JPH05267913A - Signal line for high frequency electronic parts - Google Patents
Signal line for high frequency electronic partsInfo
- Publication number
- JPH05267913A JPH05267913A JP4091869A JP9186992A JPH05267913A JP H05267913 A JPH05267913 A JP H05267913A JP 4091869 A JP4091869 A JP 4091869A JP 9186992 A JP9186992 A JP 9186992A JP H05267913 A JPH05267913 A JP H05267913A
- Authority
- JP
- Japan
- Prior art keywords
- signal line
- mesh
- ground plane
- dielectric layer
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waveguides (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高周波用電子部品の誘
電体層表面に備えた信号線路に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal line provided on the surface of a dielectric layer of a high frequency electronic component.
【０００２】[0002]
【従来の技術】上記信号線路として、図５又は図６に示
したように、ポリイミド樹脂等からなる誘電体層（図示
せず）の一方の表面に信号線路２０を備えると共に、同
じ誘電体層の他方の表面に網目状をしたメッシュグラン
ドプレーン３０を備えて、そのメッシュグランドプレー
ン３０で信号線路２０の特性インピーダンスをほぼ５０
Ω等にマッチングさせた信号線路が知られている。2. Description of the Related Art As the signal line, as shown in FIG. 5 or 6, a signal line 20 is provided on one surface of a dielectric layer (not shown) made of polyimide resin or the like, and the same dielectric layer is provided. A mesh-shaped ground plane 30 having a mesh shape is provided on the other surface of the signal line 20, and the characteristic impedance of the signal line 20 is approximately 50 by the mesh ground plane 30.
A signal line matched with Ω or the like is known.
【０００３】図５又は図６は、信号線路２０とメッシュ
グランドプレーン３０とを、それらの間の誘電体層を排
除して、上方から見た透視図を示している。FIG. 5 or FIG. 6 shows a perspective view of the signal line 20 and the mesh ground plane 30 as seen from above with the dielectric layer between them removed.
【０００４】ここで、誘電体層の他方の表面にグランド
プレーンでなく網目状をしたメッシュグランドプレーン
３０を設けている理由は、ポリイミド樹脂等からなる誘
電体層は、その厚さを通常１５〜２０μｍと薄くしか形
成できず、誘電体層の他方の表面にグランドプレーンを
備えた場合には、そのグランド効果が大きくなり過ぎ
て、信号線路２０の特性インピーダンスが５０Ω等より
大幅に低くなってしまうからである。即ち、誘電体層の
他方の表面にグランドプレーンに代えて網目状をしたメ
ッシュグランドプレーン３０を備えて、そのグランド効
果を弱め、メッシュグランドプレーン３０で信号線路２
０の特性インピーダンスを５０Ω等まで高める必要があ
るからである。The reason why the mesh ground plane 30 having a mesh shape is provided on the other surface of the dielectric layer instead of the ground plane is that the thickness of the dielectric layer made of polyimide resin is usually 15 to If it can be formed only as thin as 20 μm and a ground plane is provided on the other surface of the dielectric layer, the ground effect becomes too large and the characteristic impedance of the signal line 20 becomes significantly lower than 50Ω or the like. Because. That is, a mesh-shaped ground plane 30 having a mesh shape is provided on the other surface of the dielectric layer in place of the ground plane to weaken the ground effect, and the mesh ground plane 30 allows the signal line 2
This is because it is necessary to increase the characteristic impedance of 0 to 50Ω or the like.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
ように、誘電体層の他方の表面にメッシュグランドプレ
ーン３０を備えた場合には、メッシュグランドプレーン
３０の網目にあたる空隙部分３４に誘電体層を介して対
向する信号線路２０部分のグランド効果が、その他のメ
ッシュグランドプレーンの網線３２に誘電体層を介して
対向する信号線路２０部分に比べて、弱くて、その空隙
部分３４に誘電体層を介して対向する信号線路２０部分
の特性インピーダンスが、その他の信号線路２０部分の
特性インピーダンスに比べて、高くなってしまった。However, when the mesh ground plane 30 is provided on the other surface of the dielectric layer as described above, the dielectric layer is provided in the void portion 34 corresponding to the mesh of the mesh ground plane 30. The ground effect of the portion of the signal line 20 that faces through is weaker than that of the portion of the signal line 20 that faces the mesh line 32 of the other mesh ground plane via the dielectric layer, and the dielectric layer is formed in the void portion 34. The characteristic impedance of the portion of the signal line 20 which is opposed to via the signal line 20 is higher than the characteristic impedance of the other portion of the signal line 20.
【０００６】言い換えれば、網目状をしたメッシュグラ
ンドプレーン３０では、信号線路２０の特性インピーダ
ンスをその全長に亙って一定値の５０Ω等に的確にマッ
チングさせることができずに、信号線路２０各所でその
特性インピーダンスが高くなったり低くなったりしてし
まった。In other words, in the mesh-shaped ground plane 30 having a mesh shape, the characteristic impedance of the signal line 20 cannot be accurately matched to a constant value of 50Ω or the like over the entire length thereof, so that the signal line 20 is distributed in various places. The characteristic impedance has become higher or lower.
【０００７】なお、このような難点を解消するために、
図６右側に示したように、信号線路２０をメッシュグラ
ンドプレーンの網線３２と対向させて誘電体層の一方の
表面に備えることが行われている。[0007] In order to eliminate such a difficulty,
As shown on the right side of FIG. 6, the signal line 20 is provided on one surface of the dielectric layer so as to face the mesh line 32 of the mesh ground plane.
【０００８】しかしながら、そうした場合には、同じ図
６右側に示したように、信号線路２０の折曲箇所を、網
線３２の交叉箇所の形状に倣って、鋭く直角状等に折曲
しなければならず、その鋭く折曲した信号線路２０の折
曲箇所を伝わる高周波信号の反射損失が増大するのを避
けられなかった。However, in such a case, as shown on the right side of FIG. 6, the bent portion of the signal line 20 should be bent sharply at a right angle or the like in accordance with the shape of the intersecting portion of the mesh wire 32. Inevitably, the reflection loss of the high frequency signal transmitted through the bent portion of the sharply bent signal line 20 is unavoidable.
【０００９】本発明は、このような課題に鑑みてなされ
たもので、誘電体層の一方の表面に備えた信号線路の特
性インピーダンスをその全長に亙って５０Ω等に的確に
マッチングさせたり、その信号線路の折曲箇所を伝わる
高周波信号の反射損失を少なく抑えたりできる、高周波
用電子部品の信号線路（以下、高周波用信号線路とい
う）を提供することを目的としている。The present invention has been made in view of the above problems, and the characteristic impedance of the signal line provided on one surface of the dielectric layer is appropriately matched to 50Ω or the like over its entire length, An object of the present invention is to provide a signal line of a high-frequency electronic component (hereinafter, referred to as a high-frequency signal line), which can reduce reflection loss of a high-frequency signal transmitted through a bent portion of the signal line.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明の高周波用信号線路は、誘電体層の一方の表
面に信号線路を備えると共に、前記誘電体層の他方の表
面に網目状のメッシュグランドプレーンを備えて、その
メッシュグランドプレーンで前記信号線路の特性インピ
ーダンスをほぼ一定値にマッチングさせた高周波用電子
部品の信号線路において、前記信号線路と前記誘電体層
を介して対向するメッシュグランドプレーンを備えた誘
電体層表面部分に、前記信号線路とほぼ同一幅か又はそ
れより細幅のメッシュグランドプレーン補完用のグラン
ド線路を信号線路と同一パターンに並べて備えて、その
グランド線路の前記メッシュグランドプレーンと重なり
合った箇所をメッシュグランドプレーンに接続し、さら
に、前記信号線路の折曲箇所を弧状に形成すると共に、
その弧状に形成した信号線路の折曲箇所の形状に倣っ
て、信号線路の折曲箇所に対向する前記グランド線路の
折曲箇所を弧状に形成したことを特徴としている。In order to achieve the above object, a high-frequency signal line of the present invention comprises a signal line on one surface of a dielectric layer and a mesh on the other surface of the dielectric layer. A signal ground line of a high-frequency electronic component in which the characteristic ground impedance of the signal line is matched with the mesh ground plane to a substantially constant value, the signal ground line faces the signal line through the dielectric layer. On the dielectric layer surface portion provided with the mesh ground plane, a ground line for complementing the mesh ground plane having a width substantially equal to or narrower than that of the signal line is arranged in the same pattern as the signal line, and the ground line Connect the mesh ground plane where it overlaps with the mesh ground plane, and further connect the signal line. To form a bent portion in an arc,
In accordance with the shape of the bent portion of the signal line formed in the arc shape, the bent portion of the ground line facing the bent portion of the signal line is formed in the arc shape.
【００１１】[0011]
【作用】上記構成の高周波用信号線路においては、メッ
シュグランドプレーン補完用のグランド線路を誘電体層
を介して信号線路に対向させて信号線路と同一パターン
に並べて備えている。それと共に、グランド線路のメッ
シュグランドプレーンと重なり合った箇所を、メッシュ
グランドプレーンに接続していて、グランド線路をメッ
シュグランドプレーンを介して電位差少なく接地できる
ようにしている。In the high-frequency signal line having the above structure, the ground line for complementing the mesh ground plane is arranged in the same pattern as the signal line so as to face the signal line via the dielectric layer. At the same time, a portion of the ground line that overlaps the mesh ground plane is connected to the mesh ground plane so that the ground line can be grounded with a small potential difference via the mesh ground plane.
【００１２】そのため、メッシュグランドプレーンとそ
のプレーン補完用のグランド線路とで、信号線路の特性
インピーダンスを、その全長に亙って途切れなく５０Ω
等の一定値に的確にマッチングさせることができる。Therefore, the characteristic impedance of the signal line between the mesh ground plane and the ground line for complementing the plane is 50Ω without interruption over the entire length.
It is possible to exactly match a constant value such as.
【００１３】また、グランド線路を信号線路とほぼ同一
幅か又はそれより細幅に形成しているので、グランド線
路の信号線路に対するグランド効果を高め過ぎずに、メ
ッシュグランドプレーンとそのプレーン補完用のグラン
ド線路とで、信号線路の特性インピーダンスを一定値に
的確にマッチングさせることができる。Further, since the ground line is formed to have a width substantially the same as or narrower than the signal line, the mesh ground plane and the plane complement for the plane are complemented without excessively increasing the ground effect of the ground line on the signal line. With the ground line, the characteristic impedance of the signal line can be accurately matched to a constant value.
【００１４】メッシュグランドプレーンの網線の幅とそ
の網目にあたる空隙部分の開口率は、信号線路の幅を基
準としてそれぞれ形成している。即ち一般に、メッシュ
グランドプレーンの網線は信号線路の幅とほぼ同一幅に
形成しており、メッシュグランドプレーンの網目の開口
率は網線の幅を考慮して定めている。The width of the mesh line of the mesh ground plane and the aperture ratio of the void portion corresponding to the mesh are formed with reference to the width of the signal line. That is, generally, the mesh line of the mesh ground plane is formed to have a width substantially equal to the width of the signal line, and the aperture ratio of the mesh of the mesh ground plane is determined in consideration of the width of the mesh line.
【００１５】従って、上記構成の信号線路においては、
グランド線路の幅を信号線路とほぼ同一幅かそれより細
幅に形成しているので、メッシュグランドプレーンの網
目にあたる空隙部分をグランド線路で埋め尽くして、メ
ッシュグランドプレーンのグランド効果をグランドプレ
ーンと同様な値まで高めてしまうのを防止できる。Therefore, in the signal line having the above structure,
Since the width of the ground line is formed to be almost the same width as the signal line or narrower than that, the gap part that corresponds to the mesh of the mesh ground plane is filled with the ground line, and the ground effect of the mesh ground plane is the same as that of the ground plane. It can be prevented from increasing to a certain value.
【００１６】また、信号線路の折曲箇所を弧状に形成し
ているので、その信号線路の折曲箇所を伝わる高周波信
号の反射損失を少なく抑えることができる。Further, since the bent portion of the signal line is formed in an arc shape, the reflection loss of the high frequency signal transmitted through the bent portion of the signal line can be reduced.
【００１７】また、信号線路の折曲箇所に対向するグラ
ンド線路の折曲箇所を、信号線路の折曲箇所の形状に倣
って弧状に形成しているので、信号線路の弧状に形成し
た折曲箇所の特性インピーダンスを、その信号線路の折
曲箇所に対向する上記弧状に形成したグランド線路とそ
の周辺のメッシュグランドプレーンとで一定値に的確に
マッチングさせることができる。Further, since the bent portion of the ground line facing the bent portion of the signal line is formed in an arc shape following the shape of the bent portion of the signal line, the bent portion formed in the arc shape of the signal line. The characteristic impedance of a location can be accurately matched to a constant value between the arc-shaped ground line facing the bent portion of the signal line and the mesh ground plane around the arc-shaped ground line.
【００１８】[0018]
【実施例】次に、本発明の実施例を図面に従い説明す
る。図１ないし図４は本発明の高周波用信号線路の好適
な実施例を示し、図１はその概略構造を示す斜視図、図
２、図３又は図４はその一部断面図を示している。以下
に、この高周波用信号線路を説明する。Embodiments of the present invention will now be described with reference to the drawings. 1 to 4 show a preferred embodiment of a high-frequency signal line of the present invention, FIG. 1 is a perspective view showing a schematic structure thereof, and FIG. 2, FIG. 3 or FIG. 4 is a partial sectional view thereof. .. The high-frequency signal line will be described below.
【００１９】図において、１０、１２、１４は、ポリイ
ミド樹脂等からなる厚さの薄い誘電体層である。In the figure, reference numerals 10, 12, and 14 denote thin dielectric layers made of polyimide resin or the like.
【００２０】誘電体層１０、１２、１４の一方の表面に
は、クローム、銅、ニッケル等からなる信号線路２２、
２４、２６を備えている。A signal line 22 made of chrome, copper, nickel or the like is formed on one surface of each of the dielectric layers 10, 12, 14.
24 and 26 are provided.
【００２１】誘電体層１０、１２、１４の他方の表面に
は、チタン、モリブデン、ニッケル等からなる網目状を
したメッシュグランドプレーン３０を広く備えている。On the other surface of the dielectric layers 10, 12 and 14, a mesh-like ground plane 30 made of titanium, molybdenum, nickel or the like is widely provided.
【００２２】これらの信号線路２２、２４、２６とメッ
シュグランドプレーン３０とは、誘電体層１０、１２、
１４表面又はそれらの誘電体層を備えるセラミック基板
（図示せず）表面にスパッタリング等により備えた薄膜
をエッチング加工して形成している。The signal lines 22, 24, 26 and the mesh ground plane 30 are connected to the dielectric layers 10, 12,
14 is formed by etching a thin film provided on the surface or a surface of a ceramic substrate (not shown) provided with those dielectric layers by sputtering or the like.
【００２３】信号線路２２、２４、２６は、前述図５に
示した信号線路２０と同様に、誘電体層１０、１２、１
４の一方の表面に、その上方から見て他方の誘電体層１
０、１２、１４表面に備えたメッシュグランドプレーン
の網目にあたる空隙部分３４を斜めに横切るように備え
たり、又は前述図６に示した信号線路２０と同様に、誘
電体層１０、１２、１４の一方の表面に、その上方から
見て他方の誘電体層１０、１２、１４表面に備えたメッ
シュグランドプレーンの網線３２と平行に並べて備えた
りしている。The signal lines 22, 24 and 26 are similar to the signal line 20 shown in FIG.
4 on one surface of the other dielectric layer 1 when viewed from above.
0, 12, 14 are provided so as to diagonally traverse the void portions 34 corresponding to the mesh of the mesh ground plane provided on the surface, or like the signal line 20 shown in FIG. It is provided on one surface in parallel with the mesh line 32 of the mesh ground plane provided on the surface of the other dielectric layer 10, 12, 14 when viewed from above.
【００２４】そして、メッシュグランドプレーン３０で
誘電体層１０、１２、１４の一方の表面の信号線路２
２、２４、２６の特性インピーダンスを、ほぼ５０Ω等
にマッチングさせている。Then, in the mesh ground plane 30, the signal line 2 on one surface of the dielectric layers 10, 12, 14 is formed.
The characteristic impedances of 2, 24 and 26 are matched to about 50Ω or the like.
【００２５】以上の構成は、従来の図５又は図６に示し
た信号線路２０と同様であるが、図の信号線路２２、２
４、２６では、それに加えて、信号線路２２、２４、２
６と誘電体層１０、１２、１４を介して対向する誘電体
層１０、１２、１４の他方の表面部分に、信号線路２
２、２４、２６とほぼ同一幅か又はそれより細幅のメッ
シュグランドプレーン３０補完用のグランド線路４２、
４４、４６を信号線路２２、２４、２６と同一パターン
に並べて備えている。The above structure is similar to the conventional signal line 20 shown in FIG. 5 or 6, but the signal lines 22 and 2 shown in FIG.
4 and 26, in addition to that, the signal lines 22, 24, 2
6 and the signal line 2 on the other surface portion of the dielectric layers 10, 12, and 14 facing each other through the dielectric layers 10, 12, and 14.
A ground line 42 for complementing the mesh ground plane 30 having a width substantially equal to or smaller than 2, 24, 26,
44 and 46 are arranged in the same pattern as the signal lines 22, 24 and 26.
【００２６】具体的には、図２に示したように、信号線
路２２と誘電体層１０を介して対向するメッシュグラン
ドプレーン３０を備えた誘電体層１０下面部分に、信号
線路２２とほぼ同一幅か又はそれより細幅のグランド線
路４２を信号線路２２と同一パターンに並べて備えてい
る。又は図３に示したように、信号線路２２と誘電体層
１０を介して対向するメッシュグランドプレーン３０を
備えた誘電体層１０上面部分に、信号線路２２とほぼ同
一幅か又はそれより細幅のグランド線路４２を信号線路
２２と同一パターンに並べて備えている。グランド線路
４２のメッシュグランドプレーン３０と重なり合った複
数箇所は、メッシュグランドプレーンの網線３２にそれ
ぞれ接続していて、グランド線路４２をメッシュグラン
ドプレーン３０を介して電位差少なく接地できるように
している。そして、メッシュグランドプレーン３０とグ
ランド線路４２とで、誘電体層１０上面又はその下面の
信号線路２２をマイクロストリップ線路構造化してい
る。それと共に、メッシュグランドプレーン３０とグラ
ンド線路４２とで、誘電体層１０上面又はその下面の信
号線路２２の特性インピーダンスを、その全長に亙って
途切れなく５０Ω等に的確にマッチングさせている。Specifically, as shown in FIG. 2, the lower surface portion of the dielectric layer 10 having the mesh ground plane 30 facing the signal line 22 with the dielectric layer 10 interposed therebetween is substantially the same as the signal line 22. A ground line 42 having a width or a width smaller than that is arranged in the same pattern as the signal line 22. Alternatively, as shown in FIG. 3, the upper surface portion of the dielectric layer 10 including the mesh ground plane 30 facing the signal line 22 with the dielectric layer 10 interposed therebetween has a width substantially equal to or smaller than that of the signal line 22. The ground line 42 of is arranged in the same pattern as the signal line 22. A plurality of portions of the ground line 42 that overlap with the mesh ground plane 30 are respectively connected to the mesh lines 32 of the mesh ground plane so that the ground line 42 can be grounded via the mesh ground plane 30 with a small potential difference. The mesh ground plane 30 and the ground line 42 form the signal line 22 on the upper surface or the lower surface of the dielectric layer 10 into a microstrip line structure. At the same time, the mesh ground plane 30 and the ground line 42 accurately match the characteristic impedance of the signal line 22 on the upper surface or the lower surface of the dielectric layer 10 to 50Ω or the like over the entire length without interruption.
【００２７】又は、図４に示したように、下部誘電体層
１４上面に上部誘電体層１２を積層して、下部誘電体層
１４下面と上部誘電体層１２上面とに、網目状をしたメ
ッシュグランドプレーン３０をそれぞれ備えている。下
部誘電体層１４と上部誘電体層１２との接合面には、細
幅の信号線路２４と太幅の信号線路２６とをそれぞれ備
えている。細幅と太幅の信号線路２４、２６と上部誘電
体層１２を介して対向する上部誘電体層１２上面部分
と、細幅と太幅の信号線路２４、２６と下部誘電体層１
４を介して対向する下部誘電体層１４下面部分とには、
信号線路２４、２６とほぼ同一幅か又はそれより細幅の
グランド線路４４、４６を、信号線路２４、２６と同一
パターンにそれぞれ並べて備えている。グランド線路４
４、４６の上部誘電体層１２上面と下部誘電体層１４下
面とのメッシュグランドプレーン３０と重なり合った複
数箇所は、メッシュグランドプレーンの網線３２にそれ
ぞれ接続していて、グランド線路４４、４６をメッシュ
グランドプレーン３０を介して電位差少なく接地できる
ようにしている。そして、上部誘電体層１２上面と下部
誘電体層１４下面とのメッシュグランドプレーン３０と
グランド線路４４、４６とで、上部誘電体層１２と下部
誘電体層１４との接合面に備えた細幅と太幅の信号線路
２４、２６をそれぞれストリップ線路構造化している。
それと共に、上部誘電体層１２上面と下部誘電体層１４
下面とのメッシュグランドプレーン３０とグランド線路
４４、４６とで、上部誘電体層１２と下部誘電体層１４
との接合面に備えた細幅と太幅の信号線路２４、２６の
特性インピーダンスを、その全長に亙って途切れなく一
定値の５０Ω等にそれぞれ的確にマッチングさせてい
る。Alternatively, as shown in FIG. 4, the upper dielectric layer 12 is laminated on the upper surface of the lower dielectric layer 14 and the lower surface of the lower dielectric layer 14 and the upper surface of the upper dielectric layer 12 are meshed. Each has a mesh ground plane 30. A narrow signal line 24 and a thick signal line 26 are provided on the joint surface between the lower dielectric layer 14 and the upper dielectric layer 12, respectively. An upper surface of the upper dielectric layer 12 that faces the narrow and wide signal lines 24 and 26 with the upper dielectric layer 12 interposed therebetween, and the narrow and wide signal lines 24 and 26 and the lower dielectric layer 1
4 to the lower dielectric layer 14 lower surface portion facing each other,
Ground lines 44 and 46 having substantially the same width as or narrower than the signal lines 24 and 26 are arranged in the same pattern as the signal lines 24 and 26, respectively. Ground track 4
A plurality of portions of the upper and lower dielectric layers 12 and 14 of the upper and lower dielectric layers 12 and 14 overlapping with the mesh ground plane 30 are connected to the mesh line 32 of the mesh ground plane, and the ground lines 44 and 46 are connected to each other. The mesh ground plane 30 can be grounded with a small potential difference. Then, the mesh ground plane 30 between the upper surface of the upper dielectric layer 12 and the lower surface of the lower dielectric layer 14 and the ground lines 44 and 46 have a narrow width provided on the joint surface between the upper dielectric layer 12 and the lower dielectric layer 14. And the thick signal lines 24 and 26 have a strip line structure.
At the same time, the upper surface of the upper dielectric layer 12 and the lower dielectric layer 14 are
The upper and lower dielectric layers 12 and 14 are formed by the mesh ground plane 30 on the lower surface and the ground lines 44 and 46.
The characteristic impedances of the narrow and wide signal lines 24 and 26 provided on the joint surface with and are accurately matched to a constant value of 50Ω or the like over the entire length.
【００２８】グランド線路４２、４４、４６は、その幅
を信号線路２２、２４、２６とほぼ同一幅か又はそれよ
り細幅に形成していて、グランド線路４２、４４、４６
のグランド効果が高まり過ぎたり、グランド線路４２、
４４、４６がメッシュグランドプレーンの網目にあたる
空隙部分３４を埋め尽くして、メッシュグランドプレー
ン３０のグランド効果が高まり過ぎたりすることのない
ようにしている。The ground lines 42, 44 and 46 are formed so that their width is substantially the same as or narrower than that of the signal lines 22, 24 and 26, and the ground lines 42, 44 and 46 are formed.
Ground effect of the ground line 42,
The voids 34, which are meshes of the mesh ground plane, are completely filled with 44 and 46 so that the ground effect of the mesh ground plane 30 does not become too high.
【００２９】誘電体層１０下面又はその上面に備えた信
号線路２２の折曲箇所、又は下部誘電体層１４と上部誘
電体層１２との接合面に備えた信号線路２４、２６の折
曲箇所は、図１に示したように、円弧状等の弧状にそれ
ぞれ形成している。Bent portions of the signal line 22 provided on the lower surface or the upper surface of the dielectric layer 10 or bent portions of the signal lines 24 and 26 provided on the joint surface between the lower dielectric layer 14 and the upper dielectric layer 12. Are formed in an arc shape such as an arc shape, as shown in FIG.
【００３０】そして、信号線路２２、２４、２６の折曲
箇所を伝わる高周波信号の反射損失を少なく抑えるよう
にしている。Then, the reflection loss of the high frequency signal transmitted through the bent portions of the signal lines 22, 24 and 26 is suppressed.
【００３１】信号線路２２、２４、２６の折曲箇所と誘
電体層１０、上部誘電体層１２又は下部誘電体層１４を
介して対向するグランド線路４２、４４、４６の折曲箇
所は、信号線路２２、２４、２６の折曲箇所の形状に倣
って、円弧状等の孤状にそれぞれ形成している。The bent portions of the ground lines 42, 44 and 46 facing the bent portions of the signal lines 22, 24 and 26 via the dielectric layer 10, the upper dielectric layer 12 or the lower dielectric layer 14 are Following the shape of the bent portions of the lines 22, 24, 26, they are formed in arcuate shapes such as arcs.
【００３２】そして、グランド線路４２、４４、４６の
孤状に形成した折曲箇所とその周辺のメッシュグランド
プレーン３０とで、信号線路２２、２４、２６の弧状に
形成した折曲箇所の特性インピーダンスを、一定値の５
０Ω等に的確にマッチングさせている。The arc-shaped bent portions of the ground lines 42, 44 and 46 and the mesh ground plane 30 around the bent portions form characteristic impedances of the arc-shaped bent portions of the signal lines 22, 24 and 26. Is a constant value of 5
It matches exactly to 0Ω.
【００３３】グランド線路４２、４４、４６は、誘電体
層１０、１２、１４表面又はそれらの誘電体層を備える
セラミック基板（図示せず）表面にスパッタリング等に
より備えたチタン、モリブデン、ニッケル等からなる薄
膜層をエッチング加工して形成している。その際には、
同じ薄膜層を用いて、誘電体層１０、１２、１４表面又
はセラミック基板表面にメッシュグランドプレーン３０
を同時に重ねて備えるようにしている。又は、グランド
線路４２、４４、４６を、メッシュグランドプレーン３
０を備えた誘電体層１０、１２、１４表面又はセラミッ
ク基板表面にメッシュグランドプレーン３０に重ねて備
えるようにしている。The ground lines 42, 44, 46 are made of titanium, molybdenum, nickel, etc. provided on the surface of the dielectric layers 10, 12, 14 or the surface of the ceramic substrate (not shown) having the dielectric layers by sputtering or the like. The thin film layer is formed by etching. In that case,
Using the same thin film layer, a mesh ground plane 30 is formed on the surface of the dielectric layers 10, 12, 14 or the surface of the ceramic substrate.
Are prepared at the same time. Alternatively, the ground lines 42, 44, and 46 are connected to the mesh ground plane 3
The surface of the dielectric layer 10, 12, 14 or the surface of the ceramic substrate having 0 is overlapped with the mesh ground plane 30.
【００３４】図１ないし図４に示した高周波用信号線路
は、以上のように構成している。The high-frequency signal line shown in FIGS. 1 to 4 is constructed as described above.
【００３５】[0035]
【発明の効果】以上説明したように、本発明の高周波用
信号線路によれば、誘電体層の一方の表面に備えた高周
波信号を伝える信号線路の特性インピーダンスを、誘電
体層の他方の表面に備えたメッシュグランドプレーンと
そのプレーン補完用のグランド線路とで、その全長に亙
って途切れなく一定値の５０Ω等に的確にマッチングさ
せることができる。As described above, according to the high-frequency signal line of the present invention, the characteristic impedance of the signal line for transmitting a high-frequency signal provided on one surface of the dielectric layer is set to the other surface of the dielectric layer. With the mesh ground plane provided in and the ground line for complementing the plane, it is possible to accurately match with a constant value of 50Ω or the like over the entire length without interruption.
【００３６】また、信号線路の折曲箇所を弧状に形成し
ていて、その信号線路の折曲箇所を伝わる高周波信号の
反射損失を少なく抑えることができる。Further, since the bent portion of the signal line is formed in an arc shape, the reflection loss of the high frequency signal transmitted through the bent portion of the signal line can be suppressed to be small.
【００３７】また、信号線路の折曲箇所の形状に倣って
弧状に形成したグランド線路の折曲箇所とその周辺のメ
ッシュグランドプレーンとで、信号線路の折曲箇所の特
性インピーダンスを一定値の５０Ω等に的確にマッチン
グさせることができる。Further, the characteristic impedance of the bent portion of the signal line is fixed at 50Ω between the bent portion of the ground line formed in an arc shape following the shape of the bent portion of the signal line and the mesh ground plane around the bent portion. Etc. can be matched accurately.
【００３８】そして、誘電体層表面に備えた信号線路を
高周波信号を伝送損失少なく効率良く伝えることが可能
となる。Then, it becomes possible to efficiently transmit a high frequency signal through the signal line provided on the surface of the dielectric layer with a small transmission loss.
【図１】本発明の高周波用信号線路の概略構造を示す斜
視図である。FIG. 1 is a perspective view showing a schematic structure of a high-frequency signal line of the present invention.
【図２】本発明の高周波用信号線路の一部側面断面図で
ある。FIG. 2 is a partial side sectional view of the high-frequency signal line of the present invention.
【図３】本発明の高周波用信号線路の一部側面断面図で
ある。FIG. 3 is a partial side sectional view of the high-frequency signal line of the present invention.
【図４】本発明の高周波用信号線路の一部側面断面図で
ある。FIG. 4 is a partial side sectional view of the high-frequency signal line of the present invention.
【図５】従来の高周波用信号線路の上方から見た透視図
である。FIG. 5 is a perspective view seen from above a conventional high-frequency signal line.
【図６】従来の高周波用信号線路の上方から見た透視図
である。FIG. 6 is a perspective view seen from above a conventional high-frequency signal line.
１０、１２、１４ 誘電体層 ２０、２２、２４、２６ 信号線路 ３０ メッシュグランドプレーン ３２ 網線 ３４ 空隙部分 ４２、４４、４６ グランド線路 10, 12, 14 Dielectric layer 20, 22, 24, 26 Signal line 30 Mesh ground plane 32 Mesh line 34 Void part 42, 44, 46 Ground line
Claims (1)
ると共に、前記誘電体層の他方の表面に網目状のメッシ
ュグランドプレーンを備えて、そのメッシュグランドプ
レーンで前記信号線路の特性インピーダンスをほぼ一定
値にマッチングさせた高周波用電子部品の信号線路にお
いて、前記信号線路と前記誘電体層を介して対向するメ
ッシュグランドプレーンを備えた誘電体層表面部分に、
信号線路とほぼ同一幅か又はそれより細幅のメッシュグ
ランドプレーン補完用のグランド線路を信号線路と同一
パターンに並べて備えて、そのグランド線路の前記メッ
シュグランドプレーンと重なり合った箇所をメッシュグ
ランドプレーンに接続し、さらに、前記信号線路の折曲
箇所を弧状に形成すると共に、その弧状に形成した信号
線路の折曲箇所の形状に倣って、信号線路の折曲箇所に
対向する前記グランド線路の折曲箇所を弧状に形成した
ことを特徴とする高周波用電子部品の信号線路。1. A signal line is provided on one surface of a dielectric layer, and a mesh-shaped mesh ground plane is provided on the other surface of the dielectric layer, and the characteristic impedance of the signal line is determined by the mesh ground plane. In a signal line of a high-frequency electronic component that is matched to a substantially constant value, on a dielectric layer surface portion provided with a mesh ground plane facing the signal line through the dielectric layer,
Mesh ground planes of almost the same width as or narrower than the signal line are provided with complementary ground lines arranged in the same pattern as the signal line, and the portions of the ground lines that overlap the mesh ground plane are connected to the mesh ground plane. In addition, the bent portion of the signal line is formed in an arc shape, and the bent portion of the ground line facing the bent portion of the signal line is shaped in accordance with the shape of the bent portion of the signal line formed in the arc shape. A signal line for a high-frequency electronic component, characterized in that the points are formed in an arc shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09186992A JP3170030B2 (en) | 1992-03-17 | 1992-03-17 | Signal lines for high-frequency electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09186992A JP3170030B2 (en) | 1992-03-17 | 1992-03-17 | Signal lines for high-frequency electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267913A true JPH05267913A (en) | 1993-10-15 |
| JP3170030B2 JP3170030B2 (en) | 2001-05-28 |
Family
ID=14038569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09186992A Expired - Fee Related JP3170030B2 (en) | 1992-03-17 | 1992-03-17 | Signal lines for high-frequency electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3170030B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5479138A (en) * | 1993-12-27 | 1995-12-26 | Ngk Spark Plug Co., Ltd. | Multi-layer wiring board |
| WO1997036340A1 (en) * | 1996-03-25 | 1997-10-02 | Samsung Electronics Co., Ltd. | Bidirectional non-solid impedance controlled reference plane |
| US6624729B2 (en) * | 2000-12-29 | 2003-09-23 | Hewlett-Packard Development Company, L.P. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| EP1376747A3 (en) * | 2002-06-28 | 2005-07-20 | Texas Instruments Incorporated | Common mode rejection in differential pairs using slotted ground planes |
| JP2009081534A (en) * | 2007-09-25 | 2009-04-16 | Fujitsu Ltd | Microstrip transmission line, impedance matching circuit and semiconductor circuit |
| US7619489B2 (en) | 1999-09-20 | 2009-11-17 | Nec Corporation | Semiconductor integrated circuit |
| US8138876B2 (en) * | 2008-01-29 | 2012-03-20 | International Business Machines Corporation | On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors |
| JP2014027154A (en) * | 2012-07-27 | 2014-02-06 | Mitsubishi Electric Corp | Semiconductor chip for flip-chip mounting |
| WO2022071256A1 (en) * | 2020-09-30 | 2022-04-07 | 京セラ株式会社 | Wiring base and electronic device |
| WO2023208844A1 (en) * | 2022-04-29 | 2023-11-02 | Telefonaktiebolaget Lm Ericsson (Publ) | Design techniques for high-frequency and high-speed signals in a package with thin build-up layers |
-
1992
- 1992-03-17 JP JP09186992A patent/JP3170030B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5479138A (en) * | 1993-12-27 | 1995-12-26 | Ngk Spark Plug Co., Ltd. | Multi-layer wiring board |
| WO1997036340A1 (en) * | 1996-03-25 | 1997-10-02 | Samsung Electronics Co., Ltd. | Bidirectional non-solid impedance controlled reference plane |
| US5675299A (en) * | 1996-03-25 | 1997-10-07 | Ast Research, Inc. | Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment |
| US8178974B2 (en) | 1999-09-20 | 2012-05-15 | Nec Corporation | Microstrip structure including a signal line with a plurality of slit holes |
| US7619489B2 (en) | 1999-09-20 | 2009-11-17 | Nec Corporation | Semiconductor integrated circuit |
| US6624729B2 (en) * | 2000-12-29 | 2003-09-23 | Hewlett-Packard Development Company, L.P. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| EP1376747A3 (en) * | 2002-06-28 | 2005-07-20 | Texas Instruments Incorporated | Common mode rejection in differential pairs using slotted ground planes |
| JP2009081534A (en) * | 2007-09-25 | 2009-04-16 | Fujitsu Ltd | Microstrip transmission line, impedance matching circuit and semiconductor circuit |
| JP4649455B2 (en) * | 2007-09-25 | 2011-03-09 | 富士通株式会社 | Microstrip transmission line, impedance matching circuit and semiconductor circuit |
| US8138876B2 (en) * | 2008-01-29 | 2012-03-20 | International Business Machines Corporation | On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors |
| JP2014027154A (en) * | 2012-07-27 | 2014-02-06 | Mitsubishi Electric Corp | Semiconductor chip for flip-chip mounting |
| WO2022071256A1 (en) * | 2020-09-30 | 2022-04-07 | 京セラ株式会社 | Wiring base and electronic device |
| WO2023208844A1 (en) * | 2022-04-29 | 2023-11-02 | Telefonaktiebolaget Lm Ericsson (Publ) | Design techniques for high-frequency and high-speed signals in a package with thin build-up layers |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3170030B2 (en) | 2001-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3299266B2 (en) | Apparatus with flexible strip conductor and method of manufacturing the same | |
| JPH10173410A (en) | Transmission circuit using strip line | |
| WO2021165577A1 (en) | Airbridge for making connections on superconducting chip, and method for producing superconducting chips with airbridges | |
| JPH08506696A (en) | Circuit board array including shield grid and structure thereof | |
| JPH05267913A (en) | Signal line for high frequency electronic parts | |
| JPH06243729A (en) | Plane-form flex circuit | |
| JPH0865078A (en) | Manufacture of device having metallized region on dielectricsubstrate | |
| JPH07273514A (en) | Multilayer hybrid coupler | |
| JP3610715B2 (en) | Multilayer MMIC circuit | |
| JP2000208939A (en) | Multilayer wiring board and electronic device using the board | |
| JP2603022Y2 (en) | Printed circuit board transmission line | |
| JPH0637412A (en) | Printed wiring board | |
| JPH10126106A (en) | Dielectric filter | |
| JP3573352B2 (en) | Multi-layer wiring TAB tape carrier | |
| US20200220521A1 (en) | Acoustic wave device and method for manufacturing acoustic wave device | |
| JP3368042B2 (en) | Printed wiring board | |
| JP2566986B2 (en) | Wiring board | |
| JP2000106478A (en) | Wiring board | |
| JPH05160605A (en) | High frequency circuit parts | |
| JPH0632381B2 (en) | Multilayer ceramic substrate | |
| JPH025328B2 (en) | ||
| JP2737678B2 (en) | Slot line type single balance mixer | |
| JP7464547B2 (en) | Thin film circuit board | |
| JPH05235602A (en) | Transmission line | |
| JP2003115704A (en) | High frequency circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |