JPH05340965A - Probe card - Google Patents

Abstract

PURPOSE:To obtain a probe card for connecting a semiconductor chip formed on a semiconductor wafer with a tester or the like, especially a probe card in which a plurality of probes arranged in multilayers can be brought into concurrent contact with the electrodes of the semiconductor chip under a constant contact pressure. CONSTITUTION:The probe card comprises an insulating probe holder 32 secured to a wiring board 31, and a plurality of probes 33 led out in parallel with the wiring board 31 from the probe holder 32 with the leading ends thereof being bent substantially in right angle to be brought into vertical contact with electrodes 11a on a substrate 10 to be measured. Probe lead out face 32a of the probe holder 32 widens toward the substrate 10 and the probes 33 are led out in multilayer in the tapering direction from the probe lead out face 32a wherein the distance between the probe lead out face 32a and a bent position 33b of the probe holder 32 is set substantially constant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention contacts the tip of a probe with an electrode of a semiconductor chip formed on a semiconductor wafer,
The present invention relates to a probe card for connecting a semiconductor chip to a tester or the like, and more particularly to a probe card capable of simultaneously contacting electrodes of a semiconductor chip with a constant contact pressure of a plurality of probes arranged in a multi-layered and circular shape.

[0002]

2. Description of the Related Art Next, a conventional probe card will be described with reference to FIG. 2A and 2B are explanatory views of a conventional probe card. FIG. 2A is a schematic side sectional view of a main part of the probe card, and FIG. 2B is a schematic plan view of the main part of the probe card. It is a figure.

The conventional probe card is connected to a tester (not shown) for testing the electrical characteristics of the semiconductor chip 11 formed on the semiconductor wafer 10, as shown in FIGS. The probe lead-out surface 22a, which is fixed to the wiring board 21 and the back surface around the opening 21a provided in the wiring board 21 (one surface of the wiring board 21 facing the semiconductor wafer 10) and perpendicular to the back surface of the wiring board 21, is provided. Probe holder 22 looking at opening 21a
Is held by the probe holder 22 in a state of penetrating the probe lead-out surface 22a, and is substantially in a direction opposite to the wiring board 21 at an intermediate portion of a portion protruding from the probe lead-out surface 22a to the opening 21a side of the wiring board 21. And a probe 23 which is bent at a right angle.

Therefore, when the semiconductor wafer 10 set right under the probe card is moved in the direction of arrow U to bring the electrode 11a of the semiconductor chip 11 into contact with the probe 23,
This semiconductor chip 11 will be connected to the above tester.

Needless to say, the probe 23 is electrically connected to the wiring board 21 connected to the tester.

[0006]

By the way, the probe 23 of the conventional probe card has a through hole provided in a row of dots on the probe lead-out surface 22a of the probe holder 22, that is, in a row of dots parallel to the back surface of the wiring board 21. It was inserted in 22b.

Therefore, it is difficult to provide a large number of probes 23 in the conventional probe card.
To increase the number of probes 23, fix the second probe holder 24 as shown by the dotted line to the back surface of the probe holder 22, and hold the probes 25 and 26 on the second probe holder 24 in the same manner as the probe 23. It is possible by

However, the probe increased in this way
The lengths L ₂ and L ₃ of the portions of 25 and 26 parallel to the wiring board 21 are different from the lengths L _{1 of the} portions of the probe 23 parallel to the wiring board 21. Therefore, the electrodes 11a of the semiconductor chip 11 of the semiconductor wafer 10 are
When the probes 23,25,26 are contacted with
There is a problem in that the variation in the contact pressure between the electrodes increases and the variation in the contact resistance value with the electrode 11a also increases.

The present invention has been made in order to solve such a problem, and its purpose is to simultaneously provide a plurality of probes arranged in a multi-step and in a circular shape on electrodes of a semiconductor chip with a constant contact pressure. To provide a probe card that can be contacted.

[0010]

The above-mentioned object is to provide an insulating probe holder fixed to a wiring board 31, as shown in FIG.
32, and a plurality of probes 33 which are led out from the probe holder 32 in parallel with the wiring substrate 31, and whose tips are bent at a substantially right angle and are brought into contact with the electrodes 11a on the substrate 10 to be measured substantially vertically. In the probe card consisting of, the probe lead-out surface 32a of the probe holder 32 is an inclined surface that spreads in a taper shape toward the substrate 10 to be measured, and the probe 33 is led out from the probe lead-out surface 32a in the taper direction in multiple layers. This is achieved by a probe card characterized in that the distance from the probe leading surface 32a of the probe holder 32 to the bending position 33b is substantially the same.

[0011]

The probe 33 of the probe card of the present invention is shown in FIG.
As shown in, the distance between the bent position 33b and the probe lead-out surface 32a of the probe holder 32 is substantially the same.

Therefore, each needle-shaped tip of the probe 33 is connected to the electrode 11a of the semiconductor chip 11 of the semiconductor wafer 10.
When pressed perpendicularly to, each tip comes into contact with the electrode 11a with the same contact pressure.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The probe cards of the first and second embodiments of the present invention will be described below with reference to FIG. Figure 1
FIG. 2A is an explanatory view of a probe card according to an embodiment of the present invention, in which FIG. 1A is a schematic side sectional view of a main part of the probe card according to the first embodiment, and FIG. FIG. 3 is a schematic side sectional view of a main part of the probe card of the example of FIG.

In the present specification, the same parts, the same materials and the like are designated by the same reference numerals throughout the drawings. The probe card according to the first embodiment of the present invention shown in FIG. 1A includes a wiring board 31, a probe holder 32, and a probe.
33 and a probe connecting wiring board 34.

The wiring board 31 has an opening 31a, and a tester (not shown) for testing the electrical characteristics of the semiconductor chip 11 of the semiconductor wafer 10 set directly under the opening 31a.
Connected to.

The probe holder 32 has an insulating property and is fixed to the surface of the wiring board 31 so as to surround the opening 31a, and the probe lead-out surface 32a which desires the opening 31a is tapered as it approaches the semiconductor wafer 10. It has a slope that spreads like a shape.

The probe 33 has a multi-layered structure (for example, from the probe lead-out surface 32a of the probe holder 32 in the taper direction).
(5 layers) is bent at a substantially right angle in the middle of the exposed portion 33a, and the needle-like tip of this exposed portion 33a is formed so as to contact the electrode 11a of the substrate 10 substantially vertically. Distances L ₁ , L ₂ , L ₃ , L ₄ , and L ₅ from the probe guide surface 32a of the probe holder 32 to the bending position 33b of the exposed portion 33a are formed to be substantially the same.

The probe 33 has a probe holder 32.
It is needless to say that they are led out from the probe lead-out surface 32a in a multi-step manner as described above, and are also arranged in a row parallel to the wiring board 31.

Then, the wiring board 34 for connecting the probe is placed on the wiring board 34 so as to surround the outer surface of the probe holder 32.
It is fixed to the surface of 31 and electrically connects the wiring board 31 and the probe 33.

Therefore, the semiconductor wafer set right under the probe 33 of the probe card according to the embodiment of the present invention.
When the probe 10 is moved in the direction of the arrow U, each probe 33 comes into contact with the electrode 11a of the semiconductor chip 11 with the same contact pressure, and the semiconductor chip 11 is connected to the above-mentioned testing machine.

Since there is less variation in contact resistance between the probe 33 and the electrode 11a of the semiconductor chip 11 that are in contact with each other at the same contact pressure, the electrical characteristics of the semiconductor chip 11 can be accurately tested by a tester. Become.

FIG. 2B shows a probe card according to a second embodiment of the present invention, which is constructed by disposing a probe holder 42, a probe 43 and a probe connecting wiring board 44 on the back side of the wiring board 41. Is.

Also in the probe card of the second embodiment of the present invention, the distance L ₁ ', L ₂ ', L ₃ ', L ₄ ', from the probe lead-out surface 42a of the probe holder 42 to the bending position 43b of the probe 43,
Since L ₅ ′ can be configured the same, it is natural that the same effect as the probe card of the first embodiment described above can be obtained.

[0024]

As described above, according to the present invention, it is possible to provide a probe card capable of simultaneously contacting a plurality of probes arranged in a multilayer shape and in a circular shape with electrodes of a semiconductor chip with a constant contact pressure. To do.

Therefore, when the electrical characteristics of the semiconductor chip or the like formed on the semiconductor wafer are tested, if the probe card of the present invention is adopted, the electrical characteristics of the semiconductor chip or the like can be accurately tested by a tester or the like. It will be.

[Brief description of drawings]

FIG. 1 is an explanatory view of a probe card according to an embodiment of the present invention,

FIG. 2 is an explanatory view of a conventional probe card,

[Explanation of symbols]

 10 is a semiconductor wafer (substrate to be measured), 11 is a semiconductor chip, 11a is an electrode, 21,31,41 are wiring boards, 21a, 31a are openings, 22,32,42 are probe holders, Reference numerals 22a, 32a, 42a are probe derivation surfaces, 23, 25, 26, 33, 43 are probes, and 34, 44 are probe connection wiring boards.

Claims (1)

[Claims] 1. An insulative probe holder (32) fixed to a wiring board (31) and a probe holder (32) which is led out in parallel with the wiring board (31) and whose tip is bent at a substantially right angle. In the probe card including a plurality of probes (33) that are contacted with the electrode (11a) on the substrate to be measured (10) substantially vertically, the probe lead-out surface (32a) of the probe holder (32) is The probe (33) has a slope extending toward the substrate to be measured (10) in a taper shape, and the probe (33) is led out from the probe lead-out surface (32a) in a taper direction in a multilayer shape, and the probe holder (32). The probe card is characterized in that the distance from the probe lead-out surface (32a) to the bending position (33b) is substantially the same.