JPH05218228A - Substrate for electronic component mounting use - Google Patents

Abstract

PURPOSE:To provide a substrate for electronic component mounting use, which is easy in processing, is simple in structure and a highly integrated packaging can be realized. CONSTITUTION:A substrate for electronic component mounting use has an insulating substrate 9 having an electronic component mounting part 95 on a surface 91, bonding pads 7 provided on the periphery of the mounting part 95 and external terminals 2 provided on a rear 99 of the substrate 9. Moreover, the substrate for electronic component mounting use has penetrated through holes 1 provided in outer edge parts 92 of the substrate 9, first wiring patterns 17 to connect the pads 7 with the holes 1 and second wiring patterns 12 to connect the holes 1 with the terminals 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic parts, which is easy to process, has a simple structure, and enables high-density mounting.

[0002]

2. Description of the Related Art In recent years, high-density integration of electronic parts has advanced. Along with this, there is a demand for high-density mounting of electronic component mounting boards that receive electrical signals from electronic components. As the prior art, for example, the actual exploitation 55-176
There is an electronic component mounting substrate as disclosed in 571.

As shown in FIGS. 8 to 10, the electronic component mounting substrate is a substrate body made of insulating base materials 901, 902 and 903, and an electronic component mounting recess 95 provided on a surface 91 of the insulating base material 901. And the electronic component mounting recess 95
And bonding pads 7 provided around the peripheral surface of the insulating base material 903 and a large number of external terminals 8 arranged in a grid pattern on the back surface 99 of the insulating base material 903.
1, 82, and 83. The electronic component mounting substrate having such a structure is also called a leadless chip carrier.

Then, as shown in FIGS. 8 and 9, among the external terminals 81 to 83, the external terminal 81 is located at the outermost side of the substrate body, and the external terminals 82 and 83 are recessed portions 95 for mounting electronic parts.
, And the external terminal 82 is located between the external terminals 81 and 83. The external terminal 81 is an insulating base material 901.
One through hole 51 penetrating through ˜903 connects to the connection circuit 57. The connection circuit 57 is connected to the bonding pad 7 (FIG. 9). The external terminal 82 is connected to the connection circuit 57 via the blind via holes 52, 53 and the inner layer circuit 6 provided therebetween. The external terminal 83 is connected to the connection circuit 57 via the blind via holes 54, 55 and the inner layer circuit 6 provided therebetween.

The electronic component 4 is mounted in the electronic component mounting recess 95. The electronic component 4 and the bonding pad 7 are connected by a bonding wire 47. The above-mentioned conventional electronic component mounting board has an external terminal 81.
On the back surface 99 of the insulating base material 9, a large number of elements are arranged in a grid pattern. Therefore, the external terminals are connected to the insulating base material 903.
Since it can be provided on the entire back surface 99, high density mounting of the electronic component mounting board can be achieved.

[0006]

However, the connection between the connection circuit 57 and the external terminals 82 and 83 by the blind via holes 52 to 55 and the inner layer circuit 6 is structurally complicated. That is, the external terminals 82 and 83 are provided at a position corresponding to the lower part of the electronic component mounting recess 95 (indicated by a chain line in FIG. 10). Therefore, the inner layer circuit 6 must be provided inside the electronic component mounting board, that is, in the middle of the blind via holes 52 to 55. When forming the inner layer circuit 6, first, the insulating base materials 902 and 903 are used to form the inner layer circuit 6 on each surface thereof. Next, the blind via holes 52 to 5 are formed on the insulating base materials.
5 is provided. Then, the insulating base materials 901 to 903 are laminated and adhered.

Therefore, the number of manufacturing steps of the electronic component mounting board is large, and labor and labor are required. Therefore, the cost of the electronic component mounting board becomes high. Further, when the mounting state of the electronic component mounting board becomes high, the layout of the wiring pattern of the inner layer circuit 6 becomes complicated. In addition, the degree of freedom in designing the wiring pattern is reduced. In view of the above problems, the present invention aims to provide an electronic component mounting substrate that is easy to process, has a simple structure, and enables high-density mounting.

[0008]

According to the present invention, an insulating base material having an electronic component mounting portion on its surface, bonding pads provided around the electronic component mounting portion, and external terminals provided on the back surface of the insulating base material are provided. A through wiring hole provided on the outer edge of the insulating base material; a first wiring pattern connecting the bonding pad and the through through hole; and a second wiring pattern connecting the through hole and the external terminal. The electronic component mounting board is characterized by having.

What is most noticeable in the present invention is that the through-holes are gathered at the outer edge portion of the insulating base material which is separated from the electronic component mounting portion, and the first connecting pad and the through-hole are connected. That is, the wiring pattern and the second wiring pattern for connecting the through hole and the external terminal are provided.

The through-holes are conductors that penetrate between the front surface and the back surface of the electronic component mounting board and electrically connect the first wiring pattern and the second wiring pattern. The through-holes may be arranged in a line at the outer edge. Further, they may be arranged in two or more columns. The through-holes may be semicircular outer circle through-holes provided on the side surface of the electronic component mounting board. The outer edge portion of the insulating base material means, in the electronic component mounting board, near or around the outer peripheral portion of the insulating base material, which is farther from the electronic component mounting portion.

The external terminals are provided at arbitrary positions on the entire back surface of the electronic component mounting board. The external terminals are arranged, for example, in a lattice shape or a spiral shape. The insulating base material is one or more. In the case of two or more sheets, the above-mentioned first wiring pattern can be arranged inside the insulating base material and the first wiring pattern, the ground circuit, the power supply circuit, etc. can be wired.

As the material of the insulating base material, a synthetic resin substrate made of glass epoxy resin, glass triazine resin, glass polyimide resin or the like is used. The surfaces of the bonding pad and the external terminal are preferably coated with Ni / Au plating. The diameter of the through hole is 0.4.
mm or less is preferable. As a result, a large number of through-holes can be provided on the outer edge of the insulating base material, which enables high-density mounting. Further, it is preferable that the electronic component mounting portion is formed in a concave shape by counterboring or the like. It is preferable that the front surface and the back surface of the insulating base material are coated with a solder resist except for the bonding pad, the external terminal and the through-hole.

[0013]

In the electronic component mounting board of the present invention, the through hole is provided at the outer edge of the insulating base material, and the first wiring pattern, the through hole, and the second through hole are provided between the bonding pad and the external terminal. It is connected with the wiring pattern. Therefore, the wiring patterns on the front surface and the back surface of the electronic component mounting board may be connected by through-holes linearly formed in the insulating base material, and blind via holes, which are difficult to form as in the past, need to be provided. There is no.

Therefore, the structure of the wiring pattern is simple even when the mounting state of the electronic component mounting board is made high. Therefore, it is easy to process the electronic component mounting board. Further, the through-holes are located at the outer edge of the insulating base material. Therefore, the external terminals can be provided at arbitrary positions on almost the entire back surface of the electronic component mounting board. Therefore, there is a great deal of freedom in designing the external terminals that are required for high-density mounting. Therefore, according to the present invention, it is possible to provide an electronic component mounting substrate which is easy to process and has a simple structure and which enables high-density mounting.

[0015]

【Example】

Example 1 An electronic component mounting substrate (leadless chip carrier) according to an example of the present invention will be described with reference to FIGS. As shown in FIG. 1, the electronic component mounting board of the present example has an insulating substrate 9 having an electronic component mounting portion 95 on a surface 91.
And the bonding pad 7 provided around the electronic component mounting portion 95 and the external terminal 2 provided on the back surface 99 of the insulating base material 9. In addition, the circular through-hole 1 formed in the outer edge portion 92 of the insulating base material 9, the first wiring pattern 17 connecting the bonding pad 7 and the through-through hole 1, the through-hole 1 and the outside It has the 2nd wiring pattern 12 which connects with the terminal 2.

The electronic component mounting portion 95 has a concave shape. The wall surface is covered with copper plating 951.
As shown in FIG. 2, the bonding pads 7 are arranged in one row at equal intervals around the electronic component mounting portion 95. The external terminal 2 has an insulating base material 9 as shown in FIG.
Are arranged in a lattice pattern on the back surface 99 of the. The through-holes 1 are arranged outside the external terminal 2 near the outer peripheral edge of the insulating base material 9 in one row at equal intervals.

In the electronic component mounting board of this example, the through-hole 1 is provided in the outer edge portion 92 of the insulating base material 9. The through-hole 1 is connected to the bonding pad 7 via the first wiring pattern 17 on the surface 91 of the insulating base material 9. On the other hand, the back surface 99 of the insulating base material 9
In the external terminal 2 via the second wiring pattern 12.
Connected with. Others are the same as the conventional example.

In the electronic component mounting substrate of this example, the through-hole 1 is provided in the outer edge portion 92 of the insulating base material 9, and the first wiring pattern 17 and the through-hole are provided between the bonding pad 7 and the external terminal 2. Hole 1 and second wiring pattern 1
It is connected by 2 and. Therefore, the connection of the wiring pattern between the front surface 91 and the back surface 99 of the electronic component mounting substrate is performed by penetrating the through-hole 1 formed in the insulating base material 9 in a straight line.
It is not necessary to provide a blind via hole which is difficult to form as in the conventional case.

Therefore, even when the mounting state of the electronic component mounting board is set to a high density, the structure of the wiring pattern is simple. That is, it is only necessary to provide the through-hole 1 for connecting the first wiring pattern 17 and the second wiring pattern 12. Therefore, the processing of the electronic component mounting substrate is easy. It does not take time and effort. In addition, the through hole 1
It is on the outer edge portion 92 of the electronic component mounting portion 95 in the electronic component mounting substrate. The external terminal 2 is provided at an arbitrary position on the entire back surface 99 of the insulating base material 9. Therefore, there is great freedom in designing the through-hole 1 and the external terminal 2.

Embodiment 2 In the electronic component mounting board of this embodiment, as shown in FIG. 4, the through through holes 10 are arranged in parallel in two rows. The through-hole 10 is an insulating base material 9.
Is connected to the external terminal 2 on the back surface 99 of the. The external terminals 2 are arranged all over the back surface 99 of the insulating base material 9. On the other hand, the surface of the insulating base material 9 is connected to the bonding pad by the first wiring pattern. Others are the same as in the first embodiment. Also in this example, the same effect as that of the first embodiment can be obtained.

Example 3 In the electronic component mounting substrate of this example, as shown in FIG. 5, a semicircular through-hole 11 is also provided at the outer peripheral edge of the insulating base material 9 in Example 1. The through-holes 11 are connected to the external terminals 2 on the back surface 99 of the insulating base material 9 by the second wiring pattern 120 and to the bonding pads on the front surface of the insulating base material 9 by the first wiring pattern.

Further, inside the outer peripheral edge,
A through through hole 1 similar to that of the first embodiment is provided, and
The wiring pattern 12 is connected to the external terminal 2. Others are the same as in the first embodiment. In this example,
Since the through-holes are also provided at the outer peripheral edge of the insulating base material 9, the external terminals can be provided at a higher density. Also in this example, the same effect as that of the first embodiment can be obtained.

Example 4 In the electronic component mounting board of this example, as shown in FIG. 6, insulating base materials 910, 911 and 912 are laminated, and a grounding circuit 31 and a ground circuit 31 are provided inside the electronic component mounting board. The power supply circuit 32 is provided. The ground circuit 31 includes the copper plating 951 of the electronic component mounting portion 95 and the through-holes 10.
1 and copper plating are connected.

The power supply circuit 32 has a through-hole 1
02 is connected. The through-hole 102 is connected to the power supply bonding pad 7 via the first wiring pattern 17. Others are the same as in the first embodiment. Also in this example, the same effect as that of the first embodiment can be obtained.

Example 5 The electronic component mounting substrate of this example is a laminate of insulating base materials 913 and 914 as shown in FIG. 7, and the first wiring pattern 170 is provided inside the electronic component mounting substrate. ing.
That is, the electronic component mounting substrate has a lower insulating base material 914 provided with the electronic component mounting portion 95 on the surface 91, and an opening 955 larger than the opening of the electronic component mounting portion 95.
And the insulating base material 913 on the upper side.

The electronic component mounting portion 95 and the opening 955 are provided.
Bonding pads 70 and 71 are provided on the periphery of the. A circular through hole 1 is formed in the outer edge portion 92 of the insulating base materials 913 and 914. The bonding pads 70 and 71 and the through-hole 1 are connected via the first wiring patterns 170 and 171 respectively. Others are the same as in the first embodiment.

In the electronic component mounting substrate of this example, the first wiring patterns 170 and 171 are formed into two layers of insulating base materials 913 and 914.
It is located between. Therefore, the first wiring patterns can be arranged with higher density. Also in this example, the same effect as that of the first embodiment can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic component mounting board according to a first embodiment.

FIG. 2 is a partial plan view of the electronic component mounting board according to the first embodiment.

FIG. 3 is a partial rear view of the electronic component mounting board according to the first embodiment.

FIG. 4 is a partial rear view of the electronic component mounting board according to the second embodiment.

FIG. 5 is a partial rear view of the electronic component mounting board according to the third embodiment.

FIG. 6 is a cross-sectional view of an electronic component mounting board according to a fourth embodiment.

FIG. 7 is a cross-sectional view of an electronic component mounting board according to a fifth embodiment.

FIG. 8 is a partial cross-sectional view of a conventional electronic component mounting substrate.

FIG. 9 is a partial plan view of a conventional electronic component mounting board.

FIG. 10 is a rear view of a conventional electronic component mounting substrate.

[Explanation of symbols]

1, 10, 11, 101, 102. ． ． Through through hole, 12, 120. ． ． Second wiring pattern, 17, 170, 171. ． ． First wiring pattern, 2. ． ． External terminal, 7. ． ． Bonding pad, 9, 910, 911, 912, 913, 914. ． ． Insulating base material,

Claims (1)

[Claims] 1. An insulating base material having an electronic component mounting portion on its surface, bonding pads provided around the electronic component mounting portion, external terminals provided on the back surface of the insulating base material, and an outer edge portion of the insulating base material. And a first wiring pattern for connecting the bonding pad and the through through hole, and a second wiring pattern for connecting the through through hole and the external terminal. Substrate for mounting electronic components.