JPH0464289A - Chip component mounting device - Google Patents

Abstract

PURPOSE:To shorten a mounting requiring time by recognizing the suction state of a chip component to a suction head, calculating it based on information, and positioning the head from a chip component supply unit to an arbitrary predetermined position of a printed board while correcting the sucking position. CONSTITUTION:A chip component is sucked by a suction head 11 from a chip component supply unit, and a chip component sucking attitude is recognized by recognition camera means 12 through a mirror. The position of a chip is corrected by a positioning unit of the head 11 in response to the recognition result, the chip is supplied to a board 14 at a shortest route through an X-Y drive shaft 15, and a chip component mounting time is shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip component mounting device for mounting chip components onto a printed circuit board.

BACKGROUND OF THE INVENTION In recent years, chip component mounting apparatuses have been required to perform mounting with higher precision and speed as electronic circuits are mounted at higher density.

The conventional chip component mounting apparatus described above will be described below with reference to the drawings.

FIG. 5 is a schematic perspective view showing a conventional chip component mounting device. In FIG. 5, reference numeral 1 denotes a suction head, which is driven and positioned by an XY drive shaft 2. In FIG. 3 is a chip component supply section, 4 is a printed circuit board, and 5 is a recognition camera section.

FIG. 6 is a perspective view showing details of the suction head 1. 6th
In the figure, reference numeral 6 denotes a suction nozzle, which holds the chip component 7 by suction. 8 is a mirror, and the recognition camera section 5
This constitutes an optical system for forming an image of the adsorption posture of the chip component 7 on the wafer. The adsorption posture of the chip component 7 is determined by temporarily stopping on the mirror 8 of the recognition camera section 5 and capturing the image, and then calculating the error in the XY coordinates and rotational direction from the predetermined desired position. Printed circuit board 4 while applying correction
It is installed at a predetermined installation position.

Problem to be Solved by the Invention However, in the conventional configuration as described above, as shown in FIG.
, B, C..., be sure to use the recognition camera section 5.
capture an image at a predetermined position P on the mirror 8 of
Any predetermined mounting position A', B' of the printed circuit board 4
Since it will be attached to C'... and passes through the recognition camera section 5, the moving distance will be long, and since it will temporarily stop at the recognition camera section 5, the time required from adsorption to attachment will be significant. It had the problem of being long.

The present invention solves the above-mentioned conventional problems.In order to adsorb chip components in a supply section and mount them at a predetermined position on a printed circuit board, the present invention can continuously move the shortest moving path, and It is an object of the present invention to provide a chip component mounting device that can reduce the required time by detecting and correcting the suction posture of the chip component.

Means for Solving the Problems In order to solve the above problems, the chip component mounting apparatus of the present invention includes a suction nozzle for sucking a chip component, a recognition means for recognizing the suction state of the chip component by the suction nozzle, and a recognition means for recognizing the suction state of the chip component by the suction nozzle. A suction head having a position correction means for calculating and correcting the position based on recognition information from the means, and an XY drive means for positioning the suction head from the chip component supply section to an arbitrary predetermined position on the printed circuit board. It is something.

Further, the recognition means in the chip component mounting apparatus of the present invention is constituted by a camera means for recognizing the suction state of the chip component by the suction nozzle through a mirror; The mirror is provided with a drive means for moving the mirror to a certain position or for avoiding the movement of the suction nozzle.

Operation With the above configuration, the suction head picks up the chip parts from the chip parts supply section, and the camera installed on the suction head recognizes the suction posture of the chip parts in order to mount the chip parts at any predetermined position on the printed circuit board. Since the device can be recognized through a mirror and moved while making corrections to a predetermined posture, it is possible to capture an image of the suction posture after positioning it on a recognition camera means provided separately from the suction head, unlike conventional methods. Then, without having to take the extra route of moving to a predetermined position on the printed circuit board again, the chip components can be moved continuously in the shortest route, and the chip components can be mounted on the printed circuit board in a very short time. become.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic perspective view of a chip component mounting device according to an embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a suction head, which is equipped with a camera section 12 for recognition. Reference numeral 13 denotes a chip component supply section, and 14 denotes a printed circuit board on which the chip components supplied by the supply section 13 are to be mounted. Reference numeral 15 denotes an XY drive shaft for positioning the suction head 11 from the supply section 13 to an arbitrary predetermined position on the printed circuit board I4 in the XY force direction.

FIG. 2 is a detailed view of the suction head section 11. In FIG. 2, reference numeral 16 denotes a suction nozzle, which suctions and holds the chip component 17. The recognition camera section 12 is provided integrally with the suction head 11, and the mirror 1 provided below the suction nozzle 16.
8. Further, an image of the adsorption posture of the chip component 17 is obtained via the mirror 19. Reference numeral 20 denotes a drive means for moving the mirror j8 to a recognition position of the suction posture or for avoiding the suction nozzle 16 when the suction nozzle 16 is moved.

The operation of the chip component mounting apparatus configured as described above will be explained with reference to FIGS. 3 and 4.

Figures 3 (a), (b), (c), and (d) show the steps from suction to attachment. First, FIG. 3(a) shows a case where the suction nozzle 16 suctions the chip component 17 supplied from the supply section 13. At this time, the mirror 18
is located at a position where the suction nozzle 16 is avoided by the driving means 2G.

Next, in FIG. 3(b), the suction nozzle 16
7 is being sucked and held and moving toward the printed circuit board 14, the suction nozzle 16 is rising together with the chip component 17, and at this time, the mirror 18 is moved to the recognition position below the suction nozzle 16 by the driving means 20. Set. The suction image of the chip component 17 is captured on the recognition camera unit 12 via the mirror 18 and the mirror 19, and calculates how much the suction posture or suction position of the chip component 17 differs from a predetermined one. The correction is performed using the XY drive shaft 15 or the rotation shaft (not shown) in the suction head 11. At this time, the suction head 11 is being moved from the supply section 13 to a predetermined position on the printed circuit board 14 by the XY drive shaft 15.

Furthermore, FIG. 3(C) shows the case where the chip component 17 is mounted on the printed circuit board 14, and the mirror 18 avoids the suction nozzle 16 that descends together with the chip component I7 by the driving means 20.

Furthermore, FIG. 3(d) shows the state where the mounting has been completed, the suction nozzle 16 is raised, and the next chip component 17 is to be picked up from the supply section 13, and FIG. return.

FIG. 4 shows the movement process from the suction position to the mounting position in the case of the present invention, from the suction position A of the chip component 17 in the supply section 13 to the predetermined mounting position A of the printed circuit board 14.
', Similarly, it is possible to connect with straight lines such as B to B' and C to C', and the chip part 1 can be connected during the moving operation.
7 adsorption images can be imported.

As described above, according to this embodiment, the supply section 13 for the chip components 17, the positioning means for the printed circuit board 14, the suction head 11 for the chip components 17, and the suction head 11 from the supply section 13 for the chip components 17 are provided. and an XY drive shaft 15 for positioning at any predetermined position on the printed circuit board 14,
This suction head 16 includes a suction nozzle 16 that suctions the chip component 17, a recognition camera unit 12 that recognizes the suction state via a mirror 18 provided below the suction nozzle 16, and a recognition camera unit 12 that recognizes the suction state through a mirror 18 provided below the suction nozzle 16. This mirror 1 has a calculation function for position correction and a position correction means.
By providing the driving means 20 in the chip component 17
The chip components 17 can be delivered to the printed circuit board 14 from the supply section 13 to a predetermined position on the printed circuit board 14 in the shortest route and without stopping (since they can be moved continuously), the chip components 17 can be delivered to the printed circuit board 14 in a very short time.
can be installed.

Effects of the Invention As described above, according to the present invention, a suction head is provided with a suction nozzle that suctions a chip component, a recognition camera means as a recognition means for recognizing this suction state via a mirror, and a recognition information on the suction head. Since it is equipped with a calculation function and a position correction means for correcting the position based on the information, it is possible to take the shortest route from the chip component supply section to the predetermined position on the printed circuit board and stop, without going through the camera means as in the conventional case. The suction head can be moved continuously with the chip components by the XY drive means, and the chip components can be mounted on the printed circuit board in a very short time.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view of a chip component mounting device showing an embodiment of the present invention, FIG. 2 is a perspective view showing details of the suction head portion of the same mounting device, and FIGS. 3(a) (b') (c
) (d) is a process diagram showing the mounting process of the same mounting device, No. 4
The figure is a diagram of the movement process of the suction head in the same mounting device.
The figure is a schematic perspective view of a conventional chip component mounting apparatus, FIG. 6 is a perspective view showing details of the suction head portion of the same mounting apparatus, and FIG. 7 is a movement stroke diagram of the suction head in the same mounting apparatus. 11... Suction head, 12... Recognition camera section, 1
3... Supply unit, 14... Printed circuit board, 15...
XY drive axis, 16... Suction nozzle, 17... Chip component, 18. 19...Mirror 20...Driving means. Agent Yoshihiro Morimoto Figure x Y temporary axis Figure 2 Figure 4 Figure 5 Figure O

Claims (2)

[Claims] 1. a suction nozzle for suctioning a chip component; a recognition means for recognizing the suction state of the chip component by the suction nozzle;
A suction head having a position correction means for calculating and correcting the position based on the recognition information from the recognition means, and an XY drive means for positioning the suction head from the chip component supply section to an arbitrary predetermined position on the printed circuit board. Equipped with a chip component mounting device. 2. The recognition means includes a camera means for recognizing the suction state of the chip component by the suction nozzle via a mirror, and includes a drive means for moving the mirror to a recognition position or for avoiding the movement of the suction nozzle. The chip component mounting device according to claim 1.