JPH05315765A - Housing waterproof structure for electronic device - Google Patents
Housing waterproof structure for electronic deviceInfo
- Publication number
- JPH05315765A JPH05315765A JP4113269A JP11326992A JPH05315765A JP H05315765 A JPH05315765 A JP H05315765A JP 4113269 A JP4113269 A JP 4113269A JP 11326992 A JP11326992 A JP 11326992A JP H05315765 A JPH05315765 A JP H05315765A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- packing
- lower cover
- electronic device
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
- Calculators And Similar Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はコードレス電話などの携
帯型通信装置やノート型パーソナルコンピュータなどの
携帯型情報処理装置を始めとする携帯型の電子装置にお
いて、屋外でも使用可能とするための筐体防水構造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable electronic device such as a portable communication device such as a cordless telephone or a portable information processing device such as a notebook personal computer, which is used for outdoor use. Body waterproof structure.
【0002】電子装置の電子回路が湿気により濡れたり
水が掛かった場合には回路の短絡を生じたり、絶縁破壊
を生じたりして故障の原因となる。また、電子回路を構
成する電子部品についても絶縁抵抗の低下を生じ劣化が
加速される。When an electronic circuit of an electronic device is wetted with moisture or splashed with water, a short circuit occurs or dielectric breakdown occurs, which causes a failure. In addition, the insulation resistance of the electronic components forming the electronic circuit is also reduced, and the deterioration is accelerated.
【0003】これらのことから、屋外で使用する電子装
置については防水構造をとる必要がある。また、高周波
で使用する装置についてはシールドを設け、電子回路か
ら発生する不要な電波を外部に漏れなくすることが必要
である。For these reasons, it is necessary to take a waterproof structure for electronic devices used outdoors. Further, it is necessary to provide a shield for a device used at a high frequency to prevent unnecessary electric waves generated from an electronic circuit from leaking to the outside.
【0004】本発明は防水構造をとって内部の機器を保
護すると共にシールド構造をとる筐体防水構造に関する
ものである。The present invention relates to a waterproof structure for a casing, which has a waterproof structure to protect internal equipment and a shield structure.
【0005】[0005]
【従来の技術】筐体構造をとる電子装置への湿気や水の
侵入口としてはカバーの開口部,スイッチなどの摺動
部,カバーとカバーとの嵌合部などがあり、かゝる位置
にはパッキングを使用して装置内部を装置外部から完全
に遮断する必要がある。2. Description of the Related Art As an entry port for moisture and water to an electronic device having a housing structure, there are an opening portion of a cover, a sliding portion such as a switch, a fitting portion between the cover and the like. It is necessary to use packing to completely shield the inside of the device from the outside.
【0006】図4は従来より使用されているカバーとカ
バーとの防水構造を示すもので、凸形の断面形状をもつ
アッパァカバー1と凹型の断面形状をし、この凹部に弾
性体のチューブ3を挿入したロアーカバー2から構成さ
れており、嵌合前には円形をしている弾性体のチューブ
3を潰すことにより防水効果を生じさせている。FIG. 4 shows a waterproof structure of a cover and a cover which have been conventionally used. An upper cover 1 having a convex cross-sectional shape and a concave cross-sectional shape are provided, and an elastic tube 3 is provided in the concave portion. It is composed of the inserted lower cover 2, and before fitting, the waterproof tube 3 has a waterproof effect by crushing a circular elastic tube 3.
【0007】また、図5はアッパァカバー4は平坦で、
ロアーカバー5は内側に向けて上り階段状の段差部6が
あり、この間に中央部が窪んだパッキング7を使用した
場合を示している。Also, in FIG. 5, the upper cover 4 is flat,
The lower cover 5 has a stepped portion 6 having an upward staircase toward the inside, and shows a case where a packing 7 having a depressed central portion is used between them.
【0008】すなわち、パッキング7の凹部にロアーカ
バー5の段差部6が嵌合することによりパッキング7は
固定されており、ゴム弾性を備えたパッキング7にアッ
パァカバー4が圧着することにより防水効果を生じさせ
ている。That is, the packing 7 is fixed by fitting the stepped portion 6 of the lower cover 5 into the concave portion of the packing 7, and the waterproof effect is produced by pressing the upper cover 4 onto the packing 7 having rubber elasticity. I am letting you.
【0009】然し、使用周波数の高い電子装置の筐体の
必要条件は防水と共に筐体内部をメッキなどの処理によ
りメタライズし、シールド効果をもたせることで、その
場合にアッパァカバーとロアーカバーは導通状態に保持
する必要があるが、図4の構造ではこの条件を満たすも
のゝ、図5の構造ではパッキング7により絶縁されてい
るために、この目的には副わない。However, the necessary condition for the housing of an electronic device with a high frequency of use is to waterproof and metallize the inside of the housing by a treatment such as plating to provide a shielding effect, in which case the upper cover and the lower cover are brought into conduction. Although it is necessary to hold it, the structure of FIG. 4 satisfies this condition, and the structure of FIG. 5 is insulated by the packing 7 and therefore does not serve this purpose.
【0010】また、図5の構造では不用意にパッキング
7に力が加わるとパッキング7がロアーカバー5より外
れ易いと云う問題がある。一方、図4の構造をとるため
には凹部または凸部とこれを挟む平坦部の厚さとして少
なくとも各1mmは必要で、全体の厚さは3mm以上とな
り、このような構造をとる場合は筐体の小形化と軽量化
が難しいと云う問題がある。Further, the structure of FIG. 5 has a problem that the packing 7 is likely to come off from the lower cover 5 when a force is carelessly applied to the packing 7. On the other hand, in order to obtain the structure shown in FIG. 4, at least 1 mm is required for the thickness of the concave or convex portion and the flat portion sandwiching the concave or convex portion, and the total thickness is 3 mm or more. There is a problem that it is difficult to make the body smaller and lighter.
【0011】[0011]
【発明が解決しようとする課題】使用周波数が高い電子
装置の防水筐体として発明者等は、 モールド肉厚をできるだけ薄く(2mm以下) として
小形軽量化を図りたい。 アッパァカバーとロアーカバー間の導通を保持した
い。 パッキングをカバーに組み込む際に接着剤を使うこ
となく固定したい。 を必要条件として設定したが、従来構造では不適当であ
る。SUMMARY OF THE INVENTION As a waterproof casing for an electronic device having a high frequency of use, the inventors want to make the mold thickness as thin as possible (2 mm or less) to reduce the size and weight. I want to maintain the continuity between the upper cover and the lower cover. I want to fix the packing in the cover without using adhesive. Was set as a necessary condition, but the conventional structure is unsuitable.
【0012】そこで、この条件を満たす防水筐体を実用
化することが課題である。[0012] Therefore, it is a problem to put a waterproof casing which satisfies this condition into practical use.
【0013】[0013]
【課題を解決するための手段】上記の課題は内側に上り
階段状の段差部を有するアッパァカバーと、内側に上り
階段状の段差部を有し、所定の間隙でこの段差部に一段
と高い凸部を有するロアーカバーと、ロアーカバーの凸
部が嵌合する穴を所定の間隔で有し、上部が平坦で、下
部にロアーカバーの上り階段状の段差が嵌合し、且つ、
ロアーカバーの上部内側を覆うパッキングとからなるこ
とを特徴とする電子装置の筐体防水構造により達成する
ことができる。Means for Solving the Problems The above-mentioned problems are solved by an upper cover having an ascending stepped portion on the inside and an ascending stepped portion on the inside, and a convex portion having a higher height at the stepped portion with a predetermined gap. And a lower cover having a hole to which the convex portion of the lower cover fits at a predetermined interval, the upper part is flat, and the step-like steps of the lower cover fit in the lower part, and
This can be achieved by a waterproof structure for the casing of the electronic device, which is characterized in that it comprises a packing covering the upper inside of the lower cover.
【0014】[0014]
【作用】発明者等は上記の条件を満たす方法として、
アッパァカバーの先端形状を内側に向けて上り階段状
の段差部を有する構造とし、また、ロアーカバーの先端
形状を内側に向けて上り階段状の段差部を有し、所定の
間隙でこの段差部に一段と高い凸部を有する構造、
パッキングの構造として、ロアーカバーの凸部が嵌合す
る穴を所定の間隔で有し、上部が平坦で、下部にロアー
カバーの上り階段状の段差が嵌合し、且つ、ロアーカバ
ーの上部内側を覆う構造、とした。The present inventors have a method for satisfying the above conditions,
The upper cover has a stepped part with the tip shape facing inward, and the lower cover has a stepped part with the tip step facing inward. Structure with a much higher convex portion,
As a packing structure, the protrusions of the lower cover are provided with holes at predetermined intervals, the upper part is flat, the step-like steps of the lower cover are fitted on the lower part, and the inside of the upper part of the lower cover is The structure that covers the.
【0015】図1は本発明を実施した筐体の構造を示す
斜視図であり、(A)はアッパァカバー,(B)はパッ
キング,(C)はロアーカバー,(D)はロアーカバー
にパッキングを挿入した後、アッパァカバーを近づけた
状態を示している。FIG. 1 is a perspective view showing the structure of a case embodying the present invention. (A) is an upper cover, (B) is a packing, (C) is a lower cover, and (D) is a lower cover. It shows a state in which the upper cover is brought closer after being inserted.
【0016】すなわち、アッパァカバー9とロアーカバ
ー10の接合部は共に内側に向けて上り階段状の段差部1
1,12 を備えて構成されているが、ロアーカバー10の接
合部には一段と高い凸部13を備えている。That is, the joints between the upper cover 9 and the lower cover 10 are both inwardly stepped stepped portions 1
The lower cover 10 is provided with a higher convex portion 13 at the joint portion.
【0017】また、パッキング14は上面は平坦である
が、ロアーカバー10の凸部13が抜け出る穴15を備え、下
面にはロアーカバー10の段差部12が嵌合する凹部16を備
えて構成されている。The packing 14 has a flat upper surface, but is provided with a hole 15 through which the convex portion 13 of the lower cover 10 comes out, and a lower surface is provided with a concave portion 16 into which the step portion 12 of the lower cover 10 is fitted. ing.
【0018】そして、同図(D)に示すようにパッキン
グ14をロアーカバー10に位置合わせして圧着するとパッ
キング14の穴15よりロアーカバー10の凸部13が抜け出て
いるために、固定され、また、凸部13がアッパァカバー
9と直接に当接するために導通は確保される。Then, as shown in FIG. 3D, when the packing 14 is aligned with the lower cover 10 and pressure-bonded thereto, the convex portion 13 of the lower cover 10 comes out from the hole 15 of the packing 14 and is fixed. Further, since the convex portion 13 directly contacts the upper cover 9, conduction is ensured.
【0019】また、パッキング14はロアーカバー10とア
ッパァカバー9の段差部11,12 により押圧されて防水効
果を生じている。さて、図2は本発明に係るパッキング
の断面図、また、図3はパッキングを挿入してあるロア
ーカバーにアッパァカバーを押圧した状態を示す断面図
である。The packing 14 is pressed by the step portions 11 and 12 of the lower cover 10 and the upper cover 9 to produce a waterproof effect. 2 is a cross-sectional view of the packing according to the present invention, and FIG. 3 is a cross-sectional view showing a state in which the upper cover is pressed against the lower cover in which the packing is inserted.
【0020】すなわち、本発明に係るパッキング14はゴ
ムなどの弾性体よりなり、上側18は平坦であるが下側に
はロアーカバー10の段差部12が嵌合する凹部16があり、
また、一定の間隔を置いてロアーカバー10の凸部13が突
き出るための穴15が開けられている。That is, the packing 14 according to the present invention is made of an elastic material such as rubber, the upper side 18 is flat, and the lower side has a recess 16 into which the step portion 12 of the lower cover 10 is fitted,
In addition, holes 15 are formed at regular intervals so that the protrusions 13 of the lower cover 10 project.
【0021】そして、かゝるパッキング14をロアーカバ
ー10に装着した後に図3に示すようにアッパァカバー9
を当接すると、先ず、アッパァカバー9の段差部11がパ
ッキング14の上側に当たるが、アッパァカバー9の段差
部11の内側がロアーカバー10の凸部13に当接するまで加
圧すると、アッパァカバー9の段差部11によりパッキン
グ14は図に示すように加圧により変形し、これにより防
水効果を生じ防水が確保される。After the packing 14 is attached to the lower cover 10, as shown in FIG.
First, the stepped portion 11 of the upper cover 9 hits the upper side of the packing 14, but when the inner side of the stepped portion 11 of the upper cover 9 comes into contact with the convex portion 13 of the lower cover 10, the stepped portion of the upper cover 9 is pressed. As shown in the figure, the packing 14 is deformed by the pressure due to the pressure 11, which causes a waterproof effect and ensures waterproofness.
【0022】このような構造をとることによりシールド
と防水の両方の条件を満たすことができる。By adopting such a structure, it is possible to satisfy both conditions of shielding and waterproofing.
【0023】[0023]
【実施例】ABS樹脂(アクリロニトリル・ブタジエン
・スチレン共重合体)を用い、図1に示すような形状を
とるアッパァカバー(同図A)とロアーカバー(同図
C)を形成した。EXAMPLE An ABS resin (acrylonitrile-butadiene-styrene copolymer) was used to form an upper cover (FIG. A) and a lower cover (FIG. C) having the shapes shown in FIG.
【0024】こゝで、カバーの厚さは2mmとし、ニッケ
ル(Ni)の無電解メッキを行なってカバーの表裏面に亙
ってメタライズ層を設けた後、カバーの外側には塗装を
施した。Here, the thickness of the cover was set to 2 mm, electroless plating of nickel (Ni) was performed to provide metallization layers on the front and back surfaces of the cover, and then the outer surface of the cover was painted. ..
【0025】こゝで、ロアーカバー10の段差部12に設け
る凸部13の中心間隔は使用するシステムのクロックの高
調波周波数から想定した放射ノイズの周波数より求めて
20mmとした。Here, the center interval of the convex portions 13 provided on the step portion 12 of the lower cover 10 is obtained from the frequency of the radiation noise assumed from the harmonic frequency of the clock of the system used.
It was set to 20 mm.
【0026】また、アッパァカバー9とロアーカバー10
との接触を確実にするために、アッパァカバー9 の接触
面に半円形の突起18を設けた。また、ロアーカバー10に
はパッキング14の保持を確実にするための支持体19を予
めモールドした。Further, the upper cover 9 and the lower cover 10
In order to ensure contact with the upper cover 9, a semicircular protrusion 18 is provided on the contact surface of the upper cover 9. Further, the lower cover 10 is pre-molded with a support 19 for ensuring the retention of the packing 14.
【0027】また、パッキング14はネオプレンゴムを用
いて形成した。その結果、電子機器から発生する不要電
波を閉じ込めて遮蔽することゝ、完全防水の両方の必要
条件を満たすことができた。The packing 14 is made of neoprene rubber. As a result, we were able to satisfy both the requirements of confining and shielding unnecessary radio waves generated from electronic devices and completely waterproofing.
【0028】[0028]
【発明の効果】本発明の実施により小形軽量の電子装置
用防水筐体を実用化することができ、これにより、電子
装置の信頼性を向上することができる。By implementing the present invention, it is possible to put a small-sized and lightweight waterproof casing for an electronic device into practical use, thereby improving the reliability of the electronic device.
【図1】本発明を実施した筐体の斜視図である。FIG. 1 is a perspective view of a housing in which the present invention is implemented.
【図2】本発明に係るパッキングの断面図である。FIG. 2 is a sectional view of a packing according to the present invention.
【図3】パッキングの押圧状態を示す断面図である。FIG. 3 is a cross-sectional view showing a pressed state of packing.
【図4】従来の筐体の防水構造を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional waterproof structure for a housing.
【図5】従来の筐体の防水構造を示す別の断面図であ
る。FIG. 5 is another cross-sectional view showing a conventional waterproof structure for a housing.
9 アッパァカバー 10 ロアーカバー 11,12 段差部 13 凸部 14 パッキング 15 穴 16 凹部 9 Upper cover 10 Lower cover 11, 12 Step 13 Protrusion 14 Packing 15 Hole 16 Recess
Claims (1)
有するアッパァカバー(9)と、 内側に向けて上り階段状の段差部(12)を有し、所定の間
隙で該段差部(12)に一段と高い凸部(13)を有するロアー
カバー(10)と、 前記ロアーカバー(10)の凸部(13)が嵌合する穴(15)を所
定の間隔で有し、上側(18)が平坦で、下部にロアーカバ
ー(10)の上り階段状の段差部(12)が嵌合し、且つ、該ロ
アーカバー(10)の上部内側を覆うパッキング(14)と、 を備えてなることを特徴とする電子装置の筐体防水構
造。1. An upper cover (9) having an inwardly stepped step (11) toward the inside, and an upwardly stepped step (12) toward the inward, the stepped part having a predetermined gap. Lower cover (10) having a higher protrusion (13) in (12) and holes (15) into which the protrusions (13) of the lower cover (10) fit are provided at predetermined intervals, and the upper side ( 18) is flat, and the lower cover is fitted with the step-like step portion (12) of the lower cover (10), and the upper cover of the lower cover (10) is covered with a packing (14). A waterproof structure for a casing of an electronic device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4113269A JPH05315765A (en) | 1992-05-06 | 1992-05-06 | Housing waterproof structure for electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4113269A JPH05315765A (en) | 1992-05-06 | 1992-05-06 | Housing waterproof structure for electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05315765A true JPH05315765A (en) | 1993-11-26 |
Family
ID=14607893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4113269A Withdrawn JPH05315765A (en) | 1992-05-06 | 1992-05-06 | Housing waterproof structure for electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05315765A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07168650A (en) * | 1993-12-16 | 1995-07-04 | Nec Corp | Water-proof structure of pen input electronic equipment |
JP2003294873A (en) * | 2002-03-29 | 2003-10-15 | Seiko Precision Inc | Metronome |
JP2011119346A (en) * | 2009-12-01 | 2011-06-16 | Fujitsu Ltd | Shield case, and communication apparatus |
US20190244640A1 (en) * | 2018-02-07 | 2019-08-08 | Getac Technology Corporation | Waterproof module and seal member thereof |
CN110223721A (en) * | 2018-03-02 | 2019-09-10 | 神讯电脑(昆山)有限公司 | Waterproof module and its sealing element |
JP2019216212A (en) * | 2018-06-14 | 2019-12-19 | 株式会社日立製作所 | Air cooling enclosure |
-
1992
- 1992-05-06 JP JP4113269A patent/JPH05315765A/en not_active Withdrawn
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07168650A (en) * | 1993-12-16 | 1995-07-04 | Nec Corp | Water-proof structure of pen input electronic equipment |
JP2003294873A (en) * | 2002-03-29 | 2003-10-15 | Seiko Precision Inc | Metronome |
JP2011119346A (en) * | 2009-12-01 | 2011-06-16 | Fujitsu Ltd | Shield case, and communication apparatus |
US20190244640A1 (en) * | 2018-02-07 | 2019-08-08 | Getac Technology Corporation | Waterproof module and seal member thereof |
US10482927B2 (en) * | 2018-02-07 | 2019-11-19 | Etac Technology Corporation | Waterproof module and seal member thereof |
CN110223721A (en) * | 2018-03-02 | 2019-09-10 | 神讯电脑(昆山)有限公司 | Waterproof module and its sealing element |
CN110223721B (en) * | 2018-03-02 | 2021-07-13 | 神讯电脑(昆山)有限公司 | Waterproof module and sealing element thereof |
JP2019216212A (en) * | 2018-06-14 | 2019-12-19 | 株式会社日立製作所 | Air cooling enclosure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990706 |