JPH06277942A - Brazing method for tip for tip saw and its device - Google Patents

Abstract

PURPOSE:To prevent the accumulation of a flux onto a tip supporting member to facilitate a flux removing work by providing a flux removing means to remove the flux adhering to the tip supporting member. CONSTITUTION:A tip 18 mounted at the point of the supporting plate 16a of a tip supporting member 2a is fitted on the stepped part of a tip saw 5, and a silver solder is abutted on a joining part between the stepped part and the tip 18, and melted by heat generated through induction heating to braze the tip 18 and the stepped part. Next a motor is rotated to rotate the tip supporting member 2a to a D position. After the tip supporting member 2a stops at the D position, a flux removing device is actuated, and air is jetted from a jetting nozzle 24 to remove the flux adhering to the tip of the supporting plate 16a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tip brazing method and apparatus for a tip saw used for cutting grass and the like.

[0002]

2. Description of the Related Art Conventionally, brazing of chips to a tip saw is performed as shown in FIGS. 6 and 7, for example. That is,
A chip support member 42 is arranged above the vertically movable support column 40 via a connecting pipe 41 that is movable in the left-right direction (direction of arrow A in FIG. 7). The chip support member 42 has a chip support plate 45 movable on a frame 43 via a ball slider 44, and a chip 48 is placed on a support plate 46 fixed to the tip end of the chip support plate 45. Then, the tip 48 is brought into contact with the stepped portion 47a of the tip saw 47 rotatably attached to the tip saw support base (not shown).

In this state, flux is applied to the chip 48 with a brush or the like, and a heating coil connected to a high-frequency inverter (not shown) is placed close to the chip 48 to inductively heat the part and bring a silver solder into contact therewith. . As a result, the silver wax is melted and the tip 48 becomes the step portion 47 of the tip saw 47.
It is brazed to a. Then, when one chip 48 is brazed, the chip support plate 45 is pushed rearward (in the direction of arrow B) against the biasing force of the coil spring 49 to engage the tip portion of the support plate 46 with the step portion 47a. Then, the tip saw 47 is rotated in the direction of arrow C in FIG. Then, the chip support plate 45 is returned to the original position, and the chip 48 is brazed to the next step 47a by the same method as described above. This is performed for all the step portions 47a of the tip saw 47, and the brazing of the tip 48 is completed.

[0004]

However, in this chip brazing method, the support plate 4 of the chip support member 42 is used.
Flux was apt to adhere to No. 6 and its removal was troublesome, and the brazing work efficiency was poor.
That is, since the tip saw 47 is usually provided with a large number of blades, that is, stepped portions 47a on the peripheral surface thereof, and flux is applied to each of them, the flux easily deposits on the tip portion of the support plate 46. Due to the viscosity of this flux, the work becomes difficult when the chip 48 is set at the tip position of the support plate 46. Therefore, it is necessary to regularly remove the adhered flux, the number of times is increased, and the removal work becomes troublesome, and it is necessary to temporarily suspend the brazing work when removing the flux, which reduces the brazing work efficiency. Will be inferior.

The present invention has been made in view of the above circumstances, and it is possible to easily remove the flux adhering to the tip supporting member and to improve the work efficiency of brazing. It is an object to provide a method and an apparatus thereof.

[0006]

In order to achieve the above object, the method of tip brazing a tip saw according to claim 1 sets the tips on at least four tip support members arranged in the circumferential direction on the disk. Chip set process,
It comprises a flux applying step of applying flux to the set chips, a brazing step of brazing the chips coated with the flux by high frequency induction heating, and a flux removing step of removing the flux adhering to the chip supporting member. Then, the respective steps are sequentially performed while rotating the disk.

According to a second aspect of the present invention, there is provided a tip brazing device for a tip saw, wherein at least four tip supporting members are arranged on the disc in the circumferential direction, rotating means for rotating the disc, and the tip supporting member. Chip setting means for setting the chips, flux applying means for applying the flux to the set chips, brazing means for brazing the flux-coated chips by high frequency induction heating, and flux attached to the chip supporting member. And a control means for controlling each of the above means.

[0008]

According to the chip brazing method of claim 1, at least four chip supporting members are arranged on a rotatable disk, and while each supporting member is rotating, the chip setting process and the flux applying process are performed. The brazing process and the flux removing process are sequentially performed. As a result, the flux adhered to the chip support member is removed in the flux removing step within one round of each step and is not deposited, and the chip brazing operation can be automated.

Further, according to the chip brazing apparatus of the second aspect, the chip is set on the chip supporting member by the chip setting means, and the flux is applied to the chip by the flux applying means. Then, the chip coated with the flux is brazed to the chip saw by the brazing means, and the flux attached to the chip supporting member is removed by the flux removing means. The chip support member is arranged on a disk rotated by the rotating means, and the operation is sequentially performed by each means while the disk rotates. As a result, the flux adhering to the chip support member is removed every time brazing is performed, and the flux is not deposited.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows a basic configuration diagram of a chip brazing apparatus according to the present invention. In FIG. 1, a chip brazing apparatus 1 includes a disk 3 on which four chip supporting members 2a to 2d are arranged, and a motor 4 for rotating the disk 3.
It has a tip saw support base 6 for supporting the tip saw 5, a high frequency inverter 8 connected to the heating coil 7, a flux applicator 9 and a flux remover 10, and a controller 11 for controlling them.

As shown in FIGS. 2 and 3, the disk 3 is fixed to a rotary shaft 4a of a motor 4 arranged in a housing 12, and the upper surface thereof has a position A to divide the disk 3 into four equal parts. In D,
Four chip support members 2a to 2d are fixed. The chip support members 2a to 2d are composed of frames 13a to 13d.
chip support plates 15a to 15d movably mounted on d via ball sliders 14a to 14d (see FIG. 3, but ball sliders 14b and 14d are not shown).
have. Support plates 16a to 16d made of, for example, copper plates are fixed to the tips of the chip support plates 15a to 15d. Each of the support plates 16a to 16d has a narrow tip portion, and the tip 18 is mounted on the tip portion as described later.

The chip support plates 15a-15d are
The coil springs 19a to 19d are urged in the tip direction, and the coil springs 19a to 19d move by pushing in the arrow D direction in FIG. The tip support plates 15a to 15d are configured to be movable in order to facilitate the disengagement of the tip saw 5 described later and to reduce the impact when the tip saw 5 contacts the support plates 16a to 16d. However, it is not always necessary in the present invention.

The motor 4 is connected to the control device 11, and the foot switch 20 (FIG. 1) connected to the control device 11 is connected.
The disk 3 is rotated by the ON signal of
Rotate it once. The flux applicator 9 is arranged at the B position which is divided into four equal parts, and the flux is ejected from the ejection nozzle 21 by the control signal of the control device 11, so that the chip 1
Apply to 8.

Further, the heating coil 7 arranged at the position C
Is a copper pipe bent into a predetermined shape, both ends of which are electrically connected to the high-frequency inverter 8 and also connected to a cooling water supply device (not shown) provided in the high-frequency inverter 8 to circulate cooling water in the pipe. Supplied. The tip saw support 6 arranged near the heating coil 7 is shown in FIG.
As shown in FIG. 2, the supporting table main body 23 that moves on the pair of rails 22a and 22b is provided.
Is rotatably mounted in a vertical position.

The flux removing device 10 is disposed at the position D, and, for example, air is supplied from the injection nozzle 24 to the supporting plate 16
The support plate 16 after being sprayed and brazed to the tips of a to 16d
The flux adhering to a to 16d is removed. The chip storage box 25 is arranged at the position A, and the chips 18 are placed on the support plates 16a to 16d at this position.

Next, the chip 1 by the brazing apparatus 1
The brazing method of No. 8 will be described. First, the chip 18 is taken out from the chip storage box 25 by hand or tweezers and placed on the support plate 16a of the chip support member 2a stopped at the position A. And the foot switch 20
When stepping on, the control device 11 outputs a drive signal to the motor 4 to rotate the motor 4 90 degrees. The disk 3 is rotated by the rotation of the motor 4, and the tip support member 2a is moved to the B position.

When the tip supporting member 2a is stopped at the position B, the flux applying device 9 is operated by the control signal of the control device 11, and the flux is ejected from the ejection nozzle 21 toward the tip 18. As a result, the flux is applied to the chip 18. While this flux is being applied, the operator inserts the next chip 1 on the support plate 16d of the chip support member 2d stopped at the position A by the operator.
8 is placed.

When the foot switch 20 is stepped on, the motor 4 is rotated by the control signal from the control device 11, and the tip support member 2a is rotated to the C position. When the chip support member 2a is stopped at the C position, the high frequency inverter 8 is activated by the control signal of the control device 11 and a predetermined high frequency current is supplied to the heating coil 7, and the chip 1 is processed as follows.
8 is brazed to the step portion 5a of the tip saw 5.

That is, as shown in FIG. 4, the chip 18 placed on the tip of the supporting plate 16a of the chip supporting member 2a is
An operator fits the step portion 5a with tweezers or the like, and pushes the tip 18 in the arrow E direction to bring the silver solder 26 into contact with the joint portion between the step portion 5a and the tip 18. The silver solder 26 is melted by the heat of induction heating, and the tip 18 and the step 5a are brazed, as shown in FIG. When the tip 18 is brazed to the step portion 5a, the tip saw 5
Is slightly rotated in the direction opposite to the arrow, the engagement with the support plate 16a is released, and the foot switch 20 is stepped on. Control device 1
1 rotates the motor 4 according to the control signal to rotate the chip support member 2a to the D position.

When the tip supporting member 2a stops at the D position, the flux removing device 10 is actuated by the control signal of the control device 11, and, for example, air is ejected from the ejection nozzle 24 and adheres to the tip portion of the support plate 16a. Remove the flux. At this time, the support plate 16b is located at the C position, and the chip 18 placed on the support plate 16b
Then, the tip saw 5 is rotated in the direction of the arrow to engage the next step 5a. As a result, the four steps are completed, the chip support member 2a is again rotated to the position A by the next signal from the control device 11, and the steps similar to the above are repeated.

That is, in the above-described tip brazing method, the operator sets the tip 18 on the support plates 16a to 16d at the position A, and the tip 18 is set to B.
The flux is automatically applied at the position. Then, the tip 18 is brazed at the C position by the worker or another worker, and the flux adhering to the tips of the support plates 16a to 16d is automatically removed at the C position.

As described above, according to the above embodiment, by stepping on the foot switch 20, the chip support members 2a to 2a.
2d is sequentially rotated to perform each work, and after brazing the chips 18, the flux removing device 10 is used to support the support plate 16
The flux attached to the tips of a to 16d is removed.
Therefore, the flux is not deposited on the support plates 16a to 16d, and it is not necessary to remove the flux periodically, and the removal work is facilitated. Further, since it is not necessary to temporarily suspend the brazing work and the flux applying and removing work can be automatically performed, the operator only has to set the chips 18 and perform the brazing work. Work efficiency can be improved.

In the above embodiment, the chip 18 set at the position A is sent to the next step as it is. For example, as shown in FIG.
A recess 27 may be provided at the tip portion of 6d, and a suction device (not shown) may be connected to the recess 27 to suck and fix the set chip 18 in the recess 27.
By doing so, it is possible to prevent the tip 18 from moving when the disc 3 rotates, and the brazing work at the C position becomes easier.

Further, in the above embodiment, the operator sets the chip 18 at the A position and automatically applies the flux at the B position. For example, the chip 18 is set on the support plates 16a to 16d. May be performed automatically, or the flux may be applied manually with a brush or the like. Further, each work can be completely automated, such as mechanizing the pressing of the tip 18 to the step portion 5a and automating the disengagement of the tip 18 and the tip saw 5.

Further, the flux removing device 10 is not limited to the above embodiment, and for example, at the position D, the flux removing device 10 can be manually removed, the cleaning liquid can be sprayed on the supporting plates 16a to 16d, or the supporting plates 16a to 16d. It is possible to employ an appropriate method such as immersing the resin in a cleaning liquid to remove the flux. Further, it goes without saying that the configurations of the disk 3 and the chip support members 2a to 2d in the above embodiment are also examples, and can be variously modified without departing from the scope of the present invention.

[0026]

As described in detail above, according to the tip brazing method and device for a tip saw of the present invention, it is possible to prevent the accumulation of flux on the tip supporting member,
Flux removal work can be easily performed, and the work efficiency of brazing can be improved.

[Brief description of drawings]

FIG. 1 is a basic configuration diagram of a chip brazing apparatus according to the present invention.

[Figure 2] Plan view of the disk

FIG. 3 is a sectional view of the same side.

FIG. 4 is an explanatory diagram of the same operation.

FIG. 5 is a cross-sectional view of essential parts showing another example of the chip support plate.

FIG. 6 is a side view of a main part of a conventional chip brazing device.

FIG. 7 is a plan view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip brazing device 2a-2d Chip support member 3 Disk 4 Motor 5 Chip saw 5a Step part 6 Chip saw support stand 7 Heating coil 8 High frequency inverter 9 Flux coating device 10 Flux removal device 11 Control device 15a-15d Chip support plate 16a-16d Support Board 18 chips

Claims (2)

[Claims] 1. A chip setting step of setting chips on chip supporting members arranged at least four in a circumferential direction on a disk, a flux applying step of applying flux to the set chips, and a flux applying step. And a flux removing step of removing the flux adhering to the chip supporting member, the steps are sequentially performed while rotating the disk. A method for brazing a tip saw. 2. A chip supporting member arranged at least four in a circumferential direction on a disk, a rotating means for rotating the disk, and a chip setting means for setting a chip on the chip supporting member are set. A flux applying means for applying a flux to the chip, and a brazing means for applying a high frequency induction heating to the flux-coated chip and brazing the chip,
A tip brazing device for a tip saw, comprising: a flux removing means for removing the flux attached to the tip supporting member; and a control means for controlling each of the above means.