JPH06129962A - Sample for transmission electron microscope - Google Patents
Sample for transmission electron microscopeInfo
- Publication number
- JPH06129962A JPH06129962A JP4278461A JP27846192A JPH06129962A JP H06129962 A JPH06129962 A JP H06129962A JP 4278461 A JP4278461 A JP 4278461A JP 27846192 A JP27846192 A JP 27846192A JP H06129962 A JPH06129962 A JP H06129962A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- sample body
- transmission electron
- electron microscope
- reinforcing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えばシリコンウエ
ハを使用したＬＳＩデバイスなど、透過形電子顕微鏡に
より観察される透過形電子顕微鏡用試料に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transmission electron microscope sample observed by a transmission electron microscope, such as an LSI device using a silicon wafer.
【０００２】[0002]
【従来の技術】図２は例えば発明協会公開技報９２−１
６８０号に示された従来の透過形電子顕微鏡用試料を示
す斜視図である。図において、１は試料本体、２は試料
本体１に形成された観察面、３は試料本体１に貼り付け
られているＣ字状の補強リングである。2. Description of the Related Art FIG.
It is a perspective view which shows the conventional sample for transmission electron microscopes shown by No. 680. In the figure, 1 is a sample body, 2 is an observation surface formed on the sample body 1, and 3 is a C-shaped reinforcing ring attached to the sample body 1.
【０００３】次に、従来の試料作成について説明する。
まず、試料本体１を機械的な切り出し加工により厚さ約
０．３ｍｍ程度に切り出し、補強リング３に接着剤で貼
り付ける。そして、補強リング３に取り付けられた試料
本体１をＦＩＢ（収束イオンビーム）装置にセットし、
図の上方からイオンビームを照射するＦＩＢ加工によ
り、例えば厚さ０．１μｍ程度の観察面２を形成する。Next, conventional sample preparation will be described.
First, the sample body 1 is cut out to a thickness of about 0.3 mm by a mechanical cutting process and attached to the reinforcing ring 3 with an adhesive. Then, the sample body 1 attached to the reinforcing ring 3 is set in a FIB (focused ion beam) device,
The observation surface 2 having a thickness of, for example, about 0.1 μm is formed by FIB processing in which an ion beam is irradiated from above the drawing.
【０００４】[0004]
【発明が解決しようとする課題】上記のように構成され
た従来の透過形電子顕微鏡用試料においては、ＦＩＢ装
置へのセットの際などに、治具等への取付が不安定であ
り、また試料本体１に治具等が直接接触し易いため、か
なり慎重な取り扱いをしても試料本体１やその観察面２
を壊す恐れがあるなどの問題点があった。In the conventional transmission electron microscope sample constructed as described above, the attachment to the jig or the like is unstable when it is set in the FIB device, and the like. Since a jig or the like is likely to come into direct contact with the sample body 1, the sample body 1 and its observation surface 2 can be handled with great care.
There was a problem such as the possibility of breaking.
【０００５】この発明は、上記のような問題点を解決す
ることを課題としてなされたものであり、観察面の薄膜
化工程での治具等への取付を安定して行うことができ、
また取り扱いを簡単にすることができるとともに、試料
本体やその観察面を保護することができる透過形電子顕
微鏡用試料を得ることを目的とする。The present invention has been made to solve the above problems, and it is possible to stably attach the observation surface to a jig or the like in the thinning process.
Another object of the present invention is to obtain a transmission electron microscope sample that can be handled easily and can protect the sample body and its observation surface.
【０００６】[0006]
【課題を解決するための手段】この発明に係る透過形電
子顕微鏡用試料は、試料本体を導電性の補強枠に収納保
持し、この補強枠により少なくとも観察面の部分を除い
て試料本体の外周部を覆うようにしたものである。A sample for a transmission electron microscope according to the present invention stores and holds a sample body in a conductive reinforcing frame, and the reinforcing frame allows the outer periphery of the sample body to be removed except at least the observation surface. It is designed to cover the part.
【０００７】[0007]
【作用】この発明においては、観察面の薄膜化時に補強
枠により試料本体を収納保持することにより、試料本体
を補強し、かつ直接接触せずに試料本体を取り扱えるよ
うにする。また、治具等への取付は、ワックス，接触剤
又は試料押さえ等を用いて補強枠ごと行う。In the present invention, the sample body is accommodated and held by the reinforcing frame when the observation surface is made thin, so that the sample body is reinforced and the sample body can be handled without direct contact. The reinforcing frame is attached to a jig or the like using wax, a contact agent, a sample holder, or the like.
【０００８】[0008]
【実施例】以下、この発明の実施例を図について説明す
る。図１はこの発明の一実施例による透過形電子顕微鏡
用試料を示す斜視図であり、試料本体１及びその観察面
２は図２と同様である。図において、１１は試料本体１
を収納し保持している補強枠であり、この補強枠１１
は、例えばステンレス鋼やモリブデンなどの導電性材料
からなっている。また、補強枠１１には、観察面２を露
出させるように切欠部１１ａが設けられている。さら
に、補強枠１１は、試料本体１の図の上面よりも上方へ
突出した突出部１１ｂを有している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a sample for a transmission electron microscope according to an embodiment of the present invention, and a sample body 1 and its observation surface 2 are the same as those in FIG. In the figure, 11 is a sample body 1
Is a reinforcing frame that stores and holds
Is made of a conductive material such as stainless steel or molybdenum. Further, the reinforcing frame 11 is provided with a cutout portion 11 a so as to expose the observation surface 2. Further, the reinforcing frame 11 has a protruding portion 11b protruding upward from the upper surface of the sample body 1 in the drawing.
【０００９】次に、試料の作成について説明する。ま
ず、試料上の透過形電子顕微鏡による観察場所を含んで
試料本体１の機械的な切り出しを行う。次に、切り出し
た試料本体１を補強枠１１に挿入し接触剤などで固定す
る。この後、試料本体１を補強枠１１ごとＦＩＢ装置の
試料ステージ（図示せず）に導電性テープを用いて取り
付け、そのままＦＩＢ加工を行い、観察面２を形成す
る。観察面２の形成後、試料本体１を補強枠３ごとＦＩ
Ｂ装置の試料ステージから取り外し、今度は透過形電子
顕微鏡の試料ホルダ（図示せず）に取り付け、透過形電
子顕微鏡による観察を行う。Next, the preparation of the sample will be described. First, the sample body 1 is mechanically cut out including the observation site on the sample by a transmission electron microscope. Next, the cut out sample body 1 is inserted into the reinforcing frame 11 and fixed with a contact agent or the like. After that, the sample body 1 together with the reinforcing frame 11 is attached to a sample stage (not shown) of the FIB device using a conductive tape, and the FIB processing is performed as it is to form the observation surface 2. After forming the observation surface 2, the sample main body 1 and the reinforcing frame 3 are FI
The sample is removed from the sample stage of the B-apparatus, this time it is attached to a sample holder (not shown) of the transmission electron microscope, and observation with the transmission electron microscope is performed.
【００１０】上記のような補強枠１１を用いた試料で
は、試料本体１の観察面２の周囲を除いた部分が補強枠
１１により覆われているので、試料本体１を直接接触せ
ずに取り扱うことができ、取り扱いが容易であるととも
に、試料本体１やその観察面２の破壊が防止される。ま
た、観察面２の形成のための薄膜化工程でのＦＩＢ装置
の治具類への取付が安定する。In the sample using the reinforcing frame 11 as described above, since the portion of the sample body 1 excluding the periphery of the observation surface 2 is covered with the reinforcing frame 11, the sample body 1 is handled without direct contact. In addition to being easy to handle, destruction of the sample body 1 and the observation surface 2 thereof is prevented. Further, the FIB device is stably attached to the jigs in the thinning process for forming the observation surface 2.
【００１１】また、上記実施例の補強枠１１は、突出部
１１ｂを有しているので、外部に露出せざるを得ない試
料本体１の図の上面に治具等が接触するのを避けること
ができ、より確実に試料本体１を保護することができ
る。Further, since the reinforcing frame 11 of the above-mentioned embodiment has the projecting portion 11b, it is necessary to avoid the jig or the like from coming into contact with the upper surface of the sample main body 1 in the figure, which must be exposed to the outside. Therefore, the sample body 1 can be protected more reliably.
【００１２】なお、上記実施例では観察面２の周囲を除
いて試料本体１の外周部を補強枠１１により覆うように
したが、観察面２の形成や電子ビームの透過に支障を来
さなければ補強枠をさらに簡略化してもよい。また、補
強枠１１の材料は導電性のものであればよく、特に限定
されない。In the above-mentioned embodiment, the outer peripheral portion of the sample body 1 is covered with the reinforcing frame 11 except for the periphery of the observation surface 2. However, the formation of the observation surface 2 and the transmission of the electron beam should not be hindered. For example, the reinforcing frame may be further simplified. The material of the reinforcing frame 11 is not particularly limited as long as it is conductive.
【００１３】[0013]
【発明の効果】以上説明したように、この発明の透過形
電子顕微鏡用試料は、試料本体を導電性の補強枠に収納
保持し、この補強枠により少なくとも観察面の部分を除
いて試料本体の外周部を覆うようにしたので、観察面の
薄膜化工程での治具等への取付を安定して行うことがで
き、また試料本体に直接接触せずに簡単に取り扱うこと
ができるとともに、試料本体やその観察面を保護するこ
とができるなどの効果を奏する。As described above, in the transmission electron microscope sample of the present invention, the sample body is housed and held in the conductive reinforcing frame, and the reinforcing frame removes at least the observation surface portion of the sample body. Since the outer periphery is covered, it can be stably attached to a jig etc. in the thinning process of the observation surface, and it can be handled easily without directly contacting the sample body, and the sample This has the effect of protecting the main body and its observation surface.
【図１】この発明の一実施例による透過形電子顕微鏡用
試料を示す斜視図である。FIG. 1 is a perspective view showing a sample for a transmission electron microscope according to an embodiment of the present invention.
【図２】従来の透過形電子顕微鏡用試料の一例を示す斜
視図である。FIG. 2 is a perspective view showing an example of a conventional transmission electron microscope sample.
【符号の説明】 １ 試料本体 ２ 観察面 １１ 補強枠[Explanation of symbols] 1 sample body 2 observation surface 11 reinforcing frame
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年４月２１日[Submission date] April 21, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００７】[0007]
【作用】この発明においては、観察面の薄膜化時に補強
枠により試料本体を収納保持することにより、試料本体
を補強し、かつ直接接触せずに試料本体を取り扱えるよ
うにする。また、治具等への取付は、ワックス，接着剤
又は試料押さえ等を用いて補強枠ごと行う。In the present invention, the sample body is accommodated and held by the reinforcing frame when the observation surface is made thin, so that the sample body is reinforced and the sample body can be handled without direct contact. The mounting of the jig or the like is performed for each reinforcing frame using wax, a contact adhesive or a sample retainer, and the like.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００９】次に、試料の作成について説明する。ま
ず、試料上の透過形電子顕微鏡による観察場所を含んで
試料本体１の機械的な切り出しを行う。次に、切り出し
た試料本体１を補強枠１１に挿入し接着剤などで固定す
る。この後、試料本体１を補強枠１１ごとＦＩＢ装置の
試料ステージ（図示せず）に導電性テープを用いて取り
付け、そのままＦＩＢ加工を行い、観察面２を形成す
る。観察面２の形成後、試料本体１を補強枠３ごとＦＩ
Ｂ装置の試料ステージから取り外し、今度は透過形電子
顕微鏡の試料ホルダ（図示せず）に取り付け、透過形電
子顕微鏡による観察を行う。Next, the preparation of the sample will be described. First, the sample body 1 is mechanically cut out including the observation site on the sample by a transmission electron microscope. Next, insert the sample body 1 cut the reinforcing frame 11 is fixed by such contact adhesive. After that, the sample body 1 together with the reinforcing frame 11 is attached to a sample stage (not shown) of the FIB device using a conductive tape, and the FIB processing is performed as it is to form the observation surface 2. After forming the observation surface 2, the sample main body 1 and the reinforcing frame 3 are FI
The sample is removed from the sample stage of the B-apparatus, this time it is attached to a sample holder (not shown) of the transmission electron microscope, and observation with the transmission electron microscope is performed.
Claims (1)
る観察面が形成されている試料本体と、少なくとも上記
観察面の部分を除いて外周部を覆うように上記試料本体
を収納保持している導電性の補強枠とを備えていること
を特徴とする透過形電子顕微鏡用試料。1. A sample body having an observation surface for transmitting an electron beam of a transmission electron microscope, and the sample body is housed and held so as to cover an outer peripheral portion except at least a portion of the observation surface. A sample for a transmission electron microscope, comprising a conductive reinforcing frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4278461A JPH06129962A (en) | 1992-10-16 | 1992-10-16 | Sample for transmission electron microscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4278461A JPH06129962A (en) | 1992-10-16 | 1992-10-16 | Sample for transmission electron microscope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06129962A true JPH06129962A (en) | 1994-05-13 |
Family
ID=17597656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4278461A Pending JPH06129962A (en) | 1992-10-16 | 1992-10-16 | Sample for transmission electron microscope |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06129962A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017003579A (en) * | 2015-06-05 | 2017-01-05 | フラウンホファー ゲセルシャフト ツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー．ファオ． | Method for preparing sample for microstructural diagnosis and sample for microstructural diagnosis |
| JP2017187387A (en) * | 2016-04-06 | 2017-10-12 | 住友ゴム工業株式会社 | Method for preparing thin film sample |
| CN112179927A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Transmission electron microscope sample, preparation method thereof and failure analysis method of structure to be detected |
| WO2021100144A1 (en) * | 2019-11-20 | 2021-05-27 | 株式会社日立ハイテク | Lamella fabrication method, analysis system, and sample analysis method |
-
1992
- 1992-10-16 JP JP4278461A patent/JPH06129962A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017003579A (en) * | 2015-06-05 | 2017-01-05 | フラウンホファー ゲセルシャフト ツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー．ファオ． | Method for preparing sample for microstructural diagnosis and sample for microstructural diagnosis |
| JP2017187387A (en) * | 2016-04-06 | 2017-10-12 | 住友ゴム工業株式会社 | Method for preparing thin film sample |
| WO2021100144A1 (en) * | 2019-11-20 | 2021-05-27 | 株式会社日立ハイテク | Lamella fabrication method, analysis system, and sample analysis method |
| JPWO2021100144A1 (en) * | 2019-11-20 | 2021-05-27 | ||
| CN112179927A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Transmission electron microscope sample, preparation method thereof and failure analysis method of structure to be detected |
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