JPH0574672U - Viscous fluid discharge device - Google Patents

Abstract

(57) [Summary] [Object] To provide a viscous fluid discharge device capable of finely adjusting the discharge amount of a viscous fluid. A flow rate adjusting mechanism 3 is provided below a syringe 2 containing a viscous fluid 1, and a nozzle 6 is connected to the lower portion thereof. In the flow rate adjusting mechanism 3, the opposing flow rate adjusting plates 3c and 3e are rotatably supported by a support body. Meshes 3d and 3f are provided on the flow rate adjusting plates 3c and 3e, respectively, and the meshes 3d and 3f are rotated by rotating the flow rate adjusting plates 3c and 3e.
The phase of f is shifted, the width of the flow path of the viscous fluid is changed, and the discharge amount of the viscous fluid from the nozzle 6 is finely adjusted.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a discharging device used for discharging a viscous fluid such as an epoxy resin, a silicone resin or a solder paste.

[0002]

[Prior Art]

 A typical example of this type of discharge device will be described with reference to FIG. 4. A tube 23 for supplying compressed air is connected to an upper portion of a syringe 22 containing a viscous fluid 21 such as an epoxy resin, and a lower portion of the syringe 22. Is provided with a nozzle 26 via a solenoid valve 25. A plunger (piston) 24 is built in the syringe 22 and applies a pressure to the viscous fluid 21, which is the content. The solenoid valve 25 simply opens and closes the passage to control the discharge / stop of the viscous fluid from the nozzle 26.

[0003]

[Problems to be solved by the device]

 Generally, the viscosity of a viscous fluid such as an epoxy resin changes with a change in temperature, which causes a slight change in the discharge amount. Therefore, when an accurate and constant discharge rate is required, it is necessary to finely adjust the discharge rate by adjusting the pressure of compressed air, the valve opening time, etc. in response to changes in ambient temperature. However, the fine adjustment of the discharge amount by adjusting the pressure of the compressed air and the opening time of the valve is technically very troublesome, and there is a problem that the adjustment takes a lot of time.

Therefore, an object of the present invention is to easily and finely adjust the discharge amount of a viscous fluid.

[0005]

[Means for Solving the Problems]

 In order to achieve the above object, the viscous fluid discharge device according to the present invention is provided with a syringe for storing the viscous fluid and a lower portion of the syringe, and a flow rate adjusting mechanism for adjusting the flow rate of the viscous fluid and a lower portion of the flow rate adjusting mechanism. And a nozzle that discharges the viscous fluid via a flow rate adjusting mechanism.

The flow rate adjusting mechanism has a plurality of flow rate adjusting plates facing each other, and a support body that rotatably supports the flow rate adjusting plate. Hollow portions communicating with the inside of the nozzle may be bored, and a lattice-like mesh may be formed in each of the hollow portions.

Further, the flow rate adjusting mechanism has a plurality of flow rate adjusting plates that are in intimate contact with each other and face each other, and a support body that rotatably supports the flow rate adjusting plates, and the flow rate adjusting plates each have a flow rate. There may be provided an opening for varying the opening diameter communicating with the inside of the syringe and the inside of the nozzle by rotating the adjusting plate.

[0008]

【Example】

 An embodiment in which the present invention is applied to a potting device will be described below with reference to the drawings.

In FIG. 1, a flow rate adjusting mechanism 3 is provided below a syringe 2 (the structure of the syringe itself is the same as that of FIG. 4) containing a viscous fluid (epoxy resin in this embodiment) 1. Are connected via the mounting body 4.

The flow rate adjusting mechanism 3 is attached to the mounting plate 8 via a mounting body 9.

Below the mounting plate 8, there is a plate 7 on which the nozzle 6 is fixed by screwing. The mounting body 9 and the nozzle 6 are connected by a silicon tube 11, and the nozzle 6 is located on a belt conveyor of a device for mounting circuit elements.

Further, on the plate 10, there is a cylinder 5 which can be moved forward and backward by air pressure, by which the central portion of the silicon tube 11 can be pressed.

Next, the flow rate adjusting mechanism 3 will be described.

The support 3b has a cylindrical shape, and the inner peripheral surfaces of the upper and lower ends of the support 3b correspond to the threaded portions of the outer peripheral surface of the lower end of the mounting body 4 and the outer peripheral surface of the upper end of the mounting body 9, respectively. Screw part.

A bearing 3g, a flow rate adjusting plate 3e, a ring 3h, and a flow rate adjusting plate 3c are sequentially laminated on a stepped portion on the inner surface of the support body 3b, and knobs 3j, 3j, and 3i is attached from the outside of the support 3b. The flow rate adjusting plates 3e and 3c are supported by bearings 3g, and can be rotated separately by moving the knobs 3j and 3i.

Here, the flow rate adjusting plates 3e and 3c have a cylindrical shape, and the hollow portions 3l and 3k thereof are fitted with lattice-like meshes 3f and 3d, respectively, which are fixed to them by caulking. The assembly of the flow rate adjusting mechanism 3 is completed by the above.

Next, the assembly of the discharge device will be described.

First, from above the support body 3b, the mounting body 4 having the threaded portions on the inner peripheral surface of the upper end portion and the outer peripheral surface of the lower end portion is screwed, and this assembly is screwed into the mounting body 9 of the support body 3b. Install more. Thereby, the flow rate adjusting mechanism 3 is installed on the mounting plate 8.

Further, the syringe 2 having the threaded portion formed on the outer peripheral surface of the lower end portion is pushed into the mounting body 4 from above. The above completes the assembly of the discharge device. A plunger (not shown) is placed above the epoxy 1 in the syringe 2.

The inside of the nozzle 6 and the inside of the syringe 2 are communicated with each other through the holes of the meshes 3f and 3d.

Next, the operation of this apparatus will be described.

Compressed air having a pressure of 1.5 to 7 kgf / cm 2 is supplied into the syringe to constantly apply pressure to the viscous fluid 1 via the plunger.

First, the cylinder 5 is driven to press the silicon tube 11, and the flow of the viscous fluid 1 is stopped so as not to be discharged from the nozzle 6.

When the IC portion of the printed circuit board that has undergone the wire bonding process comes under the nozzle 6, the cylinder 5 is driven to release the pressure of the silicon tube 11 and discharge the viscous fluid 1 to mold the IC.

In the present device, the discharge amount of the viscous fluid 1 is adjusted by changing the pressure of compressed air, the opening / closing time of the silicon tube 11 by the cylinder 5, and the phase shift of the two meshes 3d, 3f of the flow rate adjusting mechanism 3. By

The adjustment of the discharge amount of the viscous fluid 1 by the flow rate adjusting mechanism 3 is performed by driving the knob 3i from the state where the meshes of the meshes 3d and 3f are overlapped as shown in FIG. 2A. 3C is rotated counterclockwise to shift the phases of the grids of the meshes 3d and 3f to narrow the passage of the viscous fluid 1 as shown in FIG. 2B.

The present invention is not limited to this embodiment. For example, the following may be considered as the flow rate adjusting mechanism. That is, one flow rate adjusting plate 12 is provided with an opening 12a as shown in FIG. 3A, the other flow rate adjusting plate 13 is provided with an opening 13a as shown in FIG. 3B, and as shown in FIG. Even if the flow rate adjusting plates 12 and 13 are placed in close contact with each other with the flow rate adjusting plates 12 and 13 facing down, respectively, the openings 12a and 13a are made to communicate with each other by the rotation of the flow rate adjusting plates 12 and 13 and the viscous fluid is allowed to pass therethrough. Good. According to this mechanism, the rotation of the flow rate adjusting plates 12 and 13 can change the size of the portion where the openings 12a and 13a communicate with each other and adjust the discharge amount of the viscous fluid. Further, by rotating the flow rate adjusting plates 12 and 13 so that the plate surface and the opening of the flow rate adjusting plate 12 and the opening and the plate surface of the flow rate adjusting plate 13 face each other, the outflow of the viscous fluid can be stopped. It can be used as a valve that can be opened and closed.

Further, for example, the flow rate of the viscous fluid can be adjusted by adjusting the vertical gap between the two grid-like meshes.

Further, three lattice-shaped meshes may be provided. Further, the viscous fluid may be silicone resin or solder paste.

[0030]

[Effect of the device]

 According to the present invention, the width of the flow path of the viscous fluid in the flow rate adjusting mechanism can be changed in a fine range. Therefore, the flow rate of the viscous fluid from the syringe to the nozzle can be finely adjusted, and the discharge amount of the viscous fluid from the nozzle can be finely adjusted.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional side view showing an embodiment of a viscous fluid discharge device according to the present invention.

FIG. 2 is an explanatory view showing the operation of the above flow rate adjusting plate.

3A and 3B are plan views of another embodiment of the above flow rate adjusting plate, and FIG. 3C is an explanatory view showing the operation of the flow rate adjusting plate.

FIG. 4 is a partial cross-sectional side view showing a conventional viscous fluid discharge device.

[Explanation of symbols]

 1 Viscous fluid 2 Syringe 3 Flow rate adjusting mechanism 6 Nozzle 3c, 3e, 12, 13 Flow rate adjusting plate 3b Supports 3d, 3f Lattice mesh 3k, 3l Hollow part 12a, 13a Opening

Claims (3)

[Scope of utility model registration request] 1. A syringe for storing a viscous fluid, a flow rate adjusting mechanism for adjusting the flow rate of the viscous fluid provided at the lower portion of the syringe, and a flow rate adjusting mechanism for providing the viscous fluid at the flow rate. A viscous fluid ejection device comprising: a nozzle for ejecting the viscous fluid through an adjusting mechanism. 2. The flow rate adjusting mechanism according to claim 1, wherein the flow rate adjusting mechanism includes a plurality of flow rate adjusting plates facing each other and a support body that rotatably supports the flow rate adjusting plates. A hollow portion is formed in the center of the hollow portion that communicates with the inside of the syringe and the inside of the nozzle, and a grid-like mesh is formed in each of the hollow portions. apparatus. 3. The flow rate adjusting mechanism according to claim 1, further comprising a plurality of flow rate adjusting plates that are in close contact with each other and face each other, and a support body that rotatably supports the flow rate adjusting plates. A viscous fluid discharge device, characterized in that each of the flow rate adjusting plates is provided with an opening for varying an opening diameter communicating with the inside of the syringe and the inside of the nozzle by rotation of the flow rate adjusting plate.