JPH0625021Y2 - Optical coupling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a structure of a reflection type optical coupling device (for example, a photo interrupter) capable of detecting the presence or absence of an object to be detected without contact.

<Prior Art> A conventional reflection type optical coupling device (photointerrupter) has a light emitting element 1 and a light receiving element 2 as shown in FIG. To the terminal on the other side (not shown) internally with a gold wire 5, and then the transparent resin 6 is placed in the recess 3a of the case 3.
It is poured into and sealed.

<Problems to be Solved by the Invention> However, the conventional reflection type optical coupling device is expensive because the case 3 made of ceramics is required.

Further, since the lead frame 4 is provided in the case 3 and the lead frame 4 is connected to the light emitting element 1, the light receiving element 2 and the gold wire 5 in the recess 3a of the case 3, when these connections are automated. Required complex manufacturing equipment.

Furthermore, when the resin is sealed, the resin 6 is injected into each of the individual products, so that the light emitting surface 6a and the light receiving surface 6b have irregularities,
It was also a cause of rising production costs.

Therefore, in view of the above problems, the present invention can stably supply the shape and size of the case, smooth the light emitting surface and the light receiving surface, and improve the performance thereof. It is an object of the present invention to provide an optical coupling device that can be easily automated and can significantly reduce the production cost.

<Means for Solving Problems> The means for solving problems according to the present invention is, as shown in FIGS. 1 to 4, a light-receiving element 1 mounted on the tip of a lead frame 10.
1 is mounted on the tip of a lead tail frame 15 different from the lead frame 10 and a light emitting side transparent resin body 14 coated with a translucent thermosetting resin 13 so that its light receiving surface 12 becomes smooth. The light-receiving side transparent resin body 18, which is formed by coating the light-receiving element 16 with the thermosetting resin 13 so that the light-receiving surface 17 becomes smooth, and the light-emitting side transparent resin so that the lead frames 10 and 15 are perpendicular to each other. The light-receiving side transparent resin body 18 and the light-receiving side transparent resin body 18 are juxtaposed at a predetermined distance, and the surfaces of the light-emitting side transparent resin body 14 and the light-receiving side transparent resin body 18 excluding the light-receiving surfaces 12 and 17 are removed. An opaque resin body 21 made of a light-shielding thermoplastic resin 20 formed so as to cover the opaque resin body 21 and sandwiched between the light emitting side transparent resin body 14 and the light receiving side transparent resin body 18 of the opaque resin body 21. Shading wall in the center 3 is formed, the light-emitting surface 12 and the light receiving surface 17 is one which is inclined suited connexion down to the light shielding wall 23 side.

<Operation> In the means for solving the above problems, the optical coupling device includes the light emitting element 11 and the light receiving element 1 on the lead frames 10 and 15, respectively.
6 are connected, and then transparent resin bodies 14 and 18 are molded by a casting method or a transfer method using thermosetting resin 13 so as to cover them. At this time, the transparent resin bodies 14 and 18 are formed by gold molding using a transfer method or the like, so that the light emitting surface 12 and the light receiving surface 17 can be formed to be smooth and inclined in one direction.

Then, the transparent resin bodies 14 and 18 are juxtaposed at a predetermined interval and inserted into the secondary molding die 19 to form the thermoplastic resin 2
0 is injected to mold the opaque resin body 21. At this time,
The light emitting surface 12 and the light receiving surface 17 are inclined by the stepped portions 25a and 25b of the side surface mold 25 so that the thermoplastic resin 20 does not flow into the light emitting surface 12 and the light receiving surface 17 of the transparent resin bodies 14 and 15. The surfaces 24a and 24b are pressed and fixed. Then, the light shielding wall 23 is formed between the light emitting surface 12 and the light receiving surface 17, and the light emitting surface 12 and the light receiving surface 1 are formed.
7 is not covered by the thermoplastic resin 20,
Since the surfaces are smooth so as to face each other, the performance of the optical coupling device is improved.

Further, since the transparent resin bodies 14 and 18 and the opaque resin body 21 can be injection-molded, the shape and size of the case can be stably supplied.

<Embodiment> A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a single unit of the optical coupling device according to the first embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a front view thereof, and FIG. 4 is an AA line of FIG. FIG. 5 is a vertical cross-sectional view, FIG. 5 is a front view of the transparent resin body, and FIG. 6 is a vertical cross-sectional view showing a state in which the transparent resin body is similarly fixed to a mold to form an opaque resin body. Similarly, FIG. 7A is a perspective view showing a state where the transparent resin body is made into a multiple type, and FIG. 7B is a perspective view showing a state that the finished product is made to be a multiple type.

As shown in the figure, in the reflection type optical coupling device (photo interrupter) of the present invention, the light emitting element 11 mounted on the tip of the lead frame 10 is made of a transparent thermosetting resin 13 so that the light emitting surface 12 thereof is smooth. Light emitting side transparent resin body 1 formed by coating
4 and a light receiving element 16 mounted on the tip of a lead frame 15 different from the lead frame 10 has a light receiving surface 17 thereof.
Of the light-receiving side transparent resin body 18 and the light-emitting side transparent resin body 14 which are formed by coating with the thermosetting resin 13 so as to be smooth.
And the transparent resin body 18 on the light-receiving side for both the leader frames 1
Secondary molding dies 19 arranged side by side so that 0 and 15 are vertical
And an opaque resin body 21 integrally molded with a light-shielding thermoplastic resin 20 so as to cover the surface fixed to the surface except the light emitting surface 12 and the light receiving surface 17.

An infrared light emitting diode is used for the light emitting element 11, and a phototransistor is used for the light receiving element 16. The light emitting element 11 and the light receiving element 16 are connected to the terminals 10a, 15a on one side of the lead frames 10, 15 as shown in FIG.
Bonding wire 22 such as a gold wire connected to 15b
It is made by internal wiring.

As shown in FIG. 4, the transparent resin bodies 14 and 18 are formed by connecting the light emitting element 11 and the light receiving element 16 to the thermosetting resin 13.
Is formed into a substantially semi-cylindrical shape by a casting method, a transfer method, or the like. The light emitting surface 12 of the light emitting side transparent resin body 14 is formed so as to be inclined so that the light shielding wall 23 side described later is lowered in order to expand the irradiation range of the light emitting element 11. On the other hand, the light-receiving surface 17 of the light-receiving side transparent resin body 18 is formed so as to be inclined so that the light-shielding wall 23 side described later is lowered in order to expand the light-receiving range of the light-receiving element 16.

Here, when the light emitting surface and the light receiving surface are flat, the light emitted from the light emitting element is emitted vertically from the light emitting surface, the light hits the object to be detected, and the reflected light returns directly to the light emitting side. Almost no light is incident on the light-receiving side, resulting in poor light output conversion efficiency. Therefore, as mentioned above,
By tilting the light emitting surface 12 and the light receiving surface 17 toward the light shielding wall 23 side, the light emitting surface 12 emits the irradiation light from the light emitting element 11 toward the light receiving side, and the light receiving surface 17 is also irradiated.
Makes it easier for the irradiation light to receive the reflected light reflected by the object to be detected, so that the irradiation range of the light emitting element 11 and the light receiving range of the light receiving element 16 that can be received by the light receiving element 16 are expanded, and the light receiving element 17 is received. The proportion of light reaching
Improves light output conversion efficiency.

An epoxy resin or the like is used for the thermosetting resin 13.

As shown in FIG. 6, the opaque resin body 21 is used for the light receiving element 16
The light emitting side transparent resin body 14 and the light receiving side transparent resin body 18 are separated by a predetermined distance A so that the light emitted from the light emitting element 11 can be received.
Are arranged side by side in parallel with each other and inserted into the secondary molding die 19, and in this state, the thermoplastic resin 20 is injected into the space A to form a substantially cylindrical shape as shown in FIGS. There is. In addition, the transparent resin body 1 that sits in the center of the opaque resin body 21
The light emitting element 1 is provided between the facing surfaces 14a and 18a of the light emitting elements 4 and 18.
The light shielding wall 23 is formed so that the irradiation light of No. 1 is not directly received by the light receiving element 16.

As shown in FIG. 6, the secondary molding die 19 has an upper surface die 24.
And a side surface mold 25. The upper surface mold 24
Inclined surfaces 24a, 24b are formed on the inner wall of the transparent resin body 14 and 18 so as to come into contact with the light emitting surface 12 and the light receiving surface 17, respectively. A recess 24c is formed so that the upper end 23a of the light shielding wall 23 is located higher.

On the other hand, at the lower part of the inner wall of the side surface mold 25, the light emitting surface 12 and the light emitting surface 17 of the both transparent resin bodies 14 and 18 are brought into contact with the inclined surfaces 24a and 24b of the upper surface mold 24. Stepped portions 25a, 25b for pushing up the lower portions 14c, 18c of the portions 14, 18 to the upper surface mold 24 side are formed.

The thermoplastic resin 20 includes polybutylene terephthalate (P · B · T), which is a linear polymer in terms of chemical structure, and polyphenylene sulfide (P ···), which has excellent heat resistance.
Resins such as P / S) are used and can be efficiently processed by injection molding.

In the figure, 26 and 27 are stepped portions 25 a and 2 of the die 25.
The recesses 28 and 29 caused by 5b are the lead frame 1
It is a tie bar that connects 0 and 15.

The optical coupling device configured as described above is manufactured as follows.

First, the terminals 10a on one side of the lead frames 10 and 15,
The light emitting element 11 and the light receiving element 16 are connected to 15a, respectively, and the internal wires are provided to the terminals 10b and 15b on the other side by bonding wires 22. Next, a transparent resin body 14 is formed by a casting method or a transfer method using a thermosetting resin 13 so as to cover them.
Mold 18. At this time, the light emitting surface 12 and the light receiving surface 17 of the transparent resin bodies 14 and 18 are formed smooth by die molding such as casting method or transfer method.

Then, the transparent resin bodies 14 and 18 are attached to the secondary molding die 19
To insert. At this time, the light emitting surface 12 and the light receiving surface 17 are covered by the stepped portions 25a and 25b of the side surface mold 25 so that the thermoplastic resin 20 does not flow into the light emitting surface 12 and the light receiving surface 17 of the transparent resin bodies 14 and 15. 24 inclined surfaces 24
Press and fix to a and 24b. Then, the thermoplastic resin 20 is injected to mold the opaque resin body 21 for completion.

Therefore, since the light emitting surface 12 and the light receiving surface 17 of the transparent resin bodies 14 and 15 are not covered with the thermoplastic resin 20, the smoothness of the light emitting surface and the light receiving surface can be maintained,
The performance of the optical coupling device is improved.

In addition, the transparent resin body 1 is different from the conventional optical coupling device that uses a ceramic case in which resin is injected for each individual product.
Since the transparent resin bodies 4 and 18 are formed of the thermosetting resin 13 and the opaque resin body 21 for integrally molding the transparent resin bodies 14 and 18 is formed of the thermoplastic resin 20, the transparent resin body 1 is formed.
4, 18 and the opaque resin body 21 can be injection-molded. Therefore, the shape and size of the case can be stably supplied.

Furthermore, as shown in FIGS. 7 and 8, since the transparent resin bodies 14 and 18 and the opaque resin body 21 can be manufactured in a multi-row manner, the automation of the manufacturing process can be easily realized and the production cost can be improved. Can be significantly reduced.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a vertical cross-sectional view showing a state of forming an opaque resin body in which a transparent resin body of an embodiment of the present invention is fixed to a mold.

As shown in the figure, the optical coupling device according to the present embodiment includes the side surface mold 2
No stepped portions 25a and 25b are provided in the lower part of 5, and the light emitting surface 12 and the light receiving surface 18 of the transparent resin bodies 14 and 18 are contacted with the inclined surfaces 24a and 24b of the upper surface mold 24, respectively. Attachment parts 30 and 31 are formed.

Other configurations, operations, and effects are similar to those of the first embodiment.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, in the above embodiment, the phototransistor is used as the light receiving element 16, but it may be a light receiving element in which an amplifier circuit or the like is integrated.

<Effects of the Invention> As is clear from the above description, according to the present invention, the light receiving element mounted on the tip of the lead frame is coated with the translucent thermosetting resin so that the light emitting surface thereof becomes smooth. A light-emitting side transparent resin body, a light-receiving side transparent resin body formed by coating a light-receiving element mounted at the tip of a lead frame different from the lead frame with a thermosetting resin so that the light-receiving surface is smooth, The light emitting side transparent resin body and the light receiving side transparent resin body are juxtaposed at a predetermined interval so that both lead frames are vertical, and the light emitting surface of the light emitting side transparent resin body and the light receiving side transparent resin body And the opaque resin body made of a light-shielding thermoplastic resin formed so as to cover the surface excluding the light-receiving surface, the light-emitting surface and the light-receiving surface can be made smooth. Moreover, since the light emitting surface and the light receiving surface are inclined downward toward the light shielding wall, the light emitting surface irradiates the irradiation light from the light emitting element toward the light receiving side, and the light receiving surface receives the irradiation light on the detected object. It becomes easier to receive the reflected light reflected by the light receiving element, and the irradiation range of the light emitting element and the light receiving range of the light receiving element can be expanded. Further, since the light shielding wall is formed in the central portion sandwiched between the light emitting side transparent resin body and the light receiving side transparent resin body, light from the light emitting element does not reach the light receiving element directly. Therefore, the improved performance of the optical coupling device has an excellent effect.

In addition, since it is possible to injection-mold a transparent resin body and an opaque resin body in a conventional optical coupling device that uses a ceramic case in which resin is injected for each individual item, it is possible to reduce the shape and size of the case. Since it can be stably supplied, and the transparent resin body and the opaque resin body can be manufactured in a multi-stage manner, automation of the manufacturing process can be easily realized, and the production cost is significantly reduced. If you can, it will have a great effect.

[Brief description of drawings]

FIG. 1 is a perspective view of an optical coupling device according to an embodiment of the present invention, and FIG.
The figure is also its plan view, FIG. 3 is also its front view, FIG. 4 is the AA vertical sectional view of FIG. 2, FIG. 5 is the same front view of the transparent resin body, and FIG. FIG. 7A is a vertical cross-sectional view showing a state in which the transparent resin body is fixed to a mold to form an opaque resin body, and FIG. 7A is a perspective view showing a state in which the transparent resin body is also in a multiple type. FIG. 8B is a perspective view showing a state in which the finished product is made into a multiple type, and FIG. 8 is a vertical section showing a state where the transparent resin body of the embodiment of the present invention is fixed to a mold to form an opaque resin body. A plan view and FIG. 9 are longitudinal sectional views of a conventional optical coupling device. 10, 15: Lead frame, 11: Light emitting element, 12:
Light emitting surface, 13: thermosetting resin, 14, 18: transparent resin body, 16: light receiving element, 17: light receiving surface, 19: secondary molding die, 20: thermoplastic resin, 21: opaque resin body, 22:
Light-shielding wall, 23: upper surface mold, 24: side surface mold.

Continuation of the front page (72) Inventor Kiyoshi Ebina 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Within Sharp Co., Ltd. (56) References JP 59-168682 (JP, A) Actual development 61-153355 ( JP, U)

Claims (1)

[Scope of utility model registration request] 1. A light emitting side transparent resin body formed by coating a light emitting element mounted on the tip of a lead frame with a translucent thermosetting resin so that its light emitting surface is smooth, and the lead frame are different from each other. Of the light-receiving element mounted on the end of the lead frame, the light-receiving side transparent resin body coated with the thermosetting resin so that the light-receiving surface is smooth, and the light-emitting side so that both lead frames are perpendicular to each other. The transparent resin body and the light-receiving side transparent resin body are juxtaposed at a predetermined interval so as to cover the surfaces of the light-emitting side transparent resin body and the light-receiving side transparent resin body excluding the light-emitting surface and the light-receiving surface. And an opaque resin body made of a light-shielding thermoplastic resin,
A light shielding wall is formed in a central portion of the opaque resin body sandwiched between the light emitting side transparent resin body and the light receiving side transparent resin body, and the light emitting surface and the light receiving surface are inclined downward toward the light shielding wall side. An optical coupling device characterized by.