JPH0550768U - Circuit board connection structure - Google Patents

Abstract

(57) [Summary] [Purpose] Omit connection parts such as connectors or electric wires.
To provide a thin and compact electronic device, and to provide a low-priced electronic device that realizes easy subassembly. [Structure] A memory board 2 having a card-edge-shaped lead terminal group is inserted into a slit-shaped hole of a control board 1 and is electrically connected to a lead terminal group 5 formed on an end face of the slit-shaped hole.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connection structure for a circuit board used in an electronic device such as a personal computer or a printer.

[0002]

[Prior Art]

 Conventionally, connection parts such as connectors or electric wires have been used to connect circuit boards.

[0003]

[Problems to be solved by the device]

 However, the above-mentioned conventional technique has a problem that the size of the electronic device is increased because a connecting component such as a connector or an electric wire is required. In addition, there is a problem in that the cost of electronic equipment increases because the cost of connecting parts is extra and the subassembly is complicated. The present invention solves the above-mentioned problems. The purpose of the present invention is to eliminate connecting parts such as connectors or electric wires, provide thin and compact electronic devices, and realize an easy sub-assembly to achieve low cost. The purpose is to provide high quality electronic devices.

[0004]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the present invention has a circuit board A having a card edge-shaped lead terminal group and a lead terminal group formed by penetrating through-hole groups arranged in a horizontal row with slit-shaped holes. A circuit board B, and a card-edge-shaped lead terminal group of the circuit board A is inserted into a slit-shaped hole of the circuit board B so as to be electrically connected to the lead terminal group of the circuit board B.

As another means, the circuit board A has a card-edge-shaped lead terminal group, and the circuit board C has a lead-terminal group formed by dividing a slit-shaped through hole into a plurality of holes. The card-edge-shaped lead terminal group of the circuit board A is inserted into the slit-shaped through hole of the circuit board C to be electrically connected to the lead terminal group of the circuit board C.

[0006]

【Example】

 Hereinafter, the present invention will be described in detail based on embodiments.

FIG. 1 is a top view of the first embodiment of the present invention, FIG. 2 is a side view of FIG. 1, FIG. 3 is a sectional view taken along line aa of FIG. 1, and FIG. The bb sectional drawing is shown. 1 to 4, reference numeral 1 is a control board of a laser beam printer, which is mounted with a ROM, a CPU, a gate array IC and the like, which are not shown, for controlling printing. Reference numeral 2 is a memory board, and although not shown, four 40-pin SOJ package DRAMs of 256 k × 16 bit structure for storing print information of the laser beam printer are mounted on the front and back sides, for a total of four. ing.

In the insertion portion of the memory substrate 2 of the control substrate 1, 36 track-shaped through holes 3 arranged in a row horizontally at a pitch of 2 mm were cut by slit-shaped holes 4 having a width of about 1.6 mm. A so-called through-hole-shaped lead terminal group 5 is formed. In addition, the memory board 2 has 36 card-edge-shaped lead terminal groups 6 corresponding to the lead terminal groups 5 of the control board 1 formed on the front and back sides, respectively, and the portions other than the lead terminal portions have the front and back sides. In both cases, the resist 7 is applied on almost the entire surface. Although not shown, signal lines are connected to the lead terminal groups 5 and 6.

The memory substrate 2 can be soldered to the control substrate 1 by inserting the memory substrate 2 into the press hole 4 of the control substrate 1 and passing it through a solder dip bath in the same process as a general dip component. Is. In this case, the width of the press hole 4 of the control board 1 is set to be slightly wider than the thickness of the lead terminal portion of the memory board 2 and slightly narrower than the thickness of the resist-coated portion, so that the width at the time of soldering is reduced. Fixing means such as taping is unnecessary. Note that solder is not shown in FIGS. 1 to 4.

FIG. 5 is a top view of the second embodiment of the present invention, FIG. 6 is a sectional view taken along line aa of FIG. 5, and FIG. 7 is a sectional view taken along line bb of FIG. 5 to 7, the control board 8 is provided with a lead terminal group 11 in which a slit-shaped through hole 9 having a width of about 1.6 mm and a length of about 75 mm is divided by 37 press holes 10. In this case as well, the width of the through hole 9 of the control board 8 is set to be slightly wider than the thickness of the lead terminal portion of the memory board 2 and slightly smaller than the thickness of the portion where the resist is applied, so that the soldering is performed. No fixing means such as taping is required.

According to the first and second embodiments, a small-sized and large-capacity memory board 2 is used as a control board without using a connecting component such as a so-called SIMM (single in-line memory module) socket, connector, or clip lead. Can be installed on. In order to mount a DRAM of the same capacity on the control board, an area of about 25 mm × 55 mm is required for the SOJ package and an area of about 8 mm × 110 mm is required for the ZIP package. In this case, the area is about 3 mm × 75 mm, which is very advantageous when the size limitation of the control board is severe.

Moreover, the soldering of the memory board 2 and the control board can be performed in the same process as other dip parts, and since the lead shape has no legs, it is cheaper than mounting a socket or a board with clip terminals. Can be sub-assembled.

When the lead terminals of the memory board 2 are formed on the front and back sides as in the present embodiment, it is possible to mount the lead terminals in a half area as compared with the case where the lead terminals are formed on only one side. Also, the soldering strength can be increased.

[0014]

[Effect of the device]

 As described in detail in the above embodiments, according to the present invention, a circuit board can be connected without connecting parts such as a connector or an electric wire. Therefore, a small and thin electronic device can be provided. Further, since the cost of connecting parts can be saved and the sub-assembly can be easily performed, an inexpensive electronic device can be provided.

[Brief description of drawings]

FIG. 1 is a top view showing an embodiment of a circuit board connection structure of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a sectional view taken along the line aa in FIG.

FIG. 4 is a cross-sectional view taken along the line bb of FIG.

FIG. 5 is a top view showing another embodiment of the circuit board connection structure of the present invention.

6 is a sectional view taken along line aa of FIG.

7 is a cross-sectional view taken along the line bb of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Control board 2 ... Memory board 3 ... Through hole 4 ... Press hole 5 ... Disconnection through hole lead terminal 6 ... Card edge lead terminal 7 ... Resist 8 ... Control board 9 ... Through hole 10 ... Press hole 11 ... Lead terminal

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display area // G06F 1/18

Claims (2)

[Scope of utility model registration request] 1. A circuit board A having a card edge-shaped lead terminal group, and a circuit board B having a lead terminal group formed by penetrating through holes arranged in a row in a row with slit-shaped holes. A circuit board connection structure, wherein a card-edge-shaped lead terminal group of the circuit board A is inserted into a slit-shaped hole of the circuit board B to be electrically connected to the lead terminal group of the circuit board B. 2. A circuit board A having a card edge-shaped lead terminal group and a circuit board C having a lead terminal group formed by dividing a slit-shaped through hole into a plurality of holes. A circuit board connection structure, wherein a card edge-shaped lead terminal group A is inserted into a slit-shaped through hole of the circuit board C and is electrically connected to the lead terminal group of the circuit board C.