JPH0486805A - Production of light emitting module - Google Patents

Abstract

PURPOSE:To decrease the man-hours for adjustment and to improve the rate of conforming articles by subjecting the package of a light emitting element to outer peripheral machining. CONSTITUTION:The semiconductor laser 1 of the package 2 mounted with the semiconductor laser 1 is made to emit light and while the package 2 is rotated around the light emission point of this laser, the outer periphery 3 of the package is machined by a tool 4 until the light emission point is positioned at the center as shown by a sign 5. The eccentricity quantity can be managed within 1mum. An optical fiber terminal 7 hermetically sealed with an optical fiber 6 worked to have a spherical tip is previously centered by outer peripheral machining in the same manner as with the semiconductor laser package 2. The centered package 2 is fitted to a cylindrical holder 8 and the part of a code 9 is seam welded over the entire circumference. The terminal 7 is then fitted to a holder 8 and is inserted to the position where a desired light output is obtd. The terminal is tentatively fixed in this state by YAG spot welding and finally the part of a sign 10 is seam welded and hermetically sealed, by which the production is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a light emitting module suitable for use as a light source for optical communications and optical measuring instruments.

[Conventional technology]

In normal packages equipped with light-emitting elements such as light-emitting diodes and semiconductor lasers, the position of the light-emitting point is not precisely controlled with respect to the center of the outer circumference of the package, and it is usually
It varies in the range of 0 to 300 μm. For this reason, in conventional light emitting modules using such packages, it is necessary to adjust the position of the light emitting point and the optical fiber, or the light emitting point and the lens in the three axes of x, y, and z in order to achieve the correct positional relationship. Ta.

[Problem to be solved by the invention]

However, when performing 3-axis position adjustment, not only does it require a large amount of adjustment man-hours, but it also requires a space for the adjustment, which is disadvantageous for downsizing. There was a problem in that the rate of non-defective products deteriorated due to the deviation.

SUMMARY OF THE INVENTION An object of the present invention has been made in view of the above-mentioned problems, and is to provide a method for manufacturing a light emitting module that reduces the number of adjustment steps and improves the yield rate.

[Means to solve the problem]

The method for manufacturing a light emitting module of the present invention includes the steps of: cutting the outer periphery of a package equipped with a light emitting element so that its center coincides with the light emitting point of the light emitting element; The structure consists of a step of fitting the element together with a cylindrical holder, and a step of integrally fixing the quarter cage and each optical element to the cylindrical holder by welding, adhesion, soldering, etc. after fitting.

[Effect]

As described above, in the present invention, by cutting the outer periphery of the groove of the light emitting element, the three-axis position adjustment can be reduced to at least one axis adjustment, and thus the number of adjustment steps can be reduced. Furthermore, since positional deviation during fixation can be suppressed, the rate of non-defective products can also be improved.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

Figures 1 to 3 are diagrams showing a first embodiment of the present invention.
2A and 2B are diagrams showing a method of cutting the outer periphery of a semiconductor laser package in this embodiment. As shown in the figure,
The outer periphery 3 of the package 2 on which the semiconductor laser 1 is mounted is cut by a cutting tool 4 by causing the semiconductor laser to emit light and rotating the package 2 around the light emitting point so that the light emitting point is centered as shown by reference numeral 5. Make it. Judging from experience with optical connectors, the amount of eccentricity can be controlled within 1 μm.

FIG. 3 shows an optical fiber module with a rounded tip using this package 2. The outer periphery of the optical fiber terminal 7 in which the tip-processed optical fiber 6 is hermetically sealed is cut and centered in the same manner as the semiconductor laser package 2. Next, first, the centered semiconductor laser package 2 is fitted into the cylindrical holder 8, and the portion 9 is seam welded all around. Next, fit the optical fiber)<terminal 7 into the cylindrical holder 8, insert it to the position where the desired optical output is obtained, temporarily fix it in this state by YAG spot welding, and finally seam weld the part 10. Then, the light emitting module is completed by hermetically sealing it.

FIGS. 4 to 6 are diagrams showing a second embodiment of the present invention, and FIG.
5 are diagrams showing a method of cutting the outer periphery of a semiconductor laser package in this embodiment. In this embodiment, the Nomatsu cage 2 on which the semiconductor laser 1 is mounted is hermetically sealed, and the outer periphery cutting by the cutting tool 4 is also carried out on the outer periphery 1 of the cap part 11.
1a, and the light emitting point is finally centered as shown by reference numeral 11b.

FIG. 6 shows a ball lens type module using this package. First, the cut portion of the outer periphery of the cap portion 11 of the semiconductor laser package 2 is fitted into the cylindrical holder 8, and the portion indicated by reference numeral 12 is fixed by YAG spot welding. Next, a lens assembly in which the spherical lens 13 is fixed to the stem 14 using low-melting glass is inserted into the cylindrical holder 8, and the portion indicated by reference numeral 15 is fixed by YAG welding. In this lens assembly, the amount of eccentricity can be controlled by increasing the accuracy of the stem 14, so no cutting of the outer periphery is performed here. next,
Spacer 1 positions the centered optical fiber 1 terminal 7
6 into the cylindrical holder 8, and the part indicated by reference numeral 17 is fixed by YAG spot welding. In the case of this embodiment, by using the ball lens 13, the permissible accuracy of the position in the Z direction is considerably relaxed compared to the first embodiment, so by using the spacer 16, even the adjustment in the Z direction can be eliminated. be able to.

Note that in the above embodiments, a semiconductor laser was used as the light emitting element, but a light emitting diode may also be used.

Furthermore, although optical fibers were used in both embodiments, a so-called receptacle type without an optical fiber may also be used.

[Effects of the Invention] As explained above, in the light emitting module manufacturing method of the present invention, the conventional three-axis position adjustment can be reduced to at least one axis adjustment by cutting the outer periphery of the light emitting element package, thereby reducing the number of adjustment steps. In addition, since positional displacement during fixation can be suppressed, the yield rate can be improved, and various other excellent effects can be achieved.

[Brief explanation of drawings]

1 and 2 are diagrams showing a method of cutting the outer periphery of a semiconductor laser package in the first embodiment of the present invention, FIG. 3 is a cross-sectional view of a spherical-tipped optical fiber module using the package, 5 and 5 are diagrams showing a method of cutting the outer periphery of a semiconductor laser package in a second embodiment of the present invention, and FIG. 6 is a sectional view of a ball lens type module using the same package. 1...Semiconductor laser, 2...Package, 3, lla...Outer periphery, 6...Optical fiber with tip processed, 7... Optical fiber terminal, 8... Cylindrical holder, 13... Ball lens, 14... Stem. Applicant NEC Corporation Agent Patent Attorney Umeo Yamauchi No. 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. Cutting the outer periphery of a package equipped with a light emitting element so that its center coincides with the light emitting point of the light emitting element, and cutting this package together with an optical element whose optical axis is centered with respect to the outer periphery. The process of fitting into a cylindrical holder, welding and
A method for manufacturing a light emitting module comprising the step of integrally fixing the package and each optical element to a cylindrical holder by adhesion, soldering, etc. 2. The method of manufacturing a light emitting module according to claim 1, wherein the optical element comprises an optical fiber terminal obtained by hermetically sealing a tip-shaped optical fiber. 3. The method for manufacturing a light emitting module according to claim 1, wherein the optical element comprises a lens assembly in which a spherical lens is fixed to a stem using low-melting glass, and an optical fiber terminal.