JPH05115436A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To provide the solid-state image pickup device which can attain high density or miniaturization by enlarging a mounting area of a flexible substrate without enlarging an external form size. CONSTITUTION:In an expansion state, a cylindrical flexible substrate is formed by loading an IC 4 and passive parts 5 on cross-shaped substrate parts 3a, 3b, 3c and 3d, and bending them so as to be opposed along a bend part, an inner lead 10 provided in one end of the substrate part 3a is stuck to a pad part of a solid-state image pickup element 1 in which a transparent member 2 is stuck to a photodetecting area, and one end of other substrate parts 3b, 3c and 3d is stuck to the face of the solid-state image pickup element 1 with an adhesive agent 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device used as a microminiature image pickup means arranged in a minute portion such as a tip portion of an electronic endoscope.

[0002]

2. Description of the Related Art In recent years, various electronic endoscopes have been proposed which use a solid-state image pickup device including solid-state image pickup devices such as CCD, SIT, and CMD as an image pickup means. The solid-state imaging device used for this electronic endoscope is incorporated in the tip of the endoscope, but the outer diameter of the tip must be made as thin as possible in order to alleviate the pain of the patient. Therefore, how to miniaturize the solid-state imaging device has become an important issue.

Conventionally, for example, Japanese Patent Application No. 3-77964 proposes a solid-state image pickup device having a structure in which a flexible substrate connected to a solid-state image pickup device through a protruding electrode is bent into a U-shape. FIG. 5 is a side view of the solid-state imaging device, and FIG.
Shows a development view of the flexible substrate. In the figure, 101
Is a solid-state image sensor, which has a pad portion on one side of the light-receiving surface, and a transparent member 102 such as a color filter is bonded to the light-receiving region with a transparent adhesive. And the solid-state image sensor 101
Inner lead portion 106 of flexible substrate 105 such as TAB (Tape Automated Bonding) substrate having IC 103 and passive components 104 constituting peripheral circuits of
Is bonded to the pad portion of the solid-state imaging device 101 via the protruding electrode 107. Next, the substrate 105 is attached to a solid-state image sensor.
Bending in the direction opposite to the light receiving surface of 101, sealing the peripheral portion of the transparent member 102 and the mounting portion of the IC 103 with the sealing resin 108, and further bending the substrate 105 into a U shape at the bending portion 109, Adhesive 11 is attached to the side of the solid-state image sensor 101.
0 is bonded to form a solid-state imaging device. In the drawing, 111 is an external lead wire attached to the surface of the substrate 105 with solder 112.

[0004]

However, simply U
In the above-mentioned conventional solid-state imaging device provided with a flexible substrate bent in a letter shape, since the area of the flexible substrate is small, it is not possible to secure sufficient mounting space for electronic components for peripheral circuits of the solid-state imaging device, There is a problem that there is a limit to miniaturization of the solid-state imaging device.

The present invention has been made in order to solve the above problems in the conventional solid-state image pickup device, and it is possible to increase the area of the flexible substrate without increasing the outer size to increase the density or An object of the present invention is to provide a solid-state imaging device that can achieve miniaturization.

[0006]

In order to solve the above-mentioned problems, according to the present invention, one side of a solid-state image pickup device is mounted on a flexible substrate in a state of being electrically connected through a projecting electrode. In the solid-state imaging device, the flexible substrate has a plurality of bent portions and is formed in a tubular shape.

By constructing the flexible substrate into a tubular shape in this manner, the mounting space for electronic parts and the like can be widened without increasing the external size, and the density or size can be reduced as compared with the conventional one. Can be achieved. In particular, when applied to an electronic endoscope, it is possible to realize a solid-state imaging device capable of miniaturizing the tip portion.

[0008]

EXAMPLES Next, examples will be described. FIG. 1 is a side view showing a first embodiment of a solid-state imaging device according to the present invention with a part thereof cut away, and FIG. 2 is a development view of a flexible substrate.
In the figure, reference numeral 1 is a solid-state image sensor, and a pad portion is provided on one side of its light-receiving surface, and a transparent member 2 made of glass such as protective glass, color filter, or transparent resin is bonded to the light-receiving area with a transparent adhesive. Has been done. Reference numeral 3 denotes a flexible substrate such as a TAB substrate, which is formed to have a cross shape in a developed state as shown in FIG. That is, the rectangular substrate portions 3a, 3b, 3 are vertically and horizontally extended from the base portion 3x.
c and 3d are integrally provided so as to project respectively, and ICs forming peripheral circuits of the solid-state imaging device 1 are respectively provided on the back surfaces of the substrate portions 3a, 3b, 3c and 3d.
4 and the passive component 5 are mounted. The IC 4 is mounted in a state in which the IC 4 is face-down bonded via the protruding electrode 6 and sealed with the sealing resin 7, and the passive component 5 is attached by the solder 8.

The substrate portions 3a, 3b, 3c, 3d on which the IC 4 and the passive component 5 are mounted in this manner are bent to be opposed to each other at the bending portion 9 of the base portion 3x, and are formed into a cylindrical shape. The inner leads 10 provided at the ends are connected to the pads of the solid-state imaging device 1 via the protruding electrodes 6, and the ends of the other substrate parts 3b, 3c, 3d are bonded with an adhesive 11 to form the solid-state imaging device 1. Adhesively fixed to the side of. Then, the peripheral portion of the transparent member 2 and the connecting portion between the solid-state image pickup element 1 and the inner lead 10 of the substrate 3 are sealed with the sealing resin 7 to form a solid-state image pickup device. A plurality of lead wires 12 are connected by solder 8 to the outer surface of the base of each substrate of the flexible substrate 3.

According to this embodiment, the board portions 3b and 3d of the flexible board 3 have a larger mounting space than that of the conventional board, and higher density mounting is possible. For example, it is possible to provide an electronic component and an electronic circuit for adjusting the magnitude of a drive voltage (a substrate voltage, an output gate voltage, etc.) necessary for appropriately driving the solid-state imaging device. Of course, in the above embodiment, the IC 4 may be connected by wire bonding.

FIG. 3 is a side view showing a second embodiment of the present invention with a part cut away, and FIG. 4 is a developed view of the flexible substrate thereof, showing the first embodiment shown in FIGS. Members that are the same as or correspond to those in the embodiment are designated by the same reference numerals. As shown in FIG. 4, the flexible substrate 21 in this embodiment has a shape in which the trapezoidal substrate portions 21a, 21b, 21c, and 21d are integrally formed in a fan shape in the unfolded state. It is configured to have a tubular shape by bending the mutual boundary portion as the bending portion 22.

The IC 4 and the passive component 5 are similarly mounted on the back surface of each substrate portion of the flexible substrate 21 having such a configuration, and the IC substrate 4 and the passive component 5 are bent along the bending portion 22 and formed at one end of the substrate portion 21a. The inner lead 10 is connected to the pad portion of the solid-state image pickup device 1, and the end portions of the respective substrate portions 21b, 21c, 21d are fixed to the side surfaces of the solid-state image pickup device 1 with the adhesive 11 to form the solid-state image pickup device.

In this embodiment, since the respective substrate portions constituting the flexible substrate are connected to each other, the wiring pattern on the back surface is easily routed. The flexible substrate in this embodiment may be formed by rolling the whole into a cylindrical shape without bending along the bent portion.

[0014]

As described above on the basis of the embodiments,
According to the present invention, the mounting area of the flexible substrate can be made larger than that of the conventional one, so that more electronic circuit components can be mounted with the same outer size and the function can be improved. With the same function, it is possible to achieve further miniaturization,
Particularly when applied to an electronic endoscope, the diameter of the tip can be reduced.

[Brief description of drawings]

FIG. 1 is a side view showing a first embodiment of a solid-state imaging device according to the present invention with a part cut away.

FIG. 2 is a diagram showing a developed flexible substrate of the first embodiment.

FIG. 3 is a side view showing a second embodiment with a part cut away.

FIG. 4 is a diagram showing a developed flexible substrate of a second embodiment.

FIG. 5 is a side view showing a configuration example of a conventional solid-state imaging device.

FIG. 6 is a diagram showing a developed flexible substrate of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Transparent member 3 Flexible substrate 3a, 3b, 3c, 3d Board part 4 IC 5 Passive component 6 Projection electrode 7 Sealing resin 10 Inner lead

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H04N 1/028 9070-5C

Claims (4)

[Claims] 1. A solid-state image pickup device in which one side of a solid-state image pickup device is electrically connected to a flexible substrate via a protruding electrode, wherein the flexible substrate has a plurality of bent portions. The solid-state imaging device is characterized by having a cylindrical shape. 2. The solid-state imaging device according to claim 1, wherein a semiconductor element and a passive component forming a peripheral circuit of the solid-state imaging element are mounted on the tubular flexible substrate. 3. The solid-state imaging device according to claim 1, wherein an electronic circuit component for adjusting a drive voltage of the solid-state imaging device is mounted on the tubular flexible substrate. 4. The external flexible lead electrode is provided on the surface of the tubular flexible substrate.
2. The solid-state imaging device according to any one of 1.