JPH06188349A - Electroformed lead frame for ic and manufacture thereof - Google Patents
Electroformed lead frame for ic and manufacture thereofInfo
- Publication number
- JPH06188349A JPH06188349A JP35566792A JP35566792A JPH06188349A JP H06188349 A JPH06188349 A JP H06188349A JP 35566792 A JP35566792 A JP 35566792A JP 35566792 A JP35566792 A JP 35566792A JP H06188349 A JPH06188349 A JP H06188349A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- region
- electroforming
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000005323 electroforming Methods 0.000 claims abstract description 29
- 238000004070 electrodeposition Methods 0.000 claims abstract description 12
- 238000000059 patterning Methods 0.000 claims abstract description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 230000008719 thickening Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【目的】 リード足部領域１を囲む枠部領域２の腰強度
を高めるために、その板厚を一回の電鋳で厚くできるよ
うにする。
【構成】 枠部領域２に多数の孔６をパターンニング形
成する。これにより単位面積当りの電着量がほぼ一定で
あることから枠部領域２の板厚を一回の電鋳のみで厚く
することができて腰強度を高めることができ、簡単かつ
安価に製造することができる。
(57) [Abstract] [Purpose] In order to increase the waist strength of the frame region 2 surrounding the lead foot region 1, the plate thickness can be increased by one electroforming. [Structure] A large number of holes 6 are formed in the frame region 2 by patterning. As a result, since the electrodeposition amount per unit area is almost constant, the plate thickness of the frame region 2 can be increased by only one electroforming, the waist strength can be increased, and the manufacturing is simple and inexpensive. can do.
Description
【０００１】[0001]
【産業上の利用分野】本発明は電鋳製のＩＣ用リードフ
レーム並びにその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroformed IC lead frame and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】電鋳製のＩＣ用リードフレームは、ＩＣ
チップ付け部および多数のリードピンをもつリード足部
領域と、これを囲むべたの枠部領域とからなり、そのべ
たの枠部領域は、ＩＣ搭載後はリード足部領域から切り
離されるとはいうものの、ＩＣ搭載の際にボンディング
装置の順送り機構にセッティングされるための孔を所定
ピッチで列設した部分で、その自動搬送時にそなえて機
械的強度を必要とする部分である。しかしながら、近
年、ＩＣの高集積化が図られ、これに伴いリード足部領
域の多ピン化および細ピッチ化を図った高精度のリード
フレームが要求されており、このためリード足部領域の
板厚も薄形化の傾向にあるが、電鋳法においては単位面
積当りに電着される金属量（電着量）はほぼ一定である
ため、枠部領域がべたであると、リード足部領域を所望
の板厚に設定した場合、そのべたの枠部領域が薄くなっ
て腰が弱くなり、自動搬送に支障を来すことになる。こ
うした問題を解消するために、例えば、特開平３−１６
３８５７号公報に開示されているように、リード足部領
域と枠部領域を電鋳するに際し、その枠部領域のみを１
次電鋳のみに止めず、更に２次電鋳することによりこれ
の板厚をリード足部領域の厚みよりも厚く形成してその
腰強度をアップさせることが提案されている。2. Description of the Related Art Electroformed IC lead frames are
It consists of a chip attachment part and a lead foot region having a large number of lead pins, and a solid frame region surrounding the lead foot region, which is said to be separated from the lead foot region after the IC is mounted. A portion in which holes to be set in a progressive mechanism of a bonding apparatus when the IC is mounted are arranged in a row at a predetermined pitch, and is a portion that requires mechanical strength for automatic transfer. However, in recent years, high integration of ICs has been attempted, and along with this, there has been a demand for a high-accuracy lead frame in which the number of pins and lead pitch of the lead foot region are increased, and therefore, the plate of the lead foot region is required. Although the thickness tends to be thinner, the amount of metal electrodeposited per unit area (electrodeposition amount) is almost constant in the electroforming method. When the area is set to a desired plate thickness, the solid frame area becomes thin and the waist becomes weak, which hinders automatic conveyance. In order to solve such a problem, for example, Japanese Patent Laid-Open No. 3-16
As disclosed in Japanese Patent No. 3857, when electroforming a lead foot region and a frame region, only the frame region is set to 1
It has been proposed that the plate thickness thereof is made thicker than the thickness of the lead foot region by not only the secondary electroforming but also the secondary electroforming to increase the waist strength.
【０００３】[0003]
【発明が解決しようとする課題】しかるに、枠部領域の
厚みを厚くする上記電鋳法では、１次電鋳後、更に２次
電鋳するため、２次電鋳不要箇所であるリード足部領域
等のマスキングのためのレジスト膜形成工程や電鋳工程
数が増大し、それだけ製造が複雑かつ面倒であった。本
発明の目的は、多数のリードピンを配列するリード足部
領域とこれを囲む枠部領域とを電鋳するに際し１次電鋳
のみでリード足部領域の増厚、増強を図ることのできる
ＩＣ用リードフレーム並びにその製造方法を提供せんと
するものである。However, in the above electroforming method for increasing the thickness of the frame region, since the secondary electroforming is further performed after the primary electroforming, the lead foot portion which is unnecessary for the secondary electroforming. The number of resist film forming steps for masking areas and the like and the number of electroforming steps are increased, and the manufacturing is complicated and cumbersome. An object of the present invention is to provide an IC capable of increasing the thickness and strengthening of the lead foot area only by primary electroforming when electroforming a lead foot area in which a large number of lead pins are arranged and a frame area surrounding the lead foot area. The present invention provides a lead frame for automobiles and a manufacturing method thereof.
【０００４】[0004]
【課題を解決するための手段】本発明の電鋳製のＩＣ用
リードフレームでは、図示例のように、ＩＣチップ付け
部３および多数のリードピン４をもつリード足部領域１
を囲む枠部領域２に、増厚用の多数の孔６をパターンニ
ング形成してあることを特徴とする。本発明の電鋳製の
ＩＣ用リードフレームの製造方法は、電鋳母型７の表面
に、ＩＣチップ付け部３および多数のリードピン４をも
つリード足部領域１と、増厚用の多数の孔６をパターン
ニング形成する枠部領域２のパターンに対応するフォト
レジスト膜１０を形成する工程と、電鋳母型７のフォト
レジスト膜１０で覆われていない表面に電鋳により電着
層１１を形成する工程と、電着層１１を電鋳母型７から
剥離する工程とからなることを特徴とする。In the electroformed IC lead frame of the present invention, the lead foot region 1 having the IC chip attaching portion 3 and a large number of lead pins 4 is formed as shown in the illustrated example.
A large number of thickening holes 6 are formed by patterning in a frame region 2 surrounding the. The method of manufacturing an electroformed IC lead frame according to the present invention includes a lead foot region 1 having an IC chip attachment portion 3 and a large number of lead pins 4 on the surface of an electroformed mother die 7, and a large number of thickening layers. A step of forming a photoresist film 10 corresponding to the pattern of the frame region 2 in which the holes 6 are patterned, and an electrodeposition layer 11 by electroforming on the surface of the electroforming mold 7 which is not covered with the photoresist film 10. And a step of peeling the electrodeposition layer 11 from the electroforming mother die 7.
【０００５】[0005]
【作用】多数の孔６をパターンニング形成する枠部領域
２は、かかる孔６を有しない従来のべた状態の枠部領域
の板厚よりも厚肉に電着形成することができる。単位面
積当りの電着量はほぼ一定であるからである。その電鋳
に際してはフォトレジスト膜形成工程および電鋳工程が
それぞれ一工程で足りることになる。The frame area 2 in which a large number of holes 6 are formed by patterning can be formed by electrodeposition to be thicker than the plate thickness of the conventional solid frame area having no such holes 6. This is because the electrodeposition amount per unit area is almost constant. At the time of the electroforming, the photoresist film forming step and the electroforming step are each sufficient.
【０００６】[0006]
【実施例】図１は本発明に係る電鋳製のＩＣ用リードフ
レームを多数連ねた状態のままで示しており、ひとつの
リードフレームはリード足部領域１と、これを囲む形の
枠部領域２とからなり、リード足部領域１にはその中央
にＩＣチップ付け部３が形成されるとともに、この周囲
に多数本のリードピン４が形成されている。枠部領域２
にはボンディング装置の順送り機構にセッティングされ
るためのセッティング孔５が送り方向に所定ピッチで形
成されるとともに、増厚用の多数の孔６を設けている。
その孔６の形状は角孔、図３に示すごとき丸孔、スリッ
ト孔、そのほかの形状を問うものではない。孔６の径は
セッティング孔５の径よりも小さくすることが、両者の
区別、およびセッティングの確実性を確保するうえで好
ましいが、必ずしも無数の微細孔に限られるものではな
い。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a large number of electroformed IC lead frames according to the present invention in a row, one lead frame being a lead leg region 1 and a frame portion surrounding the lead leg region 1. The lead foot region 1 has an IC chip attachment part 3 formed in the center thereof and a large number of lead pins 4 formed around the IC chip attachment part 3. Frame area 2
A setting hole 5 for setting in the progressive feeding mechanism of the bonding apparatus is formed at a predetermined pitch in the feeding direction, and a large number of holes 6 for increasing the thickness are provided therein.
The shape of the hole 6 may be a square hole, a round hole as shown in FIG. 3, a slit hole, or any other shape. It is preferable that the diameter of the hole 6 is smaller than the diameter of the setting hole 5 in order to distinguish between the two and ensure the setting, but the number is not necessarily limited to an infinite number of fine holes.
【０００７】つぎに、このようなリードフレームの電鋳
法の一例を図２の（Ａ）ないし（Ｅ）に基づき説明す
る。まず、図２の（Ａ）に示すように、電鋳母型７の表
面にネガタイプのフォトレジスト８を均一に塗布して乾
燥する。ついで、そのレジスト８の上に同図の（Ｂ）に
示すごとく上記リード足部領域１および枠部領域２のパ
ターンに対応するネガタイプフイルム９を密着させ、焼
き付け、現像、乾燥の各処理を行って、同図の（Ｃ）に
示すごとくリード足部領域１および枠部領域２のパター
ンに対応するフォトレジスト膜１０を形成する。勿論、
上記フォトレジスト８としては、ネガタイプのものに代
えて、ポジタイプのものであってもよい。Next, an example of the electroforming method of such a lead frame will be described with reference to FIGS. 2 (A) to 2 (E). First, as shown in FIG. 2A, a negative type photoresist 8 is uniformly applied to the surface of the electroformed mother die 7 and dried. Then, a negative type film 9 corresponding to the pattern of the lead foot region 1 and the frame region 2 is brought into close contact with the resist 8 as shown in FIG. Then, a photoresist film 10 corresponding to the patterns of the lead foot region 1 and the frame region 2 is formed as shown in FIG. Of course,
The photoresist 8 may be a positive type instead of the negative type.
【０００８】ついで、フォトレジスト膜１０が形成され
た電鋳母型７を電着槽に移し、ニッケル、あるいはニッ
ケル−コバルト、ニッケル−マンガン、ニッケル−鉄な
どの合金の電鋳を行って、同図の（Ｄ）に示すごとく電
鋳母型７のフォトレジスト膜１０で覆われていない表面
に、電着層１１を形成する。この電着層１１がリード足
部領域１と枠部領域２に相当する。この電鋳では単位面
積当りに電着される金属量はほぼ一定であるから、多数
の孔６をパターンニング形成する枠部領域２は、従来の
べた状態の枠部領域よりも厚肉に電着形成することがで
きるのである。Then, the electroforming mold 7 on which the photoresist film 10 is formed is transferred to an electrodeposition bath, and nickel or an alloy of nickel-cobalt, nickel-manganese, nickel-iron, etc. is electroformed, and the same process is performed. As shown in (D) of the figure, an electrodeposition layer 11 is formed on the surface of the electroforming mold 7 which is not covered with the photoresist film 10. The electrodeposition layer 11 corresponds to the lead foot region 1 and the frame region 2. In this electroforming, the amount of metal electrodeposited per unit area is substantially constant, so that the frame region 2 in which a large number of holes 6 are formed by patterning is thicker than the conventional solid frame region. It can be formed.
【０００９】枠部領域２の厚みは、例えば、リードフレ
ームの板幅が５５mm、リードピン４の本数が２００〜３
００本の場合、１００〜１２５μ厚程度でもって自動搬
送に支障なき腰強度を得ることができて所期の目的を達
成できるので、リード足部領域１の厚みとの関係で両領
域２・１の開孔率（開孔面積／領域面積）を任意に調整
することで、リード足部領域１の厚みと同等あるいはそ
れ以上に厚くすることは任意である。電鋳後、電鋳母型
７から電着層１１を剥離することにより、同図の（Ｅ）
および図１に示すごときリードフレーム電鋳製品が得ら
れる。The frame region 2 has a thickness of, for example, 55 mm for the lead frame width and 200 to 3 lead pins 4.
In the case of 00 pieces, the waist strength that does not hinder automatic conveyance can be obtained with a thickness of 100 to 125 μm and the intended purpose can be achieved. Therefore, in relation to the thickness of the lead foot area 1, both areas 2.1 It is optional to make the thickness equal to or more than the thickness of the lead foot region 1 by arbitrarily adjusting the aperture ratio (aperture area / region area). After electroforming, by peeling the electrodeposition layer 11 from the electroforming mold 7, (E)
And a lead frame electroformed product as shown in FIG. 1 is obtained.
【００１０】上記のように枠部領域２に多数の孔６をパ
ターンニング形成することにより、その板厚を厚くする
ことができ、腰強度を強くすることができる。すなわ
ち、一般に、はりのたわみδは、 δ＝Ｍ／ＥＩ ただし、Ｍ：曲げモーメント、Ｅ：材料特有のヤング
率、Ｉ：断面２次モーメント で与えられる。断面２次モーメントＩは、 Ｉ＝ｂｈ3 ／１２ ただし、ｈ：図２の（Ｅ）に示す枠部領域２の板厚、
ｂ：孔６・６間の肉部の幅 で与えられる。したがって、枠部領域２の板厚ｈをアッ
プさせることで、多数の孔６を設けることにより各孔６
・６間の肉部の幅ｂが小さくなっても、枠部領域２のた
わみは小さくなり、腰強度の強い枠部領域２を得ること
ができる。By patterning a large number of holes 6 in the frame region 2 as described above, the plate thickness can be increased and the waist strength can be increased. That is, generally, the deflection δ of a beam is given by δ = M / EI, where M: bending moment, E: Young's modulus peculiar to material, and I: second moment of area. Second moment I are, I = bh 3/12, however, h: plate thickness of the frame region 2 shown in FIGS. 2 (E),
b: Given by the width of the meat part between the holes 6 and 6. Therefore, by increasing the plate thickness h of the frame region 2 to provide a large number of holes 6,
Even if the width b of the meat part between 6 becomes small, the deflection of the frame region 2 becomes small, and the frame region 2 having a high waist strength can be obtained.
【００１１】[0011]
【発明の効果】本発明によれば、リード足部領域１を囲
む枠部領域２に多数の孔６をパターンニング形成するこ
とで該枠部領域２を一回の電鋳工程のみで増厚、増強す
ることができるので、ＩＣ用リードフレームを簡単かつ
安価に製造することができて有利である。According to the present invention, by patterning a large number of holes 6 in the frame region 2 surrounding the lead foot region 1, the frame region 2 can be thickened by a single electroforming step. Since it can be increased, it is advantageous that the IC lead frame can be manufactured easily and inexpensively.
【図１】連続状態のＩＣ用リードフレームの一部を切欠
して示す斜視図である。FIG. 1 is a perspective view in which a part of an IC lead frame in a continuous state is cut away.
【図２】ＩＣ用リードフレームの電鋳工程図である。FIG. 2 is an electroforming process diagram of an IC lead frame.
【図３】他の実施例を示すＩＣ用リードフレームの平面
図である。FIG. 3 is a plan view of an IC lead frame showing another embodiment.
１ リード足部領域 ２ 枠部領域 ４ リードピン ６ 孔 1 lead foot area 2 frame area 4 lead pin 6 hole
Claims (2)
ピン４をもつリード足部領域１とこれを囲む枠部領域２
とからなり、 枠部領域２に増厚用の多数の孔６をパターンニング形成
してあることを特徴とする電鋳製のＩＣ用リードフレー
ム。1. A lead foot region 1 having an IC chip attachment part 3 and a large number of lead pins 4 and a frame part region 2 surrounding the lead foot region 1.
An electroformed IC lead frame, characterized in that a large number of thickening holes 6 are formed in the frame region 2 by patterning.
３および多数のリードピン４をもつリード足部領域１
と、増厚用の多数の孔６をパターンニング形成する枠部
領域２のそれぞれのパターンに対応するフォトレジスト
膜１０を形成する工程と、 電鋳母型７のフォトレジスト膜１０で覆われていない表
面に電鋳により電着層１１を形成する工程と、 電着層１１を電鋳母型７から剥離する工程とからなる電
鋳製のＩＣ用リードフレームの製造方法。2. A lead foot region 1 having an IC chip attachment portion 3 and a large number of lead pins 4 on the surface of an electroformed mother die 7.
And a step of forming a photoresist film 10 corresponding to each pattern of the frame region 2 in which a large number of holes 6 for thickening are formed by patterning, and the photoresist film 10 of the electroforming mold 7 is covered. A method for producing an electroformed lead frame for an IC, which comprises a step of forming an electrodeposition layer 11 on an uncoated surface by electroforming and a step of peeling the electrodeposition layer 11 from the electroforming mother die 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35566792A JP3180146B2 (en) | 1992-12-18 | 1992-12-18 | Electroformed IC lead frame and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35566792A JP3180146B2 (en) | 1992-12-18 | 1992-12-18 | Electroformed IC lead frame and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06188349A true JPH06188349A (en) | 1994-07-08 |
| JP3180146B2 JP3180146B2 (en) | 2001-06-25 |
Family
ID=18445157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35566792A Expired - Fee Related JP3180146B2 (en) | 1992-12-18 | 1992-12-18 | Electroformed IC lead frame and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3180146B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6800508B2 (en) * | 2000-04-25 | 2004-10-05 | Torex Semiconductor Ltd | Semiconductor device, its manufacturing method and electrodeposition frame |
-
1992
- 1992-12-18 JP JP35566792A patent/JP3180146B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6800508B2 (en) * | 2000-04-25 | 2004-10-05 | Torex Semiconductor Ltd | Semiconductor device, its manufacturing method and electrodeposition frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3180146B2 (en) | 2001-06-25 |
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