JPH06125032A - Hybrid integrated circuit device and its manufacture - Google Patents

Abstract

PURPOSE:To easily fit a hybrid integrated circuit device to a circuit board by providing the circuit board, an insulator constituting a frame, and leads passing through the insulator and making the end sections of the leads extending inward from the frame to carry the circuit board. CONSTITUTION:A hybrid integrated circuit board 10 is turned upside down so that its lower surface with lead lands 11 can face upward and a unit lead 40 is placed on the substrate 10 so that each side on the outer periphery of the board 10 can come into contact with the inside of each side of the frame 41 and the inner part 42a of each lead 42 of the unit lead 40 can correspond to each lead land 11. Then the parts 42a of the leads 42 are soldered to the lands 11 by pressing a heated soldering iron on the parts 42a. Namely, by pressing the soldering iron against the parts 42a, the solder on the lands 11 is melted and the parts 42a are soldered to the lands 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device in which unit leads are attached to a hybrid integrated circuit board and a method of manufacturing the same.

[0002]

2. Description of the Related Art When a circuit board, for example, a hybrid integrated circuit board is mounted on a parent circuit board to connect respective terminals to each other, clip leads have been conventionally used as connecting means. That is, the clip lead is attached to the lead land (terminal) of the hybrid integrated circuit board, and the clip lead and the wiring of the parent circuit board are soldered.

FIG. 9 is a perspective view showing how the clip leads 22 are attached to the hybrid integrated circuit board 10. Each of the F-shaped clip leads 22 has a clip portion 22a, and a set of five pieces is fixed in parallel to the insulating frame 21 at a constant interval to form the lead array 20. The intervals between the clip leads 22 correspond to the intervals between the lead lands 11 provided on the front and back surfaces of the end of the hybrid integrated circuit board 10.

The clip leads 22 are connected to the hybrid integrated circuit board 1
In the case of attaching to 0, as shown in the figure, four sets of lead arrays 20 are inserted in parallel from the four directions shown by the arrows to the respective sides of the hybrid integrated circuit board 10, and the respective clip leads 22 are inserted.
The clip portion 22a is fitted to the solder-dipped lead land 11 of the hybrid integrated circuit board 10.

The hybrid integrated circuit device has a circuit board 10
In order to protect the electronic components and electrodes provided on the above, they may be further molded with an insulating resin. Figure 10
Shows a method of molding electronic components and electrodes on the hybrid integrated circuit board 10 with an insulating resin. As shown in the figure, a rectangular frame 12 is placed on the hybrid integrated circuit board 10 so as to surround electronic components and electrodes, and the frame 12 is filled with a thermosetting insulating resin. Let it stand until the surface becomes flat and expose it to infrared rays and hot air to cure it.

FIG. 11 shows a method of attaching the hybrid integrated circuit board 10 to which the clip leads 22 are attached to the parent circuit board 30. After attaching the clip lead 22 to the hybrid integrated circuit board 10 as shown in FIG.
As shown in (b), the tip of each clip lead 22 is bent outward at a right angle and processed into a so-called gull wing shape.
Then, as shown in FIG. 11C, this is placed and fixed on the parent circuit board 30, and the clip lead 22 and each wiring of the parent circuit board 30 are connected.

[0007]

The conventional hybrid integrated circuit device described above requires steps for inserting the clip leads 22 from four directions. Even if the opposite sides are inserted at the same time in one step, at least two insertion steps are required, and there is a problem that it takes time and labor to attach the clip lead 22.

Further, since the clip portion 22a of the clip lead 22 is attached to the end portion of the hybrid integrated circuit board 10 so as to be sandwiched, the lead lands 11 of the hybrid integrated circuit board 10 are required on both front and back surfaces. For this reason, there is a problem in that wiring cannot be provided in the lead land region and the degree of integration of the circuit is limited.

Further, since the clip leads 22 are attached to the lead lands 11 of the hybrid integrated circuit board 10 by the solder dipping method, if the intervals between the clip leads 22 and the intervals between the lead lands 11 are not more than a certain value, there are two or more. There is a risk that molten solder will adhere to the clip leads 22 or the lead lands 11 and cause a solder short circuit. Therefore, the space between the clip leads 22 cannot be made narrower than a certain amount, and the pitch cannot be made narrow.

When an electronic component mounted on the hybrid integrated circuit board 10 is molded with an insulating resin, a space for mounting the frame 12 on the hybrid integrated circuit board 10 is required. And, electronic components cannot be arranged in this space. Therefore, there is a problem that the mounting area of the electronic component on the hybrid integrated circuit board 10 becomes narrow.

When an electronic component mounted on the hybrid integrated circuit board 10 is molded with an insulating resin, the frame 12 is placed on the hybrid integrated circuit board 10 so as to surround the electronic component. Since the mountable range is narrow, there is a problem that it is difficult to position the frame 12.

When an electronic component mounted on the hybrid integrated circuit board 10 is molded with an insulating resin, the frame 12 is placed on the hybrid integrated circuit board 10 and the frame 12 is filled with the insulating resin. However, since the leads are attached thereafter, there is a problem that the assembly process cannot be simplified.

It is an object of the present invention to provide a hybrid integrated circuit device which can be easily mounted on a circuit board, requires a small lead land area on the circuit board, and has a narrow pitch lead. And

Further, according to the present invention, the mounting area of the electronic parts to be mounted can be increased, the frame frame for molding the insulating resin can be easily aligned, and the hybrid integrated circuit device can be assembled in a simple process. It is also an object to provide a manufacturing method.

[0015]

In order to solve the above problems, the present invention comprises a circuit board, an insulator forming a frame, and leads penetrating the insulator,
Provided is a hybrid integrated circuit device in which ends of leads projecting inward of a frame-like frame carry a circuit board.

A plurality of leads may be provided on all four sides of the frame, or a plurality of leads may be provided on only one pair of two opposite sides. In addition, the space surrounded by the frame-shaped frame and the main surface of the circuit board may be filled with an insulating resin, or a plate-like body may be attached to the opening of the frame-shaped frame to form the frame-shaped frame and the main surface of the circuit board. The space surrounded by and may be closed. In the latter case, a step may be formed on the inner edge portion of the upper surface of the frame-shaped frame, and the plate-shaped body may be supported by this step.

In this hybrid integrated circuit device, the process of holding the leads by the frame-like frame and the circuit board mounted on the frame-like frame so that both ends are projected from the outer peripheral surface and the inner peripheral surface of the frame-like frame, respectively. It can be manufactured by a process of inserting and mounting the leads on the leads protruding from the inner peripheral surface of the frame-like frame and a process of connecting the leads to the circuit board all together.

[Action]

In the hybrid integrated circuit device of the present invention, the lead land is composed of the solder layer itself, or the lead land is pre-soldered so that the lead land is placed on the inner lead and heat is applied from above. If the soldering iron is applied, the soldering can be easily performed, and the work becomes extremely easy. Therefore, the solder dipping process is unnecessary, and the pitch between the leads can be made narrower than in the conventional case.

Further, in the hybrid integrated circuit device of the present invention, the frame-shaped frame and the circuit board are structurally structured by filling the space surrounded by the frame-shaped frame and the main surface of the circuit board with an insulating resin. The integrated structure improves strength, and protects electronic components and electrodes on the circuit board from external moisture, dust, or a conductor that causes a short-circuit accident.

Further, in the hybrid integrated circuit device of the present invention, since the frame-like frame is not mounted on the circuit board, the mounting area of the electronic parts is not sacrificed and the frame frame need not be aligned.

Further, in the hybrid integrated circuit device of the present invention, the plate-like body is mounted in the opening of the frame-like frame, and the space surrounded by the frame-like frame and the main surface of the circuit board is closed, whereby The same effect as can be obtained. Further, when the plate-shaped body is mounted on the frame-shaped frame, a stepped portion is formed in advance on the inner edge portion of the upper surface of the frame-shaped frame, and the plate-shaped body is supported by the stepped portion, so that the plate-shaped body can be easily formed. It is possible to attach it to, and work efficiency can be improved.

Further, in the hybrid integrated circuit device according to the present invention, the unit leads are attached to the circuit board by fitting the circuit board into the frame-like frame so that the lead is exposed on the inner side of the frame-like frame, that is, the inner lead. Since it is carried out as it is placed, the attaching process only needs to be done once, and the work is extremely simple. Further, since the circuit board is placed and supported on the inner leads, the lead lands need only be provided on one surface of the circuit board, and need not be provided on both front and back surfaces.

[0023]

Embodiments of the present invention will now be described in detail with reference to the drawings. 1 is a perspective view of a hybrid integrated circuit device according to a first embodiment of the present invention. As shown in the figure, the hybrid integrated circuit device includes a hybrid integrated circuit board 10 and a unit lead 40 carrying the hybrid integrated circuit board 10.
The hybrid integrated circuit device is mounted on the parent circuit board 30.

The hybrid integrated circuit board 10 is composed of a rectangular plate-like body, and has a large number of electronic components and circuit patterns (not shown) on one surface (upper surface in the figure), and a plurality of electronic parts and circuit patterns on the other surface. Lead lands 11 are provided at predetermined intervals (see FIG. 3). The lead land 11 is composed of a solder layer obtained by printing high temperature solder in a predetermined pattern and then performing reflow.

The unit lead 40 is, as shown in FIG. 2, a frame-shaped frame 4 made of an insulating resin having heat resistance.
1 and a plurality of leads 4 penetrating the frame-shaped frame 41
It consists of 2. The frame-shaped frame 41 has a rectangular shape corresponding to the shape of the outer periphery of the hybrid integrated circuit board 10 to be mounted, and leads 42 penetrate through the respective sides of the frame-shaped frame 41 in the inner and outer directions.

The inner leads 42a of the leads 42 protruding inside the frame-like frame 41 carry the hybrid integrated circuit board 10 and are soldered to the lead lands 11 of the hybrid integrated circuit board 10. The outer leads 42b of the leads 42 protruding to the outside of the frame-like frame 41 are formed in a gull wing shape and soldered to the wiring of the parent circuit board 30.

Next, specific steps for fixing the unit lead 40 of this embodiment to the hybrid integrated circuit board 10 will be described.
This will be described with reference to FIG.

The hybrid integrated circuit board 10 is turned upside down so that the lower surface on which the lead lands 11 are formed faces upward, and the unit lead 40 is mounted thereon. At that time, each side of the outer periphery of the hybrid integrated circuit board 10 is in contact with the inside of each side of the frame 41 of the unit lead 40, and each inner lead 4 of the unit lead 40 is provided on each lead land 11.
Place 2a so that they correspond.

The plurality of inner leads 42a of the unit lead 40 are cut from those which were integrally formed with the frame-shaped metal member at the beginning of production. The outer lead 42b is not formed into a gull wing shape at this point.

Next, apply the heated soldering iron 50 from above,
The lead land 11 and the inner lead 42a are soldered. The soldering iron 50 used here has a hollow inside so that the iron portion 51 on the bottom surface only hits the portion where the inner lead 42a is located so as not to hit the circuit body inside the hybrid integrated circuit board 10. It is in the form of a frame.

A soldering iron 5 having such an iron portion 51
The inner lead 42a is pressed against the lead land 11 by applying 0 from above, the solder of the lead land 11 is melted, and the inner lead 42a and the lead land 11 are soldered and fixed. Further, the above soldering may be performed by reflow.

In FIG. 4, the hybrid integrated circuit board 10 to which the unit leads 40 are attached as described above is used as the parent circuit board 3.
The method of attaching to 0 is shown. After attaching the unit lead 40 to the hybrid integrated circuit 10 as shown in FIG.
As shown in FIG. 4B, the outer lead 42b of each lead 42 is bent into a crank shape and processed into a so-called gull wing shape. Then, as shown in FIG. 4C, this is placed on the parent circuit board 30 and fixed, and the unit lead 4
0 and the wiring of the parent circuit board 30 are connected by soldering or the like.

FIG. 5 shows a unit lead used in the second embodiment of the present invention. In this embodiment, a plurality of leads 42 are provided only on two facing sides of any one of the four sides of the frame 41, and the other configurations are the same as those of the first embodiment described above. Further, it can be attached to the parent circuit board 30 by the same steps as in the first embodiment.

FIG. 6 shows a third embodiment of the present invention. In the hybrid integrated circuit device of this example, the height of the frame-shaped frame 41 is made larger than that of the hybrid integrated circuit device described in the first embodiment, and the hybrid integrated circuit substrate 10 is carried on the inner leads 42a. In this state, the mounted electronic parts are set to fit in the frame-like frame 41. After that, in the space surrounded by the frame-like frame 41, a thermosetting insulating resin 60 made into a paste (for example, epoxy-based or phenol-based)
Was charged, and the insulating resin 60 was allowed to stand until the surface became flat, and then exposed to infrared rays and hot air to be cured. In addition, here, the insulating resin 60 is cured in the frame-shaped frame 41.
If it is flush with the opening, the unevenness is reduced and handling such as transportation becomes easier.

FIG. 7 shows a fourth embodiment of the present invention. In the hybrid integrated circuit device of this example, the height of the frame-shaped frame 41 is made larger than that of the hybrid integrated circuit device described in the first embodiment, and the hybrid integrated circuit substrate 10 is carried on the inner leads 42a. In this state, the mounted electronic parts are set to fit in the frame-like frame 41. In addition, a stepped notch 43 is provided in advance over the inner edge of the opening of the frame-shaped frame 41. Subsequently, a plate-like body 61 made of an insulating resin and having the same shape as the contour of the inner edge of the frame-like frame 41 is prepared,
After applying the adhesive to the end surface of the plate-shaped body 61, this was supported on the surface below the notch 43 of the frame-shaped frame 41 and left for a while to be mounted on the frame-shaped frame 41. The above work is the third
Compared to the example, the process could be completed in a short time because there was no process of filling and curing the insulating resin 60.

The plate-shaped body 61 is attached to the frame-shaped frame 41 by previously forming grooves on two opposing inner surfaces of the frame-shaped frame 41 without using an adhesive.
It is also possible to fit the edge of the plate-shaped body into the groove.

[0037]

According to the present invention, there is an effect that it can be easily attached to a circuit board, a lead land area of the board is small, and a narrow pitch lead can be formed.

Further, according to the present invention, the mounting area of the electronic component is widened and the frame-shaped frame can be easily aligned,
This has the effect of simplifying the assembly process.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a hybrid integrated circuit device showing a first embodiment of the present invention is fixed on a mother circuit board 30. FIG.

FIG. 2 is a perspective view showing an example of a unit lead used in the first embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a state in which a unit lead 40 is soldered to the hybrid integrated circuit board 10.

FIG. 4 is a process diagram showing a method of attaching the hybrid integrated circuit board 10 having the unit leads 40 attached to the parent circuit board 30, wherein (a) shows the unit leads 40 attached to the hybrid integrated circuit 10 and then (b). Shows the outer lead 42b of each lead 42 bent into a crank shape, and (c) shows the outer lead 42b after being placed and fixed on the parent circuit board 30.

FIG. 5 is a perspective view showing an example of a unit lead used in a second embodiment of the present invention.

FIG. 6 is a sectional view showing a third embodiment of the present invention.

FIG. 7 is a sectional view showing a fourth embodiment of the present invention.

FIG. 8 is a perspective view showing an example of a unit lead used in a fourth embodiment of the present invention.

9 is a perspective view showing how the clip lead 22 is attached to the hybrid integrated circuit board 10. FIG.

FIG. 10 is a perspective view showing a method of molding electronic components and electrodes on the hybrid integrated circuit board 10 with an insulating resin.

FIG. 11 is a process chart showing a method of attaching the hybrid integrated circuit board 10 with the clip leads 22 attached to the parent circuit board 30, wherein (a) shows the clip leads 22 attached to the hybrid integrated circuit 10 and then (b). As shown in FIG. 4, after the tips of the clip leads 22 are bent outward at a right angle, (c) the clip leads 22 are placed and fixed on the parent circuit board 30.

[Explanation of symbols]

 10 Hybrid Integrated Circuit Board 11 Lead Land 12 Frame Frame 20 Lead Array 21 Insulating Frame 22 Grip Lead 22a Grip Part 30 Parent Circuit Board 40 Unit Lead 41 Frame Frame 42 Lead 42a Inner Lead 42b Outer Lead 43 Notch 50 Soldering Iron 51 Trowel part 60 Insulating resin 61 Plate

Claims (6)

[Claims] 1. A circuit board, an insulator forming a frame-shaped frame, and leads penetrating the insulator are provided, and the ends of the leads projecting inside the frame-shaped frame carry the circuit board. A hybrid integrated circuit device characterized in that 2. The hybrid integrated circuit device according to claim 1, wherein a plurality of the leads are provided on all sides of the frame-like frame or on any one of two opposite sides of the frame. 3. The hybrid integrated circuit device according to claim 1, wherein a space surrounded by the frame-shaped frame and the main surface of the circuit board is filled with an insulating resin. 4. The hybrid integrated circuit according to claim 1, wherein a plate-shaped body is attached to the opening of the frame-shaped frame to close the space surrounded by the frame-shaped frame and the main surface of the circuit board. apparatus. 5. A step is formed at an inner edge portion of an upper surface of the frame-shaped frame, and the plate-like body is supported by the step.
The hybrid integrated circuit device according to. 6. A process of holding a lead by a frame-shaped frame so that both ends thereof are respectively projected from the outer peripheral surface and the inner peripheral surface of the frame-shaped frame, and a circuit board is inserted into the frame-shaped frame to form the frame-shaped frame. 6. The method for manufacturing the hybrid integrated circuit device according to claim 1, further comprising a step of mounting the leads on the inner peripheral surface of the frame and a step of connecting the leads to the circuit board at a time.