JPH06144986A - Apparatus and method for production of semiconductor single crystal - Google Patents
Apparatus and method for production of semiconductor single crystalInfo
- Publication number
- JPH06144986A JPH06144986A JP32125292A JP32125292A JPH06144986A JP H06144986 A JPH06144986 A JP H06144986A JP 32125292 A JP32125292 A JP 32125292A JP 32125292 A JP32125292 A JP 32125292A JP H06144986 A JPH06144986 A JP H06144986A
- Authority
- JP
- Japan
- Prior art keywords
- screen
- single crystal
- raw material
- lower screen
- crucible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、引き上げ単結晶の周囲
を取り囲み、下端が融液面に近接するように配設した輻
射スクリーンを有する半導体単結晶製造装置および前記
製造装置を用いる場合の半導体単結晶製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor single crystal production apparatus having a radiation screen which surrounds a pulled single crystal and is arranged so that its lower end is close to the melt surface, and a semiconductor using the production apparatus. The present invention relates to a single crystal manufacturing method.
【0002】[0002]
【従来の技術】半導体集積回路の基本材料であるシリコ
ン単結晶の製造方法の一つとして、るつぼ内の原料融液
から円柱状の単結晶を引き上げるチョクラルスキー法
(以下CZ法という)が用いられている。CZ法におい
ては、単結晶製造装置のチャンバ内に設置したるつぼに
原料である多結晶を充填し、前記るつぼの外周に設けた
ヒータによって原料を加熱溶解した上、シードチャック
に取り付けた種子結晶を融液に浸漬し、シードチャック
およびるつぼを同方向または逆方向に回転しつつシード
チャックを引き上げて単結晶を成長させる。このような
単結晶製造装置において、単結晶の引き上げ速度を早め
るとともに不純物による汚染を防止して単結晶の無転位
化を向上させる手段として、単結晶引き上げ領域の周囲
に輻射スクリーンを配設することが知られている。前記
輻射スクリーンは単結晶引き上げ領域を取り巻く熱遮蔽
体で、一般に下端開口部の直径が上端開口部の直径より
小さい円錐状の筒である。輻射スクリーンは融液、ヒー
タ、るつぼ等から単結晶に加えられる輻射熱を遮断して
単結晶の冷却を促進し、単結晶の引き上げ速度を早める
とともに、チャンバ上方から導入される不活性ガスを引
き上げ単結晶の周囲に誘導し、るつぼ中心部から周縁部
を経てチャンバ下方に至るガス流を形成させることによ
って、融液から発生する酸化珪素や黒鉛るつぼから発生
する金属蒸気等、単結晶化を阻害するガスを排除する機
能を備えている。2. Description of the Related Art The Czochralski method (hereinafter referred to as the CZ method) for pulling a cylindrical single crystal from a raw material melt in a crucible is used as one of methods for producing a silicon single crystal which is a basic material of a semiconductor integrated circuit. Has been. In the CZ method, a crucible installed in a chamber of a single crystal manufacturing apparatus is filled with a polycrystal as a raw material, the raw material is heated and melted by a heater provided on the outer circumference of the crucible, and then a seed crystal attached to a seed chuck is attached. A single crystal is grown by immersing in the melt and pulling up the seed chuck while rotating the seed chuck and the crucible in the same or opposite directions. In such a single crystal manufacturing apparatus, a radiation screen is arranged around the single crystal pulling region as a means for increasing the pulling speed of the single crystal and preventing contamination by impurities to improve dislocation-free single crystal. It has been known. The radiation screen is a heat shield surrounding the single crystal pulling region, and is generally a conical cylinder having a lower end opening diameter smaller than an upper end opening diameter. The radiant screen shuts off the radiant heat applied to the single crystal from the melt, heater, crucible, etc. to accelerate the cooling of the single crystal, accelerate the pulling rate of the single crystal, and pull up the inert gas introduced from above the chamber. By inducing around the crystal and forming a gas flow from the center of the crucible to the lower part of the chamber through the peripheral edge, it inhibits single crystallization, such as silicon oxide generated from the melt or metal vapor generated from the graphite crucible. It has the function of eliminating gas.
【0003】しかし、輻射スクリーンをるつぼの上方に
固定したままでは石英るつぼ内に単結晶原料を充填する
際、前記輻射スクリーンが邪魔になるため、輻射スクリ
ーンを配設しない場合に比べて原料の充填量が少なくな
ってしまう。そのため単結晶の生産性が低下し、生産コ
ストの上昇を招く。また、輻射スクリーンの下端と融液
面との距離の大小により、単結晶中の酸素濃度が大きく
変化することが知られている。この問題を解決する技術
の一例として、上下方向に螺進退可能な懸吊材をチャン
バ上板に設け、前記懸吊材によって輻射スクリーンをチ
ャンバ内に釣支したものが特開平3−279290号公
報に開示されている。この技術により、原料の充填およ
び溶解時には輻射スクリーンをチャンバ内の上方に退避
させることができるので、原料の充填量を減らさないで
済む。また、原料の溶解完了後は単結晶引き上げ領域の
周囲に輻射スクリーンを下降させ、融液面と輻射スクリ
ーン下端との距離を任意に調整することができる。従っ
て、単結晶中の酸素濃度のばらつきを抑えることができ
る。However, when the radiant screen is fixed above the crucible, the radiant screen becomes an obstacle when the quartz crystal crucible is filled with the single crystal raw material. Therefore, the raw material is filled more than when the radiant screen is not provided. The quantity will decrease. Therefore, the productivity of the single crystal is lowered and the production cost is increased. It is also known that the oxygen concentration in the single crystal changes greatly depending on the size of the distance between the lower end of the radiation screen and the melt surface. As an example of a technique for solving this problem, a suspension member which is capable of being screwed back and forth in the vertical direction is provided on a chamber upper plate, and a radiation screen is supported in the chamber by the suspension member, as disclosed in Japanese Patent Laid-Open No. 3-279290. Is disclosed in. With this technique, the radiation screen can be retracted upward in the chamber during filling and melting of the raw material, so that the filling amount of the raw material need not be reduced. After the completion of melting the raw materials, the radiation screen can be lowered around the single crystal pulling region, and the distance between the melt surface and the lower end of the radiation screen can be adjusted arbitrarily. Therefore, variations in oxygen concentration in the single crystal can be suppressed.
【0004】[0004]
【発明が解決しようとする課題】しかしながら上記従来
の技術による単結晶製造装置においては、原料溶解時に
輻射スクリーン全体をチャンバ内上方に退避させるた
め、ヒータ上部の熱が上方に逃げやすくなり、原料溶解
時間が長くなる。原料溶解時間を短縮するため溶解電力
を大きくすると、石英るつぼが軟化して変形しやすくな
り、安定した結晶成長が困難となる。従って、この単結
晶製造装置によって製造される製品の製造原価を高くし
てしまう。本発明はこのような従来の問題点に着目して
なされたもので、原料の充填、溶解時に輻射スクリーン
をチャンバ内上方に退避させることができ、かつ、原料
溶解時間を延長する必要のない半導体単結晶製造装置な
らびに半導体単結晶製造方法を提供することを目的とし
ている。However, in the above-mentioned conventional single crystal manufacturing apparatus, when the raw material is melted, the entire radiant screen is retracted upward in the chamber, so that the heat above the heater easily escapes upward, and the raw material is melted. Time will increase. If the melting power is increased to shorten the material melting time, the quartz crucible is softened and easily deformed, which makes stable crystal growth difficult. Therefore, the manufacturing cost of the product manufactured by this single crystal manufacturing apparatus is increased. The present invention has been made in view of such a conventional problem, and a semiconductor capable of retracting the radiant screen upward in the chamber at the time of filling and melting the raw material and not requiring an extension of the raw material melting time. An object is to provide a single crystal manufacturing apparatus and a semiconductor single crystal manufacturing method.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明に係る半導体単結晶製造装置は、半導体単結
晶の原料を充填するるつぼと、このるつぼの周囲にあっ
てるつぼ内の原料を溶解するヒータと、溶解した原料に
種子結晶を浸漬して単結晶を引き上げる引き上げ機構
と、単結晶の周囲を取り囲む輻射スクリーンを融液近傍
上方に配設した単結晶製造装置において、輻射スクリー
ンを上下に2分割し、上部スクリーンと下部スクリーン
との接続部分に継合部を設け、前記上部スクリーンを単
結晶製造時の所定位置に取り付けるとともに、下部スク
リーンを昇降する機構を備える構成とし、このような構
成において、下部スクリーン昇降機構に、上部スクリー
ンを掛止して昇降自在とする上部スクリーン掛止機構を
設けてもよく、具体的には、下部スクリーン昇降機構を
構成する上下動自在の複数のロッドの下端に下部スクリ
ーンの上端を連結するとともに、前記ロッドの下端に上
部スクリーン掛止機構を設け、この掛止機構によって掛
止される突起を上端面に備えた上部スクリーンを単結晶
製造時の所定位置に取り付ける構成としてもよい。上記
半導体単結晶製造装置を用いる場合の半導体単結晶の製
造方法は、るつぼへの原料充填に際し、下部スクリーン
昇降機構を用いて下部スクリーンをチャンバ内上方に引
き上げ、前記原料の溶解完了後、前記昇降機構を駆動し
て下部スクリーンを下降させ、下部スクリーンを上部ス
クリーンに継合させるものとし、または、るつぼへの原
料充填に際し、下部スクリーン昇降機構を用いて下部ス
クリーンをチャンバ内上方に引き上げ、前記原料の溶解
時、原料頂部の下降に伴って前記昇降機構を駆動して下
部スクリーンを漸次下降させ、原料の溶解完了時に下部
スクリーンを上部スクリーンに継合させるものとしても
よく、あるいは、るつぼへの原料充填に際し、下部スク
リーン昇降機構を用いて下部スクリーンをチャンバ内上
方に引き上げ、前記原料の溶解時、原料頂部の下降に伴
って前記昇降機構を駆動して下部スクリーンを漸次下降
させ、原料の溶解完了時に下部スクリーンを上部スクリ
ーンに継合させるとともに、単結晶の引き上げ完了後、
下部スクリーンと、前記昇降機構に掛止された上部スク
リーンとをチャンバ内上方に引き上げるものとしてもよ
い。In order to achieve the above object, a semiconductor single crystal manufacturing apparatus according to the present invention comprises a crucible for filling a raw material of a semiconductor single crystal and a raw material in a crucible surrounding the crucible. In a single crystal manufacturing apparatus in which a heater for melting, a pulling mechanism for immersing a seed crystal in a melted raw material to pull up a single crystal, and a radiation screen surrounding the periphery of the single crystal are arranged above the melt, the radiation screen is moved up and down. It is divided into two parts, a joint is provided at the connecting portion between the upper screen and the lower screen, the upper screen is attached at a predetermined position during the production of the single crystal, and a mechanism for raising and lowering the lower screen is provided. In the configuration, the lower screen lifting mechanism may be provided with an upper screen locking mechanism that locks the upper screen to allow vertical movement. Is configured to connect the upper ends of the lower screens to the lower ends of a plurality of vertically movable rods that constitute the lower screen lifting mechanism, and to provide an upper screen hooking mechanism at the lower ends of the rods to be hooked by the hooking mechanism. An upper screen having projections on the upper end surface may be attached at a predetermined position during single crystal production. The method for manufacturing a semiconductor single crystal when using the semiconductor single crystal manufacturing apparatus, when filling the raw material into the crucible, the lower screen is lifted up in the chamber using the lower screen lifting mechanism, after the melting of the raw material is completed, the lifting The lower screen is lowered by driving the mechanism, and the lower screen is joined to the upper screen.Or, when filling the crucible with the raw material, the lower screen lifting mechanism is used to pull the lower screen upward in the chamber to When melting, the lower screen is gradually lowered by driving the elevating mechanism with the lowering of the raw material top, and the lower screen may be joined to the upper screen when the raw material is completely melted, or the raw material to the crucible When filling, use the lower screen lifting mechanism to pull the lower screen up inside the chamber. Upon dissolution of the raw material, with the descent of the raw material top gradually lowers the lower screen by driving the elevating mechanism, causes the engagement of the lower screen in the upper screen when dissolution is complete the material, after pulling the completion of the single crystal,
The lower screen and the upper screen hooked by the elevating mechanism may be pulled upward in the chamber.
【0006】[0006]
【作用】上記構成によれば、輻射スクリーンを上部スク
リーンと下部スクリーンとに分割し、下部スクリーンを
昇降する機構を備えたので、必要に応じて下部スクリー
ンをチャンバ内上方に引き上げることができる。従っ
て、るつぼへの単結晶原料充填に際し、あらかじめ下部
スクリーンを引き上げておけば、原料が下部スクリーン
に干渉することはなく、所定量の原料を容易に充填する
ことができる。上部スクリーンは単結晶製造時の所定位
置に取り付けられているので、ヒータおよびるつぼの上
方が上部スクリーンによって被覆され、ヒータ上部の保
温性が著しく向上する。従って、溶解時の電力を増大し
なくても溶解所要時間の短縮が可能となる。また、原料
の溶解時、原料頂部の下降に伴って前記昇降機構を駆動
して下部スクリーンを漸次下降させることにより、ヒー
タ上部の保温性が更に向上し、原料の溶解所要時間をよ
り一層短縮させることができる。According to the above construction, the radiation screen is divided into the upper screen and the lower screen, and the mechanism for raising and lowering the lower screen is provided. Therefore, the lower screen can be pulled up into the chamber as needed. Therefore, when the lower screen is pulled up in advance when filling the crucible with the single crystal raw material, the raw material does not interfere with the lower screen and a predetermined amount of the raw material can be easily filled. Since the upper screen is attached at a predetermined position during the production of the single crystal, the upper part of the heater and the crucible is covered with the upper screen, and the heat retaining property of the upper part of the heater is significantly improved. Therefore, the time required for melting can be shortened without increasing the electric power at the time of melting. Further, when the raw material is melted, the elevating mechanism is driven as the raw material top is lowered to gradually lower the lower screen, whereby the heat retaining property of the heater upper part is further improved, and the time required for melting the raw material is further shortened. be able to.
【0007】請求項2および請求項3の半導体単結晶製
造装置は、下部スクリーン昇降機構を構成する上下動自
在の複数のロッドの下端に下部スクリーンの上端を連結
するとともに、前記ロッドの下端に上部スクリーン掛止
機構を設け、上部スクリーンの上端面には前記掛止機構
によって掛止される突起を設けて単結晶製造時の所定位
置に取り付ける構成としたので、前記ロッドを上昇させ
て下部スクリーンを引き上げると、上部スクリーンも同
時に引き上げることができる。従って、請求項6の単結
晶製造方法に基づいて単結晶の引き上げ完了後、前記昇
降機構を駆動して下部スクリーンと上部スクリーンとを
チャンバ内上方に引き上げることにより、ホットゾーン
パーツの冷却を早めることができる。In the semiconductor single crystal manufacturing apparatus according to the second and third aspects, the upper end of the lower screen is connected to the lower ends of a plurality of vertically movable rods constituting the lower screen lifting mechanism, and the upper end is connected to the lower ends of the rods. Since a screen hooking mechanism is provided and a protrusion hooked by the hooking mechanism is provided on the upper end surface of the upper screen to attach it at a predetermined position during the production of a single crystal, the rod is raised to lower the lower screen. When pulled up, the upper screen can be pulled up at the same time. Therefore, after the pulling of the single crystal is completed based on the single crystal manufacturing method of claim 6, the elevating mechanism is driven to pull up the lower screen and the upper screen upward in the chamber to accelerate the cooling of the hot zone parts. You can
【0008】[0008]
【実施例】以下に本発明に係る半導体単結晶製造装置の
実施例について、図面を参照して説明する。図1および
図2は請求項1の半導体単結晶製造装置の部分概略断面
図で、図1は石英るつぼに単結晶の原料を充填した状
態、図2は原料の溶解が完了して輻射スクリーンを所定
の位置に設置した状態を示す。図1において、メインチ
ャンバ1内に設置された黒鉛るつぼ2に石英るつぼ3が
嵌着され、この石英るつぼ3内に原料4が充填されてい
る。5は黒鉛ヒータ、6は断熱筒で、これらはいずれも
黒鉛るつぼ2を取り巻くように配設され、前記断熱筒6
の上端にサポート7を介して上部スクリーン8が取り付
けられている。上部スクリーン8は環状のフランジ部
と、このフランジ部の内縁に接続する中空円錐状の短い
筒部とからなり、フランジ部の外縁は前記サポート7に
挿嵌されている。黒鉛ヒータ5および石英るつぼ3の内
周付近の上方は、前記上部スクリーン8によって被覆さ
れる。前記メインチャンバ1の上端にはアッパチャンバ
9が連結され、垂直に上下動自在の昇降ロッド10が前
記アッパチャンバ9に装着されている。下部スクリーン
11は中空円錐状の筒で、その上端に前記上部スクリー
ン8の下端と継合する継合部11aを有し、連結部材1
2を介して昇降ロッド10の下端に固着されている。前
記下部スクリーン11を、連結部材12を介して昇降ロ
ッド10の下端に釣支してもよい。なお、13はるつぼ
軸である。Embodiments of the semiconductor single crystal manufacturing apparatus according to the present invention will be described below with reference to the drawings. 1 and 2 are partial schematic cross-sectional views of a semiconductor single crystal manufacturing apparatus according to claim 1, FIG. 1 shows a state in which a quartz crucible is filled with a raw material for a single crystal, and FIG. The state where it installed in a predetermined position is shown. In FIG. 1, a quartz crucible 3 is fitted into a graphite crucible 2 installed in a main chamber 1, and the quartz crucible 3 is filled with a raw material 4. Reference numeral 5 is a graphite heater, and 6 is a heat insulating cylinder, all of which are arranged so as to surround the graphite crucible 2.
An upper screen 8 is attached to the upper end of the via a support 7. The upper screen 8 is composed of an annular flange portion and a hollow conical short tube portion connected to the inner edge of the flange portion, and the outer edge of the flange portion is fitted into the support 7. The graphite heater 5 and the upper part of the quartz crucible 3 near the inner circumference are covered with the upper screen 8. An upper chamber 9 is connected to the upper end of the main chamber 1, and a vertically movable rod 10 is mounted on the upper chamber 9. The lower screen 11 is a hollow conical tube, and has a joint portion 11a that is joined to the lower end of the upper screen 8 at the upper end thereof.
It is fixed to the lower end of the elevating rod 10 via 2. The lower screen 11 may be supported on the lower end of the elevating rod 10 via the connecting member 12. In addition, 13 is a crucible shaft.
【0009】上記半導体単結晶製造装置を用いる場合の
単結晶製造方法の実施例について説明する。石英るつぼ
3に単結晶原料を充填する際、図1に示すように昇降ロ
ッド10を駆動し、あらかじめ下部スクリーン11をア
ッパチャンバ9の内面に近接する高さまで引き上げてお
く。上部スクリーン8の下端と石英るつぼ3の上端との
間には十分な距離が確保されているので、原料4が上部
スクリーン8に干渉することはなく、所定量の原料を容
易に充填することができる。また、必要に応じてるつぼ
軸13を駆動し、るつぼの高さを調整してもよい。石英
るつぼ3に原料4を充填した後、黒鉛ヒータ5により原
料4を加熱、溶解する。このときアッパチャンバ9に向
かって散逸する熱は上部スクリーン8によって遮断さ
れ、熱損失を小さくすることができるので、その結果と
して効率良く原料の溶解ができる。原料4の溶解完了
後、図2に示すように下部スクリーン11を下降させ、
上部スクリーン8に継合させる。その後融液に種子結晶
を浸漬し、単結晶を成長させつつ引き上げる。An example of a single crystal manufacturing method using the semiconductor single crystal manufacturing apparatus will be described. When filling the quartz crucible 3 with the single crystal raw material, the elevating rod 10 is driven as shown in FIG. 1, and the lower screen 11 is previously pulled up to a height close to the inner surface of the upper chamber 9. Since a sufficient distance is secured between the lower end of the upper screen 8 and the upper end of the quartz crucible 3, the raw material 4 does not interfere with the upper screen 8 and the predetermined amount of raw material can be easily filled. it can. Further, the height of the crucible may be adjusted by driving the crucible shaft 13 as needed. After filling the quartz crucible 3 with the raw material 4, the raw material 4 is heated and melted by the graphite heater 5. At this time, the heat dissipated toward the upper chamber 9 is blocked by the upper screen 8 and the heat loss can be reduced, and as a result, the raw materials can be efficiently melted. After the raw material 4 is completely dissolved, the lower screen 11 is lowered as shown in FIG.
Join to the upper screen 8. Then, the seed crystal is dipped in the melt and pulled up while growing a single crystal.
【0010】この半導体単結晶製造装置を用いて80k
gの単結晶原料を溶解したところ、溶解所要時間は平均
5時間45分であった。輻射スクリーン全体を上方に退
避させる従来の単結晶製造装置を用いた場合、溶解所要
時間の平均値は6時間37分であり、本改良により溶解
所要時間を平均13%短縮させることができた。なお、
上部スクリーン8に継合された下部スクリーン11の下
端と融液面との距離をるつぼの上下動によって調整する
ことにより、単結晶中の酸素濃度を所定の範囲に抑える
ことができた。Using this semiconductor single crystal manufacturing apparatus, 80 k
When g of the single crystal raw material was dissolved, the time required for dissolution was 5 hours and 45 minutes on average. When the conventional single crystal manufacturing apparatus for retracting the entire radiation screen upward was used, the average time required for melting was 6 hours and 37 minutes, and this improvement made it possible to reduce the time required for melting by 13% on average. In addition,
By adjusting the distance between the lower end of the lower screen 11 joined to the upper screen 8 and the melt surface by the vertical movement of the crucible, the oxygen concentration in the single crystal could be suppressed within a predetermined range.
【0011】次に、請求項5の単結晶製造方法の実施例
を図3に示す。単結晶原料4の石英るつぼ3への充填時
および溶解開始時は、図1に示した通り昇降ロッド10
を駆動し、下部スクリーン11をアッパチャンバ9の内
面に近接する高さまで引き上げておく。原料4の溶解が
進むと原料4の頂部高さが次第に下降するので、この変
化に対応して下部スクリーン11を徐々に下げる。この
操作により、アッパチャンバ9に向かう熱の散逸をより
一層防ぐことができる。この方法を用いた場合の原料溶
解所要時間の平均値は5時間32分であった。従って、
上記上部スクリーンのみで遮熱する場合よりも更に13
分、3%の原料溶解所要時間短縮ができる。従って、輻
射スクリーン全体を上方に退避させる従来の溶解所要時
間に対して合計65分、16%の短縮が可能となる。Next, an embodiment of the method for producing a single crystal according to claim 5 is shown in FIG. When filling the quartz crucible 3 with the single crystal raw material 4 and at the start of melting, the lifting rod 10 is moved as shown in FIG.
Is driven to raise the lower screen 11 to a height close to the inner surface of the upper chamber 9. As the melting of the raw material 4 progresses, the height of the top of the raw material 4 gradually decreases, so that the lower screen 11 is gradually lowered in response to this change. By this operation, heat dissipation toward the upper chamber 9 can be further prevented. When this method was used, the average time required to dissolve the raw materials was 5 hours and 32 minutes. Therefore,
13 more than when only the upper screen is used to shield heat
The time required for melting the raw materials can be reduced by 3%. Therefore, it is possible to reduce the total melting time by 65 minutes, which is 16%, as compared with the conventional time required for melting the radiation screen.
【0012】図4は、請求項3の半導体単結晶製造装置
および請求項6の半導体単結晶製造方法に基づいて下部
スクリーンと上部スクリーンとを同時に上方に引き上げ
た状態を示したもので、図5は図4のP部拡大図であ
る。前記下部スクリーン11を昇降する昇降ロッド10
の下端には掛止爪14が軸着され、この掛止爪14は斜
め上方向から水平方向に至る90°未満の範囲で回動自
在である。また、上部スクリーン8のフランジ部上面に
は前記掛止爪14によって掛止される円筒状の突起8a
が固着されている。石英るつぼ3への原料の充填、原料
の溶解時の操作は既に説明した通りで、原料の溶解に伴
って徐々に下部スクリーン11を下げ、溶解完了時に上
部スクリーン8に継合させる。このとき前記掛止爪14
は水平方向に突出した状態で上部スクリーン8の突起8
aに当接し、突起8aによって押し上げられつつ下降し
た後、突起8aの下方で再び水平方向に突出する。単結
晶の引き上げ完了後、昇降機構を駆動して昇降ロッド1
0を上昇させると、前記掛止爪14が突起8aの下面に
当接して下部スクリーン11とともに上部スクリーン8
もチャンバ内上方に引き上げられる。この操作によりホ
ットゾーンパーツの熱の放散が早められ、炉内整備の待
ち時間を短縮することができる。本方法を用いることに
より、炉内冷却所要時間を約60分、13%短縮するこ
とができた。FIG. 4 shows a state in which the lower screen and the upper screen are simultaneously pulled upward based on the semiconductor single crystal manufacturing apparatus of claim 3 and the semiconductor single crystal manufacturing method of claim 6, and FIG. [Fig. 5] is an enlarged view of a P portion of Fig. 4. Lifting rod 10 for lifting the lower screen 11
A hook claw 14 is axially attached to the lower end of the hook, and the hook claw 14 is rotatable within a range of less than 90 ° from an obliquely upper direction to a horizontal direction. In addition, a cylindrical projection 8a that is hooked by the hook 14 is provided on the upper surface of the flange portion of the upper screen 8.
Is stuck. The operations of filling the quartz crucible 3 with the raw material and melting the raw material are as described above, and the lower screen 11 is gradually lowered as the raw material is melted, and is joined to the upper screen 8 when the melting is completed. At this time, the hook 14
Is a projection 8 of the upper screen 8 in a state of protruding in the horizontal direction.
After coming into contact with a and descending while being pushed up by the protrusion 8a, it again projects horizontally below the protrusion 8a. After the pulling of the single crystal is completed, the lifting mechanism is driven to move the lifting rod 1.
When 0 is raised, the hook 14 comes into contact with the lower surface of the projection 8a and the lower screen 11 and the upper screen 8 are brought together.
Is also pulled upward in the chamber. This operation accelerates the heat dissipation of the hot zone parts and shortens the waiting time for the maintenance in the furnace. By using this method, the time required for cooling the furnace can be shortened by about 60 minutes or 13%.
【0013】専用の輻射スクリーン昇降機構を設けず、
図6に示すように種子結晶ホルダ15にシードチャック
の代わりに吊り治具16を装着し、この吊り治具16に
下部スクリーン11を釣支してもよい。前記吊り治具1
6は、種子結晶ホルダ15に嵌着するシャフト16a
と、このシャフト16aの下端に設けられたキリ穴に繋
着されたワイヤケーブル16bと、ワイヤケーブル16
bの下端に繋着された3個のフック16cとからなり、
前記フック16cを下部スクリーン11の下端に掛止す
ることによって、前記下部スクリーン11が吊り治具1
6に釣支される。原料充填および溶解時には、下部スク
リーン11の上端がアッパチャンバ9の内面に近接する
高さになるように、種子結晶ホルダ15の高さを調節す
る。吊り治具16を用いると、下部スクリーン11を上
部スクリーン8に継合した後、種子結晶ホルダ15に取
着した吊り治具16とシードチャックとの交換作業時間
を必要とするため、平均溶解所要時間は5時間50分と
なった。しかし、輻射スクリーン昇降機構の設置コスト
に比べて前記吊り治具は安価であり、輻射スクリーン昇
降機構のない単結晶製造装置であっても下部スクリーン
の昇降による原料溶解時間の短縮ができ、単結晶の製造
原価を下げることが可能となる。Without a dedicated radiation screen lifting mechanism,
As shown in FIG. 6, a hanging jig 16 may be attached to the seed crystal holder 15 instead of the seed chuck, and the lower screen 11 may be supported on the hanging jig 16. The hanging jig 1
6 is a shaft 16a fitted to the seed crystal holder 15
A wire cable 16b connected to a drill hole provided at the lower end of the shaft 16a, and a wire cable 16
It consists of three hooks 16c attached to the lower end of b,
By hooking the hook 16c on the lower end of the lower screen 11, the lower screen 11 is lifted.
It is supported by 6. At the time of filling and melting the raw materials, the height of the seed crystal holder 15 is adjusted so that the upper end of the lower screen 11 is close to the inner surface of the upper chamber 9. When the hanging jig 16 is used, since it is necessary to replace the hanging jig 16 attached to the seed crystal holder 15 with the seed chuck after the lower screen 11 is joined to the upper screen 8, an average dissolution is required. The time was 5 hours and 50 minutes. However, the hanging jig is less expensive than the installation cost of the radiation screen elevating mechanism, and even in a single crystal manufacturing apparatus without a radiation screen elevating mechanism, it is possible to shorten the raw material melting time by elevating the lower screen, and to reduce the single crystal. It is possible to reduce the manufacturing cost of.
【0014】[0014]
【発明の効果】以上説明したように本発明によれば、単
結晶引き上げ領域を取り巻く輻射スクリーンを上部スク
リーンと下部スクリーンとに分割し、単結晶原料の充填
および溶解時に昇降機構を用いて下部スクリーンをチャ
ンバ内上方に引き上げることにしたので、原料の充填が
容易にできるとともに、単結晶製造時の所定位置に取り
付けられた上部スクリーンによりヒータ上部の保温性を
著しく向上させることができる。従って、原料充填量を
減らすことなく、かつ、溶解電力を増大させずに原料溶
解所要時間の短縮が可能となる。また、原料の溶解時、
原料頂部の下降に伴って下部スクリーンを漸次下降させ
ることにより、ヒータ上部の保温性が更に向上し、原料
の溶解所要時間をより一層短縮させることができる。更
に、単結晶の引き上げ完了後、下部スクリーンとともに
上部スクリーンもチャンバ内上方に引き上げることにす
ると、炉内冷却所要時間を短縮させることができる。こ
れらの改良により、半導体単結晶の製造原価の低減が可
能となる。As described above, according to the present invention, the radiation screen surrounding the single crystal pulling region is divided into the upper screen and the lower screen, and the lower screen is used by using the elevating mechanism when filling and melting the single crystal raw material. Since the material is pulled upward in the chamber, it is possible to easily fill the raw material, and it is possible to remarkably improve the heat retaining property of the upper portion of the heater by the upper screen attached at a predetermined position during the production of the single crystal. Therefore, it becomes possible to shorten the time required for melting the raw material without reducing the filling amount of the raw material and without increasing the melting power. Also, when the raw materials are dissolved,
By gradually lowering the lower screen as the top of the raw material descends, the heat retaining property of the upper portion of the heater is further improved, and the time required for melting the raw material can be further shortened. Furthermore, when the upper screen as well as the lower screen is pulled upward in the chamber after the pulling of the single crystal is completed, the time required for cooling in the furnace can be shortened. These improvements make it possible to reduce the manufacturing cost of semiconductor single crystals.
【図1】半導体単結晶製造装置の部分概略断面図で、石
英るつぼに単結晶原料を充填した状態を示す。FIG. 1 is a partial schematic cross-sectional view of a semiconductor single crystal manufacturing apparatus, showing a state in which a quartz crucible is filled with a single crystal raw material.
【図2】半導体単結晶製造装置の部分概略断面図で、輻
射スクリーンを所定の位置に設置した状態を示す。FIG. 2 is a partial schematic cross-sectional view of a semiconductor single crystal manufacturing apparatus, showing a state in which a radiation screen is installed at a predetermined position.
【図3】半導体単結晶製造装置の部分概略断面図で、請
求項5の単結晶製造方法の実施例を示す図である。FIG. 3 is a partial schematic cross-sectional view of a semiconductor single crystal manufacturing apparatus, showing an embodiment of the single crystal manufacturing method of claim 5;
【図4】請求項3の半導体単結晶製造装置および請求項
6の半導体単結晶製造方法に基づいて下部スクリーンと
上部スクリーンとを同時に上方に引き上げた状態を示す
図である。FIG. 4 is a diagram showing a state in which a lower screen and an upper screen are simultaneously pulled upward based on the semiconductor single crystal manufacturing apparatus of claim 3 and the semiconductor single crystal manufacturing method of claim 6.
【図5】図4のP部拡大図である。FIG. 5 is an enlarged view of a P portion of FIG.
【図6】半導体単結晶製造装置の部分概略断面図で、吊
り治具を用いて下部スクリーンを釣支した状態を示す。FIG. 6 is a partial schematic cross-sectional view of a semiconductor single crystal manufacturing apparatus, showing a state in which a lower screen is supported by a hanging jig.
1 メインチャンバ 2 黒鉛るつぼ 3 石英るつぼ 4 原料 8 上部スクリーン 8a 突起 9 アッパチャンバ 10 昇降ロッド 11 下部スクリーン 11a 継合部 14 掛止爪 1 Main Chamber 2 Graphite Crucible 3 Quartz Crucible 4 Raw Material 8 Upper Screen 8a Protrusion 9 Upper Chamber 10 Elevating Rod 11 Lower Screen 11a Joint 14 Nail Claw
───────────────────────────────────────────────────── フロントページの続き (72)発明者 古市 登 神奈川県平塚市四之宮2612 小松電子金属 株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Noboru Furuichi 2612 Shinomiya, Hiratsuka City, Kanagawa Prefecture Komatsu Electronic Metals Co., Ltd.
Claims (6)
と、このるつぼの周囲にあってるつぼ内の原料を溶解す
るヒータと、溶解した原料に種子結晶を浸漬して単結晶
を引き上げる引き上げ機構と、単結晶の周囲を取り囲む
輻射スクリーンを融液近傍上方に配設した単結晶製造装
置において、輻射スクリーンを上下に2分割し、上部ス
クリーンと下部スクリーンとの接続部分に継合部を設
け、前記上部スクリーンを単結晶製造時の所定位置に取
り付けるとともに、下部スクリーンを昇降する機構を備
えたことを特徴とする半導体単結晶製造装置。1. A crucible for filling a raw material of a semiconductor single crystal, a heater for melting the raw material in a crucible around the crucible, and a pulling mechanism for pulling the single crystal by immersing the seed crystal in the melted raw material. In a single crystal manufacturing apparatus in which a radiant screen that surrounds the periphery of the single crystal is arranged above the vicinity of the melt, the radiant screen is divided into upper and lower parts, and a joint portion is provided at a connecting portion between the upper screen and the lower screen. An apparatus for producing a semiconductor single crystal, comprising an upper screen attached to a predetermined position during single crystal production and a mechanism for elevating and lowering a lower screen.
ーンを掛止して昇降自在とする上部スクリーン掛止機構
を設けたことを特徴とする請求項1の半導体単結晶製造
装置。2. The apparatus for producing a semiconductor single crystal according to claim 1, wherein the lower screen lifting mechanism is provided with an upper screen locking mechanism that locks the upper screen so as to be lifted and lowered.
動自在の複数のロッドの下端に下部スクリーンの上端を
連結するとともに、前記ロッドの下端に上部スクリーン
掛止機構を設け、この掛止機構によって掛止される突起
を上端面に備えた上部スクリーンを単結晶製造時の所定
位置に取り付けることを特徴とする請求項2の半導体単
結晶製造装置。3. The lower screen lifting mechanism is connected to the lower ends of a plurality of vertically movable rods, and the upper screen hooking mechanism is provided at the lower ends of the rods. The semiconductor single crystal manufacturing apparatus according to claim 2, wherein an upper screen having a projection to be stopped on an upper end surface is attached at a predetermined position during manufacturing of the single crystal.
ーン昇降機構を用いて下部スクリーンをチャンバ内上方
に引き上げ、前記原料の溶解完了後、前記昇降機構を駆
動して下部スクリーンを下降させ、下部スクリーンを上
部スクリーンに継合させることを特徴とする請求項1の
半導体単結晶製造装置を用いて行う半導体単結晶製造方
法。4. When filling a crucible with a raw material, a lower screen lifting mechanism is used to pull the lower screen upward in the chamber, and after the raw material is completely melted, the lifting mechanism is driven to lower the lower screen. The method for producing a semiconductor single crystal using the semiconductor single crystal production apparatus according to claim 1, further comprising:
ーン昇降機構を用いて下部スクリーンをチャンバ内上方
に引き上げ、前記原料の溶解時、原料頂部の下降に伴っ
て前記昇降機構を駆動して下部スクリーンを漸次下降さ
せ、原料の溶解完了時に下部スクリーンを上部スクリー
ンに継合させることを特徴とする請求項1の半導体単結
晶製造装置を用いて行う半導体単結晶製造方法。5. When filling a crucible with a raw material, the lower screen is lifted up into the chamber by using a lower screen lifting mechanism, and when the raw material is melted, the lifting mechanism is driven as the raw material top is lowered to drive the lower screen. 2. The method for producing a semiconductor single crystal according to claim 1, wherein the lower screen is joined to the upper screen when the raw material is completely melted.
ーン昇降機構を用いて下部スクリーンをチャンバ内上方
に引き上げ、前記原料の溶解時、原料頂部の下降に伴っ
て前記昇降機構を駆動して下部スクリーンを漸次下降さ
せ、原料の溶解完了時に下部スクリーンを上部スクリー
ンに継合させるとともに、単結晶の引き上げ完了後、下
部スクリーンと、前記昇降機構に掛止された上部スクリ
ーンとをチャンバ内上方に引き上げることを特徴とする
請求項2の半導体単結晶製造装置を用いて行う半導体単
結晶製造方法。6. When filling a crucible with a raw material, a lower screen lifting mechanism is used to pull the lower screen upward in the chamber, and when the raw material is melted, the lifting mechanism is driven as the raw material top is lowered to drive the lower screen. Is gradually lowered, and the lower screen is joined to the upper screen when the raw material is completely melted, and after the single crystal is completely pulled, the lower screen and the upper screen hooked by the elevating mechanism are pulled upward in the chamber. A method for producing a semiconductor single crystal using the apparatus for producing a semiconductor single crystal according to claim 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32125292A JP2939918B2 (en) | 1992-11-05 | 1992-11-05 | Semiconductor single crystal manufacturing apparatus and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32125292A JP2939918B2 (en) | 1992-11-05 | 1992-11-05 | Semiconductor single crystal manufacturing apparatus and manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06144986A true JPH06144986A (en) | 1994-05-24 |
JP2939918B2 JP2939918B2 (en) | 1999-08-25 |
Family
ID=18130507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32125292A Expired - Lifetime JP2939918B2 (en) | 1992-11-05 | 1992-11-05 | Semiconductor single crystal manufacturing apparatus and manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2939918B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853480A (en) * | 1996-04-22 | 1998-12-29 | Komatsu Electronic Metals Co., Ltd. | Apparatus for fabricating a single-crystal semiconductor |
US5928422A (en) * | 1997-03-07 | 1999-07-27 | Komatsu Electronic Metals Co., Ltd. | Regulating cylinder unit in a single-crystal pulling apparatus and a jig for installing them |
US6071341A (en) * | 1996-05-22 | 2000-06-06 | Komatsu Electronic Metals Co., Ltd. | Apparatus for fabricating single-crystal silicon |
JP2012116691A (en) * | 2010-11-30 | 2012-06-21 | Sumco Corp | Melting apparatus of single crystal raw material |
CN115852483A (en) * | 2023-02-27 | 2023-03-28 | 杭州天桴光电技术有限公司 | Device and method for preparing round cake-shaped magnesium fluoride crystal coating material |
-
1992
- 1992-11-05 JP JP32125292A patent/JP2939918B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853480A (en) * | 1996-04-22 | 1998-12-29 | Komatsu Electronic Metals Co., Ltd. | Apparatus for fabricating a single-crystal semiconductor |
US5997635A (en) * | 1996-04-22 | 1999-12-07 | Komatsu Electronic Metals Co., Ltd. | Method for fabricating a single-crystal semiconductor |
US6071341A (en) * | 1996-05-22 | 2000-06-06 | Komatsu Electronic Metals Co., Ltd. | Apparatus for fabricating single-crystal silicon |
US5928422A (en) * | 1997-03-07 | 1999-07-27 | Komatsu Electronic Metals Co., Ltd. | Regulating cylinder unit in a single-crystal pulling apparatus and a jig for installing them |
JP2012116691A (en) * | 2010-11-30 | 2012-06-21 | Sumco Corp | Melting apparatus of single crystal raw material |
CN115852483A (en) * | 2023-02-27 | 2023-03-28 | 杭州天桴光电技术有限公司 | Device and method for preparing round cake-shaped magnesium fluoride crystal coating material |
Also Published As
Publication number | Publication date |
---|---|
JP2939918B2 (en) | 1999-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5413354B2 (en) | Silicon single crystal pulling apparatus and silicon single crystal manufacturing method | |
US6482263B1 (en) | Heat shield assembly for crystal pulling apparatus | |
KR20010102396A (en) | Heat shield assembly for crystal puller | |
JPH09286692A (en) | Apparatus for producing semiconductor single crystal and production of semiconductor single crystal | |
US6071341A (en) | Apparatus for fabricating single-crystal silicon | |
JPH10101482A (en) | Production unit for single crystal silicon and its production | |
US20030047130A1 (en) | Process for eliminating neck dislocations during czochralski crystal growth | |
JPH03285893A (en) | Crystal pulling-up apparatus | |
KR20110036896A (en) | Single crystal manufacturing apparatus and manufacturing method | |
JPH06144986A (en) | Apparatus and method for production of semiconductor single crystal | |
JP2005053722A (en) | Single crystal production apparatus and single crystal production method | |
KR20140060019A (en) | Apparatus for growing silicon single crystal ingot | |
US5928422A (en) | Regulating cylinder unit in a single-crystal pulling apparatus and a jig for installing them | |
JP3741418B2 (en) | Silicon single crystal pulling device | |
JP2705809B2 (en) | Single crystal pulling device | |
JP4272449B2 (en) | Single crystal pulling method | |
US5932008A (en) | Apparatus for manufacturing a single-crystal and method of manufacturing a single-crystal using the same | |
JP2816633B2 (en) | Single crystal pulling apparatus and pulling method | |
JP3744053B2 (en) | Graphite crucible and method for producing silicon single crystal by using Czochralski method | |
JPH07330482A (en) | Method and apparatus for growing single crystal | |
JPH0754290Y2 (en) | Single crystal manufacturing equipment | |
JPH0710682A (en) | Drawing of single crystal and production machine therefor | |
JPH09202685A (en) | Apparatus for pulling up single crystal | |
JP2829688B2 (en) | Semiconductor single crystal manufacturing apparatus and semiconductor single crystal manufacturing method | |
JP4273820B2 (en) | Single crystal pulling method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080618 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090618 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100618 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100618 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 12 Free format text: PAYMENT UNTIL: 20110618 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110618 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 13 Free format text: PAYMENT UNTIL: 20120618 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120618 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130618 Year of fee payment: 14 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 14 Free format text: PAYMENT UNTIL: 20130618 |