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JPH05225799A - Semiconductor memory device - Google Patents

Semiconductor memory device

Info

Publication number
JPH05225799A
JPH05225799A JP4011493A JP1149392A JPH05225799A JP H05225799 A JPH05225799 A JP H05225799A JP 4011493 A JP4011493 A JP 4011493A JP 1149392 A JP1149392 A JP 1149392A JP H05225799 A JPH05225799 A JP H05225799A
Authority
JP
Japan
Prior art keywords
power supply
memory cell
supply voltage
hold current
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4011493A
Other languages
Japanese (ja)
Inventor
Toshio Ishii
利生 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4011493A priority Critical patent/JPH05225799A/en
Publication of JPH05225799A publication Critical patent/JPH05225799A/en
Withdrawn legal-status Critical Current

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Landscapes

  • Static Random-Access Memory (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)

Abstract

PURPOSE:To detect a latently defective memory cell having a low data holding ability in the short time. CONSTITUTION:A holding current controller 4 provided with a bipolar transistor Q2 turning off the power unit within an ordinary operating power supply voltage range and turning on in the power unit outside of the region is provided. Sufficient data holding current is supplied to each memory cell MC similarly with a conventional example and when the controller is operated at the outside of the range of the ordinary operating power supply voltage and the data holding current supplied to each memory cell is reduced when the controller is operated at the outside of the range, the defective memory cell is latently detected.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体メモリ装置に関
し、特にバイポーラトランジスタによるメモリセルを備
えこのメモリセルにデータホールド電流を供給する回路
を備えた半導体メモリ装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor memory device, and more particularly to a semiconductor memory device having a memory cell including a bipolar transistor and a circuit for supplying a data hold current to the memory cell.

【0002】[0002]

【従来の技術】従来、この種の半導体メモリ装置では図
3に示すように、行方向,列方向にマトリクス状に配列
された複数のメモリセルMCと、これらメモリセルを各
行単位で選択する複数のワード線WT1〜WT2とを備
えたメモリセルアレイ1と、このメモリセルアレイ1の
各行とそれぞれ対応して設けられ対応する行の各メモリ
セルにデータホールド電流を供給する複数の第1のバイ
ポーラトランジスタQ1及び抵抗R1を備えたホールド
電流供給回路2と、このホールド電流供給回路2の各第
1のバイポーラトランジスタQ1のベースに、電源電圧
変動や温度変動に対して安定化したバイアス電圧VBを
供給して各メモリセルMCへのデータホールド電流を所
定の値に制御するバイアス回路3とを有し、通常の動作
電源電圧範囲内の電源で所定の機能をはたす構成となっ
ていた。
2. Description of the Related Art Conventionally, in a semiconductor memory device of this type, as shown in FIG. 3, a plurality of memory cells MC arranged in a matrix in a row direction and a column direction and a plurality of memory cells MC for selecting these memory cells in units of rows. Memory cell array 1 having the word lines WT1 to WT2 and a plurality of first bipolar transistors Q1 provided corresponding to each row of the memory cell array 1 and supplying a data hold current to each memory cell of the corresponding row. And a hold current supply circuit 2 having a resistor R1 and a base of each first bipolar transistor Q1 of the hold current supply circuit 2 are supplied with a bias voltage VB stabilized against power supply voltage fluctuations and temperature fluctuations. Bias circuit 3 for controlling the data hold current to each memory cell MC to a predetermined value, and within the normal operating power supply voltage range. It has been a play constitute a predetermined function in the source.

【0003】通常、メモリセルMCの放射線等によるデ
ータ保持能力は、データホールド電流の大小で大きく変
化するため、半導体メモリ装置では、メモリセルの内容
が破壊しないように、このデータホールド電流は十分に
マージンをもった値となっている。
Normally, the data holding capacity of the memory cell MC due to radiation or the like greatly changes depending on the magnitude of the data hold current. Therefore, in the semiconductor memory device, this data hold current is sufficient so as not to destroy the contents of the memory cell. It is a value with a margin.

【0004】[0004]

【発明が解決しようとする課題】この従来の半導体メモ
リ装置では、データホールド電流が十分にマージンをも
って設計されているため、製造時の不良でメモリセルM
Cの一部に特性が十分でなく長時間の使用時に放射線等
でデータ破壊にいたるものが存在しても、短時間の選別
試験では、これらの潜在的に不良なメモリセルを検出す
ることは困難であった。
In this conventional semiconductor memory device, since the data hold current is designed with a sufficient margin, the memory cell M is defective due to manufacturing defects.
Even if a part of C does not have sufficient characteristics and causes data destruction due to radiation when used for a long time, it is possible to detect these potentially defective memory cells in a short-time screening test. It was difficult.

【0005】本発明の目的は、データ保持能力の低い潜
在的に不良なメモリセルを短時間に検出することごでき
る半導体メモリ装置を提供することにある。
An object of the present invention is to provide a semiconductor memory device capable of detecting a potentially defective memory cell having a low data retention capacity in a short time.

【0006】[0006]

【課題を解決するための手段】本発明の半導体メモリ装
置は、行方向,列方向にマトリクス状に配列された複数
のメモリセルを備えたメモリセルアレイと、このメモリ
セルアレイの各行とそれぞれ対応して設けられ対応する
行の各メモリセルにデータホールド電流を供給する複数
の第1のバイポーラトランジスタ及び抵抗を備えたホー
ルド電流供給回路と、このホールド電流供給回路の各第
1のバイポーラトランジスタのベースにバイアス電圧を
供給して前記各メモリセルへのデータホールド電流を所
定の値に制御するバイアス回路とを有し、通常の動作電
源電圧範囲内の電源で所定の機能をはたす半導体メモリ
装置において、前記通常の動作電源電圧範囲内の電源で
は前記所定の機能をはたすように前記ホールド電流供給
回路から前記メモリセルアレイの各メモリセルにデータ
ホールド電流を供給し、前記通常の動作電源電圧範囲外
の電源では前記通常の動作電源電圧範囲内の電源のとき
より小さいデータホールド電流を前記メモリセルアレイ
の各メモリセルに供給するホールド電流制御回路を設け
て構成される。
A semiconductor memory device according to the present invention includes a memory cell array having a plurality of memory cells arranged in a matrix in a row direction and a column direction, and a memory cell array corresponding to each row of the memory cell array. A hold current supply circuit including a plurality of first bipolar transistors for supplying a data hold current to each memory cell of the corresponding row and a resistor, and a bias for the base of each first bipolar transistor of the hold current supply circuit. A semiconductor memory device having a bias circuit for supplying a voltage to control a data hold current to each of the memory cells to a predetermined value and performing a predetermined function with a power supply within a normal operating power supply voltage range. In the power supply within the operating power supply voltage range, the hold current supply circuit operates so as to perform the predetermined function. A data hold current is supplied to each memory cell of the cell array, and a power supply outside the normal operating power supply voltage range supplies a smaller data hold current to each memory cell of the memory cell array when the power supply is within the normal operating power supply voltage range. A hold current control circuit for supply is provided.

【0007】[0007]

【実施例】次に本発明の実施例について図面を参照して
説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0008】図1は本発明の第1の実施例を示す回路図
である。
FIG. 1 is a circuit diagram showing a first embodiment of the present invention.

【0009】この実施例が図3に示された従来の半導体
メモリ装置と相違する点は、エミッタ及びコレクタをホ
ールド電流供給回路2の第1の電源電圧受電端(VE
E)及びバイアス電圧(VB)受電端とそれぞれ対応し
て接続する第2のバイポーラトランジスタQ2と、通常
の動作電源範囲内の電源では第2のバイポーラトランジ
スタQ2をオフ、通常の動作電源電圧範囲外の電源では
第2のバイポーラトランジスタQ2をオンにする第2の
抵抗R2及び複数のダイオードD1とを備え、通常の動
作電源電圧範囲内の電源では従来と同様の所定の機能を
はたすようにホールド電流供給回路2からメモリセルア
レイ1の各メモリセルMCにデータホールド電流を供給
し、通常の動作電源電圧範囲外の電源では通常の動作電
源電圧範囲内の電源のときより小さいデータホールド電
流をメモリセルアレイ1の各メモリセルMCに供給する
ホールド電流制御回路4を設けた点にある。
This embodiment differs from the conventional semiconductor memory device shown in FIG. 3 in that the emitter and collector hold current supply circuit 2 has a first power supply voltage receiving end (VE).
E) and a bias voltage (VB) power receiving terminal respectively corresponding to the second bipolar transistor Q2 and the power supply within the normal operating power supply range, the second bipolar transistor Q2 is turned off, and is outside the normal operating power supply voltage range. The second power supply includes a second resistor R2 for turning on the second bipolar transistor Q2 and a plurality of diodes D1, and a power supply within a normal operating power supply voltage range holds a hold current so as to perform a predetermined function similar to the conventional one. A data hold current is supplied from the supply circuit 2 to each memory cell MC of the memory cell array 1, and a power supply outside the normal operating power supply voltage range supplies a data hold current smaller than that of the power supply within the normal operating power supply voltage range. The holding current control circuit 4 for supplying each memory cell MC is provided.

【0010】このような構成とすることにより、通常の
動作電源電圧範囲内では、バイポーラトランシスタQ2
はオフ状態となり、従来例と同様に各メモリセルMCに
十分なデータホールド電流が供給されるので、十分な安
全性をもってデータの書込み、読出し等を行なうことが
できる。また、不良のメモリセルの選別試験を行う場合
12は、電源電圧を通常の動作電源電圧範囲よりも大き
い電源電圧とすることによりバイボーラトランジスタQ
2はオン状態になり、バイボーラトランジスタQ1のベ
ース電位は低下し、データホールド電流は減少する。こ
の状態で通常のメモリセル試験を行なえば、正常なメモ
リセルMCでは十分なマージンがあり、短時間のデータ
保持は可能なため動作不良にはならないが、特性が悪く
潜在的に不良なメモリセルではデータの保持が出来ず動
作不良となり、これらを選別することができる。
With this structure, the bipolar transistor Q2 is operated within the normal operating power supply voltage range.
Is turned off and a sufficient data hold current is supplied to each memory cell MC as in the conventional example, so that data writing and reading can be performed with sufficient safety. Further, in the case of performing a screening test for defective memory cells, the bipolar transistor Q is set by setting the power supply voltage to a power supply voltage larger than the normal operating power supply voltage range.
2 is turned on, the base potential of the bipolar transistor Q1 decreases, and the data hold current decreases. If a normal memory cell test is performed in this state, a normal memory cell MC has a sufficient margin, and data can be retained for a short time so that operation failure does not occur, but the memory cell has poor characteristics and is potentially defective. In this case, the data cannot be held, resulting in a malfunction, and these can be selected.

【0011】図2は本発明の第2の実施例を示す回路図
である。
FIG. 2 is a circuit diagram showing a second embodiment of the present invention.

【0012】この実施例は、ホールド電流制御回路4a
を、一端をホールド電流供給回路2の第2の電源電圧受
電端(VEE)と接続しこの第1の電源電圧受電端に第
1の電源電圧VEEを供給する第3の抵抗R3と、エミ
ッタ及びコレクタを第1の電源電圧受電端及び第2の電
源電圧供給端子(VSS)とそれぞれ対応して接続する
第2のバイポーラトランジスタQ2と、通常の動作電源
電圧範囲内の電源では第2のバイポーラトランジスタQ
2をオフ、通常の動作電源電圧範囲外の電源では第2の
バイポーラトランジスタQ2をオンにする第2の抵抗及
び複数のダイオードとを備えた構成としたものである。
In this embodiment, the hold current control circuit 4a is used.
Is connected at one end to a second power supply voltage receiving end (VEE) of the hold current supply circuit 2 and a third resistor R3 for supplying the first power supply voltage VEE to the first power supply voltage receiving end, an emitter and A second bipolar transistor Q2 whose collector is connected to the first power supply voltage receiving end and the second power supply voltage supply terminal (VSS) respectively, and a second bipolar transistor Q2 for a power supply within a normal operating power supply voltage range. Q
2 is turned off, and a power supply outside the normal operating power supply voltage range is provided with a second resistor and a plurality of diodes for turning on the second bipolar transistor Q2.

【0013】不良のメモリセルの選別試験時に、電源電
圧を十分に大きくすると、バイポーラトランジスタQ2
はオン状態になり、抵抗R3での電圧降下が増加し、抵
抗R1に流れる電流は減少する。以下の動作は第1の実
施例と同様である。本実施例では、電源電圧の増加に対
するホールド電流の減少率を抵抗R3の値の設定によっ
て比較的緩やかに変化させられることができるという利
点がある。
If the power supply voltage is made sufficiently high during the screening test for defective memory cells, the bipolar transistor Q2
Is turned on, the voltage drop across the resistor R3 increases, and the current flowing through the resistor R1 decreases. The subsequent operation is similar to that of the first embodiment. The present embodiment has the advantage that the rate of decrease of the hold current with respect to the increase of the power supply voltage can be changed relatively gently by setting the value of the resistor R3.

【0014】[0014]

【発明の効果】以上説明したように本発明は、通常の動
作電源電圧範囲外の電源を供給してデータホールド電流
を低減し、メモリセルの選別試験を行う構成とすること
により、従来の選別試験では検出困難なデータ保持能力
の低い潜在的に不良なメモリセルを、専用の端子を用い
ずに、短時間の試験で簡単に検出できるという効果があ
る。
As described above, according to the present invention, a power supply outside the normal operating power supply voltage range is supplied to reduce the data hold current, and a memory cell selection test is performed, whereby the conventional selection is performed. There is an effect that a potentially defective memory cell having a low data retention capability that is difficult to detect in a test can be easily detected in a short time test without using a dedicated terminal.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例を示す回路図である。FIG. 1 is a circuit diagram showing a first embodiment of the present invention.

【図2】本発明の第2の実施例を示す回路図である。FIG. 2 is a circuit diagram showing a second embodiment of the present invention.

【図3】従来の半導体メモリ装置の一例を示す回路図で
ある。
FIG. 3 is a circuit diagram showing an example of a conventional semiconductor memory device.

【符号の説明】[Explanation of symbols]

1 メモリセルアレイ 2 ホールド電流供給回路 3 バイアス回路 4,4a ホールド電流制御回路 D1 ダイオード MC メモリセル Q1,Q2 バイポーラトランジスタ R1〜R3 抵抗 WT1〜WTn ワード線 1 memory cell array 2 hold current supply circuit 3 bias circuit 4, 4a hold current control circuit D1 diode MC memory cell Q1, Q2 bipolar transistor R1 to R3 resistance WT1 to WTn word line

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 行方向,列方向にマトリクス状に配列さ
れた複数のメモリセルを備えたメモリセルアレイと、こ
のメモリセルアレイの各行とそれぞれ対応して設けられ
対応する行の各メモリセルにデータホールド電流を供給
する複数の第1のバイポーラトランジスタ及び抵抗を備
えたホールド電流供給回路と、このホールド電流供給回
路の各第1のバイポーラトランジスタのベースにバイア
ス電圧を供給して前記各メモリセルへのデータホールド
電流を所定の値に制御するバイアス回路とを有し、通常
の動作電源電圧範囲内の電源で所定の機能をはたす半導
体メモリ装置において、前記通常の動作電源電圧範囲内
の電源では前記所定の機能をはたすように前記ホールド
電流供給回路から前記メモリセルアレイの各メモリセル
にデータホールド電流を供給し、前記通常の動作電源電
圧範囲外の電源では前記通常の動作電源電圧範囲内の電
源のときより小さいデータホールド電流を前記メモリセ
ルアレイの各メモリセルに供給するホールド電流制御回
路を設けたことを特徴とする半導体メモリ装置。
1. A memory cell array including a plurality of memory cells arranged in a matrix in a row direction and a column direction, and data hold in each memory cell of a corresponding row provided corresponding to each row of the memory cell array. A hold current supply circuit having a plurality of first bipolar transistors for supplying current and a resistor, and a bias voltage is supplied to the base of each first bipolar transistor of the hold current supply circuit to supply data to the memory cells. A semiconductor memory device having a bias circuit for controlling a hold current to a predetermined value and performing a predetermined function with a power supply within a normal operating power supply voltage range. A data hold voltage is applied from the hold current supply circuit to each memory cell of the memory cell array so as to fulfill the function. And a hold current control circuit that supplies a data hold current to each memory cell of the memory cell array that is smaller than that of the power supply within the normal operating power supply voltage range when the power supply is outside the normal operating power supply voltage range. A semiconductor memory device characterized by the above.
【請求項2】 ホールド電流制御回路が、エミッタ及び
コレクタをホールド電流供給回路の第1の電源電圧受電
端及びバイアス電圧受電端とそれぞれ対応して接続する
第2のバイポーラトランジスタと、通常の動作電源電圧
範囲内の電源では前記第2のバイポーラトランジスタを
オフ、通常の動作電源電圧範囲内の電源では前記第2の
バイポーラトランジスタをオンにする第2の抵抗及び複
数のダイオードとを備えた回路で構成された請求項1記
載の半導体メモリ装置。
2. A second bipolar transistor in which a hold current control circuit connects an emitter and a collector to a first power supply voltage receiving end and a bias voltage receiving end of the hold current supply circuit, respectively, and a normal operating power supply. A power supply in a voltage range includes a circuit having a second resistor for turning off the second bipolar transistor, and a power supply in a normal operation power supply voltage range for turning on the second bipolar transistor and a plurality of diodes. The semiconductor memory device according to claim 1, which has been written.
【請求項3】 ホールド電流制御回路が、一端をホール
ド電流供給回路の第1の電源電圧受電端と接続しこの第
1の電源電圧受電端に第1の電源電圧を供給する第3の
抵抗と、エミッタ及びコレクタを前記第1の電源電圧受
電端及び第2の電源電圧供給端子とそれぞれ対応して接
続する第2のバイポーラトランジスタと、通常の動作電
源電圧範囲内の電源では前記第2のバイポーラトランジ
スタをオフ、前記通常の動作電源電圧範囲外の電源では
前記第2のバイポーラトランジスタをオンにする第2の
抵抗及び複数のダイオードとを備えた回路で構成された
請求項1記載の半導体メモリ装置。
3. The hold current control circuit has a third resistor, one end of which is connected to a first power supply voltage receiving end of the hold current supply circuit, and which supplies a first power supply voltage to the first power supply voltage receiving end. A second bipolar transistor having an emitter and a collector connected to the first power supply voltage receiving end and the second power supply voltage supply terminal, respectively, and the second bipolar transistor for a power supply within a normal operating power supply voltage range. 2. The semiconductor memory device according to claim 1, comprising a circuit including a second resistor for turning off the transistor and turning on the second bipolar transistor when the power supply is outside the normal operating power supply voltage range, and a plurality of diodes. ..
JP4011493A 1992-01-27 1992-01-27 Semiconductor memory device Withdrawn JPH05225799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4011493A JPH05225799A (en) 1992-01-27 1992-01-27 Semiconductor memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4011493A JPH05225799A (en) 1992-01-27 1992-01-27 Semiconductor memory device

Publications (1)

Publication Number Publication Date
JPH05225799A true JPH05225799A (en) 1993-09-03

Family

ID=11779567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4011493A Withdrawn JPH05225799A (en) 1992-01-27 1992-01-27 Semiconductor memory device

Country Status (1)

Country Link
JP (1) JPH05225799A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135114A (en) * 2006-11-28 2008-06-12 Nec Electronics Corp Semiconductor integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135114A (en) * 2006-11-28 2008-06-12 Nec Electronics Corp Semiconductor integrated circuit device

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