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JPH0485742U - - Google Patents

Info

Publication number
JPH0485742U
JPH0485742U JP12841090U JP12841090U JPH0485742U JP H0485742 U JPH0485742 U JP H0485742U JP 12841090 U JP12841090 U JP 12841090U JP 12841090 U JP12841090 U JP 12841090U JP H0485742 U JPH0485742 U JP H0485742U
Authority
JP
Japan
Prior art keywords
package
mounting surface
lead part
lead
shapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12841090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12841090U priority Critical patent/JPH0485742U/ja
Publication of JPH0485742U publication Critical patent/JPH0485742U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例によるZIP型I
Cパツケージ、第2図は従来のZIP型ICパツ
ケージ、第3図と第4図は従来のZIP型ICを
印刷配線板に実装した時の断面図、第5図はこの
考案のZIP型ICを印刷配線板に実装した時の
断面図である。 図において、4,7,8はリードである。なお
、図中、同一符号は同一または相当部分を示す。
Figure 1 shows a ZIP type I according to an embodiment of this invention.
Figure 2 shows a conventional ZIP type IC package, Figures 3 and 4 are cross-sectional views of the conventional ZIP type IC mounted on a printed wiring board, and Figure 5 shows the ZIP type IC of this invention. FIG. 3 is a cross-sectional view when mounted on a printed wiring board. In the figure, 4, 7, and 8 are leads. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICパツケージのジグザクインラインパツケー
ジにおいて、ICパツケージから取付け面までの
リード部分と、取付け面からリード先端までのリ
ード部分の形状を変えたことを特徴とするICパ
ツケージ。
An IC package characterized in that, in the zigzag inline package of the IC package, the shapes of the lead part from the IC package to the mounting surface and the lead part from the mounting surface to the lead tip are changed.
JP12841090U 1990-11-30 1990-11-30 Pending JPH0485742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12841090U JPH0485742U (en) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12841090U JPH0485742U (en) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0485742U true JPH0485742U (en) 1992-07-24

Family

ID=31875871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12841090U Pending JPH0485742U (en) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0485742U (en)

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