JPH0618557B2 - Medical conductive adhesive and medical adhesive electrode using the same - Google Patents
Medical conductive adhesive and medical adhesive electrode using the sameInfo
- Publication number
- JPH0618557B2 JPH0618557B2 JP60274154A JP27415485A JPH0618557B2 JP H0618557 B2 JPH0618557 B2 JP H0618557B2 JP 60274154 A JP60274154 A JP 60274154A JP 27415485 A JP27415485 A JP 27415485A JP H0618557 B2 JPH0618557 B2 JP H0618557B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- item
- weight
- group
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title claims description 143
- 230000001070 adhesive effect Effects 0.000 title claims description 143
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 65
- 230000007797 corrosion Effects 0.000 claims description 60
- 238000005260 corrosion Methods 0.000 claims description 60
- 239000003112 inhibitor Substances 0.000 claims description 53
- 229920001577 copolymer Polymers 0.000 claims description 37
- 239000004902 Softening Agent Substances 0.000 claims description 31
- 238000007334 copolymerization reaction Methods 0.000 claims description 29
- -1 alkali metal salicylates Chemical class 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 22
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 18
- 229910052783 alkali metal Inorganic materials 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 11
- 150000003839 salts Chemical class 0.000 claims description 11
- 229940105990 diglycerin Drugs 0.000 claims description 10
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims description 10
- 235000011187 glycerol Nutrition 0.000 claims description 9
- 125000000656 azaniumyl group Chemical group [H][N+]([H])([H])[*] 0.000 claims description 8
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical class [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 150000003926 acrylamides Chemical class 0.000 claims description 5
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims description 5
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 5
- VKFFEYLSKIYTSJ-UHFFFAOYSA-N tetraazanium;phosphonato phosphate Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[O-]P([O-])(=O)OP([O-])([O-])=O VKFFEYLSKIYTSJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004254 Ammonium phosphate Substances 0.000 claims description 4
- 229910000318 alkali metal phosphate Inorganic materials 0.000 claims description 4
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 4
- BOFZOTMTKBQRAB-UHFFFAOYSA-N azanium;2-carboxyphenolate Chemical class N.OC(=O)C1=CC=CC=C1O BOFZOTMTKBQRAB-UHFFFAOYSA-N 0.000 claims description 4
- 235000011180 diphosphates Nutrition 0.000 claims description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 4
- 239000003513 alkali Substances 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 63
- 238000011156 evaluation Methods 0.000 description 55
- 230000000052 comparative effect Effects 0.000 description 45
- 238000002360 preparation method Methods 0.000 description 32
- 239000000243 solution Substances 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 17
- 229910052718 tin Inorganic materials 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 239000002585 base Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- YXVFQADLFFNVDS-UHFFFAOYSA-N diammonium citrate Chemical compound [NH4+].[NH4+].[O-]C(=O)CC(O)(C(=O)O)CC([O-])=O YXVFQADLFFNVDS-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical compound [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 3
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229930195734 saturated hydrocarbon Natural products 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- BURBNIPKSRJAIQ-UHFFFAOYSA-N 2-azaniumyl-3-[3-(trifluoromethyl)phenyl]propanoate Chemical compound OC(=O)C(N)CC1=CC=CC(C(F)(F)F)=C1 BURBNIPKSRJAIQ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 208000010201 Exanthema Diseases 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 206010040880 Skin irritation Diseases 0.000 description 2
- ABBQHOQBGMUPJH-UHFFFAOYSA-M Sodium salicylate Chemical compound [Na+].OC1=CC=CC=C1C([O-])=O ABBQHOQBGMUPJH-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- WDHNSPIMTCZPDZ-UHFFFAOYSA-M [Cl-].C(CC(C)C)[N+](C)(C)C.C(C=C)(=O)N Chemical compound [Cl-].C(CC(C)C)[N+](C)(C)C.C(C=C)(=O)N WDHNSPIMTCZPDZ-UHFFFAOYSA-M 0.000 description 2
- YVIMHTIMVIIXBQ-UHFFFAOYSA-N [SnH3][Al] Chemical compound [SnH3][Al] YVIMHTIMVIIXBQ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229940063284 ammonium salicylate Drugs 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 2
- 235000019838 diammonium phosphate Nutrition 0.000 description 2
- KBRFQQSNFWYSMM-UHFFFAOYSA-M dimethyl-(prop-2-enoyloxymethyl)-propylazanium;chloride Chemical compound [Cl-].CCC[N+](C)(C)COC(=O)C=C KBRFQQSNFWYSMM-UHFFFAOYSA-M 0.000 description 2
- IHLOPRJQBJIRHX-UHFFFAOYSA-N dimethyl-[(2-methylprop-2-enoylamino)methyl]-propylazanium;chloride Chemical compound [Cl-].CCC[N+](C)(C)CNC(=O)C(C)=C IHLOPRJQBJIRHX-UHFFFAOYSA-N 0.000 description 2
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000002567 electromyography Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- TUHPIUNFKNTZCO-UHFFFAOYSA-M ethyl-dimethyl-(2-methylprop-2-enoyloxymethyl)azanium;chloride Chemical compound [Cl-].CC[N+](C)(C)COC(=O)C(C)=C TUHPIUNFKNTZCO-UHFFFAOYSA-M 0.000 description 2
- 201000005884 exanthem Diseases 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 206010037844 rash Diseases 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000036556 skin irritation Effects 0.000 description 2
- 231100000475 skin irritation Toxicity 0.000 description 2
- 229960004025 sodium salicylate Drugs 0.000 description 2
- 239000001393 triammonium citrate Substances 0.000 description 2
- 235000011046 triammonium citrate Nutrition 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QRIMLDXJAPZHJE-UHFFFAOYSA-N 2,3-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CO QRIMLDXJAPZHJE-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- RSNDTPFSMDVWCS-UHFFFAOYSA-N 2-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCC(=C)C(N)=O RSNDTPFSMDVWCS-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- RUUHDEGJEGHQKL-UHFFFAOYSA-M 2-hydroxypropyl(trimethyl)azanium;chloride Chemical compound [Cl-].CC(O)C[N+](C)(C)C RUUHDEGJEGHQKL-UHFFFAOYSA-M 0.000 description 1
- MWCBGWLCXSUTHK-UHFFFAOYSA-N 2-methylbutane-1,4-diol Chemical compound OCC(C)CCO MWCBGWLCXSUTHK-UHFFFAOYSA-N 0.000 description 1
- OYFJWLSZXKXLAT-UHFFFAOYSA-N 4-ethoxybutyl prop-2-enoate Chemical compound CCOCCCCOC(=O)C=C OYFJWLSZXKXLAT-UHFFFAOYSA-N 0.000 description 1
- FLCAEMBIQVZWIF-UHFFFAOYSA-N 6-(dimethylamino)-2-methylhex-2-enamide Chemical compound CN(C)CCCC=C(C)C(N)=O FLCAEMBIQVZWIF-UHFFFAOYSA-N 0.000 description 1
- 244000215068 Acacia senegal Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 241000416162 Astragalus gummifer Species 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- BWGVNKXGVNDBDI-UHFFFAOYSA-N Fibrin monomer Chemical class CNC(=O)CNC(=O)CN BWGVNKXGVNDBDI-UHFFFAOYSA-N 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- 240000001058 Sterculia urens Species 0.000 description 1
- 235000015125 Sterculia urens Nutrition 0.000 description 1
- 229920001615 Tragacanth Polymers 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- UPPMYRZSHUZNLW-UHFFFAOYSA-M [I-].C(C=C)(=O)OC[N+](C)(C)CC Chemical compound [I-].C(C=C)(=O)OC[N+](C)(C)CC UPPMYRZSHUZNLW-UHFFFAOYSA-M 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- UBNVDFUEPGQZQS-UHFFFAOYSA-N acetic acid;n,n-dimethyldodecan-1-amine Chemical compound CC([O-])=O.CCCCCCCCCCCC[NH+](C)C UBNVDFUEPGQZQS-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 1
- YSJGOMATDFSEED-UHFFFAOYSA-M behentrimonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCCCCCC[N+](C)(C)C YSJGOMATDFSEED-UHFFFAOYSA-M 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229940001468 citrate Drugs 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- GSIANSUJMKIFFZ-UHFFFAOYSA-N diethyl-[(2-methylprop-2-enoylamino)methyl]-propylazanium chloride Chemical compound [Cl-].C(C(=C)C)(=O)NC[N+](CC)(CC)CCC GSIANSUJMKIFFZ-UHFFFAOYSA-N 0.000 description 1
- RASPZVWGLAKRGQ-UHFFFAOYSA-M dimethyl-(2-methylprop-2-enoyloxymethyl)-propylazanium chloride Chemical compound [Cl-].C(C(=C)C)(=O)OC[N+](C)(C)CCC RASPZVWGLAKRGQ-UHFFFAOYSA-M 0.000 description 1
- STYDHDXJCZFGDF-UHFFFAOYSA-N dimethyl-[(2-methylprop-2-enoylamino)methyl]-propylazanium;bromide Chemical compound [Br-].CCC[N+](C)(C)CNC(=O)C(C)=C STYDHDXJCZFGDF-UHFFFAOYSA-N 0.000 description 1
- SCQOZUUUCTYPPY-UHFFFAOYSA-N dimethyl-[(prop-2-enoylamino)methyl]-propylazanium;chloride Chemical compound [Cl-].CCC[N+](C)(C)CNC(=O)C=C SCQOZUUUCTYPPY-UHFFFAOYSA-N 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- UZLGHNUASUZUOR-UHFFFAOYSA-L dipotassium;3-carboxy-3-hydroxypentanedioate Chemical compound [K+].[K+].OC(=O)CC(O)(C([O-])=O)CC([O-])=O UZLGHNUASUZUOR-UHFFFAOYSA-L 0.000 description 1
- 239000002526 disodium citrate Substances 0.000 description 1
- 235000019262 disodium citrate Nutrition 0.000 description 1
- RGEUJMSAPBESFR-UHFFFAOYSA-L disodium hydrogen phosphate tetrahydrate Chemical compound O.O.O.O.[Na+].[Na+].OP([O-])([O-])=O RGEUJMSAPBESFR-UHFFFAOYSA-L 0.000 description 1
- CEYULKASIQJZGP-UHFFFAOYSA-L disodium;2-(carboxymethyl)-2-hydroxybutanedioate Chemical compound [Na+].[Na+].[O-]C(=O)CC(O)(C(=O)O)CC([O-])=O CEYULKASIQJZGP-UHFFFAOYSA-L 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- IFMSPGDRAFEEFP-UHFFFAOYSA-N ethyl-dimethyl-[(2-methylprop-2-enoylamino)methyl]azanium;chloride Chemical compound [Cl-].CC[N+](C)(C)CNC(=O)C(C)=C IFMSPGDRAFEEFP-UHFFFAOYSA-N 0.000 description 1
- OCYRXDHPVCTKIM-UHFFFAOYSA-N ethyl-dimethyl-[(prop-2-enoylamino)methyl]azanium;chloride Chemical compound [Cl-].CC[N+](C)(C)CNC(=O)C=C OCYRXDHPVCTKIM-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000246 fibrin derivative Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- CUXQLKLUPGTTKL-UHFFFAOYSA-M microcosmic salt Chemical compound [NH4+].[Na+].OP([O-])([O-])=O CUXQLKLUPGTTKL-UHFFFAOYSA-M 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- FRMWBRPWYBNAFB-UHFFFAOYSA-M potassium salicylate Chemical compound [K+].OC1=CC=CC=C1C([O-])=O FRMWBRPWYBNAFB-UHFFFAOYSA-M 0.000 description 1
- 229960003629 potassium salicylate Drugs 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- QYUMESOEHIJKHV-UHFFFAOYSA-M prop-2-enamide;trimethyl(propyl)azanium;chloride Chemical compound [Cl-].NC(=O)C=C.CCC[N+](C)(C)C QYUMESOEHIJKHV-UHFFFAOYSA-M 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229940048084 pyrophosphate Drugs 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- VZWGHDYJGOMEKT-UHFFFAOYSA-J sodium pyrophosphate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O VZWGHDYJGOMEKT-UHFFFAOYSA-J 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 239000011366 tin-based material Substances 0.000 description 1
- 239000000196 tragacanth Substances 0.000 description 1
- 235000010487 tragacanth Nutrition 0.000 description 1
- 229940116362 tragacanth Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Landscapes
- Electrotherapy Devices (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は導電性粘着剤の層を電極板表面に設けた医療用
粘着電極に関する。TECHNICAL FIELD The present invention relates to a medical adhesive electrode in which a layer of a conductive adhesive is provided on the surface of an electrode plate.
（従来の技術） 心電計，筋電計，脳波計，低周波治療器，手術用電気メ
スなどの医療用電気機器を使用する場合には，皮膚表面
に信号用電極やアース用電極を貼付し，皮膚表面の所定
場所とこれら機器とを電気的に接続したり皮膚表面を接
地することが行われる。医療用粘着電極の素材や形状，
さらにはその電極の皮膚表面への固定手段について種々
の改良がなされており，現在では導電性粘着剤層が金属
箔製電極板表面に設けられた粘着電極が好適に利用され
ている。(Prior Art) When using medical electrical equipment such as an electrocardiograph, an electromyography, an electroencephalograph, a low-frequency therapy device, and an electrosurgical knife, attach a signal electrode or a ground electrode to the skin surface. However, a predetermined place on the skin surface is electrically connected to these devices, or the skin surface is grounded. Material and shape of medical adhesive electrode,
Further, various improvements have been made on the means for fixing the electrode to the skin surface, and at present, an adhesive electrode having a conductive adhesive layer provided on the surface of a metal foil electrode plate is preferably used.
このような粘着電極に使用されうる導電性粘着剤として
は，例えば，特開昭52-95895号公報には，α，β−オレ
フィン性不飽和カルボン酸と末端が第４アンモニウム基
である１価もしくは多価アルコールとのエステルを含む
ポリマーと多価アルコールとを含有する粘着剤が開示さ
れている。特開昭56-36939号公報には，（メタ）アクリ
ル酸，マレイン酸などの有機カルボン酸の塩（アルカリ
金属塩，アミン塩など）を５モル％以上の割合で含むポ
リマーとグリセリンなどの多価アルコールとを含有する
粘着剤が開示されている。さらに，特開昭56-36940号公
報には，ポリビニルアルコールなどの非イオン性親水性
ポリマーとグリセリンなどの水溶性可塑剤とを含有する
粘着剤が開示されている。As a conductive adhesive that can be used for such an adhesive electrode, for example, in JP-A-52-95895, an α, β-olefinically unsaturated carboxylic acid and a monovalent compound having a quaternary ammonium group at the terminal are disclosed. Alternatively, a pressure-sensitive adhesive containing a polymer containing an ester with a polyhydric alcohol and a polyhydric alcohol is disclosed. Japanese Unexamined Patent Publication No. 56-36939 discloses a polymer containing 5 mol% or more of a salt of an organic carboxylic acid such as (meth) acrylic acid or maleic acid (alkali metal salt, amine salt) and glycerin. An adhesive containing a polyhydric alcohol is disclosed. Further, JP-A-56-36940 discloses an adhesive containing a nonionic hydrophilic polymer such as polyvinyl alcohol and a water-soluble plasticizer such as glycerin.
上記医療用粘着電極に用いられる電極板には，通常，
錫，アルミニウム，錫−アルミニウム合金などが，導電
性が良好でありかつ比較的安価であることなどから，好
適に利用される。しかし，このような電極板に上記導電
性粘着剤を接触させたまま放置すると電極板の金属が短
期間のうちに腐食される。例えば，電極板として錫を用
いると黒〜褐色の斑点が不規則に発生し，次第にその数
が増す。電極板としてアルミニウムを用いると腐食によ
り変色し穿孔が発生する。腐食の進行とともに孔の数が
増加し，その径も大きくなる。このような電極は導電性
が低下するばかりでなく，穿孔が生じると電極としての
用をなさない。一般に，粘着剤の導電性の度合が高くか
つ粘着性に優れた粘着剤ほど電極板を腐食しやすいとい
う現象が認められる。The electrode plate used for the medical adhesive electrode is usually
Tin, aluminum, tin-aluminum alloy, and the like are preferably used because they have good conductivity and are relatively inexpensive. However, if the conductive adhesive is left in contact with such an electrode plate, the metal of the electrode plate is corroded within a short period of time. For example, when tin is used as the electrode plate, black to brown spots are irregularly generated, and the number thereof gradually increases. When aluminum is used for the electrode plate, it is discolored due to corrosion and perforation occurs. As corrosion progresses, the number of holes increases and the diameter also increases. Such an electrode not only loses its conductivity, but also becomes useless as an electrode when perforation occurs. In general, it is recognized that the higher the degree of conductivity of an adhesive and the better the adhesiveness, the more easily the electrode plate corrodes.
（発明が解決しようとする問題点） 本発明は上記従来の欠点を解決するものであり，その目
的とするところは，各種医療用電気機器に利用され得，
優れた導電性と粘着性とを有し，かつ，電極板を腐食す
ることのない導電性粘着剤を提供することにある。本発
明の他の目的は，上記優れた性質を有する粘着剤の層が
電極板表面に設けられた医療用粘着電極を提供すること
にある。(Problems to be Solved by the Invention) The present invention solves the above-mentioned conventional drawbacks, and an object thereof is to be utilized in various medical electric devices,
An object of the present invention is to provide a conductive adhesive that has excellent conductivity and adhesiveness and that does not corrode the electrode plate. Another object of the present invention is to provide a medical adhesive electrode in which a layer of the adhesive having the above excellent properties is provided on the surface of an electrode plate.
（問題点を解決するための手段） 本発明の医療用導電性粘着剤は，(a)置換アンモニオ基
を有するポリマー；(b)グリセリンおよび／もしくはジ
グリセリンでなる軟化剤；および(c)リン酸アルカリ金
属塩，リン酸アンモニウム塩，ピロリン酸アルカリ金属
塩，ピロリン酸アンモニウム塩，サリチル酸アルカリ金
属塩，サリチル酸アンモニウム塩，クエン酸アルカリ金
属塩，クエン酸アンモニウム塩および上記塩の複塩でな
る群から選択される少なくとも一種の腐食防止剤を含有
し，そのことにより上記目的が達成される。(Means for Solving Problems) The medical conductive adhesive of the present invention comprises: (a) a polymer having a substituted ammonio group; (b) a softening agent comprising glycerin and / or diglycerin; and (c) phosphorus. Acid alkali metal salt, ammonium phosphate salt, alkali metal pyrophosphate salt, ammonium pyrophosphate salt, alkali metal salicylate salt, ammonium salicylate salt, alkali metal citrate salt, ammonium citrate salt and a double salt of the above salts It contains at least one selected corrosion inhibitor, which achieves the above objectives.
本発明の医療用粘着電極は，導電性粘着剤層が電極板の
少なくとも一部に設けられた医療用粘着電極であって，
該粘着剤は，(a)置換アンモニオ基を有するポリマー；
(b)グリセリンおよび／もしくはジグリセリンでなる軟
化剤；および(c)リン酸アルカリ金属塩，リン酸アンモ
ニウム塩，ピロリン酸アルカリ金属塩，ピロリン酸アン
モニウム塩，サリチル酸アルカリ金属塩，サリチル酸ア
ンモニウム塩，クエン酸アルカリ金属塩，クエン酸アン
モニウム塩および上記塩の複塩でなる群から選択される
少なくとも一種の腐食防止剤を含有し，そのことにより
上記目的が達成される。The medical adhesive electrode of the present invention is a medical adhesive electrode in which a conductive adhesive layer is provided on at least a part of an electrode plate,
The adhesive is (a) a polymer having a substituted ammonio group;
(b) glycerin and / or diglycerin softening agent; and (c) alkali metal phosphate, ammonium phosphate, alkali metal pyrophosphate, ammonium pyrophosphate, alkali metal salicylate, ammonium salicylate, citrate It contains at least one corrosion inhibitor selected from the group consisting of acid alkali metal salts, ammonium citrate salts and double salts of the above salts, whereby the above objects are achieved.
本発明の医療用導電性粘着剤の主成分であるポリマー
は，次の構造式を有する（メタ）アクリルアミド誘導体
（Ｉ）および／もしくは（メタ）アクリル酸エステル誘
導体（II）を共重合成分（第１共重合成分）として含有
する共重合体である： （ここで，R1はＨまたはCH3；R2は炭素数１〜６の飽和
炭化水素基；R3,R4およびR5は炭素数１〜４のアルキル
基；そしてＸはCl,Brなどのハロゲン原子である） （ここで，R6はＨまたはCH3；R7は炭素数１〜６の飽和
炭化水素基またはヒドロキシル基を有する炭素数１〜６
の飽和炭化水素基；R8,R9およびR10は炭素数１〜４のア
ルキル基；そしてＸはCl,Brなどのハロゲン原子であ
る）。The polymer, which is the main component of the medical conductive adhesive of the present invention, comprises a copolymerization component (first) of a (meth) acrylamide derivative (I) and / or a (meth) acrylic acid ester derivative (II) having the following structural formula. 1 copolymer component) contained as a copolymer: (Wherein R 1 is H or CH 3 ; R 2 is a saturated hydrocarbon group having 1 to 6 carbon atoms; R 3 , R 4 and R 5 are alkyl groups having 1 to 4 carbon atoms; and X is Cl, Br. Is a halogen atom such as) (Here, R 6 is H or CH 3 ; R 7 is a saturated hydrocarbon group having 1 to 6 carbon atoms or 1 to 6 carbon atoms having a hydroxyl group.
Saturated hydrocarbon group; R 8 , R 9 and R 10 are alkyl groups having 1 to 4 carbon atoms; and X is a halogen atom such as Cl and Br).
上記構造式で示される化合物のうち，（メタ）アクリル
アミド誘導体（Ｉ）としては，２（アクリルアミド）エ
チルトリメチルアンモニウムクロライド，２（メタクリ
ルアミド）エチルトリメチルアンモニウムクロライド，
３（アクリルアミド）プロピルトリメチルアンモニウム
クロライド，３（メタクリルアミド）プロピルトリメチ
ルアンモニウムクロライド，３（メタクリルアミド）プ
ロピルジエチルメチルアンモニウムクロライド，３（メ
タクリルアミド）プロピルトリメチルアンモニウムブロ
マイド，３（アクリルアミド）イソペンチルトリメチル
アンモニウムクロライドなどがある。（メタ）アクリル
酸エステル誘導体（II）としては，２（アクリルオキ
シ）エチルトリメチルアンモニウムアイオダイド，２
（メタクリルオキシ）エチルトリメチルアンモニウムク
ロライド，３（アクリルオキシ）プロピルトリメチルア
ンモニウムクロライド，３（メタクリルオキシ）プロピ
ルトリメチルアンモニウムクロライド，３（メタクリル
オキシ）２ヒドロキシプロピルトリメチルアンモニウム
クロライドなどがある。Among the compounds represented by the above structural formulas, the (meth) acrylamide derivative (I) includes 2 (acrylamido) ethyltrimethylammonium chloride, 2 (methacrylamido) ethyltrimethylammonium chloride,
3 (acrylamide) propyltrimethylammonium chloride, 3 (methacrylamido) propyltrimethylammonium chloride, 3 (methacrylamido) propyldiethylmethylammonium chloride, 3 (methacrylamido) propyltrimethylammonium bromide, 3 (acrylamide) isopentyltrimethylammonium chloride, etc. There is. As the (meth) acrylic acid ester derivative (II), 2 (acryloxy) ethyltrimethylammonium iodide, 2
Examples thereof include (methacryloxy) ethyltrimethylammonium chloride, 3 (acryloxy) propyltrimethylammonium chloride, 3 (methacryloxy) propyltrimethylammonium chloride and 3 (methacryloxy) 2hydroxypropyltrimethylammonium chloride.
上記第１共重合成分とともに共重合体を形成する共重合
成分（第２共重合成分）としては，ブチルアクリレー
ト，２ヒドロキシエチルアクリレート，２ヒドロキシエ
チルメタクリレート，２ヒドロキシプロピルアクリレー
ト，２ヒドロキシプロピルメタクリレート，エチルアク
リレート，ブトキシエチルアクリレート，エトキシブチ
ルアクリレート，テトラヒドロフルフリルアクリレー
ト，アクリルアミド，メタクリルアミド，Ｎ−ジメチル
アクリルアミド，Ｎ−ジメチルメタクリルアミド，Ｎ−
ブトキシメチルアクリルアミド，ジメチルアミノプロピ
ルメタクリルアミド，ジメチルアミノエチルアクリレー
ト，ジエチルアミノエチルアクリレート，ポリエチレン
グリコールメタクリレート，ポリプロピレングリコール
メタクリレート，グリセロールメタクリレート，酢酸ビ
ニル，プロピオン酸ビニル，ビニルピロリドン，ジアセ
トンアクリルアミドなどがある。Examples of the copolymerization component (second copolymerization component) that forms a copolymer with the first copolymerization component include butyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, ethyl. Acrylate, butoxyethyl acrylate, ethoxybutyl acrylate, tetrahydrofurfuryl acrylate, acrylamide, methacrylamide, N-dimethylacrylamide, N-dimethylmethacrylamide, N-
Examples include butoxymethyl acrylamide, dimethylaminopropyl methacrylamide, dimethylaminoethyl acrylate, diethylaminoethyl acrylate, polyethylene glycol methacrylate, polypropylene glycol methacrylate, glycerol methacrylate, vinyl acetate, vinyl propionate, vinylpyrrolidone, and diacetone acrylamide.
共重合体中には第１共重合成分が20〜70重量％の割合
で，そして第２共重合成分が80〜30重量％の割合で含有
される。本発明の粘着剤の導電性は，主として，共重合
体中の第１共重合成分に起因するため，第１共重合成分
が過少であると実質的に導電性が得られない。過剰であ
ると粘着剤が吸湿性を示す。第１および第２共重合成分
はそれぞれ２種以上が混合されていてもよい。The first copolymerization component is contained in the copolymer in a proportion of 20 to 70% by weight, and the second copolymerization component is contained in a proportion of 80 to 30% by weight. Since the conductivity of the pressure-sensitive adhesive of the present invention is mainly due to the first copolymerization component in the copolymer, if the first copolymerization component is too small, the conductivity cannot be substantially obtained. If it is excessive, the pressure-sensitive adhesive exhibits hygroscopicity. Two or more kinds of each of the first and second copolymerization components may be mixed.
上記第１共重合成分および第２共重合成分（いずれも単
量体）を通常のラジカル重合方法，例えば，溶液重合法
により重合反応に供して，共重合体が得られる。溶液重
合法による場合は，溶媒としては，使用する各単量体お
よび生成する共重合体を溶解させうる溶媒が利用され
る。このような溶媒は，使用する単量体の組成により異
なるが，例えば，アルコール，水−アルコール混液（ア
ルコールは，メタノール，エタノール，イソプロパノー
ルなど）が用いられる。The first copolymerization component and the second copolymerization component (both are monomers) are subjected to a polymerization reaction by an ordinary radical polymerization method, for example, a solution polymerization method to obtain a copolymer. In the case of the solution polymerization method, as the solvent, a solvent capable of dissolving each of the used monomers and the produced copolymer is used. Such a solvent varies depending on the composition of the monomer used, but for example, alcohol, a water-alcohol mixed solution (alcohol is methanol, ethanol, isopropanol, etc.) is used.
共重合体を得るには，例えば，まず，上記の各単量体と
溶媒とを還流冷却器付き反応器に仕込む。単量体の仕込
濃度は30〜80％が好適である。次に，反応器内を窒素な
どの不活性ガスにより置換し，加熱・攪拌しながら触媒
の投入を開始する。触媒は，重合反応に通常用いられる
アゾビス系，過酸化物系などが好適に用いられる。触媒
量は，通常，全単量体のモル数の0.1〜0.5モル％の範囲
が採用される。触媒は全量の1/20〜1/5の量ずつ適宜分
割して反応液に投入される。触媒投入間隔は，使用する
触媒の半減期の0.5〜1.5倍とすることが好ましい。反応
温度は通常50〜80℃である。第１および第２共重合成分
が含まれるこのような反応系においては共重合性が高く
暴走反応やゲル化の危険が比較的少ない。しかし，特に
単量体の仕込濃度が50％以上の場合には，反応系に数回
〜十数回にわたり溶媒を加えて粘度を低下させる濃度漸
減法により暴走反応やゲル化が起こらないようにするこ
とが好ましい。反応時間は単量体組成，触媒の種類や
量，反応条件などにより異なるが，通常，約20〜50時間
である。このようにして，共重合体を含む粘稠な溶液が
得られる。To obtain the copolymer, for example, first, each of the above monomers and the solvent are charged into a reactor equipped with a reflux condenser. The monomer concentration is preferably 30 to 80%. Next, the inside of the reactor is replaced with an inert gas such as nitrogen, and the catalyst introduction is started while heating and stirring. As the catalyst, azobis type, peroxide type and the like which are usually used in the polymerization reaction are preferably used. The amount of catalyst is usually in the range of 0.1 to 0.5 mol% based on the total number of monomers. The catalyst is appropriately divided into 1/20 to 1/5 of the total amount and added to the reaction solution. The catalyst feeding interval is preferably 0.5 to 1.5 times the half-life of the catalyst used. The reaction temperature is usually 50-80 ° C. In such a reaction system containing the first and second copolymerization components, the copolymerizability is high and the risk of runaway reaction or gelation is relatively small. However, especially when the charged concentration of the monomer is 50% or more, runaway reaction and gelation are prevented by the concentration decreasing method in which the solvent is added to the reaction system several times to dozens of times to reduce the viscosity. Preferably. The reaction time varies depending on the monomer composition, type and amount of catalyst, reaction conditions, etc., but is usually about 20 to 50 hours. In this way, a viscous solution containing the copolymer is obtained.
このようにして得られた共重合体は，粘着剤の主成分と
なる。この共重合体は共重合成分の種類や量により，そ
れ自体で粘着性を有する場合もあるが，通常，非粘着性
で乾燥状態では比較的もろく硬い樹脂状である。乾燥状
態では導電性も発現されない。しかし，これに適当な軟
化剤が加えられると，共重合体は軟化して粘着性を有
し，粘着剤として機能するようになる。内部凝集力も適
度となり粘弾性的性質を有し導電性を示すようになる。The copolymer thus obtained is the main component of the pressure-sensitive adhesive. This copolymer may be tacky by itself depending on the kind and amount of the copolymerization component, but it is usually non-tacky, and in the dry state it is relatively brittle and hard resinous. In the dry state, conductivity is not exhibited. However, when an appropriate softening agent is added thereto, the copolymer softens and becomes tacky, and functions as an adhesive. The internal cohesive force also becomes appropriate, and it has viscoelastic properties and exhibits conductivity.
軟化剤としては，水が用いられうるが，蒸発により粘着
性や導電性が変化するため，通常，グリセリンおよび／
もしくはジクリセリンが利用される。軟化剤の量は共重
合成分の組成，軟化剤の種類，粘着剤層の厚み，所望す
る粘着性の度合などにより異なるが，通常，共重合体10
0重量部に対して10〜90重量部の範囲である。過少であ
ると粘着性が発現されないばかりか導電性も得られな
い。共重合体に軟化剤が加えられて軟化し，粘着剤とし
て機能する状態であれば導電性も充分である。軟化剤量
が過剰であると得られる粘着剤の接着性は増大するが，
軟化し流動性を有するようになる。Water can be used as a softening agent, but it is usually glycerin and / or
Alternatively, dichryserine is used. The amount of the softening agent varies depending on the composition of the copolymerization component, the type of the softening agent, the thickness of the pressure-sensitive adhesive layer, the desired degree of tackiness, etc.
It is in the range of 10 to 90 parts by weight with respect to 0 parts by weight. If the amount is too small, not only the tackiness is not exhibited, but also the conductivity is not obtained. If the copolymer is softened by adding a softening agent and functions as an adhesive, the conductivity is sufficient. If the amount of softening agent is excessive, the adhesiveness of the obtained pressure-sensitive adhesive increases, but
It softens and becomes fluid.
上記共重合体と軟化剤とを含有する粘着剤は優れた導電
性と粘着性とを有する。しかし，これを錫やアルミニウ
ムなどの金属に長期間接触させると金属を腐食させる欠
点がある。そのため本発明の粘着剤では，さらに，腐食
防止剤が加えられる。腐食防止剤としてはリン酸アルカ
リ金属塩，リン酸アンモニウム塩，ピロリン酸アルカリ
金属塩，ピロリン酸アンモニウム塩，サリチル酸アルカ
リ金属塩，サリチル酸アンモニウム塩，クエン酸アルカ
リ金属塩，クエン酸アンモニウム塩および上記塩の複塩
でなる群から選択される少なくとも一種が用いられる。
このような腐食防止剤としては，例えば，リン酸三ナト
リウム，リン酸三カリウム，リン酸水素二ナトリウム，
リン酸水素二カリウム，リン酸二水素ナトリウム，リン
酸二水素カリウム，リン酸三アンモニウム，リン酸水素
二アンモニウム，リン酸二水素アンモニウム，リン酸水
素アンモニウムナトリウム，ピロリン酸ナトリウム，ピ
ロリン酸カリウム，ピロリン酸アンモニウム，クエン酸
二ナトリウム，クエン酸二カリウム，クエン酸三ナトリ
ウム，クエン酸二アンモニウム，クエン酸三アンモニウ
ム，サリチル酸ナトリウム，サリチル酸カリウム，サリ
チル酸アンモニウムがある。これらは２種以上混合され
て用いられてもよい。The pressure-sensitive adhesive containing the copolymer and the softening agent has excellent conductivity and pressure-sensitive adhesiveness. However, if this is contacted with a metal such as tin or aluminum for a long period of time, it has the drawback of corroding the metal. Therefore, in the adhesive of the present invention, a corrosion inhibitor is further added. Examples of corrosion inhibitors include alkali metal phosphates, ammonium phosphates, alkali metal pyrophosphates, ammonium pyrophosphates, alkali metal salicylates, ammonium salicylates, alkali metal citrates, ammonium citrates and the above salts. At least one selected from the group consisting of double salts is used.
Examples of such corrosion inhibitors include trisodium phosphate, tripotassium phosphate, disodium hydrogen phosphate,
Dipotassium hydrogen phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, triammonium phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, sodium ammonium hydrogen phosphate, sodium pyrophosphate, potassium pyrophosphate, pyroline There are ammonium acid, disodium citrate, dipotassium citrate, trisodium citrate, diammonium citrate, triammonium citrate, sodium salicylate, potassium salicylate, and ammonium salicylate. These may be used as a mixture of two or more.
このような腐食防止剤は，通常，共重合体100重量部あ
たり１〜30重量部の割合で粘着剤中に配合される。腐食
防止剤の量が過少であると腐食防止効果が得られない。
過剰であると粘着剤の粘着性が低下する。さらに，腐食
防止剤により粘着剤の系が酸性もしくはアルカリ性とな
るため，粘着剤が皮膚刺激性を有する場合もある。腐食
防止剤が上記範囲で加えられた粘着剤はアルミニウムや
錫などの金属を全く腐食しないか，製品化された場合に
実用上全く問題のない程度に腐食速度が遅い。しかも，
粘着剤の導電性および粘着性に影響を与えることがな
く，皮膚に対する刺激もない。腐食防止剤の作用機構の
詳細は不明であるが，腐食防止剤自体が解離しやすい性
質をもち，解離して生じたイオンが，主としてイオン反
応によるとされている金属の腐食反応に関与して，これ
を防止もしくは遅延させるものと考えられる。Such a corrosion inhibitor is usually added to the adhesive in a proportion of 1 to 30 parts by weight per 100 parts by weight of the copolymer. If the amount of the corrosion inhibitor is too small, the corrosion prevention effect cannot be obtained.
If it is excessive, the tackiness of the pressure-sensitive adhesive decreases. Furthermore, since the corrosion inhibitor makes the adhesive system acidic or alkaline, the adhesive may have skin irritation. The pressure-sensitive adhesive to which the corrosion inhibitor is added in the above range does not corrode metals such as aluminum and tin at all, or has a slow corrosion rate to the extent that there is no practical problem when it is commercialized. Moreover,
It does not affect the conductivity and adhesiveness of the adhesive and does not irritate the skin. Although the details of the mechanism of action of the corrosion inhibitor are unknown, the corrosion inhibitor itself has the property of easily dissociating, and the ions generated by the dissociation are mainly involved in the corrosion reaction of the metal, which is believed to be due to an ionic reaction. , It is thought to prevent or delay this.
本発明の粘着剤中には，通常，共重合体，軟化剤および
腐食防止剤の合計量中に共重合体が30〜90重量％の割合
で，軟化剤が５〜50重量％の割合で，そして腐食防止剤
が１〜20重量％の割合で含有される。In the pressure-sensitive adhesive of the present invention, the proportion of the copolymer is usually 30 to 90% by weight and the proportion of the softener is 5 to 50% by weight in the total amount of the copolymer, the softening agent and the corrosion inhibitor. , And a corrosion inhibitor is contained in a proportion of 1 to 20% by weight.
上記共重合体，軟化剤および腐食防止剤の他に，粘着剤
中には必要に応じて充填剤，粘着剤を皮膜としたときの
強度調整剤，粘着性調整剤，導電性調整剤などの添加剤
が含有される。これらのうち，充填剤には，炭酸カルシ
ウム，炭酸マグネシウム，亜鉛華，酸化アルミニウムな
どがある。皮膜強度調整剤には，ポリビニルアルコー
ル，ポリビニルピロリドン，ポリアクリル酸，ビニルメ
チルエーテル−無水マレイン酸共重合体，ヒドロキシメ
チルセルロース，アラビアゴム，膠，トラガカントゴ
ム，カラヤゴムなどがある。粘着性調整剤には，ポリエ
チレングリコール，ポリプロピレングリコール，ブチレ
ングリコール，アミレングリコール，トリメチロールエ
タン，ソルビトール，ジエタノールアミン，アルキル硫
酸トリエタノールアミン，脂肪酸ジエタノールアミド，
アミノアルキルプロパノール，塩化マグネシウムなどが
ある。導電性調整剤には，ベヘニルトリメチルアンモニ
ウムクロライド，ラウリルトリメチルアンモニウムクロ
ライド，オクタデシルトリメチルアンモニウムクロライ
ド，ジメチルドデシルアンモニウム酢酸などがある。上
記，添加剤の量は個々により異なるが，通常，共重合
体，軟化剤および腐食防止剤の合計重量の約40％以下で
ある。過剰であると，例えば，粘着剤の粘着性や導電性
が低下する。In addition to the above-mentioned copolymer, softening agent and corrosion inhibitor, in the adhesive, if necessary, a filler, a strength adjusting agent when the adhesive is formed into a film, an adhesion adjusting agent, a conductivity adjusting agent, etc. Additives are included. Among these, the fillers include calcium carbonate, magnesium carbonate, zinc white, aluminum oxide and the like. Film strength modifiers include polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, vinyl methyl ether-maleic anhydride copolymer, hydroxymethyl cellulose, gum arabic, glue, tragacanth rubber, karaya rubber and the like. Adhesiveness modifiers include polyethylene glycol, polypropylene glycol, butylene glycol, amylene glycol, trimethylolethane, sorbitol, diethanolamine, alkylsulfuric acid triethanolamine, fatty acid diethanolamide,
Examples include aminoalkyl propanol and magnesium chloride. Examples of the conductivity adjusting agent include behenyltrimethylammonium chloride, lauryltrimethylammonium chloride, octadecyltrimethylammonium chloride and dimethyldodecylammonium acetic acid. The amount of the above additives varies depending on the individual, but is usually about 40% or less of the total weight of the copolymer, the softener and the corrosion inhibitor. If it is excessive, for example, the adhesiveness and conductivity of the adhesive will be reduced.
本発明の粘着剤を調製するには，例えば，まず，上記共
重合反応により調製された共重合体溶液に必要に応じて
溶媒を添加し粘度調整を行う。これに軟化剤および腐食
防止剤，さらに必要に応じて，上記充填剤，皮膜強度調
整剤などが加えられて粘着剤溶液が得られる。通常，軟
化剤はそのまま，そして，腐食防止剤は水やアルコール
の濃厚溶液として添加される。粘着剤溶液の固形分濃度
は，25〜35％に調整される。この粘着剤溶液を塗布・乾
燥すると粘着剤層が形成される。To prepare the pressure-sensitive adhesive of the present invention, for example, first, a solvent is added to the copolymer solution prepared by the above-mentioned copolymerization reaction as needed to adjust the viscosity. To this, a softening agent and a corrosion inhibitor, and if necessary, the above-mentioned filler, film strength adjusting agent and the like are added to obtain an adhesive solution. Usually, the softener is added as it is, and the corrosion inhibitor is added as a concentrated solution of water or alcohol. The solid content concentration of the adhesive solution is adjusted to 25 to 35%. When this adhesive solution is applied and dried, an adhesive layer is formed.
本発明の医療用粘着電極に用いられる電極板の材質とし
ては錫，アルミニウム，ニッケル，クロム，銀，金，白
金，鉄，銅やこれらの合金などが用いられる。特に，導
電性に優れかつ比較的安価な錫，アルミニウムおよび錫
−アルミニウム合金が好適に用いられる。これら金属を
厚さ20〜200μｍの金属箔として，あるいは補強用裏打
部材とのラミネート体として電極板が形成される。電極
板の大きさはその用途により異なるが，例えば心電計の
電極である場合には，その直径は20〜50mmである。補強
用裏打部材には，例えば，ポリエチレンテレフタレー
ト，ポリエチレン，ポリプロピレン，ポリ塩化ビニル，
ナイロン，ポリウレタン，エチレン−酢酸ビニル共重合
体，エチレン−アクリル酸エステル共重合体，繊維素誘
導体などの樹脂でなるフィルムもしくはシート；天然繊
維，合成繊維などを用いた紙，織布および不織布；があ
る。補強用裏打部材自体がラミネート体であってもよ
い。Examples of the material of the electrode plate used for the medical adhesive electrode of the present invention include tin, aluminum, nickel, chromium, silver, gold, platinum, iron, copper and alloys thereof. In particular, tin, aluminum and tin-aluminum alloy, which have excellent conductivity and are relatively inexpensive, are preferably used. An electrode plate is formed by using these metals as a metal foil having a thickness of 20 to 200 μm or as a laminate with a reinforcing backing member. The size of the electrode plate varies depending on its use, but in the case of an electrocardiograph electrode, its diameter is 20 to 50 mm. Examples of the reinforcing backing member include polyethylene terephthalate, polyethylene, polypropylene, polyvinyl chloride,
A film or sheet made of a resin such as nylon, polyurethane, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, or fibrin derivative; paper, woven fabric and non-woven fabric using natural fiber or synthetic fiber; is there. The reinforcing backing member itself may be a laminate.
このような電極板表面に粘着剤層を設けるには，例え
ば，軟化剤，腐食防止剤などが加えられた上記粘着剤溶
液を上記導電性基材上に流延・乾燥する。粘着剤溶液を
剥離紙上に流延・乾燥した後，導電性基材表面に転写し
てもよい。粘着剤層の厚みは100〜1000μｍ，好ましく
は100〜600μｍである。このように比較的薄い層であっ
ても充分な粘着性が得られる。このようにして粘着剤層
が形成された導電性基材は，例えば，剥離紙をあてたま
ま打抜加工に供され，所望の形状の粘着電極が得られ
る。導電性基材を所望の形状に調製してからこれに粘着
剤層を形成してもよい。To provide an adhesive layer on the surface of such an electrode plate, for example, the adhesive solution containing a softening agent, a corrosion inhibitor, etc. is cast and dried on the conductive substrate. The adhesive solution may be cast on a release paper, dried, and then transferred to the surface of the conductive substrate. The thickness of the adhesive layer is 100 to 1000 μm, preferably 100 to 600 μm. Even with such a relatively thin layer, sufficient tackiness can be obtained. The conductive base material on which the pressure-sensitive adhesive layer is formed in this manner is subjected to a punching process with the release paper applied, for example, to obtain a pressure-sensitive adhesive electrode having a desired shape. The conductive base material may be prepared into a desired shape and then the adhesive layer may be formed thereon.
第１図および第２図に示すように，本発明の粘着電極１
は，例えば，円盤状の金属箔製電極板11と，この電極板
11の片面に設けた導電性粘着剤層12とを有する。導電性
粘着剤層12の表面（被測定者の皮膚表面に接触する側）
にはシリコーンなどを薄く塗布・キュアー処理した剥離
紙13が張りつけられる。この剥離紙13は導電性粘着剤層
12を保護するものであり，該電極を皮膚に取りつけると
きに剥離される。電極板11の一部には外側方に突出する
突起部110が設けられる。突起部110には粘着剤層が設け
られておらず，第３図に示すように，この突起部110に
導線31を介して心電計などの医療用電気機器３に電気的
に接続される。突起部110への導線の接続はクリップな
どを介して行われる。電極板としては，金属箔と裏打部
材とのラミネート体を用いることもできる。ラミネート
体を用いる場合の金属箔の厚みは10〜50μｍが適当であ
る。このような電極としては，金属箔製電極板11の代わ
りにラミネート体を用いたこと以外は，第１図および第
２図と同様の構造をもつ電極が用いられうる。さらに，
第４図および第５図に示すように，補強用裏打部材211
と金属箔212とのラミネート体でなる電極板21の突起部2
10の一部に金属製端子213を貫通させた電極も好適に用
いられる。この金属製端子213は導電性に優れた鉄，ニ
ッケルなどで形成される。電極板21の金属箔面に金属製
端子213が突出した部分には，該金属製端子213が皮膚と
接触するのを避けるために，絶縁シート214が接着され
る。突起部210の裏打部材面から突出した金属製端子213
の先端にクリップなどで導線が接続され，該導線を介し
て電極２と医療用電気機器が接続される。第５図におい
て22および23は第２図の12および13と同様，それぞれ粘
着剤層および剥離紙を示す。As shown in FIGS. 1 and 2, the adhesive electrode 1 of the present invention
Is, for example, a disk-shaped metal foil electrode plate 11 and this electrode plate.
11 and a conductive adhesive layer 12 provided on one surface. Surface of conductive adhesive layer 12 (side contacting the skin surface of the measurement subject)
A release paper 13 that is thinly coated and cured with silicone or the like is attached to the. This release paper 13 is a conductive adhesive layer
It protects 12 and is peeled off when the electrode is attached to the skin. A protrusion 110 that protrudes outward is provided on a part of the electrode plate 11. No adhesive layer is provided on the protrusion 110, and as shown in FIG. 3, the protrusion 110 is electrically connected to the medical electric device 3 such as an electrocardiograph via a lead wire 31. . The conductor wire is connected to the projection 110 through a clip or the like. A laminate of a metal foil and a backing member can be used as the electrode plate. When using a laminate, the thickness of the metal foil is suitably 10 to 50 μm. As such an electrode, an electrode having the same structure as in FIGS. 1 and 2 can be used except that a laminate is used instead of the metal foil electrode plate 11. further,
As shown in FIGS. 4 and 5, the reinforcing backing member 211
2 of the electrode plate 21, which is a laminate of the metal foil 212 and the metal foil 212.
An electrode having a metal terminal 213 penetrating a part of 10 is also suitably used. The metal terminal 213 is formed of iron, nickel or the like having excellent conductivity. An insulating sheet 214 is adhered to a portion of the metal foil surface of the electrode plate 21 where the metal terminal 213 projects so as to prevent the metal terminal 213 from coming into contact with the skin. A metal terminal 213 protruding from the backing member surface of the protrusion 210
A conducting wire is connected to the tip of the electrode by a clip or the like, and the electrode 2 and the medical electric device are connected via the conducting wire. In FIG. 5, 22 and 23 indicate the adhesive layer and release paper, respectively, as in 12 and 13 of FIG.
（作用） 本発明によれば，このように，導電性と粘着性とに優れ
た粘着剤が得られる。本発明の粘着剤の層を電極板表面
に設けた粘着電極は導電性に優れるため，例えば，心電
計などの測定機器に利用すると良好な測定感度が得られ
る。従来の導電性粘着剤はいずれも錫やアルミニウムを
腐食する性質をもっているのに対して，本発明の粘着剤
はこれら金属を腐食しないため，錫やアルミニウムを電
極板として，優れた性質の粘着電極が安価に製造され
る。電極を長期間保存しても錫やアルミニウムなどの電
極板が腐食を受けて導電性が変化することがなく，ま
た，粘着剤自体の導電性が変化することもない。粘着剤
は皮膚刺激性がないため電極を長時間皮膚表面に貼付し
てもかぶれが生じにくい。(Operation) According to the present invention, as described above, an adhesive having excellent conductivity and adhesiveness can be obtained. Since the adhesive electrode provided with the layer of the adhesive of the present invention on the surface of the electrode plate is excellent in conductivity, it is possible to obtain good measurement sensitivity when used in a measuring instrument such as an electrocardiograph. While all the conventional conductive adhesives have the property of corroding tin and aluminum, the adhesive of the present invention does not corrode these metals. Therefore, tin or aluminum is used as an electrode plate and an adhesive electrode having excellent properties is obtained. Is manufactured at low cost. Even if the electrodes are stored for a long period of time, the electrode plate made of tin, aluminum or the like will not be corroded to change the conductivity, and the conductivity of the adhesive itself will not change. Since the adhesive has no skin irritation, rash does not easily occur even if the electrode is applied to the skin surface for a long time.
（実施例） 本発明を実施例につき説明する。(Examples) The present invention will be described with reference to Examples.
実施例１−１ （Ａ）粘着剤の調製：（メタ）アクリルアミド誘導体
（第１共重合成分）として３（メタクリルアミド）プロ
ピルトリメチルアンモニウムクロライド45重量部，第２
共重合成分としてアクリル酸ブチル55重量部，そして溶
媒としてエチルアルコール−水混液(90：10)を還流冷却
装置をそなえた反応容器に仕込み，50％溶液とした。Ｎ
２気流下，攪拌しながら50℃で12時間，60℃で12時間，
さらに70℃で24時間反応を行なった。重合触媒としては
アゾビスイソブチロニトリルを上記モノマーの合計量の
0.4重量％をエチルアルコール−酢酸エチル混液(90：1
0)に0.4重量％となるように溶解して用いた。触媒は50
℃では６時間おきに２回，60℃では４時間おきに３回，
そして70℃では３時間おきに７回に分割して反応系に投
入した。重合反応中に反応液の粘度が著しく上昇した場
合には，攪拌が困難となりゲル化や暴走反応が起こるお
それもあるため，溶媒で反応液を希釈した。得られた反
応液は粘稠な透明溶液であった。この反応液（共重合体
溶液）を溶媒で希釈し後述の軟化剤などを配合するのに
適した粘度（ポリマー成分25〜35％）とした。この溶液
のポリマー成分100重量部に対して軟化剤としてグリセ
リンを45重量部，そして腐食防止剤としてリン酸水素二
ナトリウム（無水）４重量部を加えて粘着剤溶液を得
た。この粘着剤溶液，後述の実施例１−２〜１−６およ
び比較例１−１〜１−６で得られる粘着剤溶液をそれぞ
れ非伸縮性裏打シート上に塗布・乾燥し50μｍの層厚と
したときの粘着力はいずれも600〜900g/15mm（ＪＩＳ−
Ｚ 1522,180°折返し法により測定）である。Example 1-1 (A) Preparation of adhesive: 45 parts by weight of 3 (methacrylamido) propyltrimethylammonium chloride as (meth) acrylamide derivative (first copolymerization component), second
55 parts by weight of butyl acrylate as a copolymerization component, and an ethyl alcohol-water mixture (90:10) as a solvent were charged into a reaction vessel equipped with a reflux cooling device to prepare a 50% solution. N
2 hours at 50 ° C with stirring for 12 hours, 60 ° C for 12 hours,
Further, the reaction was carried out at 70 ° C for 24 hours. As the polymerization catalyst, azobisisobutyronitrile was used in the total amount of the above monomers.
0.4% by weight of ethyl alcohol-ethyl acetate mixed solution (90: 1
It was used by dissolving it in 0) so as to be 0.4% by weight. Catalyst is 50
2 times every 6 hours at ℃, 3 times every 4 hours at 60 ℃,
Then, at 70 ° C., the solution was divided into 7 parts every 3 hours and charged into the reaction system. If the viscosity of the reaction solution increases significantly during the polymerization reaction, stirring may become difficult and gelation or runaway reaction may occur, so the reaction solution was diluted with a solvent. The resulting reaction solution was a viscous transparent solution. This reaction solution (copolymer solution) was diluted with a solvent to give a viscosity (polymer component 25 to 35%) suitable for blending a softening agent described later. To 100 parts by weight of the polymer component of this solution, 45 parts by weight of glycerin as a softening agent and 4 parts by weight of disodium hydrogen phosphate (anhydrous) as a corrosion inhibitor were added to obtain an adhesive solution. The pressure-sensitive adhesive solution and the pressure-sensitive adhesive solutions obtained in Examples 1-2 to 1-6 and Comparative Examples 1-1 to 1-6, which will be described later, were applied on a non-stretchable backing sheet and dried to give a layer thickness of 50 μm. The adhesive strength when applied was 600 to 900 g / 15 mm (JIS-
Z 1522, measured by 180 ° folding method).
（Ｂ）粘着剤の腐食性評価：（Ａ）項で得られた粘着剤
溶液を錫基材およびアルミニウム基材上にそれぞれ100c
m2の広さに塗布・乾燥し，厚さ約200μｍの粘着剤層を
形成した。ここで使用した錫基材は厚さ15μｍの錫箔と
厚さ50μｍのポリエチレンテレフタレート（ＰＥＴ）フ
ィルムのラミネート体である。錫箔面には３mm間隔で切
り込み線が形成されており，この面に上記粘着剤層を形
成した。アルミニウム基材としては厚さ30μｍの軟質ア
ルミニウム箔を利用した。粘着剤層が形成された各基材
を60℃，70％RHの条件下で放置し，基材が所定の程度に
まで腐食されるのに要する時間を測定した。ここで，所
定の程度にまで腐食されるとは，錫基材を用いた場合に
は錫箔面が25％の割合で腐食された状態を示す。アルミ
ニウム基材を用いた場合には，基材10cm2あたりに１個
の割合で孔が生じた状態を示す。この実施例では240時
間放置したが錫基材の場合もアルミニウム基材の場合も
上記程度にまで腐食されることはなかった。本実施例，
実施例１−２〜１−３および比較例１−１〜１−３（Ｂ
項）の結果をあわせて表１(a)に示す。実施例１−４〜
１−６および比較例１−４〜１−６（Ｂ項）の結果は表
１(b)に示す。(B) Corrosion evaluation of pressure-sensitive adhesive: The pressure-sensitive adhesive solution obtained in (A) was applied to a tin substrate and an aluminum substrate at 100c each.
It was applied and dried in an area of m 2 to form an adhesive layer with a thickness of about 200 μm. The tin base material used here is a laminate of a 15 μm thick tin foil and a 50 μm thick polyethylene terephthalate (PET) film. Slit lines were formed on the tin foil surface at intervals of 3 mm, and the adhesive layer was formed on this surface. A soft aluminum foil having a thickness of 30 μm was used as the aluminum substrate. Each base material on which the pressure-sensitive adhesive layer was formed was left under the condition of 60 ° C. and 70% RH, and the time required for the base material to be corroded to a predetermined degree was measured. Here, "corrosion to a predetermined degree" means a state where the tin foil surface is corroded at a rate of 25% when a tin base material is used. When an aluminum base material is used, one hole is formed per 10 cm 2 of the base material. In this example, the sample was left for 240 hours, but neither the tin base material nor the aluminum base material was corroded to the above degree. In this example,
Examples 1-2 to 1-3 and Comparative examples 1-1 to 1-3 (B
The results are also shown in Table 1 (a). Examples 1-4 to
The results of 1-6 and Comparative Examples 1-4 to 1-6 (Item B) are shown in Table 1 (b).
（Ｃ）導電性評価：（Ａ）項で得られた粘着剤溶液を
（Ｂ）項で利用したのと同様の錫基材表面に塗布し，厚
さ約200μｍの粘着剤層（約４cm×４cm）を形成し，こ
の基材を下部電極とした。ただし，錫基材の粘着剤層が
形成されていない部分には切り込み線が形成されていな
い。切り込み線が形成されていない別の錫基材を上部電
極とし，この上部電極の錫箔面が下部電極面上の粘着剤
層に２cm×２cmの領域にわたって接するように重ね，試
験片を得た。上部電極の粘着剤層に接していない箇所
（２cm×約１cm）を90°折りかえして上部電極端子と
し，この上部電極端子に対応する下部電極部分（粘着剤
層が形成されていない部分）を下部電極端子とした。上
部電極端子および下部電極端子にそれぞれ導線を接続
し，粘着剤層を介して10Hz,10mVの正弦波電圧を印加し
た。そのときに流れる電流値Ｉを測定した。この電流値
から上記試験片の電気抵抗値Ｒ（インピーダンス）を算
出した。(C) Conductivity evaluation: The adhesive solution obtained in (A) was applied to the same tin substrate surface as used in (B), and an adhesive layer of about 200 μm thickness (about 4 cm x 4 cm) was formed, and this base material was used as the lower electrode. However, the score line is not formed in the portion of the tin-based material where the adhesive layer is not formed. Another tin base material having no score line was used as the upper electrode, and the tin foil surface of this upper electrode was overlapped with the adhesive layer on the lower electrode surface so as to contact the area of 2 cm × 2 cm to obtain a test piece. The part of the upper electrode that is not in contact with the adhesive layer (2 cm x about 1 cm) is folded back 90 ° to form the upper electrode terminal, and the lower electrode part (the part where the adhesive layer is not formed) corresponding to this upper electrode terminal is It was used as the lower electrode terminal. Conductive wires were connected to the upper and lower electrode terminals, respectively, and a sinusoidal voltage of 10 Hz and 10 mV was applied via the adhesive layer. The current value I flowing at that time was measured. The electrical resistance value R (impedance) of the test piece was calculated from this current value.
次にこの試験片を（Ｂ）項と同様の条件下(60℃,70%Rh)
で保存した後，再び測定を行い，インピーダンスを算出
した。本実施例，実施例１−２〜１−３および比較例１
−１〜１−６（Ｃ）項の結果をあわせて表１(a)に示
す。実施例１−４〜１−６および比較例１−４〜１−６
（Ｃ）項の結果は表１(b)に示す。 Next, this test piece was subjected to the same conditions as in (B) (60 ° C, 70% Rh).
After storing at, the measurement was performed again and the impedance was calculated. This Example, Examples 1-2 to 1-3, and Comparative Example 1
The results of items -1 to 1-6 (C) are shown together in Table 1 (a). Examples 1-4 to 1-6 and Comparative Examples 1-4 to 1-6
The results of item (C) are shown in Table 1 (b).
比較例１−１ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−１（Ａ）項と同様である。Comparative Example 1-1 (A) Preparation of pressure-sensitive adhesive: The same as in Example 1-1 (A) except that the corrosion inhibitor was not added.
（Ｂ）本比較例（Ａ）項で得られた粘着剤を用い，実施
例１−１（Ｂ）項に準じて腐食性を評価した。(B) Using the pressure-sensitive adhesive obtained in this comparative example (A), the corrosiveness was evaluated according to the example 1-1 (B).
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例１−２ （Ａ）粘着剤の調製：第１共重合成分の量を35重量部と
し，第２共重合成分としてアクリル酸２ヒドロキシエチ
ルを65重量部の割合で用いて共重合体を調製し，軟化剤
および腐食防止剤の添加量をそれぞれ20重量部および３
重量部としたこと以外は実施例１−１（Ａ）項と同様で
ある。Example 1-2 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared by using 35 parts by weight of the first copolymerization component and 65 parts by weight of 2 hydroxyethyl acrylate as the second copolymerization component. 20 parts by weight and 3 parts of the softening agent and the corrosion inhibitor, respectively, were prepared.
The procedure is the same as in Example 1-1 (A), except that the weight part is used.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例１−２ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−２（Ａ）項と同様である。Comparative Example 1-2 (A) Preparation of adhesive: The same as in Example 1-2 (A) except that no corrosion inhibitor was added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例１−３ （Ａ）粘着剤の調製：第１共重合成分として２（メタク
リルオキシ）エチルトリメチルアンモニウムクロライド
55重量部を，そして第２共重合成分としてアクリル酸２
ヒドロキシプロピル45重量部を用いて共重合体を調製
し，軟化剤および腐食防止剤の添加量をそれぞれ35重量
部および５重量部としたこと以外は実施例１−１（Ａ）
項と同様である。Example 1-3 (A) Preparation of adhesive: 2 (methacryloxy) ethyltrimethylammonium chloride as first copolymerization component
55 parts by weight, and acrylic acid 2 as the second copolymerization component
Example 1-1 (A) except that a copolymer was prepared using 45 parts by weight of hydroxypropyl and the addition amounts of the softening agent and the corrosion inhibitor were 35 parts by weight and 5 parts by weight, respectively.
It is the same as the item.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例１−３ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−３（Ａ）項と同様である。Comparative Example 1-3 (A) Preparation of pressure-sensitive adhesive: The same as in Example 1-3 (A) except that no corrosion inhibitor was added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例１−４ （Ａ）粘着剤の調製：第１共重合成分として３（アクリ
ルアミド）イソペンチルトリメチルアンモニウムクロラ
イド50重量部を，そして第２共重合成分としてアクリル
酸ブチル30重量部およびアクリル酸２ヒドロキシエチル
20重量部を用いて共重合体を調製し，軟化剤および腐食
防止剤の添加量をそれぞれ30重量部および５重量部とし
たこと以外は実施例１−１（Ａ）項と同様である。Examples 1-4 (A) Preparation of adhesive: 50 parts by weight of 3 (acrylamide) isopentyltrimethylammonium chloride as the first copolymerization component, and 30 parts by weight of butyl acrylate and 2 parts of acrylic acid as the second copolymerization components. Hydroxyethyl
The procedure is the same as in Example 1-1 (A), except that the copolymer is prepared using 20 parts by weight, and the amounts of the softening agent and the corrosion inhibitor added are 30 parts by weight and 5 parts by weight, respectively.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例１−４ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−４（Ａ）項と同様である。Comparative Example 1-4 (A) Preparation of pressure-sensitive adhesive: The same as in Example 1-4 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例１−５ （Ａ）粘着剤の調製：第１共重合成分として３（アクリ
ルアミド）プロピルトリメチルアンモニウムクロライド
30重量部を，そして第２共重合成分としてアクリル酸２
ヒドロキシプロピル40重量部およびアクリル酸２ヒドロ
キシエチル30重量部を用いて共重合体調製し，軟化剤お
よび腐食防止剤の添加量をそれぞれ15重量部および３重
量部としたこと以外は実施例１−１（Ａ）項と同様であ
る。Examples 1-5 (A) Preparation of pressure-sensitive adhesive: 3 (acrylamido) propyltrimethylammonium chloride as first copolymerization component
30 parts by weight, and acrylic acid 2 as the second copolymerization component
A copolymer was prepared by using 40 parts by weight of hydroxypropyl and 30 parts by weight of 2-hydroxyethyl acrylate, and the addition amounts of the softening agent and the corrosion inhibitor were 15 parts by weight and 3 parts by weight, respectively. This is the same as item 1 (A).
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例１−５ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−５（Ａ）項と同様である。Comparative Example 1-5 (A) Preparation of adhesive: The same as in Example 1-5 (A) except that no corrosion inhibitor was added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例１−６ （Ａ）粘着剤の調製：第１共重合成分として３（アクリ
ルオキシ）プロピルトリメチルアンモニウムクロライド
60重量部，そして第２共重合成分としてビニルピロリド
ン25重量部および酢酸ビニル15重量部を用いて共重合体
を調製し，軟化剤および腐食防止剤の添加量をそれぞれ
55重量部および６重量部としたこと以外は実施例１−１
（Ａ）項と同様である。Examples 1-6 (A) Preparation of adhesive: 3 (acryloxy) propyltrimethylammonium chloride as first copolymerization component
A copolymer was prepared by using 60 parts by weight, and 25 parts by weight of vinylpyrrolidone and 15 parts by weight of vinyl acetate as the second copolymerization component, and the addition amounts of the softening agent and the corrosion inhibitor were respectively
Example 1-1 except that 55 parts by weight and 6 parts by weight were used.
It is the same as the item (A).
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例１−６ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例１−６（Ａ）項と同様である。Comparative Example 1-6 (A) Preparation of pressure-sensitive adhesive: The same as in Example 1-6 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−１ （Ａ）粘着剤の調製：実施例１−１（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン48重量部お
よび腐食防止剤としてクエン酸二アンモニウム５重量部
を添加して粘着剤溶液を得た。 Example 2-1 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-1 (A), and 48 parts by weight of diglycerin as a softening agent and diammonium citrate as a corrosion inhibitor were added. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。本実施例，実施例２−２〜２−３および比
較例２−１〜２−３（Ｂ）項の結果をあわせて表２(a)
に示す。実施例２−４〜２−６および比較例２−４〜２
−６（Ｂ）項の結果は表２(b)に示す。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1. The results of the present Example, Examples 2-1 to 2-3 and Comparative Examples 2-1 to 2-3 (B) are collectively shown in Table 2 (a).
Shown in. Examples 2-4-2-6 and Comparative Examples 2-4-2
The results of item -6 (B) are shown in Table 2 (b).
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｂ）項に準じて導電性を評価し
た。本実施例，実施例２−２〜２−３および比較例２−
１〜２−３（Ｃ）項の結果をあわせて表２(a)に示す。
実施例２−４〜２−６および比較例２−４〜２−６
（Ｃ）項の結果は表２(b)に示す。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (B). The present Example, Examples 2-2 to 2-3 and Comparative Example 2-
The results of the items 1-3 (C) are also shown in Table 2 (a).
Examples 2-4-2-6 and Comparative Examples 2-4-2-6
The results of item (C) are shown in Table 2 (b).
比較例２−１ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−１（Ａ）項と同様である。Comparative Example 2-1 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-1 (A) except that no corrosion inhibitor was added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−２ （Ａ）粘着剤の調製：実施例１−２（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン23重量部お
よび腐食防止剤としてクエン酸二アンモニウム４重量部
を添加して粘着剤溶液を得た。Example 2-2 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-2 (A), and 23 parts by weight of diglycerin as a softening agent and diammonium citrate 4 as a corrosion inhibitor were used. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例２−２ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−２（Ａ）項と同様である。Comparative Example 2-2 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-2 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−３ （Ａ）粘着剤の調製：実施例１−３（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン38重量部お
よび腐食防止剤としてクエン酸二アンモニウム６重量部
を添加して粘着剤溶液を得た。Example 2-3 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-3 (A), and 38 parts by weight of diglycerin was used as a softening agent and diammonium citrate 6 was used as a corrosion inhibitor. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例２−３ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−３（Ａ）項と同様である。Comparative Example 2-3 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-3 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−４ （Ａ）粘着剤の調製：実施例１−４（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン33重量部お
よび腐食防止剤としてクエン酸二アンモニウム６重量部
を添加して粘着剤溶液を得た。Example 2-4 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-4 (A), and 33 parts by weight of diglycerin was used as a softening agent and diammonium citrate 6 was used as a corrosion inhibitor. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例２−４ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−４（Ａ）項と同様である。Comparative Example 2-4 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-4 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−５ （Ａ）粘着剤の調製：実施例１−５（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン18重量部お
よび腐食防止剤としてクエン酸二アンモニウム４重量部
を添加して粘着剤溶液を得た。Example 2-5 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-5 (A), and 18 parts by weight of diglycerin as a softening agent and diammonium citrate as a corrosion inhibitor were added. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例２−５ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−５（Ａ）項と同様である。Comparative Example 2-5 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-5 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例２−６ （Ａ）粘着剤の調製：実施例１−６（Ａ）項と同様に共
重合体を調製し，軟化剤としてジグリセリン55重量部お
よび腐食防止剤としてクエン酸二アンモニウム７重量部
を添加して粘着剤溶液を得た。Example 2-6 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-6 (A), and 55 parts by weight of diglycerin was used as a softening agent and diammonium citrate 7 was used as a corrosion inhibitor. An adhesive solution was obtained by adding parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本実施例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in this Example (A), the conductivity was evaluated according to Example 1-1 (C).
比較例２−６ （Ａ）粘着剤の調製：腐食防止剤を加えなかったこと以
外は実施例２−６（Ａ）項と同様である。Comparative Example 2-6 (A) Preparation of pressure-sensitive adhesive: The same as in Example 2-6 (A) except that the corrosion inhibitor was not added.
（Ｂ）粘着剤の腐食性評価：本比較例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this comparative example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（Ｃ）導電性評価：本比較例（Ａ）項で得られた粘着剤
を用い，実施例１−１（Ｃ）項に準じて導電性を評価し
た。(C) Conductivity evaluation: Using the pressure-sensitive adhesive obtained in the item (A) of this comparative example, the conductivity was evaluated according to the item (C) of Example 1-1.
実施例３−１ （Ａ）粘着剤の調製：実施例１−１（Ａ）項と同様に共
重合体を調製し，軟化剤としてグリセリン45重量部およ
び腐食防止剤としてリン酸三アンモニウム（３水和物）
４重量部を添加して粘着剤溶液を得た。 Example 3-1 (A) Preparation of pressure-sensitive adhesive: A copolymer was prepared in the same manner as in Example 1-1 (A), and 45 parts by weight of glycerin as a softening agent and triammonium phosphate (3 Hydrate)
An adhesive solution was obtained by adding 4 parts by weight.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。その結果を表３に示す。実施例３−２〜３
−８の結果もあわせて表３に示す。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1. The results are shown in Table 3. Examples 3-2 to 3
The results of -8 are also shown in Table 3.
実施例３−２ （Ａ）粘着剤の調製：腐食防止剤としてピロリン酸ナト
リウム（10水和物）を用いたこと以外は実施例３−１
（Ａ）項と同様である。Example 3-2 (A) Preparation of adhesive: Example 3-1 except that sodium pyrophosphate (decahydrate) was used as a corrosion inhibitor.
It is the same as the item (A).
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−３ （Ａ）粘着剤の調製：腐食防止剤としてリン酸二水素カ
リウム６重量部を用いたこと以外は実施例３−１（Ａ）
項と同様である。Example 3-3 (A) Preparation of adhesive: Example 3-1 (A) except that 6 parts by weight of potassium dihydrogen phosphate was used as a corrosion inhibitor.
It is the same as the item.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−４ （Ａ）粘着剤の調製：腐食防止剤としてリン酸水素アン
モニウムナトリウム（４水和物）５重量部を用いたこと
以外は実施例３−１（Ａ）項と同様である。Example 3-4 (A) Preparation of pressure-sensitive adhesive: Same as Example 3-1 (A), except that 5 parts by weight of sodium hydrogen phosphate sodium (tetrahydrate) was used as a corrosion inhibitor. .
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−５ （Ａ）粘着剤の調製：腐食防止剤としてリン酸水素二ア
ンモニウム６重量部を用いたこと以外は実施例３−１
（Ａ）項と同様である。Example 3-5 (A) Preparation of adhesive: Example 3-1 except that 6 parts by weight of diammonium hydrogen phosphate was used as a corrosion inhibitor.
It is the same as the item (A).
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−６ （Ａ）粘着剤の調製：腐食防止剤としてクエン酸三ナト
リウム（２水和物）４重量部を用いたこと以外は実施例
３−１（Ａ）項と同様である。Example 3-6 (A) Preparation of adhesive: The same as in Example 3-1 (A) except that 4 parts by weight of trisodium citrate (dihydrate) was used as a corrosion inhibitor.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−７ （Ａ）粘着剤の調製：腐食防止剤としてクエン酸三アン
モニウム５重量部を用いたこと以外は実施例３−１
（Ａ）項と同様である。Example 3-7 (A) Preparation of adhesive: Example 3-1 except that 5 parts by weight of triammonium citrate was used as a corrosion inhibitor.
It is the same as the item (A).
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
実施例３−８ （Ａ）粘着剤の調製：腐食防止剤としてサリチル酸ナト
リウム４重量部を用いたこと以外は実施例３−１（Ａ）
項と同様である。Example 3-8 (A) Preparation of adhesive: Example 3-1 (A) except that 4 parts by weight of sodium salicylate was used as a corrosion inhibitor.
It is the same as the item.
（Ｂ）粘着剤の腐食性評価：本実施例（Ａ）項で得られ
た粘着剤を用い，実施例１−１（Ｂ）項に準じて腐食性
を評価した。(B) Evaluation of corrosiveness of adhesive: Using the adhesive obtained in the item (A) of this Example, the corrosiveness was evaluated according to the item (B) of Example 1-1.
（発明の効果） 本発明によれば，このように，導電性と粘着性とに優
れ，かつ，錫やアルミニウムなどの金属を腐食すること
のない粘着剤が得られる。このような粘着剤の層を電極
板表面に設けた本発明の粘着電極は，皮膚への粘着性に
優れ，かつ優れた導電性を有するため，例えば，心電計
などの医療用測定機器に利用すると良好な測定感度が得
られる。電極板として，錫，アルミニウムなどの導電性
に優れ，かつ比較的安価な金属を選択できるため，精度
の高い電極が安価で製造されうる。電極は長時間保存し
ても電極板が腐食を受けて導電性が変化することがな
く，かつ粘着剤自体の導電性が変化することもない。粘
着剤の皮膚刺激性もないため，電極を長時間皮膚表面に
貼付してもかぶれが生じにくい。このような粘着電極は
心電計，筋電計，脳波計，低周波治療器などの医療用電
気機器に広く利用され得る。 (Effects of the Invention) According to the present invention, as described above, a pressure-sensitive adhesive having excellent conductivity and adhesiveness and not corroding metals such as tin and aluminum can be obtained. The adhesive electrode of the present invention in which such an adhesive layer is provided on the surface of the electrode plate is excellent in adhesiveness to the skin and has excellent conductivity, and thus is suitable for medical measuring instruments such as an electrocardiograph. When used, good measurement sensitivity can be obtained. As the electrode plate, a metal such as tin or aluminum, which has excellent conductivity and which is relatively inexpensive, can be selected, so that a highly accurate electrode can be manufactured at low cost. Even if the electrode is stored for a long time, the conductivity of the electrode plate does not change due to corrosion of the electrode plate, and the conductivity of the adhesive itself does not change. Since the adhesive does not irritate the skin, rash does not easily occur even if the electrode is applied to the skin surface for a long time. Such an adhesive electrode can be widely used in medical electrical devices such as an electrocardiograph, an electromyography, an electroencephalograph, and a low-frequency therapeutic device.
第１図および第２図はそれぞれ本発明の医療用粘着電極
の一例を示す平面図および側面図，第３図は粘着電極の
使用状態を示す説明図，そして第４図および第５図はそ
れぞれ本発明の医療用粘着電極の他の例を示す平面図お
よび側面図である。 １，２……粘着電極，11,21……電極板，12,22……粘着
剤層，110,210……突起部。1 and 2 are respectively a plan view and a side view showing an example of the medical adhesive electrode of the present invention, FIG. 3 is an explanatory view showing a usage state of the adhesive electrode, and FIGS. 4 and 5 are respectively. It is a top view and a side view showing other examples of the medical adhesion electrode of the present invention. 1,2 ... Adhesive electrodes, 11,21 ... Electrode plates, 12,22 ... Adhesive layer, 110,210 ... Protrusions.
Claims (6)
化剤；および (c)リン酸アルカリ金属塩，リン酸アンモニウム塩，ピ
ロリン酸アルカリ金属塩，ピロリン酸アンモニウム塩，
サリチル酸アルカリ金属塩，サリチル酸アンモニウム
塩，クエン酸アルカリ金属塩，クエン酸アンモニウム塩
および上記塩の複塩でなる群から選択される少なくとも
一種の腐食防止剤を含有する， 医療用導電性粘着剤。1. A polymer having (a) a substituted ammonio group; (b) a softening agent comprising glycerin and / or diglycerin; and (c) an alkali metal phosphate, an ammonium phosphate, an alkali pyrophosphate, Ammonium pyrophosphate,
A medical conductive adhesive containing at least one corrosion inhibitor selected from the group consisting of alkali metal salicylates, ammonium salicylates, alkali metal citrates, ammonium citrates and double salts of the above salts.
基とアミド結合により結合した化学構造の（メタ）アク
リルアミド誘導体，および／もしくは 置換アンモニオ基を有する基が（メタ）アクリルオキシ
基とエステル結合により結合した化学構造の（メタ）ア
クリル酸エステル誘導体， を共重合成分とする共重合体である特許請求の範囲第１
項に記載の粘着剤。2. A (meth) acrylamide derivative having a chemical structure in which a group having a substituted ammonio group is bonded to a (meth) acrylamide group by an amide bond, and / or a group having a substituted ammonio group is (meth) acryloxy. A copolymer having a (meth) acrylic acid ester derivative having a chemical structure in which a group and an ester bond are combined, as a copolymerization component.
The adhesive according to item.
剤が10〜90重量部の割合で，そして前記腐食防止剤が１
〜30重量部の割合で含有される特許請求の範囲第１項に
記載の粘着剤。3. The ratio of the softening agent is 10 to 90 parts by weight to 100 parts by weight of the polymer, and the corrosion inhibitor is 1 part by weight.
The pressure-sensitive adhesive according to claim 1, wherein the pressure-sensitive adhesive is contained in a proportion of -30 parts by weight.
に設けられた医療用粘着電極であって， 該粘着剤は， (a)置換アンモニオ基を有するポリマー； (b)グリセリンおよび／もしくはジグリセリンでなる軟
化剤；および (c)リン酸アルカリ金属塩，リン酸アンモニウム塩，ピ
ロリン酸アルカリ金属塩，ピロリン酸アンモニウム塩，
サリチル酸アルカリ金属塩，サリチル酸アンモニウム
塩，クエン酸アルカリ金属塩，クエン酸アンモニウム塩
および上記塩の複塩でなる群から選択される少なくとも
一種の腐食防止剤を含有する， 医療用粘着電極。4. A medical adhesive electrode in which a conductive adhesive layer is provided on at least a part of an electrode plate, wherein the adhesive comprises (a) a polymer having a substituted ammonio group; (b) glycerin and / or Or a softening agent composed of diglycerin; and (c) alkali metal phosphate, ammonium phosphate, alkali metal pyrophosphate, ammonium pyrophosphate,
An adhesive electrode for medical use, containing at least one corrosion inhibitor selected from the group consisting of alkali metal salicylates, ammonium salicylates, alkali metal citrates, ammonium citrates and double salts of the above salts.
基とアミド結合により結合した化学構造の（メタ）アク
リルアミド誘導体，および／もしくは 置換アンモニオ基を有する基が（メタ）アクリルオキシ
基とエステル結合により結合した化学構造の（メタ）ア
クリル酸エステル誘導体， を共重合成分とする共重合体である特許請求の範囲第４
項に記載の医療用粘着電極。5. A (meth) acrylamide derivative having a chemical structure in which a group having a substituted ammonio group is bonded to a (meth) acrylamide group by an amide bond, and / or a group having a substituted ammonio group is (meth) acryloxy. 5. A copolymer comprising a (meth) acrylic acid ester derivative having a chemical structure bonded to a group by an ester bond, as a copolymerization component.
The medical adhesive electrode according to the item.
対して前記軟化剤を10〜90重量部の割合で，そして前記
腐食防止剤を１〜30重量部の割合で含有する特許請求の
範囲第４項に記載の医療用粘着電極。6. The adhesive contains 10 to 90 parts by weight of the softening agent and 1 to 30 parts by weight of the corrosion inhibitor with respect to 100 parts by weight of the polymer. The medical adhesive electrode according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60274154A JPH0618557B2 (en) | 1985-12-05 | 1985-12-05 | Medical conductive adhesive and medical adhesive electrode using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60274154A JPH0618557B2 (en) | 1985-12-05 | 1985-12-05 | Medical conductive adhesive and medical adhesive electrode using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133935A JPS62133935A (en) | 1987-06-17 |
| JPH0618557B2 true JPH0618557B2 (en) | 1994-03-16 |
Family
ID=17537779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60274154A Expired - Lifetime JPH0618557B2 (en) | 1985-12-05 | 1985-12-05 | Medical conductive adhesive and medical adhesive electrode using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618557B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2541029Y2 (en) * | 1990-01-31 | 1997-07-09 | オムロン株式会社 | Electrode structure of low frequency treatment device |
| JPH069614B2 (en) * | 1990-03-31 | 1994-02-09 | 日本光電工業株式会社 | Cardiac stimulation electrode |
| JP5984371B2 (en) * | 2011-12-09 | 2016-09-06 | 日本ビニールコード株式会社 | Biometric electrode |
-
1985
- 1985-12-05 JP JP60274154A patent/JPH0618557B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62133935A (en) | 1987-06-17 |
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