JPH0562749A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an IC socket realizing miniaturization and lightweight and assuring reliable electrical connection. CONSTITUTION:When a carrier 3 carrying an IC element provided with many leads is fitted to a socket base 1 planted with contacts 2 corresponding to the leads, the leads are connected to the contacts 2 in an IC socket. Each contact 2 has a hook section 2a to the carrier 3 and a contact section 2b to be brought into contact with the lead, it is energized by the hook section 2a via the carrier 3 hooked on the socket base 1, thus the contact pressure between the contact section 2b and the lead is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, particularly an electrical connection structure, in which an IC element is mounted and used.

[0002]

2. Description of the Related Art An IC socket is used to mount various IC devices for performance testing and mounting, and to connect the IC devices to an external circuit. FIG. 1 shows a configuration example of a socket. In the figure, contact pieces 12 are implanted in a socket base 11 at fine pitch intervals corresponding to a large number of leads of an IC element, and a carrier 13 carrying an IC element is By being pressed by the lid body 14 pivotally mounted on the socket base 11, the leads of the IC element are pressed against the corresponding contact pieces 12, thereby electrically connecting the two. There is. The contact piece 12 is formed of a copper alloy or the like, and by providing the curved portion 12a, the contact portion 12b is in elastic contact with the mounted lead. Since the number of the contact pieces 12 is extremely large, a considerably large upward repulsive force in the figure acts on the lid body 14 via the IC element, that is, the carrier 13, when the leads and the contact pieces 12 are in contact with each other.

[0003]

However, in such a conventional IC socket, when the contact pressure between the leads of the IC element and the contact piece is surely increased, the resilience of a large number of contact pieces 12 is increased. Based on this, a strong reaction force is directly applied to the lid body 14, and since it is necessary to secure the strength to withstand such a reaction force, the lid body 14 must be made to have a particularly sturdy structure, and therefore the bulk of the socket as a whole must be large. I didn't get it. Further, such a large-sized IC socket causes a problem in mounting, which has been a problem.

The present invention has been made in view of the above circumstances, in particular, miniaturization,
It is an object of the present invention to provide an IC socket of this kind that realizes weight reduction and ensures reliable electrical connection.

[0005]

In the IC socket according to the present invention, a carrier carrying an IC element having a large number of leads is mounted on a socket base on which contacts corresponding to the leads are mounted. In an IC socket in which a lead is placed on the contact to connect the lead and the contact,
The contact has a locking portion for the carrier and a contact portion that should come into contact with the lead, and is urged through the carrier locked by the locking portion to the socket base. The contact pressure between the contact portion and the lead is increased.

[0006]

According to the present invention, by inserting the carrier so that the lead is connected to and held in the contact while the IC element is still mounted on the carrier, the contact pressure acts on the lead by the action of the contact itself. Can be prevented from being transmitted to other than the contact, which simplifies the structure and ensures the connection between the lead and the contact.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, I according to the present invention will be described with reference to FIGS.
An example of the C socket will be described. In the figure, 1 is along the four sides
Corresponding to the lead of the IC element to be electrically connected
A socket with a number of contacts arranged in a row
The base 2 is a socket base 1 which is a carrier described later.
For locking and holding the carrier when mounted inside
Contact part to be brought into contact with the locking part 2a and the lead of the IC element
2b and the contact portion 2b so that a so-called swing motion can be performed.
(See FIG. 2, arrow A) With the bending portion 2c that elastically supports
It is a contact that has. Also, the tip of the locking portion 2a
Is the inward direction of the socket base 1 due to the elasticity of its base.
And can be flexed outwardly to a suitable degree. Furthermore,
3 is a housing portion 3 for housing the IC element therein.
a and the outer peripheral portion of the contact 2 of the above
IC carrier having stopper 2a and engaging groove 3b to be engaged
Oh. The contact portion 2b of the contact 2 is a pointed portion 2b.
₁And 2b₂Is bifurcated, and both of these
It is designed to come in contact with the leads.

Since the IC socket according to the present invention is constructed as described above, when mounting an IC element, first,
When the IC element is housed in the housing portion 3a, the I
As shown in FIGS. 2 and 3, the carrier 3 carrying the C element is pushed into the socket base 1 so as to be arranged inside the locking portion 2a of each contact 2. At this time, the locking portion 2a is slidably brought into contact with the outer peripheral edge of the cover 3 to be expanded, so that the elasticity of the base portion causes the elastic deformation of the base portion to bend and deform in the outer direction of the socket base 1 and the outer portion of the cover 3 described above. When the peripheral edge has passed over the tip of the locking portion 2a and has passed through, the elastic force of the base portion returns to the inner side of the socket base 1 again.

FIG. 4 shows a state in which the cover 3 completely rides over the engaging portion 2a of the contact 2 and is fitted into the socket base 1. In this state, as is apparent from the drawing, the engaging portion is formed. 2a is engaged with the engagement groove 3b of the cover 3, and thus the cover 3 is locked and held in this pushed state. On the other hand, from the position immediately before reaching the state shown in FIG.
First, the contact portion 2b, especially the tip 2b ₁
Pointed end 2b ₂ contacting, and thereby refers tip 2
When b ₁ is pushed down by the reed, it is turned slightly right in the figure, so that the tip 2
The contact pressure between b ₂ and the lead is strengthened.

By fitting the carrier 3 inside the engaging portion 2a of the contact 2 in this manner, an appropriate and reliable electrical connection between the lead of the IC element and the contact 2 is made. On the other hand, the elastic force of the curved portion 2c of the contact 2 mainly acts upward, and the carrier 3 carrying the IC element is locked by the locking portion 2a to counteract the elastic force of the curved portion 2c. Power acts. I
The C element and the carrier 3 are held in an electrically connected state by the acting force from these contacts 2, that is, by the contact itself, and when the IC element is electrically connected in this way, the contact pressure with the leads other than the contact 2 is applied. You don't have to In other words, the IC element can be locked and held only by the contact 2, and a special lid or the like unlike the case of the conventional example is not required, so the number of parts is reduced and the structure of the socket itself is simplified. can do.
Further, since the carrier 3 and the like are not unnecessarily loaded, these plastic parts can be formed thin and sufficient strength can be secured. Therefore, the size and weight of the socket can be effectively reduced while ensuring reliable electrical connection. Moreover, I
Since the work of mounting the C element only needs to be pushed in by the cover 3, the handling operation is extremely simple.

[0011] Incidentally, by appropriately setting the length relationship of the two arms of the tip 2b ₁ and the pointed end 2b ₂ of the contact 2 in the above embodiment, a well-balanced contact pressure between the lead of the IC element Can be generated, which can ensure the stability of the electrical connection of the lead and the contact 2.

[0012]

As described above, according to the present invention, particularly in the IC socket of this type, the shape of the contact and the like are devised to achieve stable and reliable electrical connection between the contact and the lead of the IC element. In addition to being able to
There is an advantage that the C socket can be made small and lightweight.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an embodiment of an IC socket of the present invention.

FIG. 2 is a partial vertical cross-sectional view showing a positional relationship between a contact and a carrier carrying an IC element in the IC socket according to the present invention.

FIG. 3 is a partial vertical cross-sectional view showing an operating state of the IC socket according to the present invention when a carrier is pushed in.

FIG. 4 is a partial vertical cross-sectional view showing an operating state of the IC socket according to the present invention when the carrier is completely pushed.

FIG. 5 is a partial vertical cross-sectional view showing a configuration example of a conventional IC socket.

[Explanation of symbols]

 1 Socket Base 2 Contact 2a Locking Part 2b Contact Part 2c Curved Part 3 Carrier

Claims (1)

[Claims] 1. A carrier, which carries an IC element having a large number of leads, is mounted on a socket base in which contacts corresponding to the leads are planted, whereby the leads are mounted on the contacts. In an IC socket in which the lead and the contact are connected, the contact has a locking portion for the carrier and a contact portion that should come into contact with the lead, and is locked to the socket base by the locking portion. An IC socket characterized in that a contact pressure between the contact portion and the lead is increased by being urged through the urging carrier.