JPH05225202A - Quality control method for mounting parts - Google Patents
Quality control method for mounting partsInfo
- Publication number
- JPH05225202A JPH05225202A JP2776092A JP2776092A JPH05225202A JP H05225202 A JPH05225202 A JP H05225202A JP 2776092 A JP2776092 A JP 2776092A JP 2776092 A JP2776092 A JP 2776092A JP H05225202 A JPH05225202 A JP H05225202A
- Authority
- JP
- Japan
- Prior art keywords
- host computer
- printed circuit
- mounting
- board
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003908 quality control method Methods 0.000 title claims description 11
- 238000007689 inspection Methods 0.000 claims abstract description 43
- 238000012544 monitoring process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001364 causal effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- General Factory Administration (AREA)
- Control Of Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Automatic Assembly (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複数の実装機群にて電
子部品を基板に実装する実装設備における実装状態の品
質管理方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting state quality control method in mounting equipment for mounting electronic components on a board by a plurality of mounting machine groups.
【０００２】[0002]
【従来の技術】従来の実装設備における構成及び品質管
理方法を図３に示す。図３において、１は電子部品を実
装すべきプリント基板であり、プリント基板１に半田ペ
ーストの印刷を行う印刷機２、印刷状態を検査する印刷
検査機３、プリント基板１に電子部品を装着する装着機
４、装着状態を検査する装着検査機５、電子部品を半田
付けする半田付装置６、半田付状態を検査する外観検査
機７を配設された実装ラインにコンベア８にて供給さ
れ、各工程毎に所定の処理が行われる。2. Description of the Related Art FIG. 3 shows a configuration and quality control method of a conventional mounting facility. In FIG. 3, reference numeral 1 denotes a printed circuit board on which electronic components are to be mounted. A printing machine 2 for printing solder paste on the printed circuit board 1, a printing inspection machine 3 for inspecting the printing state, and mounting the electronic parts on the printed circuit board 1. The mounting machine 4, the mounting inspection machine 5 for inspecting the mounting state, the soldering device 6 for soldering electronic components, and the appearance inspection machine 7 for inspecting the soldering state are supplied by the conveyor 8 to the mounting line, Predetermined processing is performed for each process.
【０００３】通常、プリント基板は１枚毎に検査され、
検査結果は検査機で収録されるか、あるいは重大な品質
上の問題があった場合に即座に生産を中断するようにな
っており、作業者は検査機の収録データと実際に不良の
起きたプリント基板を見ることで不良原因を分析し、設
備の調整等の適切な手続きを実施するようになってい
る。Usually, the printed circuit boards are inspected one by one,
The inspection result is recorded by the inspection machine, or the production is immediately stopped when there is a serious quality problem, and the operator records the inspection data and the actual defect occurs. The cause of failure is analyzed by looking at the printed circuit board, and appropriate procedures such as equipment adjustments are implemented.
【０００４】[0004]
【発明が解決しようとする課題】しかし、このような品
質管理方法では次のような問題がある。However, such a quality control method has the following problems.
【０００５】第１に、検査機でプリント基板を特定して
管理できないため、検査機内で収録されているデータが
どのプリント基板であるかの確認が不可能である。First, the printed circuit board cannot be specified and managed by the inspection machine, so that it is impossible to confirm which printed circuit board the data recorded in the inspection machine is.
【０００６】第２に、各検査機は前段の工程についての
検査データを有していないので、ライン全体での品質分
析を行う処理ができない。Secondly, since each inspecting machine does not have inspection data on the preceding process, it is impossible to perform quality analysis on the entire line.
【０００７】第３に、生産を中止するかどうかを判断す
るには、作業者が各検査機の出力するモニタ、あるいは
帳票を監視しなければならない。特に、検査機が多く接
続されている場合には作業者の負担も多く作業ミスを招
く。Thirdly, in order to judge whether or not to stop the production, an operator must monitor the monitor output from each inspection machine or the form. In particular, when many inspection machines are connected, the burden on the operator is large and work mistakes are caused.
【０００８】本発明は上記従来の問題点に鑑み、各工程
の検査結果を基板毎にかつ容易に管理できる部品実装の
品質管理方法を提供することを目的とする。In view of the above conventional problems, it is an object of the present invention to provide a quality control method for component mounting, which allows easy control of inspection results of each process for each board.
【０００９】[0009]
【課題を解決するための手段】本発明は、電子部品を基
板に実装する工程の品質管理方法であって、基板を特定
する記号を形成した基板を用い、各実装工程の検査結果
を基板の記号の読み取り結果とともにオンラインで上位
計算機に出力し、上位計算機にて各基板毎に検査結果に
基づいて品質の状態を監視することを特徴とする。The present invention is a quality control method for a process of mounting an electronic component on a board, wherein a board on which a symbol for identifying the board is formed is used and the inspection result of each mounting step is displayed on the board. It is characterized in that the reading result of the symbol is output online to the host computer, and the host computer monitors the quality condition for each board based on the inspection result.
【００１０】[0010]
【作用】本発明によれば、上記方法によって上位計算機
で各工程毎の検査結果をプリント基板毎に付けられてい
る記号に基づいて基板１枚単位で明確に管理できるた
め、作業者が複数の検査機を見回ることなく上位計算機
のモニタで容易に基板１枚単位で管理できて作業者の負
担を大幅に低減でき、また各工程間の不良原因の因果関
係を上位計算機内の検査データに基づいて分析し、評価
する手続きを処理に組み込むことによりライン全体の集
中監視が可能となる。According to the present invention, the inspection result of each step can be clearly managed by the above-mentioned method in the unit of one board based on the symbol attached to each printed board by the above-mentioned computer. Without having to look around the inspection machine, it can be easily managed by the monitor of the host computer on a board-by-board basis and the burden on the operator can be greatly reduced. In addition, the causal relationship of the cause of failure between each process is based on the inspection data in the host computer. It becomes possible to centrally monitor the entire line by incorporating a procedure for analyzing and evaluating in the process.
【００１１】[0011]
【実施例】以下、本発明の一実施例の部品実装の品質管
理方法について図１、図２を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting quality control method according to an embodiment of the present invention will be described below with reference to FIGS.
【００１２】図１に電子部品実装設備の全体構成を示
す。図１において、１は電子部品を実装すべきプリント
基板であり、その製造番号を示すバーコード９が印刷さ
れている。このプリント基板１に電子部品を実装する実
装ラインには、プリント基板１に半田ペーストの印刷を
行う印刷機２、印刷状態を検査する印刷検査機３、プリ
ント基板１に電子部品を装着する装着機４、装着状態を
検査する装着検査機５、電子部品を半田付けする半田付
装置６、半田付状態を検査する外観検査機７が配設さ
れ、プリント基板１はコンベア８にて各工程装置に順次
搬送され、各工程毎に所定の処理が行われる。FIG. 1 shows the overall structure of electronic component mounting equipment. In FIG. 1, reference numeral 1 is a printed circuit board on which an electronic component is to be mounted, and a bar code 9 indicating its serial number is printed. The mounting line for mounting electronic components on the printed circuit board 1 includes a printing machine 2 for printing solder paste on the printed circuit board 1, a printing inspection machine 3 for inspecting a printing state, and a mounting machine for mounting electronic parts on the printed circuit board 1. 4, a mounting inspection machine 5 for inspecting the mounting state, a soldering device 6 for soldering electronic components, and an appearance inspection machine 7 for inspecting the soldering state are arranged. The sheets are sequentially conveyed, and a predetermined process is performed for each process.
【００１３】各検査機３、５、７にはプリント基板１の
バーコード９を読み取るバーコード読み取り装置１０が
接続されている。各検査機３、５、７で１枚づつ検査さ
れた検査結果は、バーコード読み取り装置１０で読み取
られたプリント基板１の製造番号とともに上位計算機１
１に転送される。各検査機３、５、７と上位計算機１１
は、検査データのデータ量が大であり、かつ検査結果を
上位計算機１１上のモニタに即座に反映させるため、デ
ータ転送の速いイーサネット１２を用いて接続してい
る。１３は各機器とイーサネット１２を接続するケーブ
ルである。A bar code reader 10 for reading a bar code 9 on the printed circuit board 1 is connected to each of the inspection machines 3, 5, 7. The inspection results inspected one by one by each of the inspection machines 3, 5 and 7 together with the serial number of the printed circuit board 1 read by the bar code reading device 10 together with the host computer 1
Forwarded to 1. Each inspection machine 3, 5, 7 and host computer 11
In order to have a large amount of inspection data and to immediately reflect the inspection result on the monitor on the upper-level computer 11, the connection is made by using the Ethernet 12 which is fast in data transfer. Reference numeral 13 is a cable that connects each device to the Ethernet 12.
【００１４】図２に品質管理方法の処理の流れの詳細を
示す。検査データとプリント基板１の製造番号と検査機
の番号を上位計算機１１に転送することで、どの設備の
どのプリント基板１で不良を発生したのかを上位計算機
１１上で特定できる。又、上位計算機１１で収録された
検査データを集計・解析することで不良要因の傾向分析
の処理手続きに利用される。FIG. 2 shows the details of the processing flow of the quality control method. By transferring the inspection data, the manufacturing number of the printed circuit board 1 and the inspection machine number to the higher-level computer 11, it is possible to specify on the higher-level computer 11 which printed circuit board 1 of which equipment the defect has occurred. Further, the inspection data recorded by the high-level computer 11 is used for the processing procedure of the failure factor tendency analysis by collecting and analyzing the inspection data.
【００１５】尚、上記実施例ではプリント基板１にバー
コード９を印刷した例を示したが、はがれなければバー
コードを印刷したラベルを貼り付けてもよい。また、検
査データ等の転送手段としてイーサネット１３を用いた
が、他の転送手段を用いてもよい。In the above embodiment, the bar code 9 is printed on the printed board 1. However, if the bar code 9 does not come off, a bar code printed label may be attached. Although the Ethernet 13 is used as the transfer means for the inspection data and the like, other transfer means may be used.
【００１６】[0016]
【発明の効果】本発明によれば、以上のように基板の製
造番号を示す記号を形成した基板を用い、各実装工程の
検査結果を基板の記号の読み取り結果とともにオンライ
ンで上位計算機に出力し、上位計算機にて各基板毎に検
査結果に基づいて品質の状態を監視するので、各工程毎
の検査結果をプリント基板１枚単位で上位計算機のモニ
タにて容易に管理でき、作業者の負担を大幅に低減でき
るとともに、各工程間の不良原因の因果関係を上位計算
機内の検査データに基づいて分析し、評価することも可
能となり、ライン全体を集中監視できる。According to the present invention, by using the board on which the symbol indicating the board serial number is formed as described above, the inspection result of each mounting process is output to the host computer online together with the result of reading the symbol of the board. Since the host computer monitors the quality status based on the inspection results for each board, the inspection results for each process can be easily managed on the monitor of the host computer for each printed circuit board, and the burden on the operator It is also possible to significantly reduce the cause, and it is also possible to analyze and evaluate the causal relationship of the cause of failure between each process based on the inspection data in the host computer, and to centrally monitor the entire line.
【図１】本発明の部品実装の品質管理方法を適用する電
子部品実装設備の一実施例の構成図である。FIG. 1 is a configuration diagram of an example of an electronic component mounting facility to which a component mounting quality control method of the present invention is applied.
【図２】同実施例の処理の流れの説明図である。FIG. 2 is an explanatory diagram of a processing flow of the embodiment.
【図３】従来例の電子部品実装設備の構成図である。FIG. 3 is a configuration diagram of a conventional electronic component mounting facility.
１ プリント基板 ２ 印刷機 ３ 印刷検査機 ４ 装着機 ５ 装着検査機 ６ 半田付装置 ７ 外観検査機 ９ バーコード １０ バーコード読み取り装置 １１ 上位計算機 1 Printed Circuit Board 2 Printing Machine 3 Printing Inspection Machine 4 Mounting Machine 5 Mounting Inspection Machine 6 Soldering Device 7 Appearance Inspection Machine 9 Bar Code 10 Bar Code Reading Device 11 Host Computer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 13/08 Ｄ 8315−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H05K 13/08 D 8315-4E
Claims (1)
理方法であって、基板を特定する記号を形成した基板を
用い、各実装工程の検査結果を基板の記号の読み取り結
果とともにオンラインで上位計算機に出力し、上位計算
機にて各基板毎に検査結果に基づいて品質の状態を監視
することを特徴とする部品実装の品質管理方法。1. A quality control method for mounting electronic components on a board, wherein a board on which a symbol for identifying the board is formed is used, and the inspection result of each mounting step is put online along with the result of reading the board symbol. A quality control method for component mounting, which is characterized by outputting the result to a computer and monitoring the quality state of each board by a host computer based on the inspection result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2776092A JPH05225202A (en) | 1992-02-14 | 1992-02-14 | Quality control method for mounting parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2776092A JPH05225202A (en) | 1992-02-14 | 1992-02-14 | Quality control method for mounting parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05225202A true JPH05225202A (en) | 1993-09-03 |
Family
ID=12229968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2776092A Pending JPH05225202A (en) | 1992-02-14 | 1992-02-14 | Quality control method for mounting parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05225202A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07262270A (en) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | Quality control system |
| JPH07334226A (en) * | 1994-06-09 | 1995-12-22 | Toyota Motor Corp | Correction process supporting system for production facility |
| JP2008529110A (en) * | 2005-01-21 | 2008-07-31 | エフ．ホフマン−ラ ロシュ アーゲー | System and method for optically imaging an object on a detection device by means of a pinhole aperture |
| CN104648519A (en) * | 2015-01-29 | 2015-05-27 | 周俊雄 | Automatic production line for vehicle-mounted module |
| JP2019070938A (en) * | 2017-10-10 | 2019-05-09 | パナソニックＩｐマネジメント株式会社 | Manufacturing system and manufacturing method |
-
1992
- 1992-02-14 JP JP2776092A patent/JPH05225202A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07262270A (en) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | Quality control system |
| JPH07334226A (en) * | 1994-06-09 | 1995-12-22 | Toyota Motor Corp | Correction process supporting system for production facility |
| JP2008529110A (en) * | 2005-01-21 | 2008-07-31 | エフ．ホフマン−ラ ロシュ アーゲー | System and method for optically imaging an object on a detection device by means of a pinhole aperture |
| CN104648519A (en) * | 2015-01-29 | 2015-05-27 | 周俊雄 | Automatic production line for vehicle-mounted module |
| JP2019070938A (en) * | 2017-10-10 | 2019-05-09 | パナソニックＩｐマネジメント株式会社 | Manufacturing system and manufacturing method |
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