JPH0441071A - Point soldering device - Google Patents

Abstract

PURPOSE:To stabilize the quality of a joint part by controlling the energization to a heater in accordance with the solder temp. in a tank, controlling the relative position of the tank and the part to be soldered and controlling the opening and closing of a nozzle hole by driving of a needle. CONSTITUTION:Solder is supplied from a solder supplying machine 20 to the tank 1 and is heated by a heater 15. The nozzle hole 8 which is opened and closed by the needle 10 is provided in a nozzle tip 7 to drop solder. The relative position of the tank 1 and the part 35 to be soldered is adjusted by an X-Y table 27 of a positioning device. The energization to the heater 15 is controlled by a temp. control means 31 in accordance with the temp. of the solder 17 in the tank 1. The driving of a positioning means 27 is controlled by a positioning 32. The opening and closing of the nozzle hole 8 are controlled by using a means 33 for controlling the opening and closing of the nozzle hole by driving of the needle 10. The soldering is executed by supplying a proper amt. of the solder to the part to be soldered in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a point soldering device that performs soldering by dropping molten solder.

<Prior Art> Conventionally, the work of attaching electronic components to a printed circuit board involves soldering the parts to be soldered one by one using a soldering iron. In this type of point soldering, the soldering iron tip melts the thread solder containing flux, heats the part to be soldered with the soldering iron tip, and pours the melted solder into the part to be soldered. It was done.

<Problem to be solved by the invention> However, during this type of soldering, the solder wire is melted with the tip of the iron and the solder is conveyed to the part to be soldered, so the amount of solder supplied is not constant. There are large variations in the amount of solder applied to the parts to be soldered, and insufficient or excessive solder may occur, resulting in poor soldering.

Further, there is a problem in that the temperature conditions for soldering differ depending on the parts to be soldered, and it is difficult to solder each part to be soldered at an appropriate temperature and in an appropriate amount.

This invention has been made to eliminate the above-mentioned problems, and aims to provide a point soldering device that can heat the soldered part to an appropriate temperature and supply an appropriate amount of solder. be.

<Means for Solving the Problems> The present invention has been made to achieve the above object, and includes a heater for heating supplied solder, a nozzle hole that is opened and closed by driving a needle, and a nozzle hole that is opened and closed by driving a needle. a solder tank equipped with a nozzle tip capable of dripping the solder; a positioning device capable of adjusting the relative position between the solder tank and the soldered portion; and energization control of the heater based on the solder temperature in the solder tank. and a control device comprising a solder temperature control means for controlling the positioning means, a positioning control means for controlling the drive of the positioning means, and a nozzle hole opening/closing control means for controlling the opening and closing of the nozzle hole by driving the needle. This is a point soldering device.

<Operation> The present invention is constructed as described above, and the solder in the solder tank is heated and melted by the heater, and is controlled by the solder temperature control means to maintain a constant melting temperature. The solder tank faces the soldering target part which is moved by the positioning means.

The nozzle tip of the solder tank heats the part to be soldered, opens a nozzle hole by driving a needle by the control means, and drips an appropriate amount of molten solder onto the part to be soldered, thereby performing soldering.

<Example> An example of the present invention will be described below with reference to FIGS. 1 and 2.

Figure 1 is an overall configuration diagram of the key soldering device of this invention,'! Figure J2 is a cross-sectional view of the solder tank.This point soldering device has a heater 15. X, which is a positioning device that adjusts the relative position of the solder tank 1 equipped with a nozzle tip 7 and the like, a lifting mechanism 25 that raises and lowers the solder tank 1, and the solder tank 1 and the soldered portion of the printed circuit board 35;
-Y table 27, solder temperature control means 319, positioning control means 32. It is mainly composed of a control device 30 with a nozzle hole opening/closing control means 33, and a solder feeder 20. Flux tank 21. Flux injection device 2
Equipped with 3rd grade.

In the embodiment, the solder tank 1 includes a main body 2 having a cylindrical exterior and a through hole 5. It is formed by a lid part 4 having a supply port 6. The lower end of the main body 2 is formed into a funnel shape, and a nozzle tip 7 is removably screwed onto the outer periphery of the downward opening end 3.

The nozzle tip 7 is formed into a substantially inverted conical shape, and has a nozzle hole 8 of a predetermined diameter bored on its axis, and a female threaded portion 9 threaded into the opening end 3. .

A needle 10 that can open and close the nozzle hole 8 is provided in opposition to the nozzle chip 7 .

The needle 10 has a lower end formed in a circular female cedar shape, and an upper end that passes through a through hole 5 of the lid 4 and is connected to a solenoid 14 provided in the lid 4. and needle 1
o is configured to close the nozzle hole 8 by being biased by the spring 12 when the solenoid 14 is not energized.

Furthermore, inside the main body 2, a heater 15 for heating, a temperature sensor 16 for measuring the temperature of the solder, and a liquid level sensor 18 for measuring the liquid level of molten solder are arranged.

A solder feeder 2° is disposed above the solder tank 1. This solder supply machine 20 is controlled by a control device 30 and is configured to supply thread solder 17a into the main body 2 through the supply hole 6.

In addition, a flux tank 21 is installed parallel to the solder tank 1.
The flux tank 21 is equipped with an ejection pipe 22 that can eject flux to the devices to be soldered. The flux tank 21 is supplied with positive pressure and negative pressure generated by a flux injection device 230 controlled by the control device 30, and injects a predetermined amount of flux into the injection pipe.
It is configured to inject from 2. Note that the solder tank 1 and the solder supply machine 20. flux tank 21
etc. are attached to the arm 25a of the elevating mechanism 25.

The elevating mechanism 25 has an arm 25a that can be raised and lowered, and is configured to be controlled by a control device 30 to raise and lower the arm 25a to which the solder tank 1 and the like are attached.

The X-Y table 27 is configured to move the soldered portion of the printed circuit board 35 directly below the nozzle chip 7 of the solder tank 1 under the control of the control device 30 .

In the embodiment, a one-chip microcomputer is used as the control device 30, and includes solder temperature control means 31, positioning control means 32. The nozzle hole opening/closing control means 33 is configured to include a CPU that executes various calculation processes, and a RAM and a ROM that store programs for the CPU.

The solder temperature control means 31 is configured to control the supply of electricity to the heater 15 based on the signal from the temperature sensor 6 to maintain the temperature of the solder 17 in the solder tank 1 at a predetermined temperature. The positioning control means 32 is configured to drive the X-Y table 27 upon the start of the work, and move a predetermined portion of the printed circuit board 35 to be soldered to a coordinate position directly below the nozzle chip 7. The nozzle opening/closing control means 33 is configured to control the supply of electricity to the solenoid 14 in accordance with a work procedure, drive the needle 10, and adjust the amount of solder 17 dripped from the nozzle hole 8.

Further, the control device 30 outputs a drive signal for the solder feeder 20 based on the signal from the liquid level sensor 18, and also outputs a drive signal for the lifting mechanism 25 and a control signal for driving the flux jetting device 23 according to the work procedure. is configured to do so.

Next, the operation of the point soldering device configured as described above will be explained based on the flowchart in FIG. A solder thread 17a is supplied from the hole 6. These are temperature sensors 16. Solder temperature III control means 3
1. It is controlled by a solder feeder 20 and the like, and the amount of solder in the main body 2 is adjusted by a liquid level sensor 18 so that it is always constant. The temperature of the melted shard 17 is detected by the temperature sensor 16, and is maintained at a predetermined temperature. On the other hand, the printed circuit board 35 is attached to the X-Y table 27, and the X-Y table 27 and the elevating mechanism 25 are in a standby state at the predetermined original position and the highest position, respectively.

In step 10, when the soldering operation starts, the X-Y table 27 is controlled by the positioning control means 32 of the control device 30, and the X-Y table 27 is controlled by the positioning control means 32 of the control device 30, and the X-Y table 27 is positioned at a predetermined part to be soldered (for example, the round 36 and the lead of the printed circuit board 35 shown in FIG. 4). (junction of line 38)
is moved directly below the axis of the nozzle tip 7 of the solder tank 1.Next, in step 11, the lifting mechanism 25 lowers the solder tank 1 under the control of the control device 30. At this time, the lower end of the nozzle tip 7 faces the round 36 at a position slightly above the part to be soldered. In step 12, the flux 24 is ejected from the flux tank 21 through the ejection pipe 22 toward the soldered portion by the flux ejection device 23 controlled by the control device 30. The ejection amount of the flux 24 is adjusted by ejection time and the like.

Subsequently, in step 13, the nozzle tip 7 is lowered by the lifting mechanism 25, and the lower end of the nozzle tip 7 is brought into contact with the round 36. As a result, the temperature of the soldered portion increases due to heat transfer from the nozzle tip 7, which has approximately the same temperature as the solder 17, and preheating is performed (see FIG. 4). After preheating for a predetermined period of time, the nozzle tip 7 rises to a slightly upward facing position.

Next, in step 14, the solenoid 14 is energized under the control of the nozzle opening/closing control means 33, and the needle 10 is driven upward to open the nozzle hole 8. In step 15, the molten solder 17 passes through the nozzle hole 8 due to its own weight and drips onto the part to be soldered. In step 16, the amount of the solder 1 drop is controlled by the opening time of the nozzle hole 8, and the solenoid 14 is demagnetized to close the nozzle hole 8. Subsequently, in step 1F, the nozzle tip heats the part to be soldered for a predetermined period of time via an appropriate amount of solder 17 dropped, and the solder 1F spreads to the part to be soldered (see FIG. 5).

Next, in step 18, under the control of the control device 30!
M, the lowering mechanism 25 raises the solder tank 1 to the highest position, and the X-Y table 27 returns to its original position under the control of the positioning control means 32, completing one point soldering process. FIG. 6 shows the parts to be soldered.

In the entire process, the heater 15 is energized by the solder temperature control means 31 according to the signal from the temperature sensor 16 to keep the solder temperature constant, and the solder feeder 20 is controlled by the solder temperature control means 31 according to the signal from the liquid level sensor 18. Under the control of the control device 30, the thread solder 17a is supplied into the main body 2, and the amount of solder 17 inside the main body 2 is maintained constant.

Note that this invention is not limited to the above description and aspects, and its embodiments can be changed without departing from the technical idea of this invention. For example, as shown in FIG. 7, the diameter of the nozzle tip 7 may be increased to increase the heat capacity, and the diameter of the nozzle 8 may be increased to accommodate a large part to be soldered. Further, as shown in FIG. 8, the nozzle tip 7 may be made small in diameter so as to correspond to a minute soldered part.

Furthermore, by changing the X-Y table 27 of the positioning device to a rotatable chuck-shaped jig 50 as shown in FIG. 9, it is possible to solder even cylindrical objects. I can do it. Alternatively, the object to be soldered may be fixedly supported, and the solder tank may be moved in a horizontal plane.

Further, as shown in FIG. 10, this point soldering device is connected to a loading device 55. By combining with the unloading device 56, the point soldering process can be fully automated by being directly connected to other manufacturing processes.

<Effects of the Invention> As explained above, the key points of the present invention are that the soldering device has a heater that heats the supplied solder, a nozzle hole that is opened and closed by driving the needle, and a nozzle that can drip solder. A solder tank equipped with a chip, a positioning device that can adjust the relative position between the solder tank and a soldered part, and a solder temperature control means and positioning means that control energization of a heater based on the solder temperature in the solder tank. Since the configuration is equipped with a control device equipped with a positioning control means for controlling the drive and a nozzle hole opening/closing control means for controlling the opening and closing of the nozzle hole by driving the needle, it is possible to preheat the soldering part under the control of the control device.
Since the soldering is performed by properly heating and supplying an appropriate amount of solder to the soldered portion, the quality of the soldered joint can be stabilized.

In addition, the point of the present invention is that according to the soldering device, it is possible to accurately solder the part to be soldered using the positioning device. It becomes possible to automate soldering, which has the effect of preventing forgetting to solder.

[Brief explanation of the drawing]

Fig. 1 is an overall configuration diagram of a point soldering device according to an embodiment of the present invention, Fig. 2 is a sectional view of a solder tank, Fig. 3 is a flowchart showing the operation of point soldering, and Fig. 4 is a preheating using a nozzle tip. Figure 5 is a partial cross-sectional view showing solder dripping and heating, Figure 6 is a partial cross-sectional view showing the soldered part, Figure vS7, and Figure 8 are the nozzle tip and other parts. 9 is an explanatory diagram showing an example of a positioning device that uses a rotary jig to support and position an object to be soldered. FIG. 10 is an illustration of the manufacturing process and point soldering device. It is an explanatory diagram showing an example of a combination. DESCRIPTION OF SYMBOLS 1... Solder tank, 7... Nozzle chip, 8... Nozzle hole, 10... Needle, 15... Heater, 25... Lifting mechanism, 27... X-Y table (positioning equipment) 30...
Control device, 31... Solder temperature control means, 32... Positioning control means, 33... Nozzle hole opening/closing control means. Patent application: Jin-Aisan Kogyo Co., Ltd.

Claims (1)

[Scope of Claims] A solder tank having a heater that heats supplied solder, a nozzle hole that is opened and closed by driving a needle, and a nozzle tip capable of dropping the solder; a positioning device whose relative position with respect to the soldering part can be adjusted; a solder temperature control means for controlling the energization of the heater based on the solder temperature in the solder tank; a positioning control means for controlling the drive of the positioning means; A point soldering device comprising: a control device including a nozzle opening/closing control means for controlling opening/closing of the nozzle hole by driving a needle;