JPH0570190U - Power supply cooling structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a cooling structure for a power supply device, which has an excellent cooling function without increasing the size of the entire power supply device. [Structure] A power supply base plate 11 having excellent thermal conductivity is provided in a power supply device main body 3 which houses an electric component 1. And
A flow path 12 having an inlet 13 and an outlet 14 for cooling liquid is provided in the power source base plate 11. [Effect] When the heat generated from the power supply device body 3 is transmitted to the power supply base plate 11, this heat is forcibly dissipated by the cooling liquid flowing in the flow path 12. Therefore, it is possible to suppress the temperature rise in the power supply device body without using a heat sink or the like.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a cooling structure for a power supply device, and more particularly to a cooling structure for a power supply device provided with power conversion means such as an inverter circuit and a chopper circuit.

[0002]

[Prior Art]

 Generally, a cooling structure of a power supply device including a power conversion means or the like, as disclosed in, for example, Japanese Utility Model Publication No. 57-24077, heats the inside of the device to the outside by means of a heat sink having a radiation fin. A so-called air-cooling type cooling structure for dissipating is known.

FIG. 2 shows a conventional cooling (heat conduction cooling) type power supply device. In the figure, reference numeral 1 is an electric component such as a transformer, a rectifying diode, a smoothing capacitor, a power transistor, etc., which is a well-known power supply circuit, and these electric components 1 are housed in a box-shaped chassis 2 made of aluminum, plastic, or the like, and the main body of the power supply device. Make up three. Reference numeral 4 is a terminal provided for making an electrical connection with the outside. A power supply base plate 5 made of aluminum having excellent heat conductivity is provided on one side of the power supply device main body 3 so as to be in contact with the entire surface thereof. A heat sink 6 made of aluminum and having fins is closely attached. Then, the heat from the power supply device body 3 reaches the heat sink 6 through the power supply base plate 5, and the heat of the heat sink 6 is forcibly cooled by the air flowing through the heat radiation fins, so that the temperature inside the power supply device body 3 rises. Is to suppress.

[0004]

[Problems to be solved by the device]

 In the above-mentioned conventional technology, in order to enhance the cooling function of the heat sink 6, the heat sink 6 is provided on one surface of the power supply main body 3, and the fin portion is formed as large as possible to increase the contact area with air. .. For this reason, the entire power supply device is increased in size by the heat sink 6, and there is a problem that it cannot be stored in a limited storage space.

Therefore, an object of the present invention is to solve the above-mentioned problems and to provide a cooling structure for a power supply device, which has an excellent cooling function without increasing the size of the entire power supply device.

[0006]

[Means for Solving the Problems]

 According to the present invention, a heat-conducting power supply base plate is provided in a power supply device body that houses electric parts, and a flow path for inflowing and discharging a cooling liquid is provided in the power supply base plate.

[0007]

[Action]

 With the above configuration, when the heat generated from the power supply device main body is transferred to the power supply base plate, this heat is forcibly dissipated by the cooling liquid flowing in the flow path, and the temperature rise in the power supply device main body is suppressed.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to FIG. The same parts as those in FIG. 2 in the conventional example are designated by the same reference numerals, and detailed description of the common parts will be omitted. In the figure, a heat sink unlike the conventional example is not provided outside the power supply base plate 11, but instead, the tubular flow path 12 meanders in the power supply base plate 11 while the power supply device main body is being formed. It is provided so as to face one surface of No. 3. An inlet 13 and an outlet 14 of the flow path 12 are provided on one side of the power supply base plate 11, and the cooling liquid flowing from the inlet 13 is discharged from the outlet 14. It

Next, the operation of the above configuration will be described. When a predetermined input voltage is applied to the predetermined terminal 4, the power supply main body 3 is activated and the heat from the power supply main body 3 is dissipated to the outside, and is first transferred from the heat conductive power supply base plate 11. .. At this time, the heat conducted from the power supply main body 3 to the power supply base plate 11 is controlled in the flow passage 12 by controlling the circulation of the cooling liquid from the inlet 13 of the flow passage 12 to the discharge outlet 14 by a circulation device (not shown). Cooling liquid flowing through the device forcibly dissipates heat and suppresses the temperature rise of the power supply device body 3.

As described above, according to the above-described embodiment, the power supply main body 3 accommodating the electric component 1 is provided with the power supply base plate 11 having excellent thermal conductivity, and the cooling liquid flows in and out of the power supply base plate 11. With the configuration that only the flow passage 12 is provided, a good cooling function can be maintained by the cooling liquid flowing in the flow passage 12, and a compact power supply unit can be used without using a large heat sink unlike the conventional example. It is also possible to achieve this.

The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, the arrangement of the flow paths provided in the power supply base plate is not limited to the meandering shape as in the embodiment, but may be appropriately modified in consideration of the arrangement or shape of the electric parts of the power supply device main body. Further, the material of the power supply base plate is not limited to aluminum, and other material having excellent thermal conductivity can be used.

[0012]

[Effect of the device]

 According to the present invention, a heat-conducting power supply base plate is provided in the power supply unit body that houses electrical components, and a flow path for inflowing and discharging the cooling liquid is provided in the power supply base plate. It is possible to provide a cooling structure for a power supply device that is excellent in cooling function.

[Brief description of drawings]

FIG. 1 is a perspective view of a power supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a conventional power supply device.

[Explanation of symbols]

 3 Power supply unit 11 Power supply base plate 12 Flow path

Claims (1)

[Scope of utility model registration request] 1. A cooling structure for a power supply device, characterized in that a heat conductive power supply base plate is provided in a power supply device main body for accommodating electrical parts, and a flow path for inflowing and discharging a cooling liquid is provided in the power supply base plate. ..