JPH05136252A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To fix different-sized wafers without changing a wafer presser ring so as to match a wafer size by turning said wafer presser ring to a length- variable arm. CONSTITUTION:A wafer 2 is mounted on a stage 4 which is dent-shaped toward its central part and the wafer 2 is pressed and fixed with an arm which changes the length from above. More specifically, to fix a 6 inch wafer, an arm 5 is arranged to change the length proper to press the 6 inch wafer where the outer peripheral part of the wafer is vertically pressed with the stage 4 and the arm 5. On the other hand, when it is necessary to fix a 5 inch wafer, the arm 5 is arranged to change its length proper to press the 5 inch wafer. At that time, since the arm 5 is slanted to align with the dent of the stage 4, this construction prevents the arm 5 from coming into contact with the stage 4 even if the arm 5 extends its length and presses the outer periphery of the wafer 2 vertically with the stage 4 and the arm 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to an apparatus for holding a wafer.

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus has a structure as shown in FIGS. That is, in FIG. 6, 1 is a stage for mounting a conventional wafer having a shape recessed toward the center, 2 is a wafer, and 3 is a ring for holding the wafer. However, in the conventional semiconductor manufacturing apparatus, when the wafers of different sizes are fixed, the size of the ring 3 is determined by the size of the wafer. Therefore, the ring 3 matching the size of the wafer must be replaced. I had a problem that didn't happen. For example, in FIG. 6, if the wafer 2 is changed from a 6-inch wafer to a 5-inch wafer, the inner diameter of the ring 3 is larger than the 5-inch wafer, so that the wafer cannot be fixed. Further, the outer periphery of the ring 3 cannot contact the stage 1 to fix the wafer.

[0003]

However, the conventional semiconductor manufacturing apparatus has a problem that the ring for pressing the wafer for fixing the wafer is replaced according to the size of the wafer. Therefore, the present invention solves such a conventional problem, and an object thereof is to fix the wafers in different sizes.

[0004]

A semiconductor manufacturing apparatus of the present invention is a semiconductor manufacturing apparatus in which a wafer is placed on a stage having a shape recessed toward the center and is fixed by a ring for pressing the wafer from above, instead of the ring. It is characterized by having an arm for holding a wafer whose length is changed to.

[0005]

In the semiconductor manufacturing apparatus configured as described above, the arm for holding a wafer whose length changes can be fixed by adjusting the length and contacting the outer periphery of the wafer from above and below to fix wafers of different sizes. .. Further, since the arm is tilted according to the recess of the stage having a recessed shape toward the center, the wafer can be fixed without the arm coming into contact with the stage even if the length of the arm becomes long.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an essential part showing an embodiment of a semiconductor manufacturing apparatus of the present invention, in which 2 is a wafer, 4 is a stage on which a wafer having a shape recessed toward the center is placed, and the central hole is It is a hole for feeding cooling gas. Reference numeral 5 is an arm for holding the wafer of the present invention. FIG. 2 is a sectional view of essential parts showing an embodiment of the semiconductor manufacturing apparatus of the present invention. Figure 2
When the wafer 2 is a 6-inch wafer and the arm 5 is a length of an arm that holds the 6-inch wafer, the outer peripheral portion of the wafer 2 can be pressed and fixed by the stage 4 and the arm 5 from above and below. Further, when the wafer 2 has a length of 5 inch wafer and the arm 5 has a length of an arm that holds the 5 inch wafer, the arm is tilted according to the recess of the stage having a recessed shape toward the center. Even if the length of the arm becomes long, the outer peripheral portion of the wafer 2 can be pressed and fixed by the stage 4 and the arm 5 from above and below without the arm coming into contact with the stage.

FIG. 3 is a plan view of an essential part showing an embodiment of the semiconductor manufacturing apparatus of the present invention. In FIG. 3, 4 is a stage on which a wafer having a shape recessed toward the center is placed, 6 is an arm for holding the wafer of the present invention, and 7 is a wafer. In FIG. 3, when the wafer 7 is a 4-inch wafer and the arm 6 is a length of an arm that holds the 4-inch wafer,
The outer periphery of the wafer 7 is connected to the stage 4 and the arm 6.
It can be fixed by pressing from above and below. In addition, the wafer 7
Is a 5-inch wafer and the arm 6 is a length of an arm that holds the 5-inch wafer, the arm is inclined in accordance with the recess of the stage having a shape recessed toward the center. Even if the length becomes short, the outer peripheral portion of the wafer 7 can be pressed and fixed from above and below by the stage 4 and the arm 6 without the arm coming into contact with the stage.

FIG. 4 is a plan view of an essential part showing an embodiment of the semiconductor manufacturing apparatus of the present invention. In FIG. 4, 2 is a wafer, 4 is a stage on which a wafer having a shape depressed toward the center is placed, and 8 is an arm for holding the wafer of the present invention.
In FIG. 4, when the wafer 2 is a 6-inch wafer and the arm 8 is a length of an arm that holds the 6-inch wafer, the outer peripheral portion of the wafer 2 can be pressed and fixed by the stage 4 and the arm 8 from above and below. Further, when the wafer 2 has a length of 5 inch wafer and the arm 8 has a length of an arm that holds the 5 inch wafer, the arm is tilted according to the recess of the stage having a recessed shape toward the center. Even if the length of the arm is shortened, the outer peripheral portion of the wafer 2 can be pressed and fixed from above and below by the stage 4 and the arm 8 without the arm coming into contact with the stage.

The embodiment of the present invention has been described above with reference to the drawings.
I explained an example. However, the present invention is not limited to this, and it goes without saying that the present invention can be realized by having an arm for pressing a wafer of varying length instead of a ring for pressing the wafer.

[0010]

As described above, according to the present invention, the ring for pressing the wafer is used as the arm for fixing the wafer whose length is changed. Contact can be made to fix different size wafers. Further, since the arm is tilted according to the recess of the stage having a recessed shape toward the center, the wafer can be fixed without the arm coming into contact with the stage even if the length of the arm becomes long.

[Brief description of drawings]

FIG. 1 is a plan view of a main part showing an embodiment of a semiconductor manufacturing apparatus of the present invention.

FIG. 2 is a sectional view of essential parts showing an embodiment of a semiconductor manufacturing apparatus of the present invention.

FIG. 3 is a sectional view of essential parts showing an embodiment of a semiconductor manufacturing apparatus of the present invention.

FIG. 4 is a sectional view of essential parts showing an embodiment of a semiconductor manufacturing apparatus of the present invention.

FIG. 5 is a plan view of a main part showing a conventional semiconductor manufacturing apparatus.

FIG. 6 is a cross-sectional view of essential parts showing a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

1 ... Stage on which a wafer having a shape recessed toward the center is mounted 2 ... 6-inch wafer 3 ... Ring for holding a conventional 6-inch wafer 4 ... Shape recessed toward the center The stage on which the wafer is mounted 5 ... An arm for pressing a wafer whose length changes according to the present invention 6 ... An arm for pressing a wafer whose length changes according to the present invention 7 ... Wafer 8 ... A length according to the present invention The arm that holds the changing wafer

Claims (1)

[Claims] 1. A semiconductor manufacturing apparatus in which a wafer is placed on a stage having a shape recessed toward the center and is fixed by a ring for pressing the wafer from above, and an arm for pressing a wafer whose length is changed is provided instead of the ring. Characteristic semiconductor manufacturing equipment.