JPH0615304U - Dielectric resonance component - Google Patents

Abstract

(57) [Summary] [Objective] To provide an inexpensive and excellent dielectric resonant component. Structure: Input / output electrodes 21a and 22a are formed on an upper surface of a dielectric substrate 2 on which a resonator block 1 having a plurality of stages of dielectric resonators is mounted. Similarly, input / output electrodes are also formed on the lower surface of the dielectric substrate 2. The input / output electrodes formed on the upper surface and the lower surface of the dielectric substrate 2 are connected to each other through through holes 25 and 26. As a result, the input / output electrodes are not exposed on the sides of the dielectric substrate 2. Therefore, it is not necessary to apply a resist to the side surface of the dielectric substrate 2 when manufacturing the dielectric filter, and the number of manufacturing steps is reduced. As a result, the cost of the product is low. Further, the electromagnetic field leakage to the outside is reduced, and the influence from the outside becomes less likely.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a dielectric resonance component, and more particularly to a resonance component such as a dielectric filter configured by coupling a plurality of stages of dielectric resonators.

[0002]

[Prior art]

 FIG. 6 is an exploded perspective view showing an example of the configuration of a conventional dielectric filter used in a mobile communication device such as a car phone or a mobile phone. In FIG. 6, the resonator block 1 includes a dielectric block 10 in which resonator holes H1 to H3 are formed. An inner conductor as a resonance electrode is formed on the inner wall of each resonator hole H1 to H3. An outer conductor 11 as a ground electrode is formed on the outer peripheral surface of the dielectric block 10. The inner conductor formed on the inner wall of each resonator hole H1 to H3 cooperates with the outer conductor 11 to form a three-stage dielectric resonator.

The resonator block 1 is mounted on the dielectric substrate 2 and fixed by solder, conductive paste or the like. Input / output electrodes 21 are formed on the upper surface, side surfaces, and lower surface of the dielectric substrate 2 in the vicinity of the left end thereof. Input / output electrodes 22 are formed on the upper surface, side surfaces, and lower surface of the dielectric substrate 2 in the vicinity of the right end thereof. These input / output electrodes 21 and 22 are capacitively coupled to adjacent dielectric resonators in the resonator block 1, and input / output signals between the dielectric resonators and an external circuit (not shown). A ground electrode 23 is formed on the upper surface edge, side surface and lower surface of the dielectric substrate 2. The ground electrode 23 is connected to the outer conductor 11 of the resonator block 1. The input / output electrodes 21 and 22 are electrically insulated from the ground electrode 23 via the insulating space 24. Further, the outer conductor 11 of the resonator block 1 and the input / output electrodes 21, 22 of the dielectric substrate 2 are also electrically insulated via the insulating space 12.

[0004]

SUMMARY OF THE INVENTION As described above, the conventional dielectric filter has an electrical connection between the outer conductor 11 and the input / output electrodes 21, 22 and between the input / output electrodes 21, 22 and the ground electrode 23. Insulating spaces 12 and 24 must be provided on each side of the resonator block 1 and the dielectric substrate 2 for effective insulation. Conventionally, as a method for providing such insulating spaces 12 and 24, (1) after forming each electrode on the dielectric block 10 and the dielectric substrate 2, a part of the electrode corresponding to the insulating space is formed by a router or the like. Or (2) a method in which resist is applied to a portion corresponding to the insulating space on each side surface of the dielectric block 10 and the dielectric substrate 2 and then plating is performed, and then the metal of the resist portion is peeled off. was there.

However, in any of the above methods (1) and (2), there is a problem that the work takes time and the cost of the product increases.

Further, in the conventional dielectric filter, since the input / output electrodes 21 and 22 are exposed on the side surfaces, if the metal piece is close to the input / output electrodes 21 and 22 after mounting on the external circuit, There was also a problem that the characteristics were adversely affected.

Therefore, an object of the present invention is to provide an inexpensive and good dielectric resonant component.

[0008]

[Means for Solving the Problems]

 The invention according to claim 1 is a dielectric resonance component configured by coupling a plurality of stages of dielectric resonators, wherein the resonator block has a plurality of stages of dielectric resonators. A dielectric substrate having a main surface, on which a resonator block is mounted on the first main surface, and formed on both the first and second main surfaces of the dielectric substrate and connected to each other via through holes. Input / output electrodes.

[0009]

[Action]

 In the invention according to claim 1, the input / output electrode formed on the first main surface of the dielectric substrate and the input / output electrode formed on the second main surface are connected via a through hole. . Therefore, the input / output electrodes are not exposed on the side surface of the dielectric substrate. Therefore, it is not necessary to grind the side surface of the dielectric substrate with a router as in the conventional dielectric filter, and it is not necessary to apply a resist to the side surface. As a result, the number of manufacturing processes is reduced and the cost of the product is reduced. Further, when the dielectric resonant component is mounted on the external circuit, the input / output electrodes are less likely to be affected by the outside, so that the characteristic of the dielectric resonant component is improved.

[0010]

【Example】

 FIG. 1 is an exploded perspective view of a dielectric filter according to an embodiment of the present invention, which is viewed obliquely from above. FIG. 2 is an exploded perspective view of the dielectric filter according to the embodiment of the present invention as seen obliquely from below. 1 and 2, the insulating space 12 as shown in FIG. 6 is not provided on the left and right side surfaces of the resonator block 1. Input / output electrodes 21a and 22a are formed on the upper surface of the dielectric substrate 2. Input / output electrodes 21b and 22b are formed on the lower surface of the dielectric substrate 2. Each input / output electrode is electrically insulated from the ground electrode 23. The input / output electrodes 21a and 21b are connected to each other through a through hole 25. The input / output electrodes 22a and 22b are connected to each other through a through hole 26. No insulating spaces 24 as shown in FIG. 6 are provided on the left and right side surfaces of the dielectric substrate 2.

The resonator block 1 shown in FIGS. 1 and 2 is mounted on the upper surface of the dielectric substrate 2 similarly shown in FIGS. 1 and 2 and fixed by solder or conductive paste. At this time, the input / output electrodes 21a and 22a are capacitively coupled to the adjacent dielectric resonators in the resonator block 1, respectively. Therefore, signals are input / output between the dielectric resonator and an external circuit (not shown) through the through holes 25, 26 and the input / output electrodes 21b, 22b. The other configurations of the dielectric filter shown in FIGS. 1 and 2 are the same as the configuration of the conventional dielectric filter shown in FIG. 6, and the corresponding portions are designated by the same reference numerals and the description thereof will be omitted. .

Next, a method of manufacturing the dielectric substrate 2 shown in FIGS. 1 and 2 will be described. First, the dielectric substrate 2 in which the electrodes are not formed and the through holes 25 and 26 are formed is prepared. Next, the upper surface of dielectric substrate 2 (the surface on which resonator block 1 is mounted) is polished, and then resist is applied to predetermined regions on the upper and lower surfaces of dielectric substrate 2. Subsequently, electrodes such as copper are formed on the entire six surfaces (top surface, bottom surface, front surface, back surface, right side surface, left side surface) of the dielectric substrate 2 by plating or the like. Next, the resist is removed, and as a result, the electrode in the portion where the resist is formed is removed. As a result, the ground electrode pattern 23 having the shape as shown in FIGS. 1 and 2 is left on each surface of the dielectric substrate 2.

Next, a method of manufacturing the resonator block 1 shown in FIGS. 1 and 2 will be described. First, the dielectric block 10 in which the electrodes are not formed and the resonator holes H1 to H3 are formed is prepared. Next, after the lower surface of dielectric block 10 (the surface to be mounted on dielectric substrate 2) is polished, a resist is applied to a predetermined region of the lower surface. Then, electrodes such as copper are formed by plating or the like on all six surfaces (top surface, bottom surface, front surface, back surface, right side surface, left side surface) of the dielectric block 10. Next, the resist is removed, and as a result, the electrode in the portion where the resist is formed is removed. As a result, the resonator block 1 as shown in FIGS. 1 and 2 is obtained.

As described above, in the embodiment shown in FIGS. 1 to 5, it is not necessary to grind each side surface of the dielectric block 10 and the dielectric substrate 2 with a router to form an insulating space, and Since it is not necessary to apply a resist on the substrate, the number of manufacturing steps is smaller than that of the conventional dielectric filter shown in FIG. As a result, the cost of the product can be reduced. Further, since the input / output electrodes are not exposed on the side surface of the dielectric substrate 2, the characteristics are not affected even when the metal pieces are close to each other during mounting. Therefore, better characteristics can be expected compared to conventional dielectric filters. Further, the electromagnetic field leakage is reduced, and the surrounding external circuits are not adversely affected.

FIG. 3 is an exploded perspective view of a dielectric filter according to another embodiment of the present invention, which is viewed obliquely from above. In FIG. 3, the dielectric substrate 20 is formed slightly wider than the resonator block 1. Therefore, when the resonator block 1 is mounted on the upper surface of the dielectric substrate 20, the portion where the ground electrode 23 is formed on the upper surface of the dielectric substrate 20 protrudes from the dielectric substrate 20 to the outside. As shown in FIG. 4, the outer conductor 11 of the resonator block 1 and the ground electrode 23 of the dielectric substrate 20 are connected to each other by utilizing the protruding portion on the upper surface of the dielectric substrate 20. That is, an adhesive member 27 such as solder or conductive paste is applied to the protruding portion of the upper surface of the dielectric substrate 20 to connect the outer conductor 11 of the resonator block 1 and the ground electrode 23 of the dielectric substrate 20.

In the dielectric filter of the embodiment shown in FIG. 3, since it is not necessary to connect the outer conductor 11 and the ground electrode 23 on the lower surface of the resonator block 1, the outer conductor is formed on the lower surface of the resonator block 1. It is not necessary to provide 11. Therefore, it is not necessary to apply a resist to the lower surface of the dielectric block 10 when manufacturing the resonator block 1, and the number of manufacturing steps is further reduced as compared with the embodiment shown in FIGS. 1 and 2.

FIG. 5 is an exploded perspective view of a dielectric filter according to still another embodiment of the present invention, which is viewed obliquely from below. In FIG. 5, a step 13 is formed at the front end of the lower surface of the dielectric block 10. The dielectric substrate 200 is selected to have a shape that fits the step 13. The dielectric substrate 200 is mounted and fixed on the step 13. As a result, the outer conductor 11 and the ground electrode 23 are connected. The other structure of the embodiment shown in FIG. 5 is the same as that of the embodiment shown in FIGS. 1 and 2, and corresponding parts are designated by the same reference numerals and the description thereof is omitted.

It should be noted that the dielectric filters of the respective embodiments described above are provided with three-stage dielectric resonators, but the present invention is not limited to such a configuration, and is provided with other stages. May be configured as a dielectric filter. Further, the present invention is applicable not only to the dielectric filter but also to other dielectric resonance parts (a part of the oscillator, etc.).

[0019]

[Effect of device]

 As described above, according to the present invention, the input / output electrodes formed on the first main surface of the dielectric substrate and the input / output electrodes formed on the second main surface are connected through the through holes. Therefore, the input / output electrodes are not exposed on the side surface of the dielectric substrate. Therefore, it is not necessary to grind the side surface of the dielectric substrate with a router as in the conventional dielectric filter, and it is not necessary to apply a resist to the side surface. As a result, the number of manufacturing processes is reduced and the cost of the product is reduced. Further, when the dielectric resonant component is mounted on the external circuit, the input / output electrodes are less likely to be affected by the outside, so that the characteristic of the dielectric resonant component is improved. Further, the electromagnetic field leakage from the side surface of the dielectric substrate is reduced, and the influence on the neighboring external circuits is also reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a dielectric filter according to an embodiment of the present invention, which is viewed obliquely from above.

FIG. 2 is an exploded perspective view of a dielectric filter according to an embodiment of the present invention as seen from obliquely below.

FIG. 3 is an exploded perspective view of a dielectric filter according to another embodiment of the present invention, which is viewed obliquely from above.

FIG. 4 is a partial cross-sectional view showing a connection structure between a resonator block and a dielectric substrate in the dielectric filter shown in FIG.

FIG. 5 is an exploded perspective view of a dielectric filter according to still another embodiment of the present invention, as viewed from diagonally below.

FIG. 6 is an exploded perspective view of a conventional dielectric filter when viewed obliquely from above.

[Explanation of symbols]

1: Resonator block 10: Dielectric blocks H1 to H
3: Resonator hole 11: Outer conductors 2, 20, 200: Dielectric substrates 21a, 21b, 22a, 22b: Input / output electrodes 23: Ground electrodes 25, 26: Through holes

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Hisashi Mohri 2-26-10 Tenjin Tenjin, Nagaokakyo City, Kyoto Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A dielectric resonance component configured by coupling a plurality of stages of dielectric resonators, comprising: a resonator block having a plurality of stages of dielectric resonators; and a first and a second main surface. Then, it is formed on both the dielectric substrate on which the resonator block is mounted on the first main surface and the first and second main surfaces of the dielectric substrate, and they are connected to each other via through holes. A dielectric resonance component having input / output electrodes.