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JPH06140453A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPH06140453A
JPH06140453A JP4154879A JP15487992A JPH06140453A JP H06140453 A JPH06140453 A JP H06140453A JP 4154879 A JP4154879 A JP 4154879A JP 15487992 A JP15487992 A JP 15487992A JP H06140453 A JPH06140453 A JP H06140453A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding
heads
bond
bonds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4154879A
Other languages
Japanese (ja)
Inventor
Tetsuya Onuma
哲也 大沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP4154879A priority Critical patent/JPH06140453A/en
Publication of JPH06140453A publication Critical patent/JPH06140453A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To immediately specify an objective head for wire bonding when a quality trouble occurs due to wire bonding by bonding first bonds to leads and second bonds to a pellet during the course of a specific wring bonding process. CONSTITUTION:This method is used at the time of performing bonding work in a facility or on a manufacturing line equipped with a plurality of heads 29 and 30 for wiring bonding. The heads 29 and 30 are respectively used for bonding ball bonds which are first bonds to leads 11-18 and wedge bonds which are second bonds to a semiconductor pellet 2 during the source of a specific wring bonding process among a plurality of wire boding processes against one semiconductor device so that the heads 29 and 30 can be correlated with the semiconductor device manufactured by using the heads 29 and 30.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はワイヤーボンディング方
法に関する。FIELD OF THE INVENTION The present invention relates to a wire bonding method.

【０００２】[0002]

【従来の技術】従来のワイヤーボンディング方法につい
て図２を用いて説明する。図２（ｃ）は複数のワイヤー
ボンディング用ヘッドを有する設備のブロック図であ
り、図２（ａ），（ｂ）はそれぞれ図２（ｃ）のＮＯ．
１ボンディング用ヘッド２９及びＮＯ．２ボンディング
用ヘッド３０に対応するボンディング図である。2. Description of the Related Art A conventional wire bonding method will be described with reference to FIG. 2C is a block diagram of equipment having a plurality of wire bonding heads, and FIGS. 2A and 2B are NO.
1 bonding head 29 and NO. 2 is a bonding diagram corresponding to the two-bonding head 30. FIG.

【０００３】マウントアイランド１上の半導体素子２の
電極３〜１０とそれぞれに対応するリード１１〜１８と
をワイヤー１９〜２６で接続している。The electrodes 3 to 10 of the semiconductor element 2 on the mount island 1 and the corresponding leads 11 to 18 are connected by wires 19 to 26.

【０００４】図２（ａ），（ｂ），（ｃ）に示すよう
に、従来のワイヤーボンディング方法では、複数のボン
ディング用ヘッドを有する設備においても、各ボンディ
ング用ヘッドがそれぞれ同じように、第１ボンドである
ボールボンドをペレット側に、第２ボンドであるウェッ
ジボンドをリード側にするというボンディングを行って
いた。As shown in FIGS. 2 (a), 2 (b) and 2 (c), in the conventional wire bonding method, even in equipment having a plurality of bonding heads, each bonding head has the same structure. Bonding has been performed in which the ball bond, which is one bond, is on the pellet side, and the wedge bond, which is the second bond, is on the lead side.

【０００５】[0005]

【発明が解決しようとする課題】この従来のワイヤーボ
ンディング方法では、半導体装置製造の合理化に伴い、
今後さらに増加する複数のワイヤーボンディング用ヘッ
ドを有する製造ラインあるいは設備において、ワイヤー
ボンディングに起因する品質事故が発生した場合、半導
体装置とのその半導体装置を製造したワイヤーボンディ
ング用ヘッドとの対応がつかない為、その調査に莫大な
労力と時間を費やするという大きな問題点があった。In this conventional wire bonding method, the semiconductor device manufacturing is rationalized,
In a production line or equipment having a plurality of wire bonding heads, which will further increase in the future, when a quality accident occurs due to wire bonding, the semiconductor device and the wire bonding head that manufactured the semiconductor device cannot correspond to each other. Therefore, there was a big problem that a huge amount of labor and time were spent on the investigation.

【０００６】[0006]

【課題を解決するための手段】本発明のワイヤーボンデ
ィング方法は複数のワイヤーボンディング用ヘッドを有
する製造ラインあるいは設備に於いて、半導体装置とそ
の半導体装置を製造したワイヤーボンディング用ヘッド
との対応を可能にするワイヤーボンディング方法を提供
するものである。According to the wire bonding method of the present invention, in a manufacturing line or equipment having a plurality of wire bonding heads, a semiconductor device and a wire bonding head that manufactures the semiconductor device can be handled. The present invention provides a wire bonding method.

【０００７】すなわち、通常のワイヤーボンディング方
法では、第１ボンドであるボールボンドをペレット側
に、第２ボンドであるウェッジボンドをリード側に行う
ことによりワイヤーリングを完成するが、本発明では複
数のワイヤーボンディング用ヘッドそれぞれの特定のワ
イヤーボンディングに関して、逆ボンディング、つまり
第１ボンドであるボールボンドをリード側に第２ボンド
であるウェッジボンドをペレット側にするというワイヤ
ーボンディング方法である。That is, in the ordinary wire bonding method, the wire bonding is completed by performing the ball bond as the first bond on the pellet side and the wedge bond as the second bond on the lead side. Regarding specific wire bonding of each wire bonding head, it is a reverse bonding, that is, a wire bonding method in which a ball bond which is a first bond is a lead side and a wedge bond which is a second bond is a pellet side.

【０００８】[0008]

【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.

【０００９】図１（ａ），（ｂ）は本発明の一実施例の
ワイヤーボンディング方法のボンディング図であり、図
１（ｃ）はそれに対応する複数のワイヤーボンディング
用ヘッドを有する設備のブロック図である。1A and 1B are bonding diagrams of a wire bonding method according to an embodiment of the present invention, and FIG. 1C is a block diagram of equipment having a plurality of wire bonding heads corresponding thereto. Is.

【００１０】図１（ａ）は図１（ｃ）のＮＯ．１ワイヤ
ーボンディング用ヘッド２９に対応するボンディング図
であり、マウントアイランド１上の半導体素子２の電極
３〜１０が、それぞれに対応するリード１１〜１８に、
ワイヤー１９〜２６を介して接続されている。そのなか
で電極３とリード１１のワイヤーボンディングに関して
のみ第１ボンドであるボールボンドをリード側に第２ボ
ンドであるウェッジボンドをペレット側にすることによ
り外観上でＮＯ．１ボンディング用ヘッド２９との対応
が可能となる。FIG. 1 (a) shows the NO. FIG. 11 is a bonding diagram corresponding to the 1-wire bonding head 29, in which the electrodes 3 to 10 of the semiconductor element 2 on the mount island 1 are connected to the leads 11 to 18 respectively corresponding thereto.
It is connected via wires 19 to 26. Among them, only with respect to wire bonding between the electrode 3 and the lead 11, the ball bond, which is the first bond, is set to the lead side, and the wedge bond, which is the second bond, is set to the pellet side. It is possible to correspond to one bonding head 29.

【００１１】また図１（ｂ）は図１（ｃ）のＮＯ．２ワ
イヤーボンディング用ヘッド３０に対応するボンディン
グ図であり、そのなかで電極４とリード１２のワイヤー
ボンディングに関してのみ、第１ボンドであるボールボ
ンドをリード側に第２ボンドであるウェッジボンドをペ
レット側にすることにより、外観上でＮＯ．２ワイヤー
ボンディング用ヘッド３０との対応が可能となる。Further, FIG. 1 (b) shows the NO. FIG. 6 is a bonding diagram corresponding to the two-wire bonding head 30, in which only the wire bonding of the electrode 4 and the lead 12 is such that the ball bond as the first bond is on the lead side and the wedge bond as the second bond is on the pellet side. By doing so, the appearance is NO. Correspondence with the two-wire bonding head 30 is possible.

【００１２】なお、本実施例では複数のワイヤーボンデ
ィング用ヘッドを有する設備について説明したが、複数
のボンダー組込んだ製造ラインについても同様である。Although the equipment having a plurality of wire bonding heads has been described in the present embodiment, the same applies to a manufacturing line incorporating a plurality of bonders.

【００１３】[0013]

【発明の効果】以上説明したように本発明は、複数のワ
イヤーボンディング用ヘッドを有する設備に於いて、そ
れぞれのボンダーに対応した特定のワイヤーに関し、第
１ボンドでありボールボンドをリード側に第２ボンドで
あるウェッジボンドをペレット側にボンディングするこ
とにより、半導体装置とその半導体装置を製造したワイ
ヤーボンディング用ヘッドとの対応が可能となり、ワイ
ヤーボンディングに起因する品質事故が発生した場合、
その対象ワイヤーボンディング用ヘッドを直に特定する
ことが出来るという効果を有する。As described above, the present invention relates to a specific wire corresponding to each bonder in a facility having a plurality of wire bonding heads, and the first bond is the ball bond on the lead side. By bonding a wedge bond, which is two bonds, to the pellet side, it becomes possible to deal with the semiconductor device and the wire bonding head that manufactured the semiconductor device, and when a quality accident due to wire bonding occurs,
The effect is that the target wire bonding head can be directly specified.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例のワイヤーボンディング方法
によるボンディング図とそれに対応する複数のワイヤー
ボンディング用ヘッドを有する設備のブロック図。FIG. 1 is a bonding diagram of a wire bonding method according to an embodiment of the present invention and a block diagram of equipment having a plurality of wire bonding heads corresponding to the bonding diagram.

【図２】従来のワイヤーボンディング方法によるボンデ
ィング図とそれに対応する複数のワイヤーボンディング
用ヘッドを有する設備のブロック図。FIG. 2 is a block diagram of a bonding diagram according to a conventional wire bonding method and a facility having a plurality of wire bonding heads corresponding thereto.

【符号の説明】[Explanation of symbols]

１ マウントアイランド ２ 半導体素子 ３〜１０ 電極 １１〜１８ リード １９〜２６ ワイヤー ２７ マウンター ２８ キュア装置 ２９ ＮＯ．１ワイヤーボンディング用ヘッド ３０ ＮＯ．２ワイヤーボンディング用ヘッド ３１ 封入機 1 mount island 2 semiconductor element 3 to 10 electrode 11 to 18 lead 19 to 26 wire 27 mounter 28 cure device 29 NO. 1 wire bonding head 30 NO. 2 Wire bonding head 31 encapsulation machine

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 複数のワイヤーボンディング用ヘッドを
有する設備あるいは製造ラインでワイヤーボンディング
を行う方法において、前記複数のワイヤーボンディング
用ヘッドのそれぞれは、一個の半導体装置の複数のワイ
ヤーボンディングのうち特定のワイヤーボンディングに
おいて第１ボンドであるボールボンドをリード側に第２
ボンドであるウエッジボンドを半導体ペレット側に行う
ようにし、これにより半導体装置とその半導体装置を製
造したワイヤーボンディング用ヘッドとの対応を可能に
したことを特徴とするワイヤーボンディング方法。1. A method of performing wire bonding in an equipment or a production line having a plurality of wire bonding heads, wherein each of the plurality of wire bonding heads is a specific wire among a plurality of wire bondings of one semiconductor device. In bonding, the ball bond, which is the first bond, is secondly bonded to the lead side.
A wire bonding method characterized in that a wedge bond, which is a bond, is formed on the side of the semiconductor pellet, thereby enabling correspondence between the semiconductor device and the wire bonding head that manufactured the semiconductor device.
JP4154879A 1992-06-15 1992-06-15 Wire bonding method Withdrawn JPH06140453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4154879A JPH06140453A (en) 1992-06-15 1992-06-15 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4154879A JPH06140453A (en) 1992-06-15 1992-06-15 Wire bonding method

Publications (1)

Publication Number Publication Date
JPH06140453A true JPH06140453A (en) 1994-05-20

Family

ID=15593947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4154879A Withdrawn JPH06140453A (en) 1992-06-15 1992-06-15 Wire bonding method

Country Status (1)

Country Link
JP (1) JPH06140453A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718794A1 (en) * 1994-04-16 1995-10-20 Stihl Andreas Starting aid device on a membrane carburettor.
US6112972A (en) * 1996-12-19 2000-09-05 Texas Instruments Incorporated Wire bonding with capillary realignment
US11408382B2 (en) 2017-03-27 2022-08-09 Kohler Co. Carburetor drain

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718794A1 (en) * 1994-04-16 1995-10-20 Stihl Andreas Starting aid device on a membrane carburettor.
US6112972A (en) * 1996-12-19 2000-09-05 Texas Instruments Incorporated Wire bonding with capillary realignment
US11408382B2 (en) 2017-03-27 2022-08-09 Kohler Co. Carburetor drain
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