JPH06223905A - Micropin package - Google Patents

Abstract

PURPOSE: To provide a micro-pin package by which the number of input and output lines between an LSI chip, etc. and a substrate can remarkably be increased. CONSTITUTION: This micro-pin package is composed of a plurality of micro-pin sheets, each of which is produced by uniting a carrier 19, a plurality of micro- pins 12, a pair of supporting posts, and a supporting frame 20 which supports the micro-pin sheets 10 arranged at prescribed intervals. The supporting frame 20 is composed of a bottom plate 21 having a rectangular aperture 21a and a plurality of guide plates 25 layered on the bottom plates and a plurality of guide grooves 25b are formed in opposed two sides of the rectangular apertures 25a of the guide plates 25 to give a plurality of continuous guide grooves 25b connected vertically to one another. Supporting posts 11 are inserted into the guide grooves 25b and micro-pin sheets 10 are installed. The micro-pins 12 are supported on the supporting frame 20 while being arranged in an array state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micropin package used for mounting electronic parts such as IC and LSI chips on a printed circuit board or the like.

[0002]

2. Description of the Related Art As a conventional mounting method of such an electronic component on a substrate, as shown in FIG. 13 (A), a terminal P of a substrate B and a terminal portion of an electronic component E mounted thereon are provided. A method (Wire Bonding) in which the and are connected by a gold wire W is generally well known. Recently, TAB (T
A mounting method called ape Automated Bonding method has also been put into practical use. In this method, as shown in FIG. 13B, the terminal P of the substrate P and the terminal portion of the electronic component E are connected by a film lead F. In any of the above methods, IC, LSI chip, etc. (electronic parts)
The connection between the substrate and the substrate is made at the four peripheral portions of these chips. Therefore, the number of these input / output lines (the number of gold wires or the number of leads) corresponds to the peripheral length of the chip, and the maximum number of input / output lines that can be arranged is determined by the peripheral length of the chip.

[0003]

By the way, recently, the integration of LSI chips and the like has been dramatically advanced, and the number of input / output lines for connecting the chip and the substrate tends to increase accordingly. . Therefore, the conventional wire bonding method and TAB method as described above have a problem that the number of input / output lines is insufficient.

The present invention has been made in view of these problems.
It is an object of the present invention to provide a micropin package capable of dramatically increasing the number of input / output lines between an electronic component (IC, LSI chip, etc.) and a substrate.

[0005]

In order to achieve such an object, a micropin package according to the present invention is provided with a carrier portion formed by cutting a conductive metal plate and extending in the width direction, and a side end of the carrier portion. A plurality of micropin portions extending in the same direction in an aligned state from each other, and a pair of left and right support post portions that are located on both sides of the micropin portions and extend in the same direction as these, as a unit. A supporting frame for supporting the micropin sheet in a state where a plurality of micropin portions are aligned in the same direction and a plurality of micropin sheets are arranged at predetermined intervals in the thickness direction. Solder solder is attached and formed on the tip of each micro pin.

Further, the support frame includes a bottom plate having a rectangular opening facing the micropin portions aligned in the same direction, and a plurality of guide plates stacked on the bottom plate. Composed of. A rectangular opening identical to the rectangular opening of the bottom plate is formed in each guide plate, and the guide plates are overlapped and joined to each other so that these rectangular openings are vertically aligned and overlapped. . On each of two opposite sides of the rectangular opening of each guide plate, a plurality of guide grooves are formed at an alignment interval of the micropin sheets, that is, at the same pitch as the above-mentioned predetermined interval, and the guide plate is placed on the bottom plate. A guide groove that is vertically connected is formed in a state where the guide grooves are overlapped and joined. The support post portion is inserted into the guide groove, the micropin sheet is attached to the support frame, and the micropin portion is supported by the support frame in a state of being aligned in an array.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. A micropin package 1 according to the present invention is shown in FIG. The micropin package 1 includes a support frame 20 having a rectangular frame shape and a plurality of micropin sheets 10 supported by the support frame 20 side by side in the thickness direction in an aligned state. Solder solder is adhered to the tips 12a of the micro pins 12 of the micro pin sheet 10 aligned and supported in this manner.

The support frame 20 is composed of a bottom plate 21 having a rectangular frame-like shape having a rectangular opening 21a and having a predetermined thickness, and a plurality of thin plates superposed on and joined to the bottom plate 21. A guide pin 22 projects from the bottom plate 20. In addition, each support plate 25 is also the bottom plate 2
The same rectangular opening as 5 is formed to have a rectangular frame shape.

The micropin sheet 10 is made by cutting a conductive metal plate. As shown in FIG. 2, this processing is performed by cutting a metal plate S, and a plurality of supporting posts 11 and a plurality of micropins 12 are connected to and supported by carrier portions 19 formed on both upper and lower sides. Sheet MS is formed. As the metal plate S, for example,
A plate material of Fe-Ni-Co alloy is used. Each sheet M
In S, as shown in an enlarged manner in FIG. 3, the support posts 11 are located at both left and right ends, and the micro pins 12 are formed between these support posts at equal pitches. Both ends of the support post 11 and the micro pin 12 are connected to the carrier portion 19. The carrier portion 19 has guide holes 15 formed on both left and right sides. Further, the carrier portion 19 is connected to the adjacent carrier portion 19 on both left and right sides.

The micro pin 12 is used for connecting an IC, an LSI chip and the like to a substrate and is very small. For example, the length of each micro pin 12 is 1.05 mm, the diameter is 0.06 mm, the pin pitch is 0.2 mm, and the plate thickness of the metal plate S is 0.06 mm. Therefore, the mechanical cutting process cannot be performed accurately, and the cutting process is performed using a laser beam, an electron beam, or the like. When the cutting process shown in FIG. 2 is completed, a nickel undercoat having a thickness of 2.5 μm and a gold plating having a thickness of 0.5 μm are applied.

Next, the first cut line CL1 shown in FIG.
This metal plate S is cut along and is divided into metal sheets MS which are supported by the carrier portion 19 from above and below and are continuously connected to the left and right. Further, one carrier portion 19 is cut off along the second cut line CL2,
As shown in FIG. 4, a micropin sheet 10 is formed which integrally has a support post 11 and a micropin 12 extending upward from an upper end of a carrier portion 19 extending in the width direction (horizontal direction) in an aligned state. To be done. In this state, the plurality of micropin sheets 10 are connected to each other in the carrier portion 19 and continuously connected to the left and right, but each of the sheets 10 is separated during package assembly. The cutting along the cut lines CL1 and CL2 is performed mechanically by using a cutting tool, a laser beam,
It is performed by an electron beam or the like. However, a groove may be formed in advance on the front surface and the back surface of the metal plate S along the cut lines CL1 and CL2, and the metal plate S may be bent and cut at the groove. At this time, at the same time, the support rod 11 is cut into a predetermined size as shown below.

The tip 12a of each micropin 12 in the micropin sheet 10 formed in this manner is attached to the tip of FIG.
As shown in FIG. 5, the solder of the brazing material wire 14 is melted by ultrasonic waves, electromagnetic waves, etc., and the soldering solder 13 is attached and formed. The method for depositing and forming the solder solder 13 is not limited to this, and may be formed by printing solder paste.

On the other hand, the support frame 20 has a rectangular opening 2
On the bottom plate 21 having a rectangular frame shape having 1a, a guide plate 25 made of a plurality of thin metal plates having the same rectangular opening 25a is provided, as shown in FIG. It is made by stacking and thermocompression bonding so that they are aligned with each other. By stacking the guide plates 25 made of thin metal plates in this way, using only one type of guide plate 25,
It is easy to adjust the overall height of the guide plate 25 to an arbitrary height.

Each guide plate 25 has a plurality of guide grooves 25b formed at predetermined intervals on two opposing sides of the four sides forming the rectangular opening 25a (see FIGS. 7 and 5). This guide groove 25b is used for all guide plates 25.
In the state where the guide plate 25 is formed in the same position with the same shape, and the guide plate 25 is superposed on the bottom plate 21, the respective grooves 25b are overlapped with each other to form one groove. As a result, the two opposite sides of the rectangular opening 25a of the guide plate 25 in a state where a plurality of sheets are stacked are
A plurality of vertically extending grooves 25b are formed.

Since these guide grooves 25b need to be formed very accurately, they are formed by etching, laser beam, electron beam processing or the like. Each of the guide grooves 25b is formed in the same shape as the cross section of the support post 11 in the micropin sheet 10, as shown in FIG.
As shown in, the support posts 11 can be fitted exactly in the respective guide grooves 25b.

When the plurality of micropin sheets 10 and the support frame 20 are manufactured in this manner, the plurality of micropin sheets 10 are then sequentially supported by using the joining device 30 shown in FIGS. 5 and 6. It is attached by brazing on the frame 20. The joining device 30 includes a support base 31, a horizontal mover 35 provided on the support base 31 so as to be horizontally movable via rollers 36, and the horizontal mover 35 is horizontal (direction of arrow B). A horizontal moving mechanism 37 for moving and a sheet feeding device 38 for holding the micro pin sheet 10 and feeding the micro pin sheet 10 are provided.

First, as shown in FIG.
The support frame 20 is mounted on the support frame 20, and the micro pin sheets 10 are sandwiched by the sheet supply device 38 one by one, and the micro pin sheets 10 are mounted on the support frame 20. At this time, the pair of left and right support posts 1 of the micropin sheet 10
1 is fitted into the guide grooves 25b of the support frame 20 which are opposed to each other on the left and the right.

As a result, as shown in FIGS. 7 and 8, the micropin sheet 10 is attached to the support frame 20 in a state where the support post 11 is fitted in the guide groove 25b, and the micropin sheet 10 is positioned and attached at a predetermined position. To be At this time, the lower end surface of the support post 11 is guided by the guide groove 25.
It comes into contact with the upper surface of the bottom plate 21 forming the bottom surface of b, and is also positioned in the vertical direction. And the support post 11
The lower end surface of the micro pin sheet 10 is brazed to the upper surface of the bottom plate 21, and the micro pin sheet 10 is fixed to the support frame 20.

As described above, the guide grooves 25b are formed at regular intervals and at equal intervals, and the micropin sheets 10 are sequentially attached as described above. The micropin sheets 10 are predetermined in the thickness direction. It is attached to the support frame 20 in line with a space. Further, the height of the guide plate 25 is set so as to match the position of the notch 11a of the support post 11.

The support base 31 is provided with a pair of guide rods 32 extending horizontally at the same pitch as the distance between the guide holes 15 of the micropin sheet 10.
Therefore, the micro pin sheet 10 is positioned in the support frame 20 by the guide groove 25b as described above.
Is attached, the horizontal movement mechanism 35 moves the horizontal movement No. 35 to guide the guide rod 32 into the guide hole 15.
The tip 32 a of the micropin sheet 10 is inserted, and the microrod sheet 10 is supported by the guide rod 32. In this way, when the micropin sheet 10 is fitted and attached in all the guide grooves 25b, the assembly of the micropin package 1 is completed.

A method of using the micropin package 1 manufactured in this way will be briefly described. Each micro pin 12 of the micro pin package 1 is directly connected to the terminal on the back surface of the LSI chip 50 by using the solder solder 13 at the tip 12a thereof. For this connection, a mounting jig 40 having a chip holding groove 41 for mounting the LSI chip 50 and a guide hole 42 for receiving the guide pin 22 of the support frame 20 as shown in FIG. 9 is used. .

As shown in the figure, after the LSI chip 50 is placed in the chip holding groove 41, the guide pin 22 is inserted into the guide hole 42 and the micropin package 1 is mounted on the mounting jig 40. The tip of each micro pin 12 contacts the surface of the LSI chip 50. Input / output terminals are formed on the LSI chip 50 at the positions where the micro pins 12 abut. In this manner, with the tip of each micropin 12 in contact with the input / output terminal of the LSI chip 50, the whole is heated in the heating furnace, and the wax 13 at the tip of the micropin 12 is melted and each micropin is heated by this wax 13. The pin 12 is bonded to the surface of the chip 50.

In this case, as described above, each micro pin 12 is bonded to the support frame 20 when the guide groove 2 is formed.
Since the positioning of the support frame 20 with respect to the LSI chip 50 is performed accurately by using the guide pins 22, the micro pins 12 can be accurately aligned with the corresponding input / output terminals of the chip 50. It is possible to make a direct connection.

Next, as shown in FIG. 10, when each micropin 12 is separated from the carrier portion 19, a large number of micropins 12 are aligned and joined to the surface of the chip 50. In order to facilitate the separation at this time, the height of the guide plate 25 is made to be the same as the notch portion 11a of the support post 11 fitted in the guide groove 25b, and the carrier portion 19 is bent. By doing so, the carrier portion 19 can be easily separated. Then, as shown in FIG. 11, each micro pin 12
By brazing the tip of the substrate to the substrate P, the LSI chip 50 can be connected to the substrate P via the micro pins 12.

In this case, since the connection by the micropins 12 is performed using the entire surface of the chip 50, the number of the micropins 12 can be extremely increased and the number of input / output lines can be increased. . Therefore, a sufficient number of input / output lines can be secured even when a large number of input / output lines are required due to the progress of integration of LSI chips.

Further, when the chip 50 mounted on the substrate P in this way is used, if the ambient temperature rises, the difference in the coefficient of thermal expansion between the substrate P and the chip 50 causes the micropins 12 of the chip 50 to move. The joining position pitch at one end and the joining position pitch at the other end of the micro pin 12 on the substrate P are deviated. However, even if this deviation occurs, the micropins 12 are only slightly tilted, and there is almost no effect on the bonding between the micropins 12 and the chip 50 or the substrate P, and the connection reliability via the micropins 12 is high. It never drops.

When each micro pin 12 of the micro pin package 1 is directly connected to the terminal on the back surface of the LSI chip 50, a mounting jig 140 as shown in FIG. 12 may be used. In this jig 140, the LSI chip 5
The LSI chip 50 protrudes upward with 0 attached to the chip holding groove 141. On the other hand, the support frame 20 does not have the guide pin 22, and the rectangular opening 21 a of the bottom plate 21 is formed on the side surface 5 of the LSI chip 50.
It has a size corresponding to the shape of 0a. Therefore, by inserting the LSI chip 50 into the rectangular opening 21a, both can be positioned and each micro pin 12 can be accurately brought into contact with and connected to the corresponding input / output terminal of the chip 50. .

[0028]

As described above, according to the present invention,
On each of two opposite sides of the rectangular opening of each guide plate, a plurality of guide grooves are formed at an alignment interval of the micropin sheets, that is, at the same pitch as the above-mentioned predetermined interval, and the guide plate is placed on the bottom plate. In the state of being overlapped and joined, a guide groove that is vertically connected is formed.The support post is inserted into this guide groove, the micropin sheet is attached to the support frame, and the micropins are arranged in an array. The micropin package is supported by the support frame in this state. Therefore, each micropin sheet can be easily accurately positioned and attached simply by fitting the support post into the guide groove and sequentially attaching each micropin sheet to the support frame.

[Brief description of drawings]

FIG. 1 is a perspective view showing a micropin package according to the present invention.

FIG. 2 is a front view showing a metal plate obtained by cutting and processing a plurality of micropin sheets.

FIG. 3 is a front view showing a cut micropin sheet.

FIG. 4 is a front view showing the cut micropin sheet.

FIG. 5 is a perspective view illustrating a step of attaching a micropin sheet to a support frame using a joining device.

FIG. 6 is a front view illustrating a step of attaching a micropin sheet to a support frame using a joining device.

FIG. 7 is a perspective view showing a state in which a micropin sheet is attached on a support frame.

FIG. 8 is a cross-sectional view showing a state in which a micropin sheet is attached on a support frame.

[Fig. 9] L of the micropin package using a mounting jig
It is sectional drawing which shows the process of joining to an SI chip.

FIG. 10 is a cross-sectional view showing a step of separating the carrier portion from the micropins joined to the LSI chip.

FIG. 11 is a cross-sectional view showing a step of joining a micropin package to an LSI chip using another mounting jig.

FIG. 12 is a cross-sectional view showing a state in which an LSI chip is attached to a substrate using the micropin according to the present invention.

FIG. 13 is a cross-sectional view showing a conventional method of attaching an electronic component to a substrate.

[Explanation of symbols]

 1 Micro Pin Package 10 Micro Pin Sheet 11 Support Post 12 Micro Pin 19 Carrier Part 20 Support Frame 21 Bottom Plate 22 Guide Pin 25 Guide Plate 30 Joining Device 40 Mounting Jig 50 LSI Chip

Claims (1)

[Claims] 1. Made by cutting a conductive metal plate,
A carrier portion that extends in the width direction, a plurality of micropin portions that extend from the side end portion of the carrier portion in an aligned state in the same direction, and a plurality of micropin portions that are located on both sides of the micropin portion and that extend in the same direction as the micropin portions. A state in which a plurality of micro pin sheets integrally having a supporting post portion and a plurality of the micro pin sheets are aligned with the micro pin portions facing in the same direction and at a predetermined interval in the thickness direction. A micropin package consisting of a support frame supported by a bottom plate having a rectangular opening facing the micropin portion aligned in the same direction and facing each other, and a bottom plate of the bottom plate. It is composed of a plurality of guide plates stacked on top of each other, and each of these guide plates has the same rectangular opening as the bottom plate. Rectangular guide openings are formed, and the guide plates are placed on the bottom plate so as to overlap with each other so that the rectangular openings are vertically aligned and overlapped with each other. A plurality of guide grooves are formed on the two opposite sides of the rectangular opening at the same pitch as the predetermined interval, and the guide plate is vertically joined in a state in which the guide plate is superposed on and joined to the bottom plate. The support post portion is inserted into the guide groove connected to, and the support frame is configured to support the micropin sheet with the micropin portions aligned in an array. Micro pin package.