JPH0474451U - - Google Patents
Info
- Publication number
- JPH0474451U JPH0474451U JP11840290U JP11840290U JPH0474451U JP H0474451 U JPH0474451 U JP H0474451U JP 11840290 U JP11840290 U JP 11840290U JP 11840290 U JP11840290 U JP 11840290U JP H0474451 U JPH0474451 U JP H0474451U
- Authority
- JP
- Japan
- Prior art keywords
- piece
- lead
- apershaft
- pressure receiving
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案に係るリード折曲装置の実施例
を示す側面断面図、第2図は第1図の部分作用状
態図、第3図は第1図の正面図、第4図、第5図
は第3図の部分作用状態図、第6図、第7図は従
来例の作用状態図である。
1……素子、2……受圧片、3……押圧片、4
……折曲片、7……主軸、9……副軸、11……
リード。
FIG. 1 is a side sectional view showing an embodiment of the lead bending device according to the present invention, FIG. 2 is a partial operational state diagram of FIG. 1, FIG. 3 is a front view of FIG. 1, and FIGS. 5 is a partial operational state diagram of FIG. 3, and FIGS. 6 and 7 are operational state diagrams of the conventional example. 1... Element, 2... Pressure receiving piece, 3... Pressing piece, 4
...Bent piece, 7...Main shaft, 9...Subshaft, 11...
Lead.
Claims (1)
で挟持し該片に隣接する別片で同リードを略直角
に折曲げる装置において、両側に立設する一対の
側板を有する基台と、該側板の上方部で対向壁面
間に回動自在に掛渡されたアパーシヤフトと、該
アパーシヤフトに固定された操作レバーと、上記
アパーシヤフトに固定され挟持箇所の略直上位置
に設けられた押圧ロツドと、上記側板の対向壁面
間に掛渡された間隔調整シヤフトと、該間隔調整
シヤフトに貫通され基台上に立設支持される受圧
片と、該受圧片の上縁に当接してリードを挟持す
ることができる下縁を有する押圧片を副軸および
バネを介して内側に取り付けた折曲片であつて、
リードの挟持箇所から離れた位置に設けられた主
軸でバネを介し回動自在に上記受圧片に結合され
、かつ、上縁を上記押圧ロツドにより摺動押圧さ
れる折曲片と、を有することを特徴とするリード
折曲装置。 A device for holding each lead protruding substantially horizontally from an element between a pair of pieces and bending the lead at a substantially right angle with another piece adjacent to the piece, comprising: a base having a pair of side plates erected on both sides; an apershaft rotatably spanned between opposing walls at the upper part of the side plate; an operating lever fixed to the apershaft; a pressing rod fixed to the apershaft and provided at a position substantially directly above the clamping point; A spacing adjustment shaft spanned between opposing wall surfaces of a side plate, a pressure receiving piece penetrated by the spacing adjustment shaft and erected and supported on a base, and a lead being held by coming into contact with the upper edge of the pressure receiving piece. A bent piece in which a pressing piece having a lower edge that can be bent is attached inside via a subshaft and a spring,
The bending piece is rotatably coupled to the pressure receiving piece via a spring by a main shaft provided at a position away from a position where the lead is held, and whose upper edge is slidably pressed by the pressing rod. A lead bending device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11840290U JPH0474451U (en) | 1990-11-08 | 1990-11-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11840290U JPH0474451U (en) | 1990-11-08 | 1990-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0474451U true JPH0474451U (en) | 1992-06-30 |
Family
ID=31866316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11840290U Pending JPH0474451U (en) | 1990-11-08 | 1990-11-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0474451U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008211107A (en) * | 2007-02-28 | 2008-09-11 | Nec Tokin Corp | Surface-mounting thin capacitor and method of manufacturing the same |
-
1990
- 1990-11-08 JP JP11840290U patent/JPH0474451U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008211107A (en) * | 2007-02-28 | 2008-09-11 | Nec Tokin Corp | Surface-mounting thin capacitor and method of manufacturing the same |
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