JPH05164913A - Electrodeposition substrate, production of electrodeposition substrate and production of color filter by using electrodeposition substrate - Google Patents

Abstract

PURPOSE:To produce a color filter by using the electrodeposition substrate which enables the production of colored picture elements with arbitrary disposition. CONSTITUTION:A circuit for electrodeposition which energizes electrodeposition parts 22 of colored layers of the same display color and is not electrically connected to the electrodeposition parts of the colored layers of the other display colors is provided on an electrical insulating substrate 11 surface. An optical semiconductor layer 16 formed by dispersing a photoconductive material into a resin is provided on the circuit for electrodeposition. A light shieldable insulating film 17 exclusive of a conductive juncture 18 between the circuit for electrodeposition and the electrodeposition part of the colored layer is formed on the optical semiconductor layer 16. The optical semiconductor layer 16 is exposed (20) with the light shieldable insulating film 17 as a mask to conduct the conductive juncture 18, thereafter the colored substrate formed with the colored layer on the conductive film formed on the light shieldable insulating film 17 is subjected to the repetition of the operation to electrochemically electrodeposit the colored layer in the electrodeposition bath of the coloring material dispersed with pigments and high-polymer materials for each of the respective colors and thereafter the colored layers are simultaneously transferred to the color filter substrate surface, by which the color filters are produced. The high-quality color filters which are arbitrarily disposed without being restricted to the stripe shape alone are produced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a color filter for liquid crystal, and more particularly to an electrodeposition substrate for producing a color filter and a method for producing a color filter using the electrodeposition substrate.

[0002]

2. Description of the Related Art There are various color display methods for liquid crystal display devices for color televisions and computers, but generally, there are many methods such as red (R), green (G) and blue (B) on a transparent substrate. Color filters in which color pixels are regularly arranged are used.

As a method for producing a color filter, a dyeing method in which a transparent resin is dyed with a dye, a pigment dispersion method in which a coloring pigment is dispersed in a transparent resin or a transparent photosensitive resin and exposed and developed, and a printing ink is used. There is a printing method for printing pixels of each color.

The dyeing method can obtain a high quality product excellent in hue, but since the dye is used, the heat resistance and the light resistance are inferior, and the photolithography technique and the dyeing technique are used for the production, There is a problem that the manufacturing process is complicated and expensive. Therefore, at present, the pigment dispersion method, which is excellent in heat resistance and light resistance, is mainly used in the production of color filters for liquid crystal display devices. There is a problem that the yield is low and the manufacturing price is high. On the other hand, although the printing method was expected to be simple in process and can be manufactured at the lowest cost, a thin film transistor (TF), which is the mainstream of liquid crystal display devices for computers, cannot be obtained with sufficient accuracy.
In addition to being unsatisfactory for the T) type liquid crystal display device,
There is a problem of low product yield.

[0005]

On the other hand, in order to solve these problems, the film thickness can be easily adjusted by the amount of electricity to be applied, and the process of forming a colored pixel having a high film precision is relatively simple. The electrodeposition method obtained by is proposed. The electrodeposition method is a method in which a pigment, which is a component of a colored pixel of a color filter, is dispersed together with an ionic polymer substance on a glass substrate having a transparent electrode and electrochemically electrodeposited, or a substrate different from the substrate for the color filter. Many methods have been proposed, such as an electrodeposition transfer method in which a colored layer is electrodeposited thereon and then transferred onto a glass substrate for a color filter.

In the electrodeposition transfer method, a circuit for electrodepositing each color component of the color filter is previously provided on the surface of the electrodeposition substrate, and the circuit is selectively connected to an external power source for each color as shown in FIG. Corresponding by electrochemically electrodepositing the coloring material only in the target area using the insoluble electrode as the counter electrode in the electrodeposition tank in which the wearing pigment and the polymer substance are dispersed, and then connecting other circuits to the external power source. It is considered that the method of manufacturing the color filter by electrodepositing the colored layers of all colors of the color filter and then collectively transferring to the glass substrate to manufacture the color filter by repeating the process of electrodepositing the colored layer is most preferable from the manufacturing process. ..

However, the color filter that can be produced by this method is only a so-called stripe type color filter in which colored pixels of each color are arranged in parallel in a line.
In the stripe type filter, since the pixels are arranged linearly, the wiring of the electric circuit for electrodeposition can be realized only by forming it on a plane. Wiring an electric circuit is difficult.

That is, a TFT type or other active matrix structure has been widely adopted, and a staggered pattern or a complicated mosaic pattern has been required as an array of colored pixels of a color filter. In this case, the circuit wiring for supplying the current to the area where the colored pixel of the target color filter should be electrodeposited cannot be realized by a flat wiring, and various arrangements necessary for the TFT type or the like are required. The formation of colored pixels has not been realized.

[0009]

In the electrodeposition substrate of the present invention and the method of manufacturing a color filter using the same, a three-dimensional wiring is formed in order to realize a mosaic pattern or other complicated arrangement of colored pixels. It proposes a novel substrate and a method for manufacturing a color filter using the substrate.

That is, in the electrodeposited substrate of the present invention, the electrodeposited portion of the colored layer of the same display color is energized on the surface of the electrically insulating substrate, and the electrodeposited portion of the colored layer of another display color is electrically connected. Has an electro-deposition circuit which is not connected to the substrate, has a photo-semiconductor layer made of a resin and a photo-conductive substance such as zinc oxide on the surface of the substrate on which the electro-deposition circuit is formed, and forms a predetermined pattern on the photo-semiconductor layer Having a conductive connection portion for conductively connecting the electrodeposition circuit of the colored layer and the electrodeposition portion of the colored layer obtained by metalizing by reducing the zinc oxide in the exposed portion after exposure using the electrically insulating light-shielding layer as a mask,
The electrodeposited substrate is characterized in that a conductive film is formed on the electrodeposited portion of the colored layer.

Further, in the method for producing a color filter of the present invention, the conductive coating of the electrodeposition portion of the colored layer of the electrodeposition substrate is energized from the electrodeposition circuit to form one electrode, and the insoluble electrode is used as a counter electrode for the coloring material. A colored layer is electrodeposited on a conductive film corresponding to each colored pixel in a dispersed electrodeposition bath, and this operation is repeated for each color, and then each colored pixel is transferred to the transparent substrate surface for the color filter. This is a method of manufacturing a color filter.

In the method of the present invention, a conductive memory formed by exposing an optical semiconductor containing zinc oxide or the like as a main component is used, and the behavior of electrons in the exposed portion is used to form a wiring having a three-dimensional structure. This is to obtain an electrodeposition substrate. The substrate of the present invention has an extremely simple structure by utilizing the optical semiconductor characteristics, and a three-dimensional electrodeposition circuit can be manufactured quickly and easily.

The electrodeposited substrate of the present invention and the method of manufacturing a color filter using the same will be described below with reference to the drawings. FIG. 1 is a diagram illustrating an electrodeposited substrate for producing a color filter for a mosaic type filter of the present invention.

Each colored pixel of the color filter is partitioned by a black matrix having a light-shielding property. Correspondingly, the electrodeposited substrate for manufacturing a color filter is partitioned into colored units 1 corresponding to each pixel. R, G, B on the surface of electrodeposited substrate
The red wiring 2, the green wiring 3, and the blue wiring 4 are formed so that each of them can be electrodeposited independently. In order to form a conductive connection between each wiring and the coloring unit, a conductive connection portion 5,
6 and 7 are formed. In the example of FIG. 1, three wirings for red, green, and blue are arranged in one coloring unit, and the coloring layer connecting portion 5 is provided on the wiring corresponding to the display color to be formed. Has been. Further, a plurality of wirings for the same color are connected to the respective bus bars 8, 9 and 10 so that they can be energized collectively from an external power source for each color. As described above, in the method of the present invention, wiring is performed using the lower layer portion of the coloring unit, and it is possible to energize the colored pixels in an arbitrary arrangement by the three-dimensional wiring.

FIG. 2 is a cross-sectional view showing a process for producing an electrodeposited substrate for producing a color filter of the present invention and a process up to electrodeposition of a colored layer. Wiring is performed on the surface of the electrically insulating substrate 11 with a normal conductive material. Epoxy resin-based printed circuit board, polyester film,
A film substrate such as a polycarbonate film or a polyamide film, glass, ceramics, or the like can be used, but a material having a light-shielding property and having a small thermal or mechanical stretchability is preferable. In consideration of the final transfer operation, a member that retains flexibility and has high mechanical strength is desirable. For example, a metal plate such as stainless steel or amber having a low coefficient of linear expansion is used, and the member is not affected by the electrodeposition bath. It may be a substrate which is covered with a non-insulating film and on which a conductive member for wiring is formed. Copper, nickel, chromium, iron, aluminum and other metals or their alloys as conductive members,
A conductive oxide film or the like is used, and a vapor deposition film or a laminated film is used. The wiring of the conductive member is formed by forming a wiring pattern by ordinary photolithography or printing and then etching.

Wiring is processed by the red wiring 1 as shown in FIG.
Two wirings for the green wiring 13, the green wiring 13, and the blue wiring 14 are formed so as to pass through each coloring unit 15. Next, an optical semiconductor layer 16 made of zinc oxide and synthetic resin is formed on this surface with a thickness of 3 to 30.
It is formed by coating and drying to a thickness of μm (FIG. 2 (B)).

The photo-semiconductor layer 16 is roller-coated or bar-coated by kneading zinc oxide, which is an N-type photo-semiconductor used in the field of electrophotography, with an electrically insulating resin by adding a suitable organic solvent. It was applied by screen printing, etc. and dried. As the electrically insulating resin, a resin used for an electrophotographic recording material using zinc oxide can be used, and examples thereof include alkyd resin, styrene-butadiene copolymer resin, acrylic resin, epoxy resin, polyimide resin, and styrene-butadiene. Copolymer resin, acrylic resin, epoxy resin, polyimide resin and the like are preferable.

Further, in order to increase the photosensitivity of zinc oxide, rose bengal, bromphenol blue, patent blue or the like may be added as a sensitizer.

Next, a light-shielding insulating film 17 made of a photosensitive resin is formed on the optical semiconductor layer 16 and exposed 20 through a photomask 19 having a conductive connecting portion 18 (FIG. 2).
(C)). The pattern of the photomask may be a transparent glass, a synthetic resin film or the like on which a black and white image is formed with a photographic emulsion, or a thin film of chromium or the like used for manufacturing a semiconductor device. Further, in order to form a pattern on the light-shielding insulating film, a photoresist pattern obtained by applying a photoresist on the light-shielding insulating film, exposing it with a photomask on which a pattern is drawn, and then developing it is used. The photoresist may be removed after etching is performed. Further, the light-shielding insulating film having a pattern may be formed by a printing method instead of photolithography. Next, using the light-shielding insulating film 17 having the pattern as a mask, the optical semiconductor layer 16 is formed.
The conductive connection portion 18 is exposed 20 (FIG. 2D).

In order to accurately form the conductive connection portion at a corresponding position of the wiring in the colored pixel, it is necessary to accurately form the conductive connection portion by a positioning method or the like which is performed in a normal photolithography process.

The non-exposed portion of the photosemiconductor layer on the conductive substrate is electrically insulating, but the exposed portion becomes conductive due to a decrease in electrical resistance, and the photosemiconductor retains conductivity even after the exposure is stopped. The conductive memory is formed. Then, it exhibits a chemical reducing property by the action of the electrons forming the conductive memory, and when the photosemiconductor layer is further used as a cathode in the aqueous solution containing the easily reducing substance, the easily reducing substance can be reduced and deposited. .. On the other hand, it is known that in a solution containing no easily reducing substance, the zinc oxide itself in the exposed portion of the optical semiconductor is reduced by energization to release metallic zinc and turn black. The electro-developing method in electrophotography is an image forming method utilizing a phenomenon in which photoelectrons are generated only in the surface layer portion to which light reaches upon exposure, and metallic zinc in the photo semiconductor layer in the surface layer portion is released.

When the zinc oxide photosemiconductor layer on which the conductive memory is formed is used as a cathode in an electrolytic solution such as an aqueous solution of sodium dodecylsulfate or an aqueous solution of sodium carbonate, and an insoluble anode is used as an anode to perform electrolysis, metallic zinc is originally formed. It was found that the zinc oxide was reduced to a depth where it would not be liberated and turned into zinc metal to become black, and the reduced zinc reached the conductive substrate surface by sufficient development.
For this reason, the electrical resistance of the developed exposed area is significantly reduced,
The low electrical resistance as a result of the formation of metallic zinc can be retained permanently. In this case, the current can be passed in either direction because it is not the N-type semiconductor but the metal layer.

In this way, the zinc metal layer was partially formed by reduction of zinc oxide to form the conductive connection portion 21 with the colored layer as shown in FIG. 2 (E). Next, a conductive thin film made of a metal, an alloy or a conductive oxide is formed on the surface of the optical semiconductor layer by vapor deposition and electroless plating, and an electrodeposition portion 22 corresponding to the colored pixel is formed by etching using the pattern of the colored pixel. In the electrodeposition tank in which the pigment and the polymer substance are dispersed, the obtained electrodeposition surface is used as a cathode and the insoluble electrode is used as an anode, and current is applied to each colored layer 23, 24, 25.
Are formed (FIG. 2 (F)). For electrodeposition, a cation type electrodeposition material is generally preferable, but an anion type electrodeposition material may be used to perform electrodeposition as an anode.

A color filter is obtained by transferring the electrodeposited colored pixels onto the substrate surface of a color filter such as a transparent glass substrate.

FIG. 3 is a sectional view of the obtained color filter. When the electrodeposited colored layer is transferred to the glass substrate 31, a black matrix 32 is previously formed on the surface of the glass substrate 31, and colored pixels 33, 34 and 35 transferred from the electrodeposited substrate are formed. Black matrix has light-shielding metal such as chromium and tungsten,
It is possible to use a material formed of a synthetic resin such as polyamide in which a light-shielding pigment such as carbon black or ferrosoferric oxide is dispersed, and it may be produced by any method such as photolithography technology and printing technology. ..

When the colored layer is transferred to the color filter substrate on which the black matrix is formed, it can be transferred as it is if the colored layer on the substrate surface has adhesiveness.
If the adhesiveness is weak or not adhesive, an adhesive or an adhesive may be applied to the transfer surface of the glass substrate for adhesion. As the adhesive used for adhesion between the color filter substrate and the colored layer, it is preferable to use a photo-curable or thermosetting adhesive for quick curing.

When the colored layer and the electrodeposited surface have a strong adhesive force and are difficult to peel off, it is preferable to treat the electrodeposition surface with a release agent before electrodeposition. As the release agent, a silicone release agent and other commercially available products can be used. It is also possible to treat with an inorganic stripping solution such as chromate.

In order to further improve the peelability, it is also effective to form a metal layer having good peelability on the electrodeposited surface and then polish the surface to form a smooth surface. Further, in order to remove the unevenness of the electrodeposition surface caused by the step formed between the conductive connection portion and the light-shielding insulating film, after the conductive connection portion of zinc is formed, the conductive connection portion is made of a metal such as copper. It is also possible to form an electrodeposited surface after deposition and then to obtain a sufficiently smooth surface by polishing or the like.

A protective layer made of a transparent synthetic resin composition is formed on the colored layer transferred onto the color filter substrate, and the surface of the protective layer is smoothed by polishing or the like, and then an ITO film for driving a liquid crystal or the like is formed. A color filter is completed by forming a transparent electrode film.

The electrodeposited substrate for producing a color filter, in which the electrodeposited colored layer is transferred to the color filter substrate, can be used again for producing the same kind of color filter, and thus can be used repeatedly a number of times. Therefore, after the production of the electrodeposition substrate for producing a color filter, only the electrodeposition and transfer of the colored layer need be repeated, which is suitable for mass production of color filters.

[0031]

Since the electrodeposited substrate of the present invention has a three-dimensional wiring formed therein, if it is used for manufacturing a color filter, not only stripe-shaped colored pixels but also colored pixels arranged in a mosaic pattern should be formed. It is also possible to easily manufacture a large area color filter.
In addition, since the electrodeposited substrate can be used repeatedly, it is possible to manufacture a high-quality color filter at a low cost as compared with the conventional method that makes heavy use of photolithography technology. It can also be used to manufacture a multi-layer substrate having fine wiring.

[0032]

【Example】

Example 1 An adhesive was used as a single-sided conductive film in which a thin copper film was formed on one surface of a polyester film having a thickness of 0.25 mm on a smooth stainless plate surface having a size of 300 × 300 mm and a thickness of 0.1 mm. Glued together. Next, a resist pattern for electric wiring for colored pixels of three colors of R, G, and B as shown in FIG. 1 was provided by a normal photolithography method, and etching processing was performed using a ferric chloride aqueous solution.

The wiring specifications are as follows.

Electrodeposition effective area (for 10.4 inch panel: 158.4 × 211.2 mm) Number of pixels: 640 × 480 R, G, B size of each pixel: 330 μm × 110 μm Line width of black matrix: 30 μm In-pixel wiring width: 70 μm (divided in the direction of 330 μm) Distance between wiring lines: 22.5 μm In the portion where the wiring of the colored pixel and the busbar intersect with other colored pixels or busbars, the planar wiring lines are in contact with each other and conductive connection is made. Since it is formed, after forming the wiring of the lower layer at the intersecting part, the insulating material is applied by screen printing and then the conductive ink (copper paste) is printed on the upper part of the wiring to form the other wiring. So that no electrical connection is made.

In order to prevent electrodeposition on the wiring in the non-electrodeposition area of the substrate surface, a negative photosensitive resin (OM
R: Tokyo Ohka Kogyo Co., Ltd. (trade name) is applied to a thickness of 1 μm, and contact exposure is carried out by using the pattern in which the effective area portion and the electrode lead portion of the above specifications are black as a mask, and development, drying according to the specified prescription, After baking, a zinc oxide photosemiconductor layer having the following composition was applied with a wire bar to a thickness of about 15 μm and dried.

(Photosemiconductor coating liquid composition) Zinc oxide fine powder for electrophotography 80 g Epoxy resin (one-component curing type) 20 g Sensitizer (rose bengal) Trace amount solvent (xylene) 100 ml These are mixed and dispersed by ultrasonic waves. And make a paste.

Next, a photosensitive resin (OMR) to which a black pigment is added to provide light-shielding properties is uniformly applied to a thickness of about 2 mm and dried, and each colored pixel and red wiring, green wiring or In order to form a colored pixel connection portion (conductive connection portion) with the blue wiring, a photomask in which a colored pixel connection portion having a diameter of 40 μm is drawn is used, and they are brought into close contact in an accurately aligned state and a mercury lamp is used. After exposure, development and drying, 3 at 120-160 ℃
Post-baking was performed for 0 minutes to form a light-shielding insulating film in which the resist was not present only in the conductive connection portion. Then, the obtained light-shielding insulating film was used as a mask and exposed with a 100 W tungsten light bulb for 10 seconds, and then electrolytic development was performed in the following electrolytic solution.

(Electrolyte solution) Sodium carbonate 150 g Sodium dodecyl sulfate 16 g Water 10,000 ml (electrolysis conditions) Counter electrode platinum plate Electrode distance 3 cm Electrolysis voltage 5 V Electrolysis temperature 20 ° C. Electrolysis time Exposure of zinc oxide layer by 10 seconds or more The part was blackened and the part was conductive.

Then, after sufficiently washing with water and drying, nickel is vacuum-deposited to a thickness of 200 nm on the conductive connection portion and the light-shielding insulating film, and then a resist pattern is formed using a photomask on which a pattern of each pixel is drawn. Etching was performed to form electrodeposition portions of red, green, and blue colored pixels, and a color filter electrodeposition substrate was completed. For electrodeposition of colored pixels by this electrodeposition substrate, the stainless steel surface was covered with an insulating coating film, and then the following bath was used. In order to facilitate the transfer operation after electrodeposition, a commercially available silicone-based stripping solution (KF410, manufactured by Shin-Etsu Chemical Co., Ltd.) is diluted on the electrodeposited portion of nickel to such an extent that the conductivity of nickel is not diminished. A treatment of coating and drying was performed. (Electrodeposition bath composition) Acrylic resin 50 parts Ethyl cellosolve 25 parts Isopropyl alcohol 3 parts Sulfuric acid 1.5 parts Pigment 15 parts (Pigment red for red electrodeposition solution, phthalocyanine green for green electrodeposition solution, blue electrodeposition) For the landing liquid, 800 parts of phthalocyanine blue) water, an acrylic resin, ethyl cellosolve and a pigment were mixed and kneaded with a ball mill until the pigment particles became finer to 0.2 μm or less, and then the above composition was stirred and prepared.

Next, an insulating coating is applied to the back surface of the electrodeposition substrate for producing the color filter, the bus bar for red is connected to the power supply for electrodeposition, the electrodeposition substrate is used as the cathode, and the platinum electrode is used as the counter electrode for the red electrode. It was electrodeposited in the electrodeposition bath. The electrodeposition starts from the initial voltage of 20V, and the electric resistance increases with the increase of the electrodeposition film thickness, and the current stops flowing. Therefore, the voltage is gradually increased to continue the electrodeposition, and when the voltage is increased to 80V, the thickness of 2 μm The red colored layer was electrodeposited. After washing with water and drying, heat treatment was performed at 150 ° C. for 30 minutes to obtain red colored pixels.

Then, similarly to the electrodeposition of the red colored layer,
A 2 μm thick green and blue colored layer was electrodeposited.

Next, a photocurable adhesive (acrylic resin-based adhesive Toho Kasei Co., Ltd. H on a glass substrate having a black matrisk made of chromium metal having a thickness of 150 nm)
(I-LOLK UV500L) is evenly spin-coated to a thickness of 2 μm, and the substrate on which the colored layer is electrodeposited is then adhered, and the glass plate surface is irradiated with ultraviolet rays to cure the adhesive, and then the electrodeposited substrate is applied. When peeled off carefully, the colored layer is transferred to the glass substrate side to form a color filter.
The colored pixels of the obtained color filter slightly overlap the black matrix on the glass surface, and the gaps between the colored pixels are completely covered by the black matrix.

A photocurable resin composition (photosensitive polyimide resin) for the protective layer is applied to the colored pixels of each color on the surface of the glass plate in a uniform thickness and UV-cured. Finally, an ITO film was formed on the protective layer by sputtering to complete a liquid crystal color filter. On the other hand, the electrodeposited substrate after peeling off the electrodeposition layer can be used again for the next electrodeposition,
The above operation was repeated and could be used many times.

Example 2 In the process for producing an electrodeposited substrate of Example 1, after the stacked state of the zinc oxide layer having the conductive connection portion and the light-shielding insulating film was completed, the gap between the conductive connection portion and the light-shielding insulating film was completed. In order to remove the level difference, copper plating was performed only on the conductive connection portion to a thickness of about 2 μm. Copper plating was performed under the following conditions.

(Copper Plating Bath) Copper Sulfate (CuSO ₄ .5H ₂ O) 240 g / l Sulfuric Acid (H ₂ SO ₄ Specific Gravity 1.83) 35 g / l Liquid Temperature 20 ° C. Current Density 5 A / dm ² Shielded by Copper After the conductive insulating film surface and the conductive connection portion were made to be the same surface, an electroless copper plating film was formed under the following conditions.

(Sensitizer) Stannous chloride (SnCl ₂ · 2H ₂ O) 20 g / l Hydrochloric acid (HCl · 35%) 15 m / l Liquid temperature 30 ° C. (activator) Palladium chloride (PdCl ₂ ) 0.2 g / l Hydrochloric acid (HCl / 35%) 2m / l Liquid temperature 30 ° C (electroless copper plating bath) Copper sulfate (CuSO ₄ / 5H ₂ O) 5g / l Rochelle salt (KNaC ₄ H ₄ O ₆ ) 25g / l Formalin (HCHO) ) 10 g / l Sodium hydroxide (NaOH) 7 g / l Liquid temperature 20 ° C.

Next, the copper is plated using the above copper plating bath so that the total thickness of the copper is about 10 μm, and is then mirror-finished by rough polishing and buff polishing to obtain a smoothness of 0.1 to 0.1 μm.
After finishing to 0.2 μm, nickel plating was performed under the following conditions to perform nickel plating with a thickness of 2 μm.

[0048] (nickel plating bath composition) nickel sulfate _{(NiSO 4 · 6H 2 O)} 250g / l nickel chloride _{(NiCl 2 · 6H 2 O)} 45g / l boric acid _{(H 3 BO 3) 35g /} l liquid temperature 30 ° C. Current Density 5 A / dm ² Then, a photosensitive resin (OMR: trade name of Tokyo Ohka Kogyo Co., Ltd.) is used to form a resist pattern using a photomask in which a pattern of each pixel is drawn, and then etching is performed to form an electrodeposited surface. Formed. Since a height difference of about 12 μm is formed between the non-electrodeposition surface, which is an insulating part that separates the electrodeposition surface, and the electrodeposition surface, an insulating paint mixed with a white pigment in epoxy resin is filled. Then, it was squeegeeed with a doctor blade and then cured, and the surface was buffed to remove the height difference between the two and to clean the electrodeposited surface.

By the above operation, a color filter electrodeposition substrate having a smooth surface was completed. Using this electrodeposited substrate, colored pixels of R, GB color filters were sequentially electrodeposited in the same manner from the electrodeposition baths of R, G, B colors according to the method described in Example 1 to form a black matrix. A color filter was prepared by transferring and adhering to a glass substrate using a photocurable acrylic adhesive. The transferred color filter surface was a very smooth surface, and a product of better quality than that of Example 1 was obtained. The electrodeposited substrate after transfer was used repeatedly, but the repeatability was much improved.

[0050]

According to the present invention, since the electric wiring for electrodeposition to the electrodeposition substrate is three-dimensionally formed by the conductive portion formed in the optical semiconductor layer made of zinc oxide, it is possible to use the electrodeposition substrate. Not limited to striped color filters,
It is possible to manufacture a color filter having an arbitrary arrangement such as a mosaic shape by electrodeposition, and a high quality color filter can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an electrodeposited substrate for producing a color filter of the present invention.

FIG. 2 is a cross-sectional view showing a process for producing an electrodeposited substrate for producing a color filter of the present invention and a process up to electrodeposition of a colored layer.

FIG. 3 is a cross-sectional view of a color filter.

FIG. 4 is a diagram illustrating an electrodeposition method.

[Explanation of symbols]

1 ... Coloring unit, 2 ... Red wiring, 3 ... Green wiring, 4 ... Blue wiring, 5, 6, 7 ... Conductive connection part, 8, 9, 10 ... Busbar,
11 ... Electrically insulating substrate, 12 ... Red wiring, 13 ... Green wiring, 14 ... Blue wiring, 15 ... Coloring unit, 16 ... Optical semiconductor layer, 17 ... Light-shielding insulating film, 18 ... Conductive connection part, 19 ... Photomask, 20 ... Exposure, 21 ... Conductive connection part, 22 ... Electrodeposition part, 23, 24, 25 ... Colored layer, 31 ... Glass substrate,
32 ... Black matrix, 33, 34, 35 ... Colored pixels

Claims (7)

[Claims] 1. An electrodeposited substrate formed on the surface of an electrically insulating substrate, wherein a plurality of electrodeposition circuits that are not electrically connected to each other are provided on the substrate surface, and a photoconductive material is provided on the electrodeposition circuit. And an optical semiconductor layer with a resin, the optical semiconductor layer has a conductive connection portion between the electrodeposition circuit and the electrodeposition portion made conductive by exposure and development, on the optical semiconductor layer with the electrodeposition circuit An electrodeposition substrate having a light-shielding insulating film formed excluding the conductive connection portion, and having an electrodeposition portion electrically connected to an electrodeposition circuit on the light-shielding insulating film. 2. The photoconductive material is zinc oxide, and the conductive connection portion is metallized zinc.
The electrodeposited substrate described. 3. The electrodeposition according to claim 1, wherein the electrodeposition part is divided into a plurality of parts by the non-electrodeposition part, and the surfaces of the electrodeposition part and the non-electrodeposition part are on the same plane. substrate. 4. A method of manufacturing an electrodeposited substrate formed on the surface of an electrically insulating substrate, wherein a plurality of electrodeposition circuits that are not electrically connected to each other are formed on the surface of the substrate, and then a photoconductive substance is applied to the resin. A photo-semiconductor layer dispersed on the photo-conductor layer, a light-shielding insulating layer is formed on the photo-conductor layer except for a conductive connection portion with an electrodeposition circuit, and the photo-semiconductor layer is exposed using the light-shielding insulating layer as a mask After the conductive connection part of the optical semiconductor layer is made conductive by development, a conductive film is formed on the light-shielding insulating film, the conductive film is then divided into a plurality of parts, and a non-contact part is formed between the electrodeposition parts. A method for manufacturing an electrodeposited substrate, which comprises forming an electrodeposited portion. 5. The method for producing an electrodeposited substrate according to claim 4, wherein the surfaces of the electrodeposited portion and the non-electrodeposited portion are made flush with each other. 6. A method for producing a color filter by electrodeposition, wherein the electrodeposited portion of the colored layer of the same display color is energized on the surface of the electrically insulating substrate to define the electrodeposited portion of the colored layer of another display color. After forming an electro-deposition circuit that is not electrically connected, a photo-semiconductor layer in which a photo-conductive substance is dispersed in a resin is formed, and a light-shielding property is provided on the photo-conductor layer except for a conductive connection portion with the electro-deposition circuit. After forming an insulating layer, exposing and developing using the light-shielding insulating layer as a mask to make the conductive connection portion of the optical semiconductor layer conductive, forming a conductive film on the light-shielding insulating film, and then forming a plurality of conductive films. The electrodeposited surface of the electrodeposited substrate obtained by dividing into parts is electrochemically electrodeposited in a bath of a coloring material in which a pigment and a polymer substance are dispersed. After repeating each time, transfer the colored layer to the transparent substrate surface all at once. And a method for manufacturing a color filter. 7. The electrodeposition surface is divided into a plurality of parts by the non-electrodeposition part, and the colored layer is electrodeposited after the electrodeposition part and the non-electrodeposition part are made flush with each other. Item 7. A method for producing a color filter according to item 6.