JPH05228668A - Method for cutting base sheet with mount - Google Patents
Method for cutting base sheet with mountInfo
- Publication number
- JPH05228668A JPH05228668A JP4070344A JP7034492A JPH05228668A JP H05228668 A JPH05228668 A JP H05228668A JP 4070344 A JP4070344 A JP 4070344A JP 7034492 A JP7034492 A JP 7034492A JP H05228668 A JPH05228668 A JP H05228668A
- Authority
- JP
- Japan
- Prior art keywords
- mount
- base sheet
- cutting
- cut
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Making Paper Articles (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、台紙の付いた基材シ
ートからラベルや粘着材シートとして利用される基材シ
ートのみを切断する切断方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting method for cutting only a base sheet used as a label or an adhesive sheet from a base sheet having a mount.
【0002】[0002]
【従来の技術】従来、台紙つき基材シートから基材シー
トのみをレーザ光線によりカットし、ラベル、粘着材シ
ートとして利用するものとして、特開昭59−1473
82号公報の技術が知られている。この従来技術によれ
ば、台紙としてアルミニウム等の金属板を用い、レーザ
光線を照射して台紙の切断を防止しつつ、基材シートの
みをレーザ切断するようにしている。2. Description of the Related Art Conventionally, only a base material sheet from a base material sheet with a mount is cut by a laser beam and used as a label or an adhesive material sheet.
The technique of Japanese Patent No. 82 is known. According to this conventional technique, a metal plate such as aluminum is used as a mount, and a laser beam is irradiated to prevent the mount from being cut, and only the base sheet is laser-cut.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来の技術で
は、基材シートのみを切断するためにレーザ出力の微妙
な制御が必要となり、又、基材シートが確実に切断され
ないと剥離性が悪くなり、更に、台紙にアルミニウム等
の金属を用いると、ロール状で材料を供給する場合に重
量が大きくなる等の課題があった。本発明は斯かる課題
を解決するためになされたもので、その目的とするとこ
ろは、台紙を残して基材シートのみをレーザにより切断
することができる台紙つき基材シートの切断方法を提供
することにある。However, in the conventional technique, delicate control of the laser output is required in order to cut only the base sheet, and if the base sheet is not cut reliably, the releasability is poor. Furthermore, when a metal such as aluminum is used for the mount, there is a problem that the weight becomes large when the material is supplied in a roll shape. The present invention has been made to solve such a problem, and an object thereof is to provide a method for cutting a base sheet with a mount, which can cut only the base sheet with a laser while leaving the mount. Especially.
【0004】[0004]
【課題を解決するための手段】前記目的を達成するため
に、本発明は、第1に、台紙とこの台紙に剥離自在な基
材シートからなる台紙つき基材シートにレーザ光を照射
して基材シートを切断する台紙つき基材シートの切断方
法において、複数のレーザ光を近接させたまま照射した
ことを特徴とする。第2に、レーザ光の照射位置を部分
的に近接させて照射したことを特徴とする。第3に、レ
ーザ光の照射位置を部分的に交差させて照射したことを
特徴とする。第4に、レーザ光の照射位置を複数回交差
させて照射したことを特徴とする。第5に、焦点の異な
るレーザ光を用いたことを特徴とする。第6に、中央の
レーザビームモードが大で、かつ周環のレーザビームモ
ードが小さいレーザ光を用いたことを特徴とする。In order to achieve the above object, the present invention firstly irradiates a base material sheet with a mount, which is composed of a mount material and a base material sheet which can be separated from the mount material, with laser light. A method of cutting a base sheet with a mount, which cuts a base sheet, is characterized in that a plurality of laser beams are radiated while being close to each other. Secondly, the irradiation position of the laser light is partially close to the irradiation. Thirdly, it is characterized in that the irradiation positions of the laser light are made to partially intersect with each other. Fourthly, the irradiation position of the laser light is intersected a plurality of times to perform irradiation. Fifthly, it is characterized in that laser lights having different focal points are used. Sixth, a laser beam having a large central laser beam mode and a small circular laser beam mode is used.
【0005】[0005]
【作用】前記構成による切断方法は、複数のレーザ光を
近接照射して基材シートの複数箇所を切断することで、
少なくとも一箇所は確実に切断されるため、切断の信頼
性が高くなり、かつ基材シートの剥離性が向上する。
又、レーザ光の照射位置を部分的に近接、交差もしくは
複数回交差させて照射することにより、部分的に基材シ
ートの複数箇所が切断されるため、切断の信頼性の向上
と基材シートの剥離性を高めることができる。更に、焦
点の異なるレーザ光やワインカップ状のレーザ光を照射
することにより、切断と熱処理を同時に行え、かつ熱処
理により切断部が玉状となって基材シートの剥離性が向
上する。In the cutting method having the above-described structure, the plurality of laser beams are irradiated in close proximity to each other to cut the plurality of portions of the base sheet,
Since at least one position is surely cut, the reliability of cutting is increased and the releasability of the base sheet is improved.
Further, by irradiating the irradiation position of the laser light so that the irradiation position is partially close to, intersects, or intersects a plurality of times, a plurality of portions of the base sheet are partially cut, so that the cutting reliability is improved and the base sheet is cut. The peelability of can be improved. Further, by irradiating laser light having a different focus or laser light in a wine cup shape, cutting and heat treatment can be performed at the same time, and the heat treatment improves the peelability of the base sheet by forming the cut portion into a bead shape.
【0006】[0006]
【実施例】以下、図面に基づき本発明の好ましい実施例
を説明する。図1はロール状の台紙つき基材シートから
基材シートのみを切断する装置を示し、台紙つき基材シ
ート10は供給ロール20と巻取りロール30間に張架
されている。これら二つのロール20,30の中途部に
レーザ切断装置40を設け、レーザエネルギにより台紙
1から基材シート2のみを切断して剥離できるようにな
っている。なお、台紙1としては例えば紙が用いられる
が、これに限定されるものではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an apparatus for cutting only a base material sheet from a roll-shaped base material sheet with a mount, and the base material sheet with a mount 10 is stretched between a supply roll 20 and a winding roll 30. A laser cutting device 40 is provided in the middle of these two rolls 20 and 30 so that only the base sheet 2 can be cut and peeled from the mount 1 by laser energy. As the mount 1, for example, paper is used, but it is not limited to this.
【0007】〔実施例1〕この実施例では、複数のレー
ザ光を近接させて照射したことを特徴とする。すなわ
ち、図2(a)のように、基材シート2の上方に集光レ
ンズ3を配置し、この集光レンズ3でレーザ光を二つに
分割して集光し、図2(b)のように、基材シート2を
近接した二つの切断線C,C’で切断するようにしてい
る。これにより、たとえ切断線C,C’のうちいずれか
一方が不完全な切断であったとしても、他方の切断線で
切断されることになるから、切断の信頼性が向上する。[Embodiment 1] This embodiment is characterized in that a plurality of laser beams are irradiated close to each other. That is, as shown in FIG. 2A, a condenser lens 3 is arranged above the base material sheet 2, and the condenser lens 3 divides the laser light into two and condenses the laser light. As described above, the base material sheet 2 is cut along two cutting lines C and C ′ that are close to each other. As a result, even if one of the cutting lines C and C ′ is an incomplete cutting, the cutting is performed at the other cutting line, so that the cutting reliability is improved.
【0008】〔実施例2〕この実施例では、複数のレー
ザ光を近接させて照射する場合において、レーザ光の照
射位置を部分的に近接させて照射したことを特徴とす
る。すなわち、図3(a)のように、切断始めは二つの
レーザ光の照射位置を離しておき、徐々に近接させてい
ってV字状に切断し、中間位置においてはレーザ光の照
射位置を一致させ、更に切断終わりは二つのレーザ光の
照射位置を徐々に離して逆V字状に切断する。[Embodiment 2] This embodiment is characterized in that when a plurality of laser beams are irradiated in close proximity to each other, the irradiation positions of the laser lights are partially moved in close proximity to each other. That is, as shown in FIG. 3A, at the beginning of cutting, the irradiation positions of the two laser beams are separated from each other, gradually approached to each other, and cut into V-shapes. At the end of cutting, the irradiation positions of the two laser beams are gradually separated to cut into an inverted V shape.
【0009】又、図3(b)のように、切断始めは二つ
のレーザ光の照射位置を徐々に近接させていってU字状
に切断し、中間位置においてはレーザ光の照射位置を一
致させ、更に切断終わりは二つのレーザ光の照射位置を
徐々に離して逆U字状に切断する。Further, as shown in FIG. 3 (b), at the beginning of cutting, the irradiation positions of the two laser beams are gradually brought close to each other to make a U-shaped cut, and at the intermediate position, the irradiation positions of the laser beams coincide. Further, at the end of cutting, the irradiation positions of the two laser beams are gradually separated to cut into an inverted U shape.
【0010】更に、図3(c)は、切断始めは二つのレ
ーザ光の照射位置を徐々に近接させていってV字状に切
断し、その後はレーザ光の照射位置を一致させ、中央位
置では二つのレーザ光の照射位置を徐々に操作して菱形
状に切断し、更に切断終わりは二つのレーザ光の照射位
置を徐々に離して逆V字状に切断する。なお、図3
(a)〜(c)における以上の切断位置は、夫々切断線
Cで示している。Further, in FIG. 3 (c), at the beginning of cutting, the irradiation positions of the two laser beams are gradually brought close to each other to make a V-shaped cut, and thereafter, the irradiation positions of the laser beams are made to coincide with each other, and the central position is set. Then, the irradiation positions of the two laser beams are gradually operated to cut into a rhombus shape, and at the end of the cutting, the irradiation positions of the two laser beams are gradually separated to cut into an inverted V shape. Note that FIG.
The above cutting positions in (a) to (c) are indicated by cutting lines C, respectively.
【0011】〔実施例3〕この実施例では、レーザ光の
照射位置を部分的に交差させて照射したことを特徴とす
る。すなわち、図4のように、切断始めは二つのレーザ
光の照射位置を離しておき、徐々に近接させていって基
材シート2の略中間位置においてレーザ光を交差させ、
その後再び二つのレーザ光の照射位置を徐々に離してい
って切断線C,C’のように切断する。[Embodiment 3] This embodiment is characterized in that the irradiation positions of the laser light are made to partially intersect with each other. That is, as shown in FIG. 4, the irradiation positions of the two laser beams are separated at the beginning of cutting, and the laser beams are made to gradually approach each other to intersect the laser beams at a substantially intermediate position of the base sheet 2,
After that, the irradiation positions of the two laser beams are gradually separated again to cut along the cutting lines C and C ′.
【0012】〔実施例4〕この実施例では、レーザ光の
照射位置を複数回交差させて照射したことを特徴とす
る。すなわち、図5(a)のように、集光レンズ3を回
転させながら移動させることにより、図5(b)のよう
に、基材シート2が螺旋状に切断される。[Embodiment 4] The present embodiment is characterized in that the irradiation positions of the laser light are crossed a plurality of times for irradiation. That is, by moving the condenser lens 3 while rotating it as shown in FIG. 5A, the base material sheet 2 is spirally cut as shown in FIG. 5B.
【0013】〔実施例5〕この実施例では、焦点の異な
るレーザ光を用いたことを特徴とする。すなわち、図6
(a)のように、焦点の異なる集光レンズ3を用い、基
材シート2にレーザ光を照射することにより、図6
(b)のように、レーザ光で切断を行い、レーザ光
で熱処理を行うものである。[Embodiment 5] This embodiment is characterized in that laser lights having different focal points are used. That is, FIG.
As shown in FIG. 6A, by using the condensing lens 3 having a different focus, the base sheet 2 is irradiated with the laser light, so that FIG.
As in (b), cutting is performed with laser light and heat treatment is performed with laser light.
【0014】〔実施例6〕この実施例では、中央のレー
ザビームモードが大で、かつ周環のレーザビームモード
が小さいレーザ光を用いたことを特徴とする。すなわ
ち、図7(a)のように、集光レンズ3により、中央の
レーザビームモードが大で、その周環のレーザビームモ
ードが小さいレーザ光をつくる。このレーザ光は、図7
(b)のように、中央のレーザビームモードが大で、そ
の周環のレーザビームモードが小さくなっていて、これ
を基材シート2に照射すれば、図7(c)のように、中
央のレーザ光で切断し周囲のレーザ光で熱処理を行うこ
とができる。[Embodiment 6] This embodiment is characterized in that a laser beam having a large central laser beam mode and a small peripheral laser beam mode is used. That is, as shown in FIG. 7A, the condenser lens 3 produces laser light having a large central laser beam mode and a small peripheral laser beam mode. This laser light is shown in FIG.
As shown in FIG. 7B, the central laser beam mode is large, and the peripheral laser beam mode is small. If the substrate sheet 2 is irradiated with this laser beam mode, the central laser beam mode becomes as shown in FIG. It is possible to perform cutting with the laser light and heat treatment with the surrounding laser light.
【0015】[0015]
【発明の効果】この発明は、以上説明した通り、台紙と
この台紙に剥離自在な基材シートからなる台紙つき基材
シートにレーザ光を照射して基材シートを切断する台紙
つき基材シートの切断方法において、複数のレーザ光を
近接させて、又は部分的に近接させて、あるいは部分的
に交差させて、更に複数回交差させて照射したことによ
り、切断の信頼性の向上と基材シートの剥離性の向上を
図ることができる。又、焦点の異なるレーザ光を用いた
り、中央のレーザビームモードが大でかつ周環のレーザ
ビームモードが小さいレーザ光を用いたことにより、切
断と熱処理を同時に行うことができると共に、切断部を
熱処理して玉状にするため、基材シートの剥離性を良く
することができる。As described above, the present invention irradiates a base sheet with a mount, which is composed of a mount and a base sheet which can be peeled off from the mount, with a laser beam to cut the base sheet. In the cutting method of (1), a plurality of laser beams are irradiated close to each other, partially close to each other, or partially crossed, and further crossed several times, thereby improving the reliability of cutting and the substrate. The peelability of the sheet can be improved. Further, by using laser light having different focal points, or by using laser light having a large central laser beam mode and a small circumferential laser beam mode, it is possible to perform cutting and heat treatment at the same time, and to cut the cutting portion. Since it is heat-treated into a ball shape, the releasability of the base sheet can be improved.
【図1】台紙つき基材シートの切断装置の外観を示す図
である。FIG. 1 is a diagram showing an appearance of a cutting device for a base sheet with a mount.
【図2】(a)(b)は複数のレーザ光を近接させたま
ま照射して切断する状態を示す図である。FIG. 2A and FIG. 2B are diagrams showing a state in which a plurality of laser beams are radiated and cut while being brought close to each other.
【図3】(a)〜(c)は複数のレーザ光を部分的に近
接させて照射し、切断する状態を示す図である。FIGS. 3A to 3C are diagrams showing a state in which a plurality of laser beams are partially brought close to each other and irradiated, and then cut.
【図4】複数のレーザ光を部分的に交差させて照射し、
切断する状態を示す図である。FIG. 4 is a cross-sectional view of a plurality of laser beams,
It is a figure which shows the state cut | disconnected.
【図5】(a)(b)は複数のレーザ光を複数回交差さ
せて照射し、切断する状態を示す図である。5A and 5B are diagrams showing a state in which a plurality of laser beams are crossed a plurality of times to irradiate and cut.
【図6】(a)(b)は焦点の異なる複数のレーザ光を
照射し、切断する状態を示す図である。6A and 6B are diagrams showing a state in which a plurality of laser beams having different focal points are irradiated and cut.
【図7】(a)〜(c)はワインカップ状のレーザ光を
照射し、切断する状態を示す図である。7A to 7C are diagrams showing a state in which a wine cup-shaped laser beam is irradiated and cut.
1 台紙 2 基材シート 3 集光レンズ 10 台紙つき基材シート 20 供給ロール 30 巻取りロール 40 レーザ切断装置 1 Mount 2 Base Material Sheet 3 Condensing Lens 10 Base Material Sheet with Mount Paper 20 Supply Roll 30 Winding Roll 40 Laser Cutting Device
Claims (6)
からなる台紙つき基材シートにレーザ光を照射して基材
シートを切断する台紙つき基材シートの切断方法におい
て、複数のレーザ光を近接させたまま照射したことを特
徴とする台紙つき基材シートの切断方法。1. A method of cutting a base sheet with a mount, which comprises irradiating a base sheet with a mount, which comprises a mount and a base sheet that can be peeled off from the mount, with a laser beam to cut the base sheet. A method for cutting a base material sheet with a mount, which is characterized in that irradiation is carried out while keeping them close.
て照射したことを特徴とする請求項1記載の台紙つき基
材シートの切断方法。2. The method of cutting a base sheet with a mount according to claim 1, wherein the irradiation positions of the laser light are partially close to each other.
て照射したことを特徴とする請求項1記載の台紙つき基
材シートの切断方法。3. The method for cutting a base sheet with a mount according to claim 1, wherein the irradiation position of the laser light is made to partially intersect with the irradiation position.
照射したことを特徴とする請求項1記載の台紙つき基材
シートの切断方法。4. The method for cutting a base sheet with a mount according to claim 1, wherein the irradiation position of the laser beam is crossed a plurality of times for irradiation.
徴とする請求項1記載の台紙つき基材シートの切断方
法。5. The method for cutting a base sheet with a mount according to claim 1, wherein laser beams having different focal points are used.
周環のレーザビームモードが小さいレーザ光を用いたこ
とを特徴とする請求項1記載の台紙つき基材シートの切
断方法。6. The method for cutting a base sheet with a mount according to claim 1, wherein a laser beam having a large central laser beam mode and a small peripheral laser beam mode is used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4070344A JP2750978B2 (en) | 1992-02-20 | 1992-02-20 | Cutting method for base sheet with backing sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4070344A JP2750978B2 (en) | 1992-02-20 | 1992-02-20 | Cutting method for base sheet with backing sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05228668A true JPH05228668A (en) | 1993-09-07 |
JP2750978B2 JP2750978B2 (en) | 1998-05-18 |
Family
ID=13428712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4070344A Expired - Lifetime JP2750978B2 (en) | 1992-02-20 | 1992-02-20 | Cutting method for base sheet with backing sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2750978B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008062075A (en) * | 2001-05-17 | 2008-03-21 | Nitto Denko Corp | Adhesive material and method for producing the same |
JP2014034111A (en) * | 2012-08-07 | 2014-02-24 | Miyakoshi Printing Machinery Co Ltd | Method and apparatus for refuse removal of label base paper |
JP2014148056A (en) * | 2013-01-31 | 2014-08-21 | Taiyo Mark:Kk | Base sheet, kit, and laminate for cutting a functional sheet and method for cutting a functional sheet |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0412834A (en) * | 1990-04-28 | 1992-01-17 | Kanzaki Paper Mfg Co Ltd | Processing method for adhesive sheet |
-
1992
- 1992-02-20 JP JP4070344A patent/JP2750978B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0412834A (en) * | 1990-04-28 | 1992-01-17 | Kanzaki Paper Mfg Co Ltd | Processing method for adhesive sheet |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008062075A (en) * | 2001-05-17 | 2008-03-21 | Nitto Denko Corp | Adhesive material and method for producing the same |
JP2014034111A (en) * | 2012-08-07 | 2014-02-24 | Miyakoshi Printing Machinery Co Ltd | Method and apparatus for refuse removal of label base paper |
JP2014148056A (en) * | 2013-01-31 | 2014-08-21 | Taiyo Mark:Kk | Base sheet, kit, and laminate for cutting a functional sheet and method for cutting a functional sheet |
Also Published As
Publication number | Publication date |
---|---|
JP2750978B2 (en) | 1998-05-18 |
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