JPH0469301A - Building board and its antifungal treatment - Google Patents
Building board and its antifungal treatmentInfo
- Publication number
- JPH0469301A JPH0469301A JP18046290A JP18046290A JPH0469301A JP H0469301 A JPH0469301 A JP H0469301A JP 18046290 A JP18046290 A JP 18046290A JP 18046290 A JP18046290 A JP 18046290A JP H0469301 A JPH0469301 A JP H0469301A
- Authority
- JP
- Japan
- Prior art keywords
- board
- base paper
- nonwoven fabric
- drying
- pyrithione
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000843 anti-fungal effect Effects 0.000 title claims abstract description 7
- 229940121375 antifungal agent Drugs 0.000 title abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 44
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 28
- 238000001035 drying Methods 0.000 claims abstract description 23
- 238000004804 winding Methods 0.000 claims abstract description 16
- FGVVTMRZYROCTH-UHFFFAOYSA-N pyridine-2-thiol N-oxide Chemical compound [O-][N+]1=CC=CC=C1S FGVVTMRZYROCTH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000007864 aqueous solution Substances 0.000 claims abstract description 10
- 229910052602 gypsum Inorganic materials 0.000 claims abstract description 9
- 239000010440 gypsum Substances 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 15
- 239000000417 fungicide Substances 0.000 claims description 14
- 230000000855 fungicidal effect Effects 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 3
- 229960002026 pyrithione Drugs 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000003429 antifungal agent Substances 0.000 abstract 1
- 230000015271 coagulation Effects 0.000 abstract 1
- 238000005345 coagulation Methods 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 3
- 230000012010 growth Effects 0.000 description 3
- 241000233866 Fungi Species 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PICXIOQBANWBIZ-UHFFFAOYSA-N zinc;1-oxidopyridine-2-thione Chemical class [Zn+2].[O-]N1C=CC=CC1=S.[O-]N1C=CC=CC1=S PICXIOQBANWBIZ-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000012258 culturing Methods 0.000 description 1
- 239000000645 desinfectant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000002538 fungal effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 230000009670 mycobacterial growth Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- XNRNJIIJLOFJEK-UHFFFAOYSA-N sodium;1-oxidopyridine-2-thione Chemical class [Na+].[O-]N1C=CC=CC1=S XNRNJIIJLOFJEK-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Producing Shaped Articles From Materials (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、建築用内装工事における表面材にボード原紙
または不織布を使用した建築用ボードとその防かび処理
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an architectural board using board base paper or nonwoven fabric as a surface material for interior construction work, and a method for mold-proofing the same.
(従来の技術)
建築物やその周囲には、常にかびやその胞子が飛散して
おり、これらが繁殖すると、外観汚染による嫌悪感のみ
ならず、かびの繁殖による材料劣化、かび菌による疾患
やアレルギー疾患のように直接人体に及ぼす悪影響等憂
慮する問題が多い。(Conventional technology) Mold and its spores are constantly scattered around buildings and their surroundings, and when they propagate, they not only cause disgust due to external contamination, but also cause material deterioration due to mold propagation, and diseases caused by mold bacteria. There are many issues of concern, such as allergic diseases, which have a direct negative impact on the human body.
そのために、かびによる汚染か予想される場合は、建築
用ボードを室内に建込前に、現場にてボード表面に防か
び剤をはけて塗布していた。For this reason, if mold contamination was suspected, a fungicide was applied to the surface of the building board at the site before it was erected indoors.
後処理としては、ボード表面にかびか付着発生した段階
でアルコール系殺菌剤等で殺菌し、その後で次亜塩素酸
ナトリウム溶液等により、更に殺菌、漂白していた。As for post-treatment, once mold or mildew has formed on the surface of the board, it is sterilized using an alcohol-based disinfectant, followed by further sterilization and bleaching using a sodium hypochlorite solution or the like.
このように、建築内装工事における建築用ボードに対す
る製造時の防かび処理ではなく、施工時の処理か、もし
くはかび発生後の後処理が殆どである。In this way, most of the construction interior construction work involves anti-mold treatment for architectural boards during construction, or post-treatment after mold occurs, rather than anti-mold treatment during manufacture.
(発明が解決しようとする課題)
現場施工による防かび処理やかび発生後の処理作業は作
業効率が悪く、特に後処理作業は室内設置物の移動を伴
うなど、作業効率の面からは著しく不利であった。(Problem to be solved by the invention) Work efficiency is poor in on-site mold prevention treatment and treatment work after mold occurs, and in particular, post-treatment work involves moving indoor objects, which is extremely disadvantageous in terms of work efficiency. Met.
また、ボード製造に際して防かび処理を施すものも存在
するが、製造時の乾燥工程によって受ける熱負荷等で防
かび処理剤か劣化し、施工時に必要とするかび抵抗性か
十分期待できなかった。In addition, there are some boards that are treated with anti-mold treatment during manufacturing, but the anti-mold agent deteriorates due to the heat load received during the drying process during manufacturing, and the mold resistance required during construction cannot be expected.
この事は、建築上必要とするかび抵抗性かあくまでも施
工時や使用時に発揮されるべき点に合致しない。This does not meet the architectural requirements for mold resistance, which should only be exhibited during construction and use.
本発明は上記事情に鑑みてなされたものであって、その
目的は建築施工時や使用時において十分なかび抵抗性能
を発揮し得る建築用ボードとその防かび処理方法を提供
することにある。The present invention has been made in view of the above circumstances, and its purpose is to provide a building board that can exhibit sufficient mold resistance during construction and use, and a method for treating the board to prevent mold.
(課題を解決するための手段)
上記目的を達成するために、本発明の建築用ボードとそ
の防かび処理方法は、ピリチオン系誘導体を主成分とす
る防かび剤を吸着させたボード原紙または不織布を建築
用ボードの表面材としたのである。(Means for Solving the Problems) In order to achieve the above object, the architectural board of the present invention and its fungicidal treatment method are provided by using a board base paper or a non-woven board to which a fungicidal agent containing a pyrithione derivative as a main component is adsorbed. was used as the surface material for architectural boards.
また、処理方法としてはボード原紙、不織布等は乾燥・
巻取工程において乾燥させた後、巻取前後の何れかにて
0.1乃至10%濃度のピリチオン系誘導体を主成分と
する水溶液を該ボード原紙不織布等に塗布あるいは散布
し、これを建築用ボード表面に貼着するのである。或い
は、ボード原紙、不織布等は乾燥・巻取工程において、
乾燥させた後、巻取前後の何れかにて0.1乃至10%
濃度のピリチオン系誘導体を主成分とする水溶液を該ボ
ード原紙、不織布等に塗布あるいは散布し、石膏主材ま
たはこれを混合材と共に該ボード原紙。In addition, as for processing methods, board base paper, nonwoven fabrics, etc.
After drying in the winding process, either before or after winding, an aqueous solution containing a pyrithione derivative as a main component at a concentration of 0.1 to 10% is applied or sprayed onto the base paper nonwoven fabric, etc. It is attached to the surface of the board. Or, for board base paper, non-woven fabrics, etc., in the drying and winding process,
After drying, 0.1 to 10% either before or after winding
An aqueous solution containing a concentrated pyrithione derivative as a main component is applied or sprinkled on the board base paper, nonwoven fabric, etc. to produce the board base paper together with gypsum as a main material or a mixed material thereof.
不織布の上に流し込み成型し、凝結した後、乾燥養生す
るものである。或いは、ボード原紙、不織布等は乾燥・
巻取工程において、乾燥させた後、巻取前後の何れかに
て0.1乃至10%濃度のピリチオン系誘導体を主成分
とする水溶液を該ボード原紙、不織布等に塗布あるいは
散布し、石膏主材またはこれを混合材と共に成型凝結し
た後、乾燥養生する前に該原紙、不織布等を上記成型ボ
ード表面に貼着し、その後ボードと共に乾燥養生しても
よい。It is poured and molded onto a nonwoven fabric, solidified, and then dried and cured. Alternatively, board base paper, nonwoven fabrics, etc. can be dried and
In the winding process, after drying, an aqueous solution containing pyrithione derivatives as a main component at a concentration of 0.1 to 10% is applied or sprinkled on the board base paper, nonwoven fabric, etc. either before or after winding. After forming and condensing the material or the mixed material together with the mixed material, the base paper, nonwoven fabric, etc. may be adhered to the surface of the molded board before drying and curing, and then drying and curing together with the board.
(作 用)
建築用ボードを構成する表面材であるボード原紙、不織
布は予めピリチオン系誘導体を吸着処理させているので
、防かび処理剤のグリップ力が強く、施工時においても
高いかび抵抗性を維持している。(Function) The board base paper and nonwoven fabric, which are the surface materials that make up architectural boards, have been adsorbed with pyrithione derivatives in advance, so the grip of the anti-mold agent is strong, and high mold resistance is maintained during construction. Maintained.
これらの防かび剤を水溶液とし、処理濃度の均一化とグ
リップ力の強化を行う目的で製造工程中においてボード
原紙、不織布に塗布吸着させ、かつ分散性を高めている
。These fungicides are made into an aqueous solution, and applied and adsorbed onto base paper or nonwoven fabric during the manufacturing process in order to uniformize the treatment concentration and strengthen grip strength, and to improve dispersibility.
これらの防かび剤は熱処理後の劣化か殆んとない。These fungicides show almost no deterioration after heat treatment.
(実 施 例)
以下、本発明の好適な実施例について図面を参照にして
詳細に説明する。(Embodiments) Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
第1図は建築用ボード1て、縦横に一定の規格化した寸
法を有し、主材2の表裏には、流し込み一体成型による
か、もしくは接着剤等で貼着している表面材3か密着し
である。Fig. 1 shows a construction board 1 which has certain standardized dimensions vertically and horizontally, and has a surface material 3 on the front and back sides of the main material 2, either by pouring integral molding or by pasting it with an adhesive or the like. It's in close contact.
主材2は石膏を主成分とするが、本出願人等が先に出願
した特開平1−157476号の如く、耐水性能の向上
と寸法の安定性を確保するために石膏主材のほかにスラ
グ、セメント、発泡剤等の混合材を混ぜ、然る後に高温
養生したものでもよいし、石膏ボードでもよい。The main material 2 is mainly composed of gypsum, but as in JP-A-1-157476 previously filed by the present applicant, in addition to the main material of gypsum, in order to improve water resistance and ensure dimensional stability, It may be a material mixed with a mixture of slag, cement, a foaming agent, etc. and then cured at a high temperature, or it may be a gypsum board.
表面材3はボード原紙、不織布などである。The surface material 3 is board base paper, nonwoven fabric, or the like.
表面材3の製造工程は、大きく抄造・圧搾・乾燥・巻取
の4つの工程に分かれるが、これらの乾燥・巻取間に塗
布器を設置し、O11〜10%濃度のピリチオン系誘導
体を主成分とする水溶液を上記塗布器にてボード原紙、
不織布などの表面材3に塗布または散布する。The manufacturing process for surface material 3 is broadly divided into four steps: paper forming, pressing, drying, and winding. An applicator is installed between these drying and winding steps, and a pyrithione derivative with an O concentration of 11 to 10% is mainly used. Apply the aqueous solution containing the ingredients to the board base paper using the above applicator.
It is applied or sprayed onto a surface material 3 such as non-woven fabric.
このようにして製造した表面材3及び主材2は、建築用
ボード1の製造ラインにおいて100℃〜160℃の乾
燥工程あるいは乾燥養生工程を経て製品化する。The surface material 3 and main material 2 manufactured in this way are manufactured into products through a drying process or a drying curing process at 100°C to 160°C on a production line for architectural board 1.
即ち、主材2に貼着してもよいし、主材2自体が乾燥養
生を必要とするものであれば、表面材3は、乾燥処理前
に凝結させるか、或いは主材2の凝結後表面材3を貼着
し、然る後に、主材2と表面材3は共に一体的に乾燥養
生させてもよい。That is, the surface material 3 may be attached to the main material 2, or if the main material 2 itself requires drying and curing, the surface material 3 may be set before the drying process, or after the main material 2 has set. After the surface material 3 is attached, the main material 2 and the surface material 3 may be dried and cured together.
念の為に第2図乃至第5図にピリチオンナトリウム系及
びピリチオン亜鉛系のピリチオン系誘導体と他の防かび
剤との比較を例示する。For the sake of clarity, comparisons between sodium pyrithione derivatives and zinc pyrithione derivatives and other fungicides are illustrated in FIGS. 2 to 5.
第2図に16種類の防かび剤を示す。これらの防かび剤
はボード原紙に叙述の手段にて1g/d程度を吸着させ
、これを160℃で24時間熱風乾燥させて16種類の
試料を得た。Figure 2 shows 16 types of fungicides. About 1 g/d of these fungicides were adsorbed onto the board base paper by the method described above, and this was dried with hot air at 160° C. for 24 hours to obtain 16 types of samples.
この上記試料には第3図に列挙したかび菌子6種を夫々
別個に付着させる。The six types of mold fungi listed in FIG. 3 are individually attached to the sample.
すなわち、試料を平板培地の培養面中央に接着して置き
、第3図列挙の菌子胞子を混ぜた胞子懸濁液を培養面と
試料面に均等に蒔きかけ、その後温度28℃、湿度95
%以上で4週間培養し、かび発生の状況を観察した結果
か第4図である。That is, the sample is placed on the center of the culture surface of a flat plate medium, and a spore suspension containing the fungal spores listed in Figure 3 is evenly spread on the culture surface and the sample surface, and then the temperature is 28℃ and the humidity is 95℃.
Figure 4 shows the results of culturing for 4 weeks at % or more and observing the status of mold growth.
第4図は横軸方向に第2図中で各防かび剤に付した番号
を記入し、縦軸にかびの広がり状況の程度を1.2.3
で表わした棒グラフであり、グラフの濃淡で期間を表示
するようにしたものである。In Figure 4, the numbers given to each fungicide in Figure 2 are written in the horizontal axis direction, and the degree of mold spread is shown in the vertical axis.
It is a bar graph expressed as , and the period is displayed using the shading of the graph.
縦軸方向の1は試料または試料に近接した部分に認めら
れる菌子の発育部分面積が試料面積の1/3をこえる程
度てあり、2は1/3をこえない程度、3は菌子の発育
が認められない程度を表わしている。1 in the vertical axis direction indicates that the area of mycobacterial growth observed in the sample or a portion close to the sample exceeds 1/3 of the sample area, 2 indicates that the area does not exceed 1/3, and 3 indicates that the mycelium growth area is not greater than 1/3 of the sample area. It represents an unacceptable level.
この第4図によれば、横軸方向の8,9番の箇所、即ち
ピリチオン系誘導体を主成分とする防かび剤が最も優れ
たかび抵抗性を表し、特にピリチオン亜鉛系では、4週
間経過後も全く菌子の発育が認められない。According to this Figure 4, the fungicides at points 8 and 9 in the horizontal axis direction, that is, the fungicides containing pyrithione-based derivatives as the main component, exhibit the best mold resistance. After that, no mycelium was observed to grow.
同様にしてピリチオン亜鉛系誘導体で防かび処理を施し
たボード原紙を発泡石膏パネル表面に貼着し、これらを
飽水状態にして第、5図に示す8種類のかび菌子混合胞
子懸濁液を塗布し、温度25℃、湿度95%以上で1箇
月以上様子を見たが、全く菌子の発育は認められなかっ
た。In the same way, board base paper treated with a pyrithione zinc derivative was attached to the surface of the foamed gypsum panel, saturated with water, and a mixed spore suspension of 8 types of mold and fungi as shown in Figure 5 was applied. After coating, the condition was observed for over a month at a temperature of 25° C. and a humidity of 95% or more, but no growth of mycelium was observed.
(効 果)
以上詳細に説明したように、本発明の建築用ボードとそ
の防かび処理方法によれば、ボード製造時に防かび処理
が施してあり、熱によるかび抵抗性の劣化がないので、
未処理材と全く同様の方法で施工することが可能であり
、現場作業の効率の向上および施工上のばらつきも生じ
にくく、しかも高いかび抵抗性を維持できる効果がある
。(Effects) As explained in detail above, according to the architectural board and the method for anti-mold treatment of the present invention, the anti-mold treatment is applied at the time of manufacture of the board, and there is no deterioration in mold resistance due to heat.
It can be constructed in exactly the same way as untreated materials, improves the efficiency of on-site work, is less likely to cause variations in construction, and has the effect of maintaining high mold resistance.
建築用ボードの主材を石膏とする混合材を含むボードを
高温乾燥させる際、防かび剤を塗布したたけのボード原
紙、不織布も一体的に高温乾燥させるように、予めこれ
らの表面材を主材凝結後の表面に貼着するか、或いは主
材と表面材を流し込み一体成型し、凝結後、乾燥養生さ
せた場合には、ボード原紙、不織布の加工工程を簡易化
できる効果がある。When drying a board containing a mixed material whose main material is gypsum for construction boards at high temperatures, we dry these surface materials as the main material in advance so that the board base paper and nonwoven fabric coated with fungicides are also dried at high temperatures together. If it is attached to the surface after solidification, or if the main material and surface material are poured and integrally molded, and then dried and cured after solidification, it has the effect of simplifying the processing steps for board base paper and nonwoven fabric.
第1図は建築用ボードの斜視図、第2図〜第5図は防か
び性能を比較明瞭化するための図で、第2図は使用した
防かび剤の一覧図、第3図は使用したかび菌子の一覧図
、第4図は発生したかびの状態を示すグラフ、第5図は
別の実例を示すために使用したかび菌子の一覧図である
。
1・・・・・・建築用ボード 2・・・・主材3・
・・・・・表面材
特許出願人 株式会社 大 林 紐間
内外木材工業株式会社第1図
第3図
第2図
第5図Figure 1 is a perspective view of a construction board, Figures 2 to 5 are diagrams for comparing and clarifying the antifungal performance, Figure 2 is a list of the fungicides used, and Figure 3 is a list of the fungicides used. FIG. 4 is a graph showing the state of generated mold, and FIG. 5 is a list of mold mycelium used to show another example. 1... Architectural board 2... Main material 3.
...Surface material patent applicant Himoma Obayashi Co., Ltd.
Naigai Mokuzai Co., Ltd. Figure 1 Figure 3 Figure 2 Figure 5
Claims (4)
着させたボード原紙または不織布を建築用ボードの表面
材としたことを特徴とする建築用ボード。(1) An architectural board characterized in that the surface material of the architectural board is base paper or nonwoven fabric to which a fungicide containing a pyrithione derivative as a main component has been adsorbed.
乾燥させた後、巻取前後の何れかにて0.1乃至10%
濃度のピリチオン系誘導体を主成分とする水溶液を該ボ
ード原紙、不織布等に塗布あるいは散布し、これを建築
用ボード表面に貼着する建築用ボードの防かび処理方法
。(2) For board base paper, nonwoven fabrics, etc., after drying in the drying and winding process, 0.1 to 10% is applied either before or after winding.
A method for anti-fungal treatment of architectural boards, which comprises applying or spraying an aqueous solution containing a concentrated pyrithione derivative as a main component to the board base paper, nonwoven fabric, etc., and pasting this onto the surface of the architectural board.
、乾燥させた後、巻取前後の何れかにて0.1乃至10
%濃度のピリチオン系誘導体を主成分とする水溶液を該
ボード原紙、不織布等に塗布あるいは散布し、石膏主材
またはこれを混合材と共に該ボード原紙、不織布の上に
流し込み成型し、凝結した後、乾燥養生したことを特徴
とする建築用ボードの防かび処理方法。(3) In the drying/winding process for board base paper, nonwoven fabrics, etc., after drying, either before or after winding, the
% concentration of an aqueous solution mainly composed of pyrithione derivatives is applied or sprinkled on the board base paper, nonwoven fabric, etc., and the gypsum base material or this together with a mixed material is poured onto the board base paper or nonwoven fabric and molded, and after solidification, A method for anti-fungal treatment of architectural boards characterized by dry curing.
、乾燥させた後、巻取前後の何れかにて0.1乃至10
%濃度のピリチオン系誘導体を主成分とする水溶液を該
ボード原紙、不織布等に塗布あるいは散布し、石膏主材
またはこれを混合材と共に成型凝結した後、乾燥養生す
る前に該原紙、不織布等を上記成型ボード表面に貼着し
、その後ボードと共に乾燥養生したことを特徴とする建
築用ボードの防かび処理方法。(4) In the drying/winding process for board base paper, nonwoven fabrics, etc., after drying, either before or after winding, the
% concentration of an aqueous solution containing pyrithione derivatives as the main component is applied or sprinkled on the board base paper, nonwoven fabric, etc., and after forming and solidifying the gypsum base material or this together with the mixed material, the base paper, nonwoven fabric, etc. is dried and cured. A method for anti-fungal treatment of architectural boards, characterized in that the above molded boards are adhered to the surface and then dried and cured together with the boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18046290A JPH0469301A (en) | 1990-07-10 | 1990-07-10 | Building board and its antifungal treatment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18046290A JPH0469301A (en) | 1990-07-10 | 1990-07-10 | Building board and its antifungal treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0469301A true JPH0469301A (en) | 1992-03-04 |
Family
ID=16083646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18046290A Pending JPH0469301A (en) | 1990-07-10 | 1990-07-10 | Building board and its antifungal treatment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0469301A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0648689A1 (en) * | 1993-10-06 | 1995-04-19 | Morris Greenhalgh Limited | Packaging of cleaning products |
FR2748503A1 (en) * | 1996-05-10 | 1997-11-14 | Rhone Poulenc Agrochimie | USE OF 1-PHENYL PYRAZOLE FOR THE PROTECTION OF COMPOSITE MATERIAL AGAINST TERMITES |
WO1999004112A1 (en) * | 1997-07-16 | 1999-01-28 | Fletcher Challenge Limited | Reinforced plasterboard |
WO2003045143A1 (en) * | 2001-11-21 | 2003-06-05 | Microban Products Company | Antimicrobial, sporicidal composition and treated products thereof |
US6680127B2 (en) * | 2001-08-03 | 2004-01-20 | Temple-Inland Forest Products, Corporation | Antifungal gypsum board |
WO2004038120A1 (en) * | 2002-09-17 | 2004-05-06 | Temple-Inland Forest Products Corporation | Antifungal gypsum board |
US6773822B2 (en) * | 2001-08-03 | 2004-08-10 | Temple-Inland Forest Products Corporation | Antifungal gypsum board |
US6838163B2 (en) | 2001-04-12 | 2005-01-04 | Milliken & Company | Composite facer for wallboards |
US6893752B2 (en) * | 2002-06-28 | 2005-05-17 | United States Gypsum Company | Mold-resistant gypsum panel and method of making same |
EP1468975A3 (en) * | 2003-04-17 | 2006-04-26 | USG INTERIORS, Inc. | Mold resistant acoustical panel |
JP2016530410A (en) * | 2013-06-20 | 2016-09-29 | アーチ・ケミカルズ・インコーポレーテッド | Building materials with antifungal properties |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118705A (en) * | 1984-07-05 | 1986-01-27 | Ig Tech Res Inc | Mildew-proofing gypsum board |
-
1990
- 1990-07-10 JP JP18046290A patent/JPH0469301A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118705A (en) * | 1984-07-05 | 1986-01-27 | Ig Tech Res Inc | Mildew-proofing gypsum board |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0648689A1 (en) * | 1993-10-06 | 1995-04-19 | Morris Greenhalgh Limited | Packaging of cleaning products |
FR2748503A1 (en) * | 1996-05-10 | 1997-11-14 | Rhone Poulenc Agrochimie | USE OF 1-PHENYL PYRAZOLE FOR THE PROTECTION OF COMPOSITE MATERIAL AGAINST TERMITES |
WO1997042817A1 (en) * | 1996-05-10 | 1997-11-20 | Rhone Poulenc Agrochimie | Anti-termite protection |
WO1999004112A1 (en) * | 1997-07-16 | 1999-01-28 | Fletcher Challenge Limited | Reinforced plasterboard |
GB2340518A (en) * | 1997-07-16 | 2000-02-23 | Fletcher Challenge Ltd | Reinforced plasterboard |
GB2340518B (en) * | 1997-07-16 | 2001-11-28 | Fletcher Challenge Ltd | Reinforced plasterboard |
US6547901B1 (en) | 1997-07-16 | 2003-04-15 | Milliken & Company | Reinforced plasterboard |
US6838163B2 (en) | 2001-04-12 | 2005-01-04 | Milliken & Company | Composite facer for wallboards |
US6680127B2 (en) * | 2001-08-03 | 2004-01-20 | Temple-Inland Forest Products, Corporation | Antifungal gypsum board |
US6773822B2 (en) * | 2001-08-03 | 2004-08-10 | Temple-Inland Forest Products Corporation | Antifungal gypsum board |
WO2003045143A1 (en) * | 2001-11-21 | 2003-06-05 | Microban Products Company | Antimicrobial, sporicidal composition and treated products thereof |
US6893752B2 (en) * | 2002-06-28 | 2005-05-17 | United States Gypsum Company | Mold-resistant gypsum panel and method of making same |
AU2003253741B2 (en) * | 2002-06-28 | 2006-09-07 | United States Gypsum Company | Mold-resistant gypsum panel and method of making same |
WO2004038120A1 (en) * | 2002-09-17 | 2004-05-06 | Temple-Inland Forest Products Corporation | Antifungal gypsum board |
EP1468975A3 (en) * | 2003-04-17 | 2006-04-26 | USG INTERIORS, Inc. | Mold resistant acoustical panel |
JP2016530410A (en) * | 2013-06-20 | 2016-09-29 | アーチ・ケミカルズ・インコーポレーテッド | Building materials with antifungal properties |
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