JPH0481262A - Light beam soldering device - Google Patents

Abstract

PURPOSE:To obtain an energy density distribution which attains high heat even in the irradiated region apart from an optical axis by providing plural sets of light source units each consisting of a light source, lamp house and optical system in correspondence to the plural parts to be soldered of a single work. CONSTITUTION:The plural light source units 24 simultaneously heat the individual parts 27a, 27b, 27c, 27d to be soldered. The energy density distribution with which the high heat is obtainable in the irradiated regions apart from the optical axis is attained in the individual parts to be soldered at this time. The light sources 21, etc., of the plural light source units 24 are independently adjusted if nonuniformity arises in the thermal energy between the respective parts to be soldered. Further, the light source units 24 are moved as a whole if the size of the work 27 to be soldered changes, by which the correspondence with the size change is executed without changing the optical axis angle of the the optical system 23.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a light beam soldering device that performs soldering using the heat of a light beam.

(Prior Art) As shown in FIG. 3, a conventional light beam soldering device uses a light source (halogen lamp or xenon lamp)
1 and a lamp house (
an optical system 16 consisting of a first plane mirror 13, a second plane mirror 14 and a condensing lens (cylindrical lens) 15 disposed on the opening side of the lamp house 12; A mask (automatic mask) 18 is arranged between the substrate 17 and the substrate 17. An electronic component 19 as a workpiece to be soldered is mounted on the substrate 17.

Then, the light emitted from one light source 11 to the surroundings is
downward direction (=
The light beams are split into multiple light beams by multiple optical systems IG, and are irradiated to multiple soldering parts of the electronic component 19 through the mask 18, and the heat of the light beams causes local soldering at multiple locations on the single component. Attachment is done all at once.

(Problems to be Solved by the Invention) As shown in FIG. 3, light emitted from one light source 11 is split into a plurality of light beams by a plurality of optical systems 16, and a single electronic component 19 is split into a plurality of light beams. For example, as shown in FIG. 4, one light source 11 illuminates the four-side lead group 19a of the electronic component (Ford flat package integrated circuit) 19, as shown in FIG. 1
9b, 19c, ]! When N is heated simultaneously, each side lead group 19a, 19b, 19c.

An energy density distribution is shown in which the temperature of the irradiation area (shaded area) near the optical axis located at the center of +9d is high, while the temperature of the irradiation area away from the optical axis is low. Therefore, each side lead group 19a, 19b
, 19c, and 19d, the heat energy is likely to be insufficient at both ends because the heat dissipation area is larger than that at the center. In addition, one light source 11 can cause four electronic components 19 to
Side lead groups 19a, 19b, 19c.

When heating +96 at the same time, if there is non-uniformity in the thermal energy between the four sides, the optical system 16 is adjusted so that the thermal energy between each side is uniform.
It is not easy to adjust.

Furthermore, when the size of the electronic component 19 changes, conventionally the angles of the first plane mirror 13, second plane mirror 14, and condensing lens (cylindrical lens) 15 are changed. When changing the optical axis angle of the system 16, the energy density changes depending on the relationship with the mask 18, making it difficult to make the energy density uniform and requiring a control mechanism to control the angle of the mirror etc. There is also the problem that the configuration of the system 16 becomes complicated.

Furthermore, the conventional light source 11 uses a halogen lamp or a xenon lamp, but these lamps use infrared rays to raise the board temperature more than necessary, or have an adverse thermal effect on the area around the local soldering part. There is also the issue of giving.

The present invention aims to solve these various problems.

[Structure of the invention]

(Means for Solving the Problems) The invention of claim 1 includes a light source 21, a lamp house 22 disposed around the light source 21, and a lamp house 22 disposed around the light source 21.
an optical system 23 placed on the opening side, and a mask 26 placed between this optical system 23 and the workpiece 27 to be soldered.
In the light beam soldering apparatus, a light source unit 24 consisting of the light source 21, lamp house 22 and optical system 23 is used to solder a plurality of parts 278.27b, 27c in a single workpiece.

A plurality of sets are provided corresponding to 27d.

The invention according to claim 2 is the light beam soldering apparatus according to claim 1, in which the light source unit 24 is provided movably.

According to a third aspect of the invention, in the light beam soldering apparatus according to the first or second aspect, a metal halide lamp is provided as the light source 21.

(Function) In the invention of claim 1, the plurality of light source units 24 have individual soldering parts 27a, 27b, 2'lc,
27+] is heated simultaneously. At this time, each soldering target part has an energy density distribution in which high heat is obtained in the irradiation area away from the optical axis. Moreover, if non-uniformity occurs in the thermal energy between the respective soldered parts, the light sources 21 and the like of the plurality of light source units 24 are adjusted independently.

According to the second aspect of the invention, when the size of the workpiece 27 to be soldered changes, the light source unit 24 is moved as a whole to cope with the size change without changing the optical axis angle of the optical system 23.

According to the third aspect of the invention, since the metal halide lamp emits less infrared rays, it is possible to suppress the thermal influence on the substrate temperature and the surroundings.

(Example) Hereinafter, the present invention will be described in detail with reference to an example shown in FIGS. 1 and 2.

As shown in FIG. 1, a light source unit 24 includes a light source 21, a lamp house 22 placed around the light source 21, and an optical system 23 placed on the opening side of the lamp house 22. ing. Although the positional relationship between the light source 21, lamp house 22, and optical system 23 is fixed, the light source unit 24 is provided so as to be movable in the horizontal direction, so the irradiation position can be changed by moving the entire unit. .

As the light source 21, a halogen lamp, a xenon lamp, or a metal halide lamp is used. A metal halide lamp is a discharge lamp containing mercury and a metal halide.The light emitted from this metal halide lamp is mainly in the wavelength range from ultraviolet rays to visible light (400 to 800 nm), with little infrared radiation. It is preferable. Furthermore, this metal halide lamp is more efficient than other lamps and can be made smaller, so it is advantageous when a plurality of metal halide lamps are provided.

As the lamp house 22, an elliptical reflecting mirror is used.

The optical system 23 uses a segment mirror, a cylindrical lens, or an aspherical lens to make energy uniform.

Further, a mask (automatic mask) 26 is arranged between the optical system 23 and the substrate 25 to limit the range of light beam irradiation. This mask 26 is provided with a shutter, and its aperture is controlled at a necessary time and for a necessary period of time, allowing the light beam to pass through. This mask 26 may have an integral structure with the light source unit 24.

On the board 25 are electronic components 2 as workpieces to be soldered.
7 is installed. This electronic component 27 is provided with a plurality of parts to be soldered.

A plurality of light source units 24 are provided corresponding to a plurality of soldered parts in a single electronic component 27.

Although a plurality of masks 26 may be provided as shown in the figure, one mask 26 may be provided. This mask position is automatically set or changed.

Then, the light beams 28 irradiated from the plurality of light source units 24 pass through the mask 26 and simultaneously heat the plurality of parts to be soldered, thereby performing local reflow soldering at a plurality of locations of a single component all at once.

For example, solderable portions (lead groups) 27a on four sides of an electronic component 27 such as a Ford flat package type integrated circuit shown in FIG.

When heating 27b, 27c, and 27d at the same time, the individual soldered parts (lead groups) 27a, 2
7b, 27c.

At 27d, the irradiation area away from the optical axis (shaded area)
The energy density distribution is such that high heat can be obtained.

Therefore, the soldered parts (lead groups) 27a, 27b, 27c, on each side with a large heat dissipation area,
Sufficient thermal energy can be obtained at both ends of 27+I.

If non-uniformity of thermal energy occurs between the individual soldered parts of the electronic component 27, the individual light sources 21 are adjusted or the like is taken as a countermeasure.

Moreover, when the size of the electronic component 27 changes, the individual soldering parts 27g, 27b, 27c,
Since the position of 2Ld also changes, the entire light source unit 24 is moved horizontally, and the position of the mask 26 is also moved to change the irradiation position accordingly. Therefore, size changes can be accommodated without changing the optical axis angle of the optical system 23.

〔Effect of the invention〕

According to the invention of claim 1, since a plurality of light source units each consisting of a light source, a lamp house, and an optical system are provided corresponding to a plurality of parts to be soldered in a single workpiece, each part to be soldered can: An energy density distribution that produces high heat can be obtained even in the irradiation area far from the optical axis. Also, if there is unevenness in the thermal energy between the parts to be soldered,
This can be easily handled by adjusting the light source of each light source unit.

According to the invention of claim 2, since the light source unit is provided movably, when the size of the work to be soldered changes, the optical axis angle of the optical system can be changed by moving the light source unit as a whole. The above-mentioned size change can be easily accommodated without causing any problems when changing the optical axis angle.

That is, it is possible to maintain the uniformity of the energy density, and since it is sufficient to simply move the light source unit, it is possible to prevent the optical system and the like from becoming complicated.

According to the third aspect of the invention, since the metal halide lamp as the light source emits less infrared radiation, it is possible to suppress the substrate temperature during soldering and also suppress the thermal influence on the surroundings.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the light beam soldering device of the present invention, FIG. 2 is a plan view of the light beam irradiation part, and FIG. 3 is a schematic diagram showing a conventional light beam soldering device. FIG. 4 is a plan view of the light beam irradiation section. 21...Light source, 22...Lamp house, 23...Optical system, 24...Light source unit, 26...Mask, 27...Work to be soldered, 27a, 27b, 27c
, 2N...Soldered part.

Claims (3)

[Claims] (1) A light source, a lamp house placed around this light source, an optical system placed on the opening side of this lamp house, and a mask placed between this optical system and the workpiece to be soldered. A light beam soldering apparatus comprising: a plurality of light source units comprising the light source, a lamp house, and an optical system, each of which is provided in correspondence with a plurality of parts to be soldered in a single workpiece; attaching device. (2) The light beam soldering apparatus according to claim 1, wherein the light source unit is movably provided. (3) The light beam soldering apparatus according to claim 1 or 2, characterized in that a metal halide lamp is provided as a light source.