JPH05243768A - Electronic device cooling mechanism - Google Patents

Abstract

(57) [Abstract] [Purpose] A collision jet type cooling device that forcibly cools electronic circuit parts with high heat generation by blowing an air stream, and maintains only the failed parts while maintaining the normal cooling state. It is an object of the present invention to provide a cooling mechanism that can be replaced quickly and easily in the event of a fan failure while working. [Structure] A plurality of high heat-generating electronic circuit components (4), which are arranged in order on the surface of a backboard (3) adjacent to each other, are divided into a predetermined number of groups, and are housed in a grid pattern at positions corresponding to each group. A box-shaped fan in which a shelf (10) formed by arranging compartments (11) is installed to face the high heat-generating electronic circuit component (4) group, and an individual fan (19) and a nozzle plate (16) are incorporated. The unit (13) is slidably mounted in the storage compartment (11) from the back side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an impingement jet cooling device for forcibly cooling an electronic circuit component mounted on a printed circuit board with high heat generation by blowing an air stream.

[0002]

2. Description of the Related Art In recent years, in general electronic devices, the speeding up and cost reduction of systems have been advanced, and along with that, the high integration of internal electronic circuit parts has been developed. For this reason, the amount of heat generated by the electronic circuit component is significantly increased, and efficient cooling of the component is a problem. As this cooling method, there has been a shift from conventional natural air cooling to forced air cooling, but among them, the collision jet cooling method that blows an air current vertically to high heat generating electronic circuit components mounted flat on the printed circuit board is effective. Is.

An example of a conventional collision jet cooling mechanism will be described with reference to FIG. On a backboard 3 installed on the back side of the apparatus, a plurality of electronic circuit components 4 with high heat generation are mounted in parallel and are planarly mounted. To face this, a cooling duct 6 having a plurality of blower fans 5 fixed thereto by screws or the like is provided in the lower part, and a plurality of nozzles 7 face each of the high heat generating electronic circuit components 4 on one surface of the duct. Installed. With this configuration, the cooling airflow formed by the blower fan 5 is supplied at a uniform wind speed and air volume in a predetermined direction through the straightening vanes and the like, and is blown through the nozzles 7 at right angles to the high heat generating electronic circuit components 4. It is cooled and cooled, sucked by the exhaust fan 2 installed above the backboard 3, and discharged to the outside of the system.

[0004]

In the case of a system having a great social impact such as a communication system, a backup circuit is built in the system, and when the system fails, it is switched to this to prevent the system from going down. Is configured to. However, since it is necessary to remove the cooling duct in order to access the high heat generation electronic circuit parts that have failed for maintenance, two cooling systems are also required, which causes the cooling system to become large and complicated, which causes a cost increase. Has become.

Further, when a fan fails, it is necessary to immediately replace it with a spare fan to continue cooling, but since the fixing method using screws is adopted as described above, replacement work is required. There was a drawback that it took time. The present invention, without stopping the entire system, while maintaining a normal cooling state for normal high heat generation electronic circuit components,
In addition to performing maintenance work only on the failed parts,
An object of the present invention is to provide a cooling mechanism that can replace a fan quickly and easily when it fails.

[0006]

The object of the present invention is to divide a plurality of high heat generating electronic circuit parts, which are arranged neatly adjacent to each other on the surface of a backboard, into groups each having a predetermined number, and to arrange them at positions corresponding to the groups. A shelf formed by arranging storage compartments in a grid pattern was installed facing the high heat-generating electronic circuit component group, and a box-shaped fan unit incorporating a fan and a nozzle plate was detachably arranged in the storage compartment. This is achieved by a cooling mechanism for an electronic device.

[0007]

When a specific high heat generating electronic circuit component fails, only the fan unit assigned to the group including this circuit component is stopped, and the other fan units are operated as they are to cool the high heat generating electronic circuit component. While continuing, remove the stopped fan unit. Then, the storage compartment becomes empty, through which the defective high heat generating electronic circuit component can be accessed.

When a specific fan unit fails, it can be immediately removed and replaced with a spare fan unit. Hereinafter, the present invention will be described in more detail with reference to the preferred embodiments shown in the drawings.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION In the cooling mechanism of the present invention, as shown in FIG. 1, instead of the conventional integrated cooling duct 6 of the type which receives the cooling air from the blower fan 5 provided in the lower part, as shown in FIG. Shelf 1 with multiple storage compartments 11
It is composed of 0s. Each storage compartment 11 is provided corresponding to each high heat generation electronic circuit component 4 to be cooled, which is arranged on the backboard 3.

In the storage compartment 11, the guide rail 1
2, the housing 14 of the box-shaped fan unit 13 is detachably mounted from the back side along the line 2. As shown in FIG. 2, the housing 14 has a blower opening 15 formed on the wall surface facing the high heat generation electronic circuit component 4, and a nozzle plate 16 having a nozzle 16a is attached to the front surface thereof. A mounting plate 17 bent into a special shape is fixed in the inside thereof, and an opening 18 is provided in one surface 17a thereof which faces the opening 15 in an inclined manner. Both left and right edges of the opening 18 are folded back to form a rail groove 17b along which the individual fan 19 is inserted and fixed. With this configuration, when the individual fan 19 is rotated, an air flow is generated, and the nozzle 16a is opened through the openings 18 and 15.
Blown out from.

An exhaust fan 2 is provided above the backboard 3. Next, the operation of the cooling mechanism of the present invention will be described. When the system is operating normally, cooling air is supplied from each fan unit 13 to each high heat generating electronic circuit component 4. The blowing direction is directed obliquely upward as shown in FIG.
The reason for this is that when it is sprayed at a right angle to a high-heat-generating electronic circuit component as in the past, it collides with the component and scatters in all directions to form a turbulent flow, cooling the component and retaining warm air. This may hinder the cooling of the adjacent components. When the air is blown obliquely upward as in the present invention, it is easy to join the upward airflow generated by the exhaust fan 2 and the air is smoothly exhausted without turbulence.

When a specific high heat generating electronic circuit component 4 fails, only the circuit associated with the component 4 and the fan unit 13 corresponding thereto are stopped without stopping the entire system. Then, the fan unit 13 is stored in the storage compartment 1
When removed from 1, a space for accessing the failed high heat generation electronic circuit component 4 is obtained through the opening 16 as in the lower right corner of FIG. 1, and maintenance / replacement can be performed through the space.

When a specific fan unit 13 fails, the fan unit is immediately removed and a spare fan unit is attached instead, and the work is completed in a short time. In the above example, the fan unit is installed for each high heat generation electronic circuit component, but one fan unit may be provided for each set of a plurality of adjacent high heat generation electronic circuit components. ..

[0014]

As described in detail above, according to the present invention,
One fan unit was provided for each set of high-heat electronic circuit components of a predetermined number, and this fan unit was slidably mounted in a grid-shaped storage compartment so that a specific fan could be Maintenance / replacement work can be performed in a short time without removing the unit and keeping the others in the operating state to stop the system.

[Brief description of drawings]

FIG. 1 is a perspective view of a system incorporating a cooling mechanism of the present invention viewed from the back side.

FIG. 2 is an exploded perspective view showing a configuration of a fan unit of the present invention.

FIG. 3 is a schematic diagram of the flow of cooling air by the cooling mechanism of the present invention.

FIG. 4 is a perspective view of a system incorporating a conventional cooling mechanism as viewed from the back side.

[Explanation of symbols]

 2 ... Exhaust fan 3 ... Backboard 4 ... High heat generation electronic circuit parts 5 ... Blower fan 6 ... Cooling duct 10 ... Shelf 11 ... Storage compartment 12 ... Guide rail 13 ... Fan unit 14 ... Housing 15 ... Blower opening 16 ... Nozzle plate 16a ... Nozzle 17 ... Mounting plate 19 ... Individual fan

Claims (2)

[Claims] 1. A plurality of high heat-generating electronic circuit components (4) arranged in order on the surface of a backboard (3) adjacent to each other.
Is divided into a predetermined number of groups, and a shelf (10) in which storage compartments (11) are arranged in a lattice pattern at positions corresponding to the groups is installed facing the high heat-generating electronic circuit component (4) group. Then, the box-shaped fan unit (13) incorporating the individual fan (19) and the nozzle plate (16) is installed in the storage compartment (1).
1) A cooling mechanism for an electronic device, which is slidably mounted in the inside from the back side. 2. The cooling mechanism according to claim 1, wherein the direction of the fan unit (13) is set so that the cooling air is directed obliquely upward with respect to the backboard (3).