JPH0536889A - Semiconductor device - Google Patents

Abstract

PURPOSE:To increase the number of outer leads without increasing the number of pins. CONSTITUTION:Each lead pin 22 has a double structure composed of a first lead 22A and a second lead 22B, and an insulating cylinder 23 is interposed between them. Since the lead pin 22 is composed of two lead 22A and 22B, the actual number of leads amounts two times the number of pins.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a technique for improving the packaging density of outer leads of a semiconductor device, for example, a semiconductor integrated circuit device provided with a pin grid array package (hereinafter referred to as a semiconductor integrated circuit device). , PGA
Sometimes called IC. ) Or a technique effective when applied to a semiconductor integrated circuit device having a lead structure formed using a lead frame.

[0002]

2. Description of the Related Art A conventional semiconductor device is disclosed in, for example, Japanese Patent Publication No.
As described in Japanese Patent Application Laid-Open No. 3-4354, one semiconductor pellet having a semiconductor integrated circuit is bonded to a tab of a lead frame via a bonding layer made of silver paste or the like, and the bonding pad of the pellet is bonded. And both ends of the wire are respectively bonded to the tips of the plurality of inner leads, and then a package in which the pellet, the wire group and the inner lead are sealed is molded, and each outer lead connected to each inner lead is packaged. It is configured by being molded into a desired shape outside the.

Therefore, in such a conventional semiconductor device, the number of outer leads actually arranged outside the package (hereinafter sometimes referred to as the apparent number of legs) is in principle the number of inner leads. It corresponds as. However, exceptionally, a plurality of inner leads may be connected to one outer lead, or one inner lead may be connected to a plurality of outer leads. This principle also applies to PGA / IC.

According to this principle, in the conventional semiconductor device, for example, the integration of ICs and the increase in the number of bits of memory have progressed, and the number of signals to be handled and the entrance and exit of signals (multi-bit).
If is increased, the number of apparent feet protruding out of the package will be increased proportionally.

[0005]

However, in the conventional semiconductor device, when the integration and the increase in the number of bits are advanced, the actual number of outer leads projected from the package to the outside, that is, the apparent number of legs is reduced. Since it increases proportionally, there are the following problems.

Since the package becomes large due to the increase in the apparent number of legs, high-density mounting is hindered.

[0007] If an attempt is made to increase the number of legs by suppressing the size of the package from increasing, the pitch between adjacent legs will be narrowed, so that a short circuit failure will occur due to a bridging phenomenon of the soldered portion during mounting. .

An object of the present invention is to provide a semiconductor device which can meet the demand for high-density mounting while suppressing an increase in the number of apparent legs.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a semiconductor pellet in which an electronic circuit is formed and a plurality of semiconductor pellets which are insulated from each other and are radially radiated to the outside of the semiconductor pellet, and are electrically connected to the electrode pads of the semiconductor pellet, respectively. In a semiconductor device comprising a book inner lead, an outer lead electrically connected to each inner lead, and a package formed to seal the semiconductor pellet and each inner lead, At least one outer lead of the outer lead group is configured in a multiple structure, and adjacent part members are insulated by an insulating layer.

[0012]

According to the above-mentioned means, since the apparent legs protruding to the outside of the package have a multi-layered structure, the outer leads of the outer leads are substantially different from the apparent number of legs protruding from the package. This means that the number has been increased. However, since the apparent number is suppressed from increasing, the size of the package is suppressed. Moreover, since the apparent number of legs is suppressed, it is not necessary to reduce the distance between the adjacent feet.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a PGA IC which is an embodiment of the present invention.
FIG. 3 is a front cross-sectional view showing the mounted state of FIG. 2 and the subsequent P
It shows each step of the manufacturing method of the GA / IC.

In this embodiment, the semiconductor device according to the present invention is constructed as a PGA IC. This PGA
The IC 35 includes a base 11 formed by laminating glass reinforced plastic (epoxy resin) as an insulating substrate and formed into a substantially square plate shape, and the base 1.
1. A semiconductor pellet 26 bonded to one main surface of the No. 1 and having an electronic circuit formed therein, and a plurality of inner leads 16A and 16B radially wired to the base 11 so as to be insulated from each other, Each inner lead 16
Wires 28 bridged between the inner tip portions of A and 16B and the respective electrode pads 27 of the semiconductor pellet 26.
Group, and a hermetically sealed package 30 formed so that the semiconductor pellet 26, the inner leads 16A, 16B and the group of wires 28 are resin-sealed on one main surface of the base 11.
It has and.

A plurality of lead pins 22 as outer leads having an inner / outer multiple structure are planted in the base 11 so as to penetrate through the hermetically sealed package 30 in the inner and outer directions. The lead pin 22 of each multiple structure is composed of a round bar-shaped first lead pin 22A and a cylindrical second lead pin 22B that are arranged in inner and outer concentric circles and are insulated from each other through an insulating cylinder 23. The first lead pin 22A as a part member is the first inner lead 16A.
Further, the second lead pins 22B as the second part member are electrically connected to the second inner leads 16B, respectively.

PGA / IC3 configured as described above
5 is manufactured by the following manufacturing method. By the explanation of this manufacturing method, the P
Details about the configuration of the GA IC will be revealed together.

In the method of manufacturing the PGA IC according to this embodiment, the base 11 manufactured by using glass reinforced plastic (epoxy resin type) as shown in FIGS. 2 and 3 is used. It The base 11 is the first frame member 1
2A and a second frame member 12B, and a substrate member 13, each frame member 12A, 12B is formed in a square frame-shaped plate body having different inner diameters, the substrate member 13 is both frame members 12A, 12B. It is formed into a square plate having the same outer shape as that of. The first frame member 12A has a first small diameter.
A large number of through-holes 14A are regularly arranged on a peripheral portion in a row in a substantially square frame, and are formed so as to penetrate in a thickness direction (hereinafter, referred to as vertical direction). A first through-hole conductor 15A having a small diameter is attached to the inner peripheral surface of the first through-hole 14A.

A first inner lead 16A as an electric wiring is formed on one end surface (hereinafter referred to as an upper surface) of the first frame member 12A.
A plurality of the first frame members 12A are radially arranged from the inner peripheral edge of the first frame member 12A toward the outer peripheral area, and are formed so as to be insulated from each other.
At the outer end of each first through-hole conductor 15A
Are each electrically connected to. Inner lead 16
As a method of forming the group A, a screen printing method, a method of photoetching a copper foil, or the like is used. Each of the inner front end portions of the first inner leads 16A has the first frame member 12
By arranging an appropriate air gap in the circumferential direction at the inner peripheral portion of A and arranging radially, the electrode pads 27 of the pellet 26, which will be described later, face each other.

The second frame member 12B is provided with a large number of second through holes 14B having a large diameter, which are regularly arranged on the peripheral portion in a row of substantially square frames, and are arranged in the thickness direction (hereinafter referred to as the vertical direction). It is opened to penetrate. A second through-hole conductor 15B having a small diameter is attached to the inner peripheral surface of the second through-hole 14B.

Further, a plurality of second inner leads 16B are arranged on the upper surface of the second frame member 12B, and are radially arranged from the inner peripheral edge of the second frame member 12B toward the outer peripheral portion.
Further, the second inner leads 16B are formed so as to be insulated from each other, and are electrically connected to the respective second through-hole conductors 15B at their outer end portions.
Each of the inner tip portions of the second inner leads 16B is radially arranged with an appropriate air gap in the circumferential direction at the inner peripheral portion of the second frame member 12B, so that each electrode pad of the pellet 26 to be described later. 27 are opposed to each other.

The board member 13, which is formed in a square plate having the same outer shape as the frame members 12A and 12B, has a large number of through holes 18 for inserting lead pins, and a row of substantially square holes in the peripheral portion. Regularly on the frame, and
Each through hole 14 in each frame member 12A, 12B
It is arranged so as to face A and 14B, and is opened so as to penetrate in the thickness direction (hereinafter referred to as the vertical direction).

On the upper surface of the substrate member 13, a magnetic shield layer 19 which also serves as a bonding floor is laid substantially entirely by a suitable means using a conductive material such as silver foil or copper foil. 19 is the inner lead 16
A, 16B and the lower part of the pellets described later are coated. Through holes 20 are respectively formed in the shield layer 19 at portions facing the through holes 18 so as to maintain insulation with the through hole conductors 15B. Further, at least one through hole 20C in the group of through holes 20 is covered with a through hole conductor 15C.
A magnetic shield layer 19 is electrically connected to.

On the upper surface of the substrate member 13 thus formed, the first frame member 12A formed as described above.
Also, the second frame member 12B is arranged concentrically at the top and bottom and joined together via an adhesive material (not shown). Since the board member 13 is concentrically arranged and joined to both frame members 12A and 12B, a square plate-shaped recess 21 is formed upward in the center of the upper surface of the base 11 as a whole. There is. At the bottom of the recess 21, the central portion of the magnetic shield layer 19 laid on the substrate member 13 is exposed as a bonding floor.

In this joined state, the through holes 18 formed in the substrate member 13 and the frame members 12A, 12 are formed.
The through holes 14A and 14B formed in B are aligned with each other in a straight line. In each of the through holes 14A, 14B and the through hole 18 which are aligned with each other, a first lead pin 22A as a part member of the outer lead 22 having a multiple structure is provided.
And the second lead pin 22B are respectively fitted, and the lead pins 22A and 22B are electrically connected to the first inner lead 16A and the second inner lead 16B via the first through-hole conductor 15A and the second through-hole conductor 15B, respectively. It is connected.

Here, the first lead pin 22A as the first part portion in the outer lead 22 having the multiple structure is formed in an elongated round bar shape, and the second lead pin 22B as the second part portion is also formed in an elongated cylindrical shape. Has been formed. The first lead pin 22A is inserted into the second lead pin 22B with an insulating cylinder 23 formed of an insulating material and formed in an elongated cylindrical shape interposed therebetween. The upper and lower ends of the first lead pin 22A have insulating cylinder 23 and Each of them projects from the second lead pin 22B. The upper protruding end portion of the first lead pin 22A is fitted into the through hole 14A of the first frame member 12A, and the first through hole conductor 15A is formed.
Electrically connected to. In addition, the second lead pin 22
The upper end of B is the through hole 14B of the second frame member 12B.
And is electrically connected to the second through-hole conductor 15B. In this way, the state in which the first lead pin 22A is fitted into the second lead pin 22B is a state of apparently one lead pin (hereinafter sometimes referred to as an apparent lead pin 22). In other words, the apparent lead pin 22 has an inner and outer double structure of the first lead pin 22A and the second lead pin 22B, so that it is apparently configured as an outer lead having a multiple structure.

A third lead pin 22C is fitted via an outer insulating tube 24 to the outside of at least one second lead pin 22A facing the through-hole conductor 21 electrically connected to the magnetic shield layer 19. The third lead pin 22C is in a state of being electrically connected to the magnetic shield layer 19 by coming into contact with the through-hole conductor 15C. The apparent lead pin 22 provided with the third lead pin 22C is
The first lead pin 22A as a part member, the second lead pin 22B as a second part member, and the third lead pin 22C as a third part member are configured in an inner-outer triple structure.

In the pellet bonding process and the wire bonding process, the pellet 11 and the wire are bonded to the base 11 configured as described above, as shown in FIGS. 4 and 5. In the pellet and wire bonding work, the base 11 is arranged with the concave portion 21 thereof facing upward.

First, in a pellet bonding step, a semiconductor pellet 26 (hereinafter referred to as a pellet) is bonded via a bonding layer 25 on a magnetic shield layer 19 serving as a bonding floor formed on the bottom surface of the recess 21 of the base 11. It Bonding layer 2
5 is formed of an appropriate material such as a silver paste or a gold-silicon eutectic layer.

Next, in a wire bonding step, wires 28 are formed between the electrode pads 27 of the pellets 26 bonded to the base 11 and the tips of the inner leads 16A and 16B formed on the base 11. The parts are bonded and bridged. Further, the ground terminal for taking the most negative potential of the pellet 26 is electrically connected to the magnetic shield layer 19 by an appropriate means such as wire bonding (not shown).

The hermetically sealed package 3 is attached to the assembly 29 thus pelletized and wire-bonded.
0 is molded as shown in FIG.

That is, in the peripheral portion of the upper surface of the base 11 to which a plurality of lead pins 22A are fixed, a dam 31 formed of a glass reinforced plastic and formed into a substantially square frame-shaped flat plate covers the through hole 14. It is arranged and fixed. As a result, the cavity 32 is formed inside the dam 31 on the base 11.

On the dam 31, a cap 33 made of glass reinforced plastic and formed in a substantially square flat plate shape is arranged so as to cover the cavity 32, and is made of a low melting point glass or a solder material. Sealing material layer 34
Fixed through. As a result, the pellet 26, the bonding wire 28, and the tips of the inner leads 16A and 16B inside the cavity 32 are hermetically sealed, and the hermetically sealed package 30 is configured.

Through the above steps, FIG.
Thus, the PGA-IC 35 having the above-described configuration including the hermetically sealed package 30 is manufactured.

On the other hand, the mounting board 40 on which the PGA / IC 35 is mounted is constructed as shown in FIG. The mounting board 40 shown in FIG. 1 includes a base 41 made of glass reinforced plastic (epoxy resin). Although only a part of the base 41 is illustrated, it is formed in a plate body having a desired size and a desired shape. A large number of through holes 42 are provided in the peripheral portion of the PGA / IC mounting position on the base 41.
It is arranged so as to correspond to each apparent lead pin 22 of the GA / IC 35, and is opened so as to penetrate in the thickness direction (hereinafter referred to as the vertical direction). A first through-hole conductor 43 is formed on the inner peripheral surface of these through-holes 42.
A and the second through-hole conductor 43B are separately attached to the lower part and the upper part.

A first electric wiring 44A such as a signal line is formed on a main surface (hereinafter referred to as a lower surface) opposite to the mounting surface of the base 41.
, A plurality of first through-hole conductors 43A to the base 4
1 are radially arranged toward the outer periphery (not shown) of 1 and are formed so as to be insulated from each other, and each first electric wiring 44A has each first through-hole conductor 43A at its inner end portion. Are each electrically connected to.

A plurality of second electric wirings 44B such as signal lines are provided on the mounting surface of the base 41, and each second through-hole conductor 43B.
From the base 41 to the outer periphery (not shown) of the base 41 and are formed so as to be insulated from each other. Each of them is electrically connected to the hole conductor 43B. In addition, electrical wiring 44A and 44B
As a method of forming the groups, a screen printing method, a method of photo-etching a copper foil, or the like is used.

The small diameter first lead pin 22A and the large diameter second lead pin 22B of the apparent lead pin 22 can be fitted into the respective inner diameters of the through hole conductors 43A and 43B attached to the through hole 42. It is set for each dimension. The first lead pin 22A and the second lead pin 22B are mechanically and electrically connected to the through-hole conductors 43A and 43B by soldering or the like. The through-hole conductors 43A and 43B are connected to each other. It is adapted to be electrically connected to the electric wirings 44A and 44B such as signal lines via the respective wirings.

At a position corresponding to the specific apparent lead pin 22 on which the third lead pin 22C of the base 41 is arranged, a ground wiring 45 as a most negative potential wiring is provided, and an electric wiring 44A is provided via an insulating layer 46. , 44
It is manufactured and formed in the same manner as B, and the ground wiring 45 is electrically connected to the third lead pin 22C on the outer periphery of the specific apparent lead pin 22.

Next, a mounting operation of the PGA / IC 35 having the above-described configuration on the mounting substrate 40 having the above-described configuration and its operation will be described.

In the PGA IC 35, the apparent lead pin 22 side is opposed to the upper surface of the mounting substrate 40, and the first lead pins 22A and the second lead pins 22B of the multiple structure of each lead pin 22 are through holes of the mounting substrate 40. 42 are inserted from above.

Subsequently, the PGA / IC 35 is mounted on the mounting substrate 40.
When the reflow soldering process or the like is performed in the state of being set above, the first lead pin 22A and the second lead pin 22B in the lead pin 22 of each multiplex structure and the first through hole in each through hole 42 of the mounting substrate 40. Since the conductor 43A and the second through-hole conductor 43B are soldered, the PGA-IC 35 is in a mounted state in which it is electrically and mechanically connected to the mounting board 40.
In the triple-structured lead pin 22 in which the third lead pin 22C is arranged, the third lead pin 22C is electrically connected to the ground wiring 45.

In this mounted state, when the PGA / IC 35 is energized through the ground wiring 45 of the mounting substrate 40, the pellet 26 is electrically bonded to the magnetic shield layer 19 by being wire-bonded to the magnetic shield layer 19. Since the pellets 26 are connected to each other, the pellet 26 includes the magnetic shield layer 19, the third lead pin 22C, and the ground wiring 4
A state of most negative potential is obtained through 5. Therefore, the magnetic shield layer 19 becomes electromagnetically stable. As a result, the magnetic shield layer 19 extremely effectively magnetically shields the pellet 26 and the inner leads 16A and 16B that are hermetically sealed inside the hermetically sealed package 30. Due to this magnetic shielding effect, external magnetic noise and internal magnetic noise can be mutually shielded, so that malfunction of the PGA / IC 35 and occurrence of interference due to interfering electromagnetic waves can be prevented.

Further, since the pellet 26 is directly connected to the mounting substrate 40 by the magnetic shield layer 19 and the third lead pin 22C in a heat conductive manner, heat generated by the pellet 26 is mounted through the magnetic shield layer 19 and the third lead pin 22C. Heat is effectively radiated to the substrate 40. Therefore, by improving the heat dissipation performance of the PGA-IC 35, the electrical characteristics and reliability of the PGA-IC 35 can be improved.

According to the above embodiment, the following effects can be obtained.
Since the apparent lead pins protruding to the outside of the package are configured in a multiple structure inside and outside, the number of actual lead pins is doubled with respect to the number of apparent lead pins protruding from the package. Will be there.

Since the increase in the number of apparent lead pins is suppressed, the size of the package is suppressed,
Further, since the apparent number of lead pins is suppressed, it is not necessary to reduce the distance between the adjacent lead pins.

A semiconductor pellet is bonded to the magnetic shield layer, and this magnetic shield layer is connected to the electric wiring of the mounting board via the third lead pin arranged outside the lead pin of the multiple structure, thereby forming the magnetic shield layer. Since the most negative potential can be set, the magnetic shield layer can be electromagnetically stabilized, and as a result, the semiconductor pellets and leads sealed inside the package can be magnetically shielded very effectively. You can

By the magnetic shielding effect, the external magnetic noise and the internal magnetic noise can be mutually shielded, so that the malfunction of the semiconductor device and the occurrence of the disturbance due to the electromagnetic interference can be prevented.

FIG. 7 is a partially cut front view showing a mounting state of an IC having a surface mount type package according to another embodiment of the present invention, and FIG. 8 shows a state of the IC excluding a resin-sealed package. It is a partially omitted perspective view shown.

In the second embodiment, the semiconductor device according to the present invention is configured as an IC having a surface mount type package. The package of this IC is molded in a resin encapsulation type, and the inner lead and outer lead groups are formed by using a lead frame, and each outer lead is apparently formed in a gull wing shape. . That is, this IC is generally classified as an IC having a small outline package.

The IC according to this embodiment (hereinafter, modified SOP
Sometimes called IC. ) 50 includes a pair of front and back lead frame assemblies 60A and 60B. The front-side assembly 60A and the back-side assembly 60B are respectively configured to have a front-back symmetrical shape, and are joined back to back with the insulating layer 61 interposed therebetween. In this joined state, the same resin encapsulation package 62 is resin-molded in both the assemblies 60A and 60B, and the outer leads 63 having a multiple structure superposed on each other from the resin encapsulation package 62 are projected to the outside to form a gull wing shape. It is bent and molded.

The front side assembly 60A and the back side assembly 60B are symmetrically formed on the front side and the back side, and therefore the structure thereof will be representatively described by using the reference numerals of the front side assembly 60A. That is, the front side assembly 60A includes a semiconductor pellet (hereinafter, referred to as a pellet) 51A in which an integrated circuit is formed, a plurality of inner leads 53A wired in two directions of the pellet 51A, and each inner lead 53A. The outer lead 54A and the pellet 51A that are integrally connected to each other
Each of the electrode pads 52A and the tip of the inner lead 53A, the bonding wire 56A having its both ends bonded and bridged, and the tab 57A to which the pellet 51A is bonded via the bonding layer 55A. ing.

The pellet 51A of the front side assembly 60A
And the pellet 51B of the other party's back side assembly 60B,
Although the integrated circuits of the same kind may be used together, for example, the pellets 5 arranged in the front assembly 60A may be used.
1A has a built-in integrated circuit for analog signal processing, and pellets 51B arranged on the back side assembly 60B has a built-in integrated circuit that has a function of processing the processed signal. The use of the ones has the effect that multiple functions can be packaged.

Each outer lead 63 apparently protruding from the resin-sealed package 62 is an outer lead 54A of the front assembly 60A (hereinafter referred to as a front outer lead).
And an outer lead (hereinafter referred to as a back outer lead) 54B of the back side assembly 60B are joined to each other with an insulating layer 61 sandwiched therebetween, and have a multi-layered structure, protruding from the resin-sealed package 62 and bent substantially vertically. And, the vertical part is bent horizontally. The outer lead 63 of each multiple structure has a horizontal portion of the front outer lead 54A bent outward and a horizontal portion of the back outer lead 54B bent inward. Therefore, the outer lead 63 having the multiple structure is different from the gull wing-shaped outer lead by the amount that the back outer lead 54B is bent inward.

On the other hand, the mounting substrate 70 on which the modified SOP / IC 50 is mounted is constructed as shown in FIG. The mounting substrate shown in FIG. 7 includes a base 71 made of glass reinforced plastic (epoxy resin). A plurality of lands 72 having a multiple structure are formed in the periphery of the SOP / IC mounting position on the main surface (hereinafter, referred to as an upper surface) on the mounting side of the base 71, and each multiplex in the modified SOP / IC 50 to be a mounting object. They are arranged in two rows so as to correspond to the outer leads 63 of the structure, and are formed into a substantially rectangular small flat plate shape using a solder material.

The land 72 of each multiple structure is the outer land 73.
A and an outer land 73B are provided.
A and the inner land 73B are arranged next to each other in the radial direction in series with the insulating portion 74 interposed therebetween. The outer land 73A corresponds to the front outer lead 54A, and the inner land 73B corresponds to the back outer lead 54B. These outer land 73A and inner land 73
The group B is electrically and appropriately connected to a signal wiring or the like (not shown).

When the modified SOP IC 50 having the above structure is surface-mounted on the mounting board 70, the modified SOP IC 50
The front side outer lead 54A and the back side outer lead 54B of the outer lead 63 of the multiple structure in the IC 50 are the outer land 73A and the inner land 73B on the mounting substrate 70.
A cream solder material (not shown) is sandwiched between and abutted against each other.

Subsequently, when the cream solder material is melted and then solidified by an appropriate means such as reflow soldering, each front side outer lead 54A and back side outer lead 54B, each outer land 73A and inner land 7 is formed.
A soldering portion (not shown) is formed between each of them and 3B. In this soldered state,
The modified SOP IC 50 is electrically and mechanically connected to the mounting substrate 70 and is in a surface-mounted state.

According to the above embodiment, the following effects can be obtained.
Since the apparently one outer lead 63 protruding to the outside of the resin-sealed package 62 has a double-sided structure, it is substantially different from the apparent number of outer leads 63 projected from the resin-sealed package 62. That is, the number of the outer leads 54A and 54B is doubled.

Since the number of apparent outer leads 63 is suppressed from increasing, the size of the resin-sealed package 62 is suppressed, and the apparent outer leads 63 are suppressed.
Therefore, the distance between the adjacent outer leads 63 does not have to be narrowed.

The invention made by the present inventor has been specifically described based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, it is desirable to appropriately change the apparent number and shape of the lead pins and outer leads having a multiple structure according to the usage conditions of the semiconductor device. The shape of the outer lead is not limited to the gull wing shape, but DI
A standard shape, an I-lid lid shape, a beam lead shape and the like used for the P.IC can be considered.

The magnetic shield may be omitted,
You may also use the heat sink.

In the above description, the invention made by the present inventor is the field of application which is the background of the invention.
The case of application to an IC and a modified SOP / IC has been described, but the present invention is not limited to this, and an IC including another hermetically sealed package and a resin sealed package, a power transistor, and others. Can be applied to all electronic devices. In particular, the invention is
An excellent effect can be obtained by applying it to a semiconductor device that requires high-density mounting.

[0064]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Since the apparent outer leads protruding to the outside of the package have a multi-layer structure of inside and outside,
It is possible to substantially double the number of lead pins with respect to the apparent number of outer leads protruding from the package.

On the contrary, since the apparent number of outer leads is suppressed from increasing, the size of the package can be suppressed. Further, since the apparent number of outer leads is suppressed, it is possible to avoid narrowing the distance between the adjacent outer leads.

[Brief description of drawings]

FIG. 1 is a front sectional view showing a mounted state of a PGA IC according to an embodiment of the present invention.

FIG. 2 is a front cross-sectional view showing a base used in the PGA / IC manufacturing method.

FIG. 3 is a partially omitted plan view thereof.

FIG. 4 is a front sectional view showing a state after a pellet and wire bonding step.

FIG. 5 is a partially omitted plan view thereof.

FIG. 6 is a front sectional view showing a package after molding.

FIG. 7 is a partially cut front view showing a mounted state of a modified SOP / IC according to another embodiment of the present invention.

FIG. 8 is a partially omitted perspective view showing the IC excluding the resin-sealed package.

[Explanation of sign]

11 ... Base, 12A, 12B ... Frame member, 13 ... Substrate member, 14A, 14B ... Through hole, 15A, 15B ...
Through-hole conductor, 16A, 16B ... Inner lead, 1
8 ... Through hole, 19 ... Magnetic shield layer, 20 ... Through hole, 21 ... Recess, 22 ... Multiple structure lead pin (multiple structure outer lead), 22A, 22B ... Outer lead (part member), 23 ... Insulating cylinder, 24 ... Insulating cylinder , 25 ...
Bonding layer, 26 ... Semiconductor pellet, 27 ... Electrode pad, 28 ... Wire, 29 ... Assembly, 30 ... Hermetically sealed package, 31 ... Dam, 32 ... Cavity, 33 ... Cap, 34 ... Encapsulating material layer, 35 ... PGA / IC (semiconductor device), 40 ... Mounting board, 41 ... Base, 42 ... Through hole, 43A, 43B ... Through hole conductor, 44A,
44B ... Electric wiring, 45 ... Ground wiring (most negative wiring), 46 ... Insulating layer, 50 ... SOP / IC (semiconductor device), 51A, 51B ... Pellet, 52A, 52
B ... Electrode pad, 53A, 53B ... Inner lead, 54
A, 54B ... Outer leads, 55 ... Bonding layer, 5
6A, 56B ... Bonding wire, 57A, 57B ...
... tab, 60A, 60B ... lead frame assembly, 61
... Insulating layer, 62 ... Resin sealing package, 63 ... Multi-structure outer lead, 70 ... Mounting substrate, 71 ... Base, 72 ...
Multiple structure land, 73A, 73B ... Land, 74 ... Insulating layer.

Claims (5)

[Claims] 1. A semiconductor pellet in which an electronic circuit is formed, and a plurality of semiconductor pellets, which are insulated from each other and are radially wired to the outside of the semiconductor pellet, and are electrically connected to electrode pads of the semiconductor pellet, respectively. A semiconductor device comprising a book inner lead, an outer lead electrically connected to each inner lead, and a package formed to seal the semiconductor pellet and the inner leads, wherein A semiconductor device, wherein at least one outer lead of the outer lead group has a multi-layered structure, and adjacent part members are insulated from each other by an insulating layer. 2. At least one part member of the outer leads formed in the multiple structure is used as an outer lead forming a most negative potential, and the outer lead is formed to substantially correspond to the entire surface of the semiconductor pellet. The semiconductor device according to claim 1, wherein the semiconductor device is electrically connected to the magnetic shield layer. 3. The outer lead groups are each configured in a pin grid array structure, at least one of which is configured in a concentric multiple structure, and the inner and outer adjacent part members are formed by a cylindrical insulating layer. The semiconductor device according to claim 1, wherein the semiconductor device is insulated. 4. The outer lead group comprises a lead structure formed by using a lead frame, and the outer leads of the lead structure are formed in a multiple structure in which the front and back are superposed with an insulating layer interposed therebetween. The semiconductor device according to claim 1. 5. The semiconductor device according to claim 4,
A semiconductor device in which the tips of outer leads having a multiple structure are bent in mutually opposite directions.