32 is X, Y, Z
It is movable in any direction and has a center of rotation S. Therefore, by rotating the stage 32 every 90 degrees, the television camera 4 can sequentially capture the images reflected by the four plane mirrors 31. The reflector 30 is supported by the up-and-down means so as not to interfere with the transportation of the object to be inspected when it is in the raised position except during measurement. In the configuration of the second embodiment, the light emitted downward from the illuminator 41 is reflected by one of the plane mirrors 31 in the lateral direction along the lead frame 3 and is integrated circuit chip 2.
Becomes the transmitted light, which is further reflected by the other plane mirror 31 and travels in the direction coaxial with the optical axis R of the television camera 4 (upward). As a result, the television camera 4 can accurately capture an image of the integrated circuit chip 2 and its periphery illuminated by the transmitted light in the lateral direction. At that time, each plane mirror 3
Since the reflection surface of No. 1 makes an angle of slightly larger than 45 degrees with respect to the upper surface of the lead frame, light passing through the lower part of the integrated circuit chip 2 can also be generated and the image under the integrated circuit chip 2 is also good. Can be taken into. In the image processing device 14, the height dimension e of the bonding ball 20 with reference to the upper surface of the integrated circuit chip 2 shown in FIG.
Also, the loop height dimension f of the conductor wire 5 can be measured. Such measurement is sequentially performed on the four side surfaces of the integrated circuit chip 2 by rotating the stage 32 every 90 degrees. FIG. 7 shows a third embodiment of the present invention, which is a combination of the first and second embodiments. In this case, the partial reflection plane mirror 13 is arranged between the illuminator 41 and the television camera 4 attached to the stage 32, and the integrated circuit chip 2 and the lead frame 3 as the inspection object. The illuminator 1 is arranged laterally. Other configurations are similar to those of the second embodiment described above. In the structure of the third embodiment, the illuminator 1 is turned on and the illuminator 41 is turned on when measuring the position and size of the bonding ball 20 and the stitch 21 of FIG. 2 viewed from above the integrated circuit chip 2.
Is turned off, and the television camera 4 is arranged right above the integrated circuit chip 2 to perform the same measurement operation as that of the first embodiment shown in FIG. Further, when measuring the height of the bonding ball 20 and the loop height of the conductor wire 5 of FIG. 4 may be set to the position shown in FIG. 7 and the same measurement operation as in the second embodiment of FIG. 4 may be executed. The reflector 30 according to the second embodiment may have a regular polygonal pyramidal concave surface other than the regular quadrangular pyramidal concave surface in accordance with the shape of the integrated circuit chip.
【発明の効果】以上説明したように、本発明のワイヤー
ボンディング外観検査装置によれば、反射鏡の配置を工
夫することにより、導体ワイヤー接合端部のボンディン
グボールの位置、形状並びに大きさ、あるいは導体ワイ
ヤーのループ高さやボンディングボール高さを正確に認
識できる。この結果、ワイヤーボンディング工程終了後
の検査の自動化を図ることができ、外観検査人員の省力
化を図り得る。さらに、検査結果をワイヤーボンディン
グ工程を実行するワイヤーボンダーにフィードバックす
ることにより、製品の品質向上を図ることが可能とな
る。As described above, according to the wire bonding visual inspection apparatus of the present invention, the position, shape and size of the bonding ball at the conductor wire joining end can be improved by devising the arrangement of the reflecting mirror. It is possible to accurately recognize the loop height of the conductor wire and the height of the bonding ball. As a result, the inspection after the wire bonding process is completed can be automated, and the labor of the appearance inspection personnel can be saved. Further, by feeding back the inspection result to the wire bonder that executes the wire bonding process, it is possible to improve the quality of the product.
【図１】本発明に係るワイヤーボンディング外観検査装
置の第１実施例を示す構成図である。FIG. 1 is a configuration diagram showing a first embodiment of a wire bonding visual inspection apparatus according to the present invention.
【図２】被検査物としての集積回路チップ及びその周辺
を示す拡大平面図である。FIG. 2 is an enlarged plan view showing an integrated circuit chip as an inspection object and its periphery.
【図３】集積回路チップの上方からみたボンディングボ
ール及びスティッチの形状を示す説明図である。FIG. 3 is an explanatory diagram showing the shapes of a bonding ball and a stitch as seen from above the integrated circuit chip.
【図４】本発明の第２実施例を示す構成図である。FIG. 4 is a configuration diagram showing a second embodiment of the present invention.
【図５】第２実施例で用いる反射器の平面図である。FIG. 5 is a plan view of a reflector used in the second embodiment.
【図６】集積回路チップの側方からみたボンディングボ
ール及び導体ワイヤーの高さを示す説明図である。FIG. 6 is an explanatory diagram showing the heights of the bonding balls and the conductor wires as seen from the side of the integrated circuit chip.
【図７】本発明の第３実施例を示す構成図である。FIG. 7 is a configuration diagram showing a third embodiment of the present invention.
【図８】従来のワイヤーボンディングの外観検査の構成
例を示す構成図である。FIG. 8 is a configuration diagram showing a configuration example of a conventional visual inspection of wire bonding.
【図９】被検査物の１例としてのリードフレーム及びこ
れに搭載された集積回路チップを示す平面図である。FIG. 9 is a plan view showing a lead frame as an example of an object to be inspected and an integrated circuit chip mounted on the lead frame.
１，６，４１ 照明器 ２ 集積回路チップ ３ リードフレーム ４ テレビカメラ ５ 導体ワイヤー １１ ボンディングパッド １２ 電極 １３ 部分反射平面鏡 １４ 画像処理装置 ２０ ボンディングボール ３０ 反射器 ３１ 平面鏡 ３２ ステージ 1, 6, 41 Illuminator 2 Integrated circuit chip 3 Lead frame 4 TV camera 5 Conductor wire 11 Bonding pad 12 Electrode 13 Partial reflection plane mirror 14 Image processing device 20 Bonding ball 30 Reflector 31 Plane mirror 32 Stage
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/66 Ｊ 7352−4Ｍ Ｈ０４Ｂ 10/02 Ｈ０４Ｎ 7/18 Ｂ Ｈ０５Ｋ 13/08 Ｑ 8315−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location H01L 21/66 J 7352-4M H04B 10/02 H04N 7/18 B H05K 13/08 Q 8315-4E
Claims (2)
載されているリードフレームとをワイヤーボンディング
で接続した被検査物の外観を検査するワイヤーボンディ
ング外観検査装置において、前記集積回路チップ及びリ
ードフレームにテレビカメラを対向配置し、該テレビカ
メラと前記集積回路チップとの間に部分反射鏡を傾斜さ
せて配設するとともに、該部分反射鏡に向けて光を照射
する照明手段を配設し、該照明手段から照射された光が
前記部分反射鏡で反射されて前記集積回路チップ及びリ
ードフレームを上方から照らすようにしたことを特徴と
するワイヤーボンディング外観検査装置。1. A wire bonding visual inspection apparatus for inspecting the external appearance of an object to be inspected, wherein an integrated circuit chip and a lead frame on which the integrated circuit chip is mounted are connected by wire bonding. The television cameras are arranged to face each other, and the partial reflecting mirror is inclinedly arranged between the television camera and the integrated circuit chip, and the illuminating means for irradiating light toward the partial reflecting mirror is arranged. The wire bonding visual inspection apparatus is characterized in that the light emitted from the illuminating means is reflected by the partial reflecting mirror to illuminate the integrated circuit chip and the lead frame from above.
載されているリードフレームとをワイヤーボンディング
で接続した被検査物の外観を検査するワイヤーボンディ
ング外観検査装置において、前記集積回路チップの両側
に、当該集積回路チップを挟んで傾斜した反射面が相互
に対向する如く少なくとも一対の反射鏡を配設し、それ
ら一対の反射鏡のうちの一方の反射鏡に照明手段を対向
配置するとともに、他方の反射鏡にテレビカメラを対向
配置し、前記照明手段から照射された光が一方の反射鏡
で反射されて前記集積回路を側方から照らすようにした
ことを特徴とするワイヤーボンディング外観検査装置。2. A wire bonding visual inspection apparatus for inspecting the external appearance of an object to be inspected, wherein an integrated circuit chip and a lead frame on which the integrated circuit chip is mounted are connected by wire bonding. At least a pair of reflecting mirrors are arranged so that the inclined reflecting surfaces sandwich the integrated circuit chip so as to face each other, and one of the pair of reflecting mirrors is provided with the illuminating means so as to face the other reflecting mirror. A wire bonding visual inspection apparatus, wherein a television camera is arranged opposite to a reflecting mirror, and light emitted from the illuminating means is reflected by one reflecting mirror to illuminate the integrated circuit from the side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18609792A JP3215871B2 (en) | 1992-06-19 | 1992-06-19 | Wire bonding visual inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18609792A JP3215871B2 (en) | 1992-06-19 | 1992-06-19 | Wire bonding visual inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH063124A true JPH063124A (en) | 1994-01-11 |
| JP3215871B2 JP3215871B2 (en) | 2001-10-09 |
Family
ID=16182319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18609792A Expired - Fee Related JP3215871B2 (en) | 1992-06-19 | 1992-06-19 | Wire bonding visual inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3215871B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI423411B (en) * | 2010-01-15 | 2014-01-11 | ||
| JP2015152510A (en) * | 2014-02-18 | 2015-08-24 | 株式会社東芝 | Lead frame shape inspection apparatus and lead frame distance measuring method |
| CN112179920A (en) * | 2020-11-29 | 2021-01-05 | 惠州高视科技有限公司 | Method and system for detecting chip bonding wire defects |
| CN112730453A (en) * | 2020-12-22 | 2021-04-30 | 华南理工大学 | Bottom visual inspection device after multi-pin component pin insertion |
-
1992
- 1992-06-19 JP JP18609792A patent/JP3215871B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI423411B (en) * | 2010-01-15 | 2014-01-11 | ||
| JP2015152510A (en) * | 2014-02-18 | 2015-08-24 | 株式会社東芝 | Lead frame shape inspection apparatus and lead frame distance measuring method |
| CN112179920A (en) * | 2020-11-29 | 2021-01-05 | 惠州高视科技有限公司 | Method and system for detecting chip bonding wire defects |
| CN112730453A (en) * | 2020-12-22 | 2021-04-30 | 华南理工大学 | Bottom visual inspection device after multi-pin component pin insertion |
| CN112730453B (en) * | 2020-12-22 | 2022-07-26 | 华南理工大学 | Bottom visual inspection device after multi-pin element pin insertion |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3215871B2 (en) | 2001-10-09 |
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