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JPH06112252A - Pt-alloy extrafine wire for semiconductor element - Google Patents

Pt-alloy extrafine wire for semiconductor element

Info

Publication number
JPH06112252A
JPH06112252A JP4262212A JP26221292A JPH06112252A JP H06112252 A JPH06112252 A JP H06112252A JP 4262212 A JP4262212 A JP 4262212A JP 26221292 A JP26221292 A JP 26221292A JP H06112252 A JPH06112252 A JP H06112252A
Authority
JP
Japan
Prior art keywords
wire
alloy
added
executed
high temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4262212A
Other languages
Japanese (ja)
Other versions
JP3074626B2 (en
Inventor
Kazumitsu Itabashi
一光 板橋
Takeshi Kujiraoka
毅 鯨岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP04262212A priority Critical patent/JP3074626B2/en
Publication of JPH06112252A publication Critical patent/JPH06112252A/en
Application granted granted Critical
Publication of JP3074626B2 publication Critical patent/JP3074626B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/45169—Platinum (Pt) as principal constituent
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a Pt-alloy extrafine wire, for semiconductor element use, wherein it enhances the high-temperature strength of a Pt extrafine wire, it lowers the incidence of an A-point exfoliation in a high-temperature shelf test and it is extremely useful for a wire bonding method and a bump connecting method. CONSTITUTION:One kind or two kinds out of Au and Pd are added to high- purity Pt at a total addition amount of 0.01 to 10wt.%, one kind or two kinds out of Ru and Rh are added to it at 0.01 to 1wt.%, one kind or two or more kinds out of Be, Ge, Ca, Si, Fe, So, Y and rare-earth elements at 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is molded.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体素子のチップ電
極と基板上の外部リードとを接続するために用いられる
半導体素子用Ｐｔ合金極細線、特にワイヤボンディング
法及びバンプ接続法に好適なものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Pt alloy ultrafine wire for semiconductor devices used for connecting a chip electrode of a semiconductor device and an external lead on a substrate, and particularly suitable for a wire bonding method and a bump connecting method. Regarding

【０００２】[0002]

【従来の技術】従来から、例えばキャピラリーの先端に
垂下せしめた合金ワイヤの先端を電気トーチにより溶融
させてボールを形成し、このボールをチップ上のＡｌ又
はＡｌ合金からなる電極に圧着・切断してバンプ電極を
形成するバンプ接続法や、前記ボールをチップ電極に圧
着，接合せしめた後、ループ状に外部リードまで導いて
該外部リードに圧着・切断することにより、チップ電極
と外部リードを接続させるワイヤボンディング法が知ら
れている。また、この種ボンディングに用いるに有用な
合金ワイヤとして、特公昭６２−４３５４０号に開示さ
れるような、高純度ＰｔからなるＰｔワイヤがある。2. Description of the Related Art Conventionally, for example, the tip of an alloy wire suspended from the tip of a capillary is melted by an electric torch to form a ball, and the ball is pressure-bonded and cut to an electrode made of Al or Al alloy on a chip. To connect the chip electrode to the external lead by a bump connection method of forming a bump electrode by pressing, or after the ball is pressure-bonded and bonded to the chip electrode, then led to the external lead in a loop shape and pressure-bonded / cut to the external lead. A known wire bonding method is known. Further, as an alloy wire useful for this type of bonding, there is a Pt wire made of high-purity Pt as disclosed in Japanese Patent Publication No. 62-43540.

【０００３】[0003]

【発明が解決しようとする課題】しかし乍ら、上記従来
のＰｔワイヤでは高温強度が弱く、所定のボンディング
強度が得られない欠点があると共に、Ｐｔの純度が高す
ぎることから、チップ上のＡｌ電極とボールとの接合面
（即ち、Ａ点）におけるＰｔとＡｌの相互拡散が過剰に
なり、接合強度の低下が生じる結果、ボンディング後の
高温放置試験におけるＡ点剥がれの発生率が高くなると
いう不具合があった。However, the above-mentioned conventional Pt wire has a drawback that the high temperature strength is weak and a predetermined bonding strength cannot be obtained, and the purity of Pt is too high. It is said that the mutual diffusion of Pt and Al at the joint surface between the electrode and the ball (that is, the point A) becomes excessive and the joint strength is reduced, resulting in a higher incidence of peeling at the point A in the high temperature storage test after bonding. There was a problem.

【０００４】本発明はこのような従来事情に鑑みてなさ
れたものであり、その目的とするところは、所定の高温
強度が得られると共に、ボンディング後の高温放置試験
でＡ点剥がれが発生する虞れのない、信頼性の高い半導
体素子用Ｐｔ合金極細線を提供することである。The present invention has been made in view of the above conventional circumstances, and an object thereof is to obtain a predetermined high temperature strength and to cause peeling of point A in a high temperature standing test after bonding. It is an object of the present invention to provide a highly reliable Pt alloy extra fine wire for a semiconductor device.

【０００５】[0005]

【課題を解決するための手段】以上の目的を達成するた
めに、本発明の半導体素子用Ｐｔ合金極細線は、Ａｕ，
Ｐｄの内の１種又は２種を総添加量で０．０１〜１０wt
％含有し、残部Ｐｔからなることを特徴とする。In order to achieve the above object, a Pt alloy extra fine wire for a semiconductor device of the present invention comprises Au,
0.01-10 wt% of Pd in total of 1 or 2
%, And the balance is Pt.

【０００６】また、後述の理由から、上記の配合にＲ
ｕ，Ｒｈの内から１種又は２種を０．０１〜１wt％含有
せしめること、さらには、前記の配合にＢｅ，Ｇｅ，Ｃ
ａ，Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素の中から１種又
は２種以上を０．０００１〜０．００５wt％含有せしめ
ることが有用である。For the reasons described below, R is added to the above composition.
One or two of u and Rh should be contained in an amount of 0.01 to 1 wt%, and further, Be, Ge, C may be added to the above composition.
It is useful to contain 0.0001 to 0.005 wt% of one or more of a, Si, Fe, Sc, Y and rare earth elements.

【０００７】[0007]

【作用】上記の構成によれば、Ａｕ，ＰｄはＰｔに全率
固溶し、高温強度の高いＰｔ合金ワイヤを形成する。同
時に、その添加総量を０．０１〜１０wt％の範囲内とし
たことから、ボールとチップ電極の下地金属層との接合
面におけるＰｔとＡｌの相互拡散を適度に抑止し、該接
合面、即ち、Ａ点における接合強度が改善される。According to the above structure, Au and Pd all form a solid solution in Pt to form a Pt alloy wire having high strength at high temperature. At the same time, since the total addition amount is within the range of 0.01 to 10 wt%, the interdiffusion of Pt and Al at the joint surface between the ball and the base metal layer of the chip electrode is appropriately suppressed, and the joint surface, that is, , The bonding strength at points A is improved.

【０００８】また、Ｒｕ，Ｒｈを添加することで、前記
Ｐｔ合金における結晶の粗粒化（粒子の粗大化）を防止
し、ワイヤの高温強度をさらに向上させる。Further, by adding Ru and Rh, coarsening of crystals (coarsening of grains) in the Pt alloy is prevented, and the high temperature strength of the wire is further improved.

【０００９】さらに、Ｂｅ，Ｇｅ，Ｃａ，Ｓｉ，Ｆｅ，
Ｓｃ，Ｙ，希土類元素の添加により、前記結晶の粗粒化
防止をより促進し、さらに高レベルな高温強度を得る。Further, Be, Ge, Ca, Si, Fe,
The addition of Sc, Y, and a rare earth element further promotes the prevention of coarsening of the crystal and obtains a higher level high temperature strength.

【００１０】しかし乍ら、Ａｕ，Ｐｄ、Ｒｕ，Ｒｈ、Ｂ
ｅ，Ｇｅ，Ｃａ，Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素の
各添加量が上記添加範囲の下限未満では、上述の効果を
得ることができない。However, Au, Pd, Ru, Rh, B
If the addition amount of each of e, Ge, Ca, Si, Fe, Sc, Y and the rare earth element is less than the lower limit of the above addition range, the above effect cannot be obtained.

【００１１】また、Ａｕ，Ｐｄの添加量が１０wt％を越
えると、ワイヤ先端に形成するボールが硬くなり過ぎ、
ボンディング時においてチップ割れが生じるので好まし
くない。Ｒｕ，Ｒｈの添加量が１wt％を越えると、合金
形成時に偏析が生じ、伸線加工できないので好ましくな
い。Ｂｅ，Ｇｅ，Ｃａ，Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，希土類
元素の添加量が０．００５wt％を越えると、ワイヤ先端
に形成するボールの形状が不安定になり、ボンディング
時におけるボールとチップとの接合強度が低下する。If the amount of Au or Pd added exceeds 10 wt%, the ball formed at the tip of the wire becomes too hard,
It is not preferable because chip cracks occur during bonding. If the addition amount of Ru and Rh exceeds 1 wt%, segregation occurs during alloy formation and wire drawing cannot be performed, which is not preferable. If the addition amount of Be, Ge, Ca, Si, Fe, Sc, Y, or the rare earth element exceeds 0.005 wt%, the shape of the ball formed at the tip of the wire becomes unstable, and the ball and the chip during bonding become unstable. Bonding strength decreases.

【００１２】従って、Ａｕ，Ｐｄの添加量を０．０１〜
１０wt％の範囲に、Ｒｕ，Ｒｈの添加量を０．０１〜１
wt％の範囲に、Ｂｅ，Ｇｅ，Ｃａ，Ｓｉ，Ｆｅ，Ｓｃ，
Ｙ，希土類元素の添加量を０．０００１〜０．００５wt
％の範囲に、各々設定した。Therefore, the addition amount of Au and Pd is 0.01 to
The addition amount of Ru and Rh is 0.01 to 1 within the range of 10 wt%.
Be, Ge, Ca, Si, Fe, Sc,
Y, the amount of rare earth element added is 0.0001 to 0.005 wt
Each range was set to%.

【００１３】[0013]

【実施例】以下、具体的な実施例について説明する。EXAMPLES Specific examples will be described below.

【００１４】高純度Ｐｔに、Ａｕ，Ｐｄ，Ｒｕ，Ｒｈ，
Ｂｅ，Ｇｅ，Ｃａ、Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，Ｌａの各添
加元素を表１中に示す含有率に基づき添加して溶解鋳造
し、次に溝ロール加工を施し、その途中で焼なまし処理
を施した後に線引加工で線径２５μｍの母線に成形し、
更に十分な応力除去を行うことにより各試料とした。High-purity Pt contains Au, Pd, Ru, Rh,
Additive elements of Be, Ge, Ca, Si, Fe, Sc, Y and La are added based on the content rates shown in Table 1 and melt-cast, then groove roll processed and annealed in the middle. After the treatment, it is drawn into a bus bar with a wire diameter of 25 μm.
Further, sufficient stress relief was performed to obtain each sample.

【００１５】表１中の試料Ｎｏ．１〜８は高純度Ｐｔに
Ａｕ，Ｐｄの１種又は２種を添加した本発明実施品、試
料Ｎｏ．９〜１４は前記Ａｕ，Ｐｄの配合に加えてＲ
ｕ，Ｒｈの１種又は２種を添加した本発明実施品、試料
Ｎｏ．１５〜２６は前記Ａｕ，Ｐｄ，Ｒｕ，Ｒｈの配合
に加えて、Ｂｅ，Ｇｅ，Ｃａ，Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，
希土類元素（Ｌａ）の中から１種又は２種以上を添加し
た本発明実施品である。Sample No. 1 in Table 1 Samples Nos. 1 to 8 of the present invention in which one or two kinds of Au and Pd were added to high-purity Pt, Sample No. 9 to 14 are R in addition to the combination of Au and Pd.
u, Rh one or two kinds of the present invention, sample No. 15 to 26 are Be, Ge, Ca, Si, Fe, Sc, Y, in addition to the composition of Au, Pd, Ru, Rh.
It is a product of the present invention in which one or more of rare earth elements (La) are added.

【００１６】また、試料Ｎｏ．２７は高純度Ｐｔ（９
９．９６wt％）に何も添加しない比較品である。Sample No. 27 is high purity Pt (9
This is a comparative product in which nothing is added to 9.96 wt%).

【００１７】尚、表１では希土類元素の代表としてＬａ
のデータを示したが、これ以外の希土類元素はＬａと同
質性のため省略した。In Table 1, La is shown as a representative of rare earth elements.
However, the other rare earth elements are omitted because they are homogeneous with La.

【００１８】上記のようにして作製した各試料を熱処理
により所定の伸び率に合わせた後、高温強度及びＡ点剥
がれ発生率を測定した。Each of the samples prepared as described above was heat-treated to have a predetermined elongation, and then the high temperature strength and the A point peeling occurrence rate were measured.

【００１９】高温強度は、各試料を２５０℃×２０秒保
持後、標点間距離１００ｍｍにて引張速度１０ｍｍ／ｍ
ｉｎで引張り試験を行った時の破断荷重を測定した。The high-temperature strength was such that after holding each sample at 250 ° C. for 20 seconds, the tensile speed was 10 mm / m at a gauge length of 100 mm.
The breaking load was measured when the tensile test was performed in in.

【００２０】Ａ点剥がれ発生率は、各試料をＡｌ薄膜
（０．８μｍ厚）のチップ電極上に所定条件にてボンデ
ィングした後、Ａｌが拡散し易い高温条件下で放置し
（２００℃×３００時間）、その後にＣ点（ループ部）
を引張るプルテストを行って、ボンディングワイヤがチ
ップとの接合面から剥がれた割合を計算した。これらの
結果も表１中に示す。The occurrence rate of peeling at point A was determined by bonding each sample to a chip electrode of an Al thin film (0.8 μm thick) under predetermined conditions and then leaving it under high temperature conditions where Al was likely to diffuse (200 ° C. × 300). Time), then point C (loop part)
Was pulled to calculate the rate at which the bonding wire was peeled from the bonding surface with the chip. These results are also shown in Table 1.

【００２１】[0021]

【表１】 [Table 1]

【００２２】試料Ｎｏ．１〜８の測定結果から、高純度
ＰｔにＡｕ，Ｐｄの１種又は２種を、総添加量０．０１
〜１０wt％の範囲内で添加すれば、所定の高温強度が得
られると同時に、ボールとチップ電極の下地金属層との
接合面（Ａ点）において剥がれが発生せず、該接合面に
おける接合強度が改善されることが確認できた。Sample No. From the measurement results of 1 to 8, 1 or 2 kinds of Au and Pd were added to high-purity Pt in a total addition amount of 0.01
If added within the range of 10 wt%, a predetermined high temperature strength can be obtained, and at the same time, peeling does not occur at the joint surface (point A) between the ball and the underlying metal layer of the chip electrode, and the joint strength at the joint surface is high. Was confirmed to be improved.

【００２３】また、試料Ｎｏ．９〜１４の測定結果か
ら、０．０１〜１０wt％のＡｕ，Ｐｄの添加に加えて、
Ｒｕ，Ｒｈの１種又は２種を所定量添加すれば、上記高
温強度をさらに向上できることが確認できた。Sample No. From the measurement results of 9 to 14, in addition to the addition of 0.01 to 10 wt% Au and Pd,
It was confirmed that the high temperature strength can be further improved by adding a predetermined amount of one or two of Ru and Rh.

【００２４】さらに、試料Ｎｏ．１５〜２６の測定結果
から、０．０１〜１０wt％のＡｕ，Ｐｄの添加、０．０
１〜１wt％のＲｕ，Ｒｈの添加に加えて、Ｂｅ，Ｇｅ，
Ｃａ，Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素の中から１種
又は２種以上を所定量添加すれば、上記高温強度をより
高レベルなものにし得ることが確認できた。Further, the sample No. From the measurement results of 15 to 26, addition of 0.01 to 10 wt% of Au and Pd, 0.0
In addition to the addition of 1 to 1 wt% of Ru and Rh, Be, Ge,
It was confirmed that the high temperature strength can be increased to a higher level by adding a predetermined amount of one or more selected from Ca, Si, Fe, Sc, Y and rare earth elements.

【００２５】また、試料Ｎｏ．２７の測定結果から、高
純度ＰｔにＡｕ，Ｐｄ，Ｒｕ，Ｂｅ，Ｇｅ，Ｃａ，Ｓ
ｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素を添加しない場合は、
所定の高温強度が得られないと共に、Ａ点剥がれの発生
率が高いことが確認できた。Sample No. From the measurement results of 27, high purity Pt was added to Au, Pd, Ru, Be, Ge, Ca, S.
When i, Fe, Sc, Y and rare earth elements are not added,
It was confirmed that the predetermined high temperature strength could not be obtained and that the occurrence rate of A point peeling was high.

【００２６】[0026]

【発明の効果】本発明に係る半導体素子用Ｐｔ合金極細
線は以上説明したように、高純度ＰｔにＡｕ，Ｐｄを添
加することで、ワイヤの高温強度向上を図ると同時に、
ボンディング後の高温放置試験におけるＡ点剥がれの発
生率を著しく低下し得た。As described above, in the Pt alloy ultrafine wire for semiconductor device according to the present invention, by adding Au and Pd to high-purity Pt, the high temperature strength of the wire is improved and at the same time,
The incidence of peeling at point A in the high temperature storage test after bonding could be significantly reduced.

【００２７】従って、ボンディング後において所定の高
温強度を得られると共に、ボールとチップ電極の接合強
度を著しく改善して、ワイヤボンディング法及びバンプ
接続法に用いるに極めて有用な半導体素子用Ｐｔ合金極
細線を提供できた。Therefore, a predetermined high temperature strength can be obtained after bonding, and the bonding strength between the ball and the chip electrode can be remarkably improved, which is extremely useful for the wire bonding method and the bump connecting method for the semiconductor element Pt alloy ultrafine wire. Could be provided.

【００２８】また、Ｒｕ，Ｒｈの添加によって上記高温
強度をより向上し得、さらには、Ｂｅ，Ｇｅ，Ｃａ，Ｓ
ｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素を添加することで、よ
り高レベルな高温強度を得ることができた。The high temperature strength can be further improved by adding Ru and Rh, and further, Be, Ge, Ca and S can be added.
By adding i, Fe, Sc, Y and a rare earth element, a higher level high temperature strength could be obtained.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】Ａｕ，Ｐｄの内の１種又は２種を総添加量
０．０１〜１０wt％含有し、残部Ｐｔからなる半導体素
子用Ｐｔ合金極細線。1. A Pt alloy extra fine wire for a semiconductor device, which contains one or two kinds of Au and Pd in a total amount of 0.01 to 10 wt% and the balance is Pt. 【請求項２】 Ａｕ，Ｐｄの内の１種又は２種を総添加
量０．０１〜１０wt％含有すると共に、Ｒｕ，Ｒｈの内
から１種又は２種を０．０１〜１wt％含有し、残部Ｐｔ
からなる半導体素子用Ｐｔ合金極細線。2. One or two kinds of Au and Pd are contained in a total amount of 0.01 to 10 wt% and one or two kinds of Ru and Rh are contained in 0.01 to 1 wt%. , Balance Pt
An ultrafine Pt alloy wire for a semiconductor device. 【請求項３】 Ａｕ，Ｐｄの内の１種又は２種を０．０
１〜１０wt％、Ｒｕ，Ｒｈの内から１種又は２種を０．
０１〜１wt％夫々含有すると共に、Ｂｅ，Ｇｅ，Ｃａ，
Ｓｉ，Ｆｅ，Ｓｃ，Ｙ，希土類元素の中から１種又は２
種以上を０．０００１〜０．００５wt％含有し、残部Ｐ
ｔからなる半導体素子用Ｐｔ合金極細線。3. One or two of Au and Pd is 0.0
1 to 10 wt%, and one or two of Ru and Rh is added to 0.
01 to 1 wt% of each, Be, Ge, Ca,
One or two of Si, Fe, Sc, Y and rare earth elements
0.0001-0.005 wt% of seeds or more, balance P
A Pt alloy extra fine wire for a semiconductor element, which is composed of t.
JP04262212A 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices Expired - Fee Related JP3074626B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04262212A JP3074626B2 (en) 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04262212A JP3074626B2 (en) 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices

Publications (2)

Publication Number Publication Date
JPH06112252A true JPH06112252A (en) 1994-04-22
JP3074626B2 JP3074626B2 (en) 2000-08-07

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
WO2010110746A1 (en) * 2009-03-26 2010-09-30 Autium Pte Ltd Platinum alloys and method for forming the same
JP2017145480A (en) * 2016-02-19 2017-08-24 石福金属興業株式会社 Platinum palladium rhodium alloy
CN113241303A (en) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 Packaging bonding platinum wire and preparation method thereof
JP2023088265A (en) * 2021-12-14 2023-06-26 ニヴァロックス－ファー ソシエテ アノニム Platinum alloy

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
WO2010110746A1 (en) * 2009-03-26 2010-09-30 Autium Pte Ltd Platinum alloys and method for forming the same
JP2017145480A (en) * 2016-02-19 2017-08-24 石福金属興業株式会社 Platinum palladium rhodium alloy
CN113241303A (en) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 Packaging bonding platinum wire and preparation method thereof
JP2023088265A (en) * 2021-12-14 2023-06-26 ニヴァロックス－ファー ソシエテ アノニム Platinum alloy

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