JPH0626299U - Chip-shaped electronic component feeder - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] Prevents the parts from popping out and the posture from failing in the parts transport path, and eliminates component pick-up errors. [Structure] A fixed first cover guide 80 and a pair of cover guides 60, 60 having an inverted L-shaped front opening and closing are arranged so as to cover the carrier tape 100 immediately after the cover tape 110 is peeled off. Therefore, the chip-shaped electronic component a that is moving while being stored in the component storage unit 101 of the carrier tape 100 does not pop out and spill, or its posture does not change. Then, the suction nozzle 50 vacuum-sucks and holds the chip-shaped electronic component a therein through the nozzle insertion hole 62 provided in the second cover guides 60, 60. Then, the second cover guide 60,
Since the nozzle 60 opens from both sides of the nozzle insertion hole 62, the suction nozzle 50 takes out the chip-shaped electronic component a sucked and held at its tip and conveys it to, for example, the circuit board side.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip-shaped electronic component supply device used for supplying chip-shaped electronic components such as a chip resistor and a chip capacitor and mounting them on a circuit board, and particularly to a chip-shaped electronic component on a circuit board. The present invention relates to a chip-shaped electronic component supply device that can be applied to a so-called one-by-one type mounting device for mounting on a board.

[0002]

[Prior art]

 In the past, for example, in an apparatus for automatically mounting chip-shaped components on a circuit board, chip-shaped electronic components packaged in line with a carrier tape or chip-shaped electronic components pre-aligned from the bulk state are suction nozzles of the automatic mounting device. It is sequentially moved to the bottom, where it is sucked and held at the tip of the suction nozzle, and then moved and mounted on the circuit board.

In the chip-shaped electronic component mounting apparatus as described above, when the chip-shaped electronic component is moved to the suction position in order to be sucked and held by the suction nozzle, for example, the chip-shaped electronic component packaged in the carrier tape is In this case, remove the cover tape of the carrier tape in advance, and if the chip-shaped electronic components are to be transferred while being held at a predetermined position on the transfer belt, the electronic component holding claws for holding the chip-shaped electronic components in advance. Release the holding state such as to make it possible to take out the chip-shaped electronic component to be adsorbed from above.

[0004]

[Problems to be solved by the device]

 However, in the conventional component feeder, the carrier tape is removed by peeling off the cover tape, then while it is transported to the suction position, or after removing the holding claws of chip-shaped electronic components, During the time before the electronic components are picked up, the chip-shaped electronic components may spill from the carrier tape or the transfer belt, or the chip-shaped electronic components may stand up in the storage groove, resulting in suction errors. I had a problem.

Therefore, in the present invention, in view of the above-mentioned problems in the prior art, the chip-shaped electronic components conveyed on the carrier tape or the transfer belt are surely transferred to the suction position by the suction nozzle in a correct posture. It is an object of the present invention to provide a chip-shaped electronic component supply device capable of preventing the occurrence of suction error.

[0006]

[Means for Solving the Problems]

 That is, in order to achieve the above object, according to the present invention, a carrier means for holding and carrying a chip-shaped electronic component in a component housing formed side by side in the transport direction, and a chip-shaped electronic component by the carrier means. Is arranged on the transfer path of the transfer device, and has a suction nozzle for sucking and holding the chip-shaped electronic component at its tip, and a suction nozzle which is divided into two parts to open and close, and when closed, covers the surface of the component transfer path of the transfer means. And a cover guide, which is larger than the outer diameter of the suction nozzle at the position where the suction nozzle sucks the chip-shaped electronic component on the component conveying path of the cover guide and the chip-shaped electronic component. A chip insertion hole having a diameter smaller than the external shape of the component is provided, and the cover guide is opened and closed separately on both sides of the nozzle insertion hole at a position where the chip-shaped electronic component is sucked. Providing Jo electronic component feeding device.

[0007]

[Action]

 According to the chip-shaped electronic component supply device of the present invention, when the chip-shaped electronic component is transported to the suction position by the suction nozzle on the component transportation path on the transportation step surface, the surface of the component transportation path is covered by the cover guide. Therefore, the chip-shaped electronic component transported on the transport means is moved while being held at a predetermined position in the component storage unit and does not spill or stand up on the way. Therefore, the chip-shaped electronic component can be reliably sucked by the suction nozzle, and a suction error can be prevented. The tip of the suction nozzle can be inserted into the cover guide through a nozzle insertion hole formed on the cover guide. Then, after contacting and adsorbing the chip-shaped electronic component in it and adsorbing and holding the chip-shaped electronic component at the tip, the cover guide is divided and opened on both sides at this adsorption position, and the chip-shaped electronic component Electronic components are taken out.

[0008]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 3 shows an external view of a chip-shaped electronic component supply apparatus according to an embodiment of the present invention. In the figure, reference numeral 10 is a carrier tape reel around which a carrier tape 100 is wound, and the carrier tape 100 is its carrier tape reel. It is formed by arranging recesses for storing components at predetermined intervals in the longitudinal direction, accommodating chip-shaped electronic components in the recesses, and sealing the upper portion with a cover tape. As is clear from this figure, the carrier tape 100 supplied from the carrier tape reel 10 is supplied to the chip-shaped electronic component supply device 30 side through the guide reel 20.

The cover tape 110 of the carrier tape 100 is peeled off on the chip-shaped electronic component supply device 30 side, and the cover tape 110 is wound on another tape reel 40. Further, the carrier tape 100 from which the cover tape 110 has been peeled off is opened above the component housing portion housing the chip-shaped electronic components, and the chip-shaped circuit components housed therein are suction-held by the suction nozzle 50. The chip-shaped electronic component sucked by the suction nozzle 50 is mounted on a circuit board (not shown), and the emptied carrier tape 100 is sent out by one component storage unit.

FIG. 2 shows a main part of the chip-shaped electronic component supply apparatus according to the present invention. A suction nozzle and a suction nozzle 50 for sucking and holding the chip-shaped electronic component a are arranged at the tip of the transport path of the component formed by the carrier tape 100 after the cover tape 110 is peeled off. The suction nozzle 50 can be moved up and down by a drive mechanism (not shown) as indicated by an arrow in the figure. The position where the suction nozzle 50 descends and intersects the transport path is the position where the suction nozzle 50 sucks the chip-shaped electronic component at its tip, that is, the suction position.

In addition, a first cover guide 80 having a gate-shaped front surface and a pair of members having an inverted L-shaped front surface so as to cover the surface of the carrier tape 100 immediately after the cover tape 110 is peeled off. The two cover guides 60, 60 are arranged opposite to each other on both sides of the component conveying path of the conveying means through which the carrier tape 100 passes. The first cover guide 80 is provided right after the position where the cover tape 110 is peeled off from the carrier tape 100 to the second cover guides 60, 60, which covers the upper surface of the carrier tape 100 without opening and closing. There is. Further, the lower ends of the second cover guides 60, 60 are pivotally attached so that they can be opened separately on both sides thereof. A nozzle for inserting the suction nozzle 50 on the separation line of both cover guides 60, 60 on the upper surface of the second cover guide 60, 60 at the suction position on the transport path, that is, directly below the suction nozzle 50. An insertion hole 62 is formed. The nozzle insertion hole 62 is provided on the dividing line where the cover guides 60, 60 are separated and opened on both sides. Therefore, the cover guides 60, 60 are separately opened on both sides of the nozzle insertion hole 62. The diameter of the nozzle insertion hole 62 is larger than the outer diameter of the tip of the suction nozzle 50 and smaller than the outer shape of the chip-shaped electronic component a conveyed on the carrier tape. ing.

The operation of the chip-shaped electronic component supply device will be described. First, the chip-shaped electronic component a to be supplied is conveyed while being packaged in the carrier tape 100, and the cover tape 110 is peeled off. Then, the tape is fed upward, and is wound on the other tape reel 40 shown in FIG. By peeling off the cover tape 110, the upper part of the component storage portion 101 of the carrier tape 100 is opened. In this state, the chip-shaped electronic component a is transported in the direction of the arrow as the carrier tape 100 moves. Since the first and second cover guides 80, 60, 60 are arranged along this transport path, the chip-shaped electronic component a stored in the component storage section 101 of the carrier tape 100 is It is prevented from jumping out of the storage groove 101 and spilling or standing up due to vibration or the like, and the sheet is conveyed in a correct posture.

After that, when the carrier tape 100 moves and the chip-shaped electronic component a in the storage groove 101 reaches the suction position below the suction nozzle 50, the carrier tape 100 stops and the suction nozzle 50 descends. To do. The suction nozzle 50 has its tip inserted into the cover guides 60, 60 through the nozzle insertion holes 62 of the second cover guides 60, 60, and sucks and holds the chip-shaped electronic component a therein. After that, the pair of cover guides 60, 60 are separated and opened on both sides of the component transport path around the nozzle insertion hole 62 as shown by the arrow in the figure. Then, in this state, the suction nozzle 50 that suction-holds the chip-shaped electronic component a at its tip rises. After that, the suction nozzle 50 moves, and the chip-shaped electronic component a suction-held at its tip is automatically supplied and mounted on a circuit board (not shown).

FIG. 4 shows another embodiment of the present invention. In this embodiment, the cover guides are provided on both sides of the component conveying path like the second cover guides 60, 60. Instead of opening separately, it opens separately in the transfer direction of the parts transfer path. That is, the pair of cover guides 60 ′ and 60 ′ are separated into the above two parts of the component conveying path, and the nozzle insertion hole 62 is provided on the dividing line. Therefore, after the suction nozzle 50 is lowered and the tip-shaped electronic component a is suction-held at its tip, these cover guides 60 ′, 60 ′ are opened by sliding back and forth, The chip-shaped electronic component a is taken out in the meantime. The state where the cover guides 60 ', 60' are slid in this manner is shown by broken lines in the figure. Here, since the rear cover guide 60 'has the function of the first cover guide 80, a fixed cover guide such as the first cover guide 80 is not particularly necessary.

FIG. 5 shows still another embodiment of the present invention. In this embodiment, unlike the method of supplying the chip-shaped electronic parts by the carrier tape, the chip-shaped electronic parts are sequentially sent out and supplied one by one, and the supplied chip-shaped electronic parts a are It is conveyed by the conveyor belt 70 arranged along the component conveying path. In addition, on the surface of the conveyor belt 70, a component storage portion 71 for storing the chip-shaped electronic circuit a in a predetermined posture is formed. The first cover guide 80 and the second opening / closing cover guides 60, 60 arranged along the component conveyance path prevent the chip-shaped electronic components from being ejected during conveyance and a suction error due to a poor appearance. This is the same as the case of the carrier tape 100 with the cover tape 110 removed. Reference numeral 75 in the drawing denotes a chute for sequentially taking out the chip-shaped electronic components a stored in a bulk form one by one and then supplying the electronic components a to the component storage portion 71 of the belt conveyor 70. Further, although not shown, in the embodiment in which the conveyor belt shown in FIG. 5 constitutes the parts conveying path, a pair of cover guides 70 ', 70' which can slide forward and backward as shown in FIG. 4 are adopted. Is also possible.

[0016]

[Effect of device]

 As described above, according to the present invention, the function of the pair of cover guides arranged along the component conveying path is to convey the conveyed chip-shaped electronic components to the suction position in a correct posture. It eliminates the occurrence of suction mistakes due to the suction nozzle and enables accurate component supply. As a result, it becomes possible to provide a chip-shaped electronic component supply device with high production capacity.

[Brief description of drawings]

FIG. 1 is a perspective view showing an open state of a cover guide for explaining the operation of a chip-shaped electronic component supply apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view for explaining a main part structure of a chip-shaped electronic component supply device according to an embodiment of the present invention.

FIG. 3 is a schematic structural diagram showing an overall structure of a chip-shaped electronic component supply device according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a main structure of a chip-shaped electronic component supply device according to another embodiment of the present invention.

FIG. 5 is a perspective view showing a main structure of a chip-shaped electronic component supply device according to still another embodiment of the present invention.

[Explanation of symbols]

 10, 40 reel 50 suction nozzle 60, 60 'cover guide that is opened and closed 62 nozzle insertion hole 70 conveyor belt 71 parts storage part 80 fixed cover guide 100 carrier tape 101 parts storage part 110 cover tape a chip-shaped electronic part

Claims (1)

[Reference number] 0040300-01 [Claims for utility model registration] 1. A transport means for holding and transporting a chip-shaped electronic component in a component storage portion formed side by side in the transport direction, and a transport route for the chip-shaped electronic component by the transport means, which is disposed at the tip. The cover has a suction nozzle that sucks and holds the chip-shaped electronic component, and a cover guide that is divided into two and is opened / closed and is arranged to cover the surface of the component transport path of the transport means when closed. A nozzle insertion hole having a diameter larger than the outer diameter of the suction nozzle and smaller than the outer diameter of the chip electronic component at a position where the suction nozzle sucks the chip electronic component on the component conveying path of the guide. And a cover guide that is opened and closed separately on both sides of the nozzle insertion hole at a position where the chip electronic component is sucked.