JPH0592450A - Transfer molds and molded products with igi ectapine - Google Patents
Transfer molds and molded products with igi ectapineInfo
- Publication number
- JPH0592450A JPH0592450A JP25560591A JP25560591A JPH0592450A JP H0592450 A JPH0592450 A JP H0592450A JP 25560591 A JP25560591 A JP 25560591A JP 25560591 A JP25560591 A JP 25560591A JP H0592450 A JPH0592450 A JP H0592450A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- ejector pin
- flash
- convex portion
- pin hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001721 transfer moulding Methods 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
- B29C2045/0036—Submerged or recessed burrs
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】
【目的】成形品の平坦部にイジェクタピンによるばりが
あっても、他の部品の取付けや、ラベルの貼付や、印刷
を確実に行えるようにする。
【構成】トランスファ成形金型の金型本体１の平坦部に
は、凸部１１が設けられる。この凸部１１に設けられる
ピン穴２にイジェクタピン３が嵌め込まれる。このため
金型本体１の凸部１１に対応する成形品４の凹部に、ピ
ン穴２に対応するばり５が形成される。しかしこのばり
５の高さは前記凹部の深さより充分に小さくでき、成形
品４の平坦部より突出することがない。このため、ばり
５は他の部品の取付けや、ラベルの貼付や、印刷を全く
阻害しない。
(57) [Summary] [Purpose] Even if there is a flash due to an ejector pin on the flat part of a molded product, it is possible to reliably mount other parts, attach labels, and print. [Constitution] A convex portion 11 is provided on a flat portion of a die main body 1 of a transfer molding die. The ejector pin 3 is fitted into the pin hole 2 provided in the convex portion 11. Therefore, the flash 5 corresponding to the pin hole 2 is formed in the concave portion of the molded product 4 corresponding to the convex portion 11 of the mold body 1. However, the height of the flash 5 can be made sufficiently smaller than the depth of the recess, so that it does not protrude from the flat portion of the molded product 4. Therefore, the flash 5 does not interfere with the attachment of other parts, the attachment of labels, and the printing at all.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、イジェクタピンを備
えるトランスファ成形金型及び成形品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer molding die provided with an ejector pin and a molded product.
【０００２】[0002]
【従来の技術】図２は従来例の部分断面図である。金型
本体２１の平坦部に設けられるピン穴２にイジェクタピ
ン３が嵌め込まれている。この金型本体２１で成形され
た成形品４１は、前記ピン穴２に対応する部分に、ばり
５１が形成されやすい。2. Description of the Related Art FIG. 2 is a partial sectional view of a conventional example. The ejector pin 3 is fitted into the pin hole 2 provided in the flat portion of the mold body 21. In the molded product 41 molded by the mold body 21, the flash 51 is easily formed in the portion corresponding to the pin hole 2.
【０００３】[0003]
【発明が解決しようとする課題】前記の従来例では、成
形品４１の平坦部に他の部品を取付けたり、ラベル等を
貼り付けようとすると、前記ばり５１が阻害して、他の
部品が取付かなかったり、取付いても正確に取付かなか
ったりし、ラベル等がうまく貼り付かなかったりする。
またイジェクタピン３に対応する凹部に印刷されないの
を承知のうえで成形品４１の平坦部にスタンプで印刷し
ようとすると、ばり５１の外周のかなりの領域も印刷が
されなかったり、不鮮明であったりする。In the above-mentioned conventional example, when another part is attached to the flat part of the molded product 41 or a label or the like is attached, the burr 51 interferes with the operation of the other part. It may not be attached, or even if it is attached, it may not be attached correctly, or the label etc. may not stick well.
Further, when printing is attempted on the flat portion of the molded product 41 by stamping, knowing that the recessed portion corresponding to the ejector pin 3 is not printed, a considerable area on the outer periphery of the flash 51 is not printed or is unclear. To do.
【０００４】この発明の目的は、平坦部にイジェクタピ
ンによるばりがあっても、他の部品の取付けや、ラベル
の貼付や、印刷を確実に行えるイジェクタピンを備える
トランスファ成形金型及び成形品を提供することにあ
る。An object of the present invention is to provide a transfer molding die and a molded product provided with an ejector pin capable of reliably attaching other parts, attaching a label, and printing even if the flat portion has a flash due to the ejector pin. To provide.
【０００５】[0005]
【課題を解決するための手段】発明１のイジェクタピン
を備えるトランスファ成形金型は、金型本体の平坦部に
設けられる凸部と、この凸部に設けられるピン穴と、こ
のピン穴に嵌め込まれるイジェクタピンとからなるもの
である。このとき発明２は、前記イジェクタピンの先端
を前記凸部からわずかに突出した状態で成形を行うもの
である。そして発明３の成形品は、成形時にイジェクタ
ピンが当接する当接部を平坦部に有する成形品におい
て、前記当接部及びその周囲が前記平坦部の表面より凹
んでいるものである。[MEANS FOR SOLVING THE PROBLEMS] A transfer molding die having an ejector pin according to the first aspect of the present invention is provided with a convex portion provided in a flat portion of a die body, a pin hole provided in the convex portion, and a pin hole fitted in the pin hole. It is composed of ejector pins. At this time, the second aspect of the invention is to perform molding with the tip of the ejector pin slightly protruding from the convex portion. The molded product of the invention 3 is a molded product having a flat portion with a contact portion with which the ejector pin abuts during molding, and the contact portion and its periphery are recessed from the surface of the flat portion.
【０００６】[0006]
【作用】図１を参照する。金型本体１の凸部１１に対応
する成形品４の凹部に、ピン穴２に対応するばり５が形
成されるが、このばり５の高さは前記凹部の深さより充
分に小さくでき、成形品４の平坦部より突出することが
ない。このため、ばり５は他の部品の取付けや、ラベル
の貼付や、印刷を全く阻害しない。Operation: Referring to FIG. The burrs 5 corresponding to the pin holes 2 are formed in the concave portions of the molded product 4 corresponding to the convex portions 11 of the mold body 1. The height of the burrs 5 can be made sufficiently smaller than the depth of the concave portions. It does not protrude from the flat part of the product 4. Therefore, the flash 5 does not hinder the attachment of other parts, the attachment of labels, and the printing at all.
【０００７】[0007]
【実施例】図１は実施例の部分断面図であり、従来例と
同一符号をつけるものはおよそ同一機能を持ち、重複説
明を省くこともある。金型本体１の平坦部には、凸部１
１が設けられる。この凸部１１の中央部に設けられるピ
ン穴２にイジェクタピン３が嵌め込まれる。このため金
型本体１の凸部１１に対応する成形品４の凹部に、ピン
穴２に対応するばり５が形成されるが、このばり５の高
さは前記凹部の深さより充分に小さくでき、成形品４の
平坦部より突出することがない。このため、ばり５は他
の部品の取付けや、ラベルの貼付や、印刷を全く阻害し
ない。FIG. 1 is a partial cross-sectional view of an embodiment, in which the parts denoted by the same reference numerals as those of the conventional example have approximately the same function, and duplicate explanation may be omitted. The convex portion 1 is provided on the flat portion of the mold body 1.
1 is provided. The ejector pin 3 is fitted into the pin hole 2 provided at the center of the convex portion 11. Therefore, a flash 5 corresponding to the pin hole 2 is formed in the recess of the molded product 4 corresponding to the projection 11 of the mold body 1. The height of the flash 5 can be made sufficiently smaller than the depth of the recess. , Does not protrude from the flat portion of the molded product 4. Therefore, the flash 5 does not interfere with the attachment of other parts, the attachment of labels, and the printing at all.
【０００８】[0008]
【発明の効果】この発明群のイジェクタピンを備えるト
ランスファ成形金型及び成形品は、金型本体の平坦部に
設けられる凸部と、この凸部に設けられるピン穴と、こ
のピン穴に嵌め込まれるイジェクタピンとからなる成形
金型及びこれにより成形される成形品である。このため
ピン穴に対応するばりは、成形品の平坦部より突出する
ことがなく、平坦部への他の部品の取付けや、ラベルの
貼付や、印刷を確実に行えるという効果がある。EFFECTS OF THE INVENTION A transfer molding die and a molded product provided with ejector pins according to the present invention are provided with a convex portion provided on a flat portion of a mold body, a pin hole provided on the convex portion, and a pin hole fitted into the convex portion. And a molded product formed by the same. Therefore, the burr corresponding to the pin hole does not protrude from the flat portion of the molded product, and there is an effect that other components can be attached to the flat portion, a label can be attached, and printing can be reliably performed.
【図１】実施例の部分断面図FIG. 1 is a partial sectional view of an embodiment.
【図２】従来例の部分断面図FIG. 2 is a partial sectional view of a conventional example.
１ 金型本体 ２ ピン穴 ３ イジェクタピン ４ 成形品 ５ ばり １１ 凸部 ２１ 金型本体 ４１ 成形品 ５１ ばり 1 Mold Main Body 2 Pin Hole 3 Ejector Pin 4 Molded Product 5 Burr 11 Convex 21 Mold Main Body 41 Molded Product 51 Burr
Claims (3)
の凸部に設けられるピン穴と、このピン穴に嵌め込まれ
るイジェクタピンとからなることを特徴とするイジェク
タピンを備えるトランスファ成形金型。1. A transfer molding die having an ejector pin, comprising a convex portion provided on a flat portion of a mold body, a pin hole provided on the convex portion, and an ejector pin fitted into the pin hole. Type.
ランスファ成形金型において、前記イジェクタピンの先
端を前記凸部からわずかに突出した状態で成形を行うこ
とを特徴とするイジェクタピンを備えるトランスファ成
形金型。2. A transfer molding die including an ejector pin according to claim 1, wherein molding is performed with the tip of the ejector pin slightly protruding from the convex portion. Mold.
を平坦部に有する成形品において、前記当接部及びその
周囲が前記平坦部の表面より凹んでいることを特徴とす
る成形品。3. A molded article having a flat portion with an abutting portion with which an ejector pin abuts during molding, wherein the abutting portion and its periphery are recessed from the surface of the flat portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25560591A JPH0592450A (en) | 1991-10-03 | 1991-10-03 | Transfer molds and molded products with igi ectapine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25560591A JPH0592450A (en) | 1991-10-03 | 1991-10-03 | Transfer molds and molded products with igi ectapine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0592450A true JPH0592450A (en) | 1993-04-16 |
Family
ID=17281057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25560591A Pending JPH0592450A (en) | 1991-10-03 | 1991-10-03 | Transfer molds and molded products with igi ectapine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0592450A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007307805A (en) * | 2006-05-18 | 2007-11-29 | Fuji Electric Device Technology Co Ltd | Semiconductor package manufacturing apparatus, semiconductor package manufacturing method, and semiconductor package |
| JP2008000995A (en) * | 2006-06-22 | 2008-01-10 | Nidec Sankyo Corp | Manufacturing method for bonded article made of resin, molding die, and resin bonded article |
| WO2010074032A1 (en) * | 2008-12-24 | 2010-07-01 | 株式会社フジクラ | Optical ferrule, die for molding optical ferrule, process for producing optical ferrule, and ferrule with optical fiber |
| JP2011192937A (en) * | 2010-03-17 | 2011-09-29 | Hitachi Automotive Systems Ltd | Electronic controller for vehicle |
| JP2011198985A (en) * | 2010-03-19 | 2011-10-06 | Hitachi Automotive Systems Ltd | Electronic control device for vehicle |
| EP2505333A1 (en) * | 2009-11-24 | 2012-10-03 | Fujikura, Ltd. | Injection molding die and resin molded product |
| US20150061189A1 (en) * | 2013-09-03 | 2015-03-05 | Sony Dadc Austria Ag | Microfluidic device |
| US10307967B2 (en) * | 2015-05-25 | 2019-06-04 | Canon Kabushiki Kaisha | Method for manufacturing liquid-ejecting head |
-
1991
- 1991-10-03 JP JP25560591A patent/JPH0592450A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007307805A (en) * | 2006-05-18 | 2007-11-29 | Fuji Electric Device Technology Co Ltd | Semiconductor package manufacturing apparatus, semiconductor package manufacturing method, and semiconductor package |
| JP2008000995A (en) * | 2006-06-22 | 2008-01-10 | Nidec Sankyo Corp | Manufacturing method for bonded article made of resin, molding die, and resin bonded article |
| WO2010074032A1 (en) * | 2008-12-24 | 2010-07-01 | 株式会社フジクラ | Optical ferrule, die for molding optical ferrule, process for producing optical ferrule, and ferrule with optical fiber |
| JP5213957B2 (en) * | 2008-12-24 | 2013-06-19 | 株式会社フジクラ | OPTICAL FERRULE, OPTICAL FERRULE MOLDING METHOD, OPTICAL FERRUL MANUFACTURING METHOD, AND FERRULE WITH OPTICAL FIBER |
| US8562225B2 (en) | 2008-12-24 | 2013-10-22 | Fujikura Ltd. | Optical ferrule, optical ferrule molding die, manufacturing method of optical ferrule, and ferrule with optical fiber |
| EP2505333A1 (en) * | 2009-11-24 | 2012-10-03 | Fujikura, Ltd. | Injection molding die and resin molded product |
| EP2505333A4 (en) * | 2009-11-24 | 2013-06-12 | Fujikura Ltd | Injection molding die and resin molded product |
| JP2011192937A (en) * | 2010-03-17 | 2011-09-29 | Hitachi Automotive Systems Ltd | Electronic controller for vehicle |
| JP2011198985A (en) * | 2010-03-19 | 2011-10-06 | Hitachi Automotive Systems Ltd | Electronic control device for vehicle |
| US20150061189A1 (en) * | 2013-09-03 | 2015-03-05 | Sony Dadc Austria Ag | Microfluidic device |
| US10160145B2 (en) * | 2013-09-03 | 2018-12-25 | STRATEC CONSUMABLES GmbH | Microfluidic device |
| US10307967B2 (en) * | 2015-05-25 | 2019-06-04 | Canon Kabushiki Kaisha | Method for manufacturing liquid-ejecting head |
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