JPH0433990Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of an apparatus for coating electronic components such as hybrid ICs with synthetic resin powder.

[Conventional technology]

In a hybrid IC, a film-like conductor pattern is formed on both sides or one side of a substrate 2 made of alumina, etc., and components 3 such as capacitors, chip resistors, and semiconductor integrated circuits are attached to appropriate locations on the substrate 2. A plurality of lead parts 4 are made to protrude from the side ends, and the main body 1, which is made up of the board and components except for the lead parts 4, is packaged in a package 5 using a synthetic resin material or the like.
This is usually the case (see Figures 3 and 4).

One method for packaging such electronic components is painting by fluidized dipping. In this method, powdered thermoplastic synthetic resin is placed in a fluidized tank.
Air is blown upward from a large number of pores in a filter stretched near the bottom of the fluidized tank, and the fluidized tank is vibrated up and down, so that the synthetic resin powder inside becomes fluid. The lead portion 4 is heated by raising the fluidized tank appropriately while keeping the temperature of the fluidized tank heated, and immersing it in the synthetic resin powder fluidized bed inside the fluidized tank for an appropriate amount of time. The synthetic resin is applied to the entire surface of the main body except for one part in an appropriate thickness and coated.

In this case, the lead portion 4 of the object to be coated is held between chucks or the like, and the main body 1 is suspended downward, and the substrate 2 of the main body 1 is placed against the upper surface of the fluidized bed of synthetic resin powder in the fluidized tank. When the fluidized tank is vertically fixed and vibrated vertically, the body 1
The upward flow of air from below the fluidized bed is obstructed on the side surface, which becomes extremely uneven due to the installation of components 3 such as capacitors, chip resistors, and semiconductor integrated circuits on both the front and back sides of the fluidized bed, and the synthetic resin powder in the fluidized bed is The body also goes around the top of the uneven parts and moves away.
On the other hand, since the air rises smoothly on the side surface with less unevenness, the powder easily rises toward the lead part, and therefore, the adhesion of the synthetic resin powder to the main body 1
At the base of the lead portion 4, the height is low on the uneven side surface, and high on the smooth side surface, resulting in an unsightly appearance of the synthetic resin package.

As a means to solve this problem, as shown in Fig. 4, the lead part 4 of the electronic component is held between chucks, etc., and the main body 1 is held at an appropriate angle (θ1) so that its uneven side faces downward. The fluidized tank 6 is vertically fixed in an inclined manner, and the fluidized tank 6 is finely vibrated up and down in the vertical direction, and the air 8 is blown upward from a filter 7 having a large number of pores at the bottom of the fluidized tank 6. A fluidized bed of synthetic resin powder 7 is formed in the tank 6, and the fluidized bed 6 is raised vertically.
It was considered that the base of the main body 1 and the lead part 4 was immersed.

[Problem that the invention attempts to solve]

According to this means, since the upper surface of the synthetic resin powder 7 in the fluidization tank 6 and the axis of the main body 1 intersect obliquely, the base of the main body 1 and the lead part 4 on the side surface with severe unevenness is made of synthetic resin. The depth at which the upper surface of the powder 7 is immersed is deeper than that on the opposite side, so that the depth of resin adhesion on the highly uneven side surface, which occurs in the case of vertical immersion as described above, is shallower. Although the difference in resin adhesion depth between the front and back surfaces disappears, the air 8 rising from below the fluidized bed
The projected area is such that the highly uneven side faces the front surface, and the air 8
As the collision becomes more intense, the synthetic resin powder 7 blows up, and the synthetic resin powder 7 adheres to the lead part 4 in powder form and becomes dirty, or the lower end side of the unevenness, that is, the part between the board 2 and the component 3. Since the lower surface side of the mounting part protrudes like an eaves, a part of the air 8 that tries to rise will accumulate in the air pocket 9 portion on the lower surface side, causing a problem that many pinholes will be generated in the coating.

Further, the inclination angle of the main body 1 is a minute angle of 1 to several degrees, and the mounting posture of the main body 1 with respect to the chuck is adjusted such that the inclination angle is varied depending on the degree of unevenness and the number of parts 3 on the main body 1. The work was also extremely troublesome as it had to be changed and adjusted.

On the other hand, in the prior art Japanese Patent Publication No. 54-16978,
It is proposed to simultaneously vibrate the fluidized tank vertically and horizontally (back and forth). According to this, the synthetic resin powder in the fluidized tank is circulated diagonally up and down, but the vibration excitation device itself for giving vibration is at a collision angle of the synthetic resin powder in the diagonal direction with respect to the substrate 2 of the main body 1. It is extremely difficult to finely adjust the angle of impact, and the angle of oblique collision varies depending on the vibration.

The present invention aims to solve these problems.

[Means for solving problems]

In order to achieve the above object, the present invention vibrates the fluidized tank 6 with an open top surface up and down, and
Synthetic resin powder coating equipment for electronic components, in which the synthetic resin powder 7 in the tank is made into a fluid by air 8 blown up from the bottom of the tank, and the liquid is immersed into the main body 1 of the electronic component with the board 2 suspended vertically. , an elevating guide mechanism 13 for vertically movably supporting the fluidizing tank 6 with an appropriate slope angle with respect to the vertical direction;
a pair of parallel links 15 and 16 rotatably connected to the fluidization tank 6; and a lifting drive means 17 for raising and lowering the fluidization tank 6 in order to immerse the main body 1 of the electronic component in the synthetic resin powder 7. The middle part of the pair of parallel links 15 and 16 is fixed to the base 1.
8, while the pair of parallel links 15 and 16 are linked with an angle adjusting means 19 for integrally changing the inclination angle of these axes. be.

[Effect]

According to this configuration, the fluidized tank 6 vibrates vertically from diagonally downward to upward and in the opposite direction while the upper surface of the fluidized bed of synthetic resin powder 7 remains horizontal. The upper surface of the fluidized bed of the synthetic resin powder 7 intersects the substrate 2 of the suspended electronic component main body 1 at right angles, and the synthetic resin powder 7 is placed on the side surface of the main body 1 with large irregularities. Since the fluidized bed contacts with a relative projected area, both the front and back sides of the base of the main body 1 and the lead part 4 can be immersed and adhered to the synthetic resin powder 7 to approximately the same depth, which reduces coating variation. does not occur.

Moreover, since the upward flow of the blown air 8 from the bottom of the fluidized tank is parallel to the vertical direction of the substrate 2 in the main body 1, there are no air pockets where the air 8 accumulates on the lower end surface of the parts attached to the main body 1.
There are no pinholes.

Furthermore, since the board 2 of the main body 1 of the electronic component is suspended vertically, the adjustment in the vertical direction can be uniformly performed and is extremely simple. An elevating guide mechanism 13 for supporting the fluidizing tank 6 in a vertically movable manner at an appropriate inclination angle with respect to the vertical direction.
a pair of parallel links 15 and 16 rotatably connected to the fluidization tank 6; and a lifting drive means for raising and lowering the fluidization tank 6 in order to immerse the main body 1 of the electronic component in the synthetic resin powder 7. 17, and the pair of parallel links 15, 16 are rotatably and slidably supported with respect to a fixed position base 18, while the pair of parallel links 15, 16 are Since the angle adjustment means 19 for integrally changing the inclination angle of the axis line is linked,
The operator can arbitrarily increase or decrease the inclination angle of the links 15 and 16 with respect to the vertical, depending on the shape of the unevenness of the electronic component.

〔Example〕

Next, an embodiment of the present invention will be described. FIG. 1 is a side sectional view of the device of the present invention, in which a filter 12 with a large number of pores 30 is stretched near the bottom of a fluidized tank 6 with an open top. It is configured to blow air 8 upward from the outside, contains synthetic resin powder 7 above the filter 12, and above the fluidization tank 6 is provided with a hanging body 10 so as to be horizontally movable. do. The hanging body 10 is attached to the lower end of the main body 1 while holding the lead part 4 of the electronic component. The parts 3 are hung so that the side surfaces, which become more uneven when attached, face in the same direction, so as to face the upper surface of the synthetic resin powder 7.

Reference numeral 13 denotes an elevating guide that guides and supports the fluidizing tank 6 vertically and at an appropriate slight inclination angle (θ2) so as to be able to rise and fall so as to approach the uneven side surface of the main body 1 of the object from below. The lifting guide mechanism 13 includes a pair of parallel links 15 and 16 which are pivotally connected to the support table 11 on the lower surface of the fluidizing tank 6 with pins 14 and 14 separated from each other by an appropriate distance (l1), and the synthetic resin powder. The fluidizing tank 6 is moved up and down in order to immerse the main body 1 of the electronic component in the body 7. The pair of parallel links 15 and 16 are extended downward, and both links 15 and 16 are inserted into the insertion holes 20 and 2 of the base 18 located below the fluidization tank 6.
An angle adjusting means 19 for integrally changing the inclination angle of the axes of 0 and both links 15 and 16, for example, an insertion hole 21 of an angle adjusting rod supported at a lower position of the base 18 so as to be horizontally movable left and right. , 21. Then, pins 26, 26 are attached to a pair of brackets 24, 24, which are fixed to the base 18 at a distance (l1) between the bushes 22, 22, which are slidably fitted into the middle portions of both the links 15, 16. The links 15 and 16 are rotatably connected via the
Bushes 23, 2 that are slidably fitted in the middle part of the
A pair of brackets 2 are fixed to the angle adjusting means 19 such as the angle adjusting rod at a left-right distance (l1).
5 and 25 via pins 27 and 27 so as to be rotatable.

The roller at the upper end of the piston rod of the air cylinder in the lifting drive means 17 mounted on the base 18 is slidably in contact with the lower surface of the support table 11, so that the base 18 and, by extension, the fluidizing tank 6 can be vertically maintained while remaining horizontal. It is configured to move up and down largely along a direction that is inclined at an appropriate angle (θ2) with respect to the direction.

Furthermore, the fluidization tank 6 is provided with a vibration-proof rubber 2 on the base 18.
8 and 28, and is configured to be vertically vibrated by vibrators 29 and 29 attached to the lower surface of the fluidized tank.

In this configuration, as shown in FIG. 1, the lead part 4 of the electronic component is held between the hanging body 10, the board 2 of the main body 1 is oriented vertically, and the side of the main body 1 from which the component 3 protrudes is oriented to the left. Hang it like this. At this time, the main body 1 is heated in advance so that the synthetic resin powder 7 such as thermoplastic synthetic resin can be attached thereto.

Next, the angle adjusting means 19 is appropriately moved to the left or right so that the axes of both the left and right links 15, 16 are inclined to the right by an angle (θ2) of 1 degree to several degrees with respect to the vertical line 31. Fix it.

Furthermore, the vibrators 29 and 29 are driven while feeding the air 8 into the fluidized tank 6 to form the synthetic resin powder 7 in the fluidized tank 6 into a fluidized layer, and the piston rod of the air cylinder in the lifting drive means 17 is , and raise the fluidized tank 6 along with the support table 11, so that the upper surface of the synthetic resin powder 7 in the fluidized tank 6 reaches the base of the main body 1 and the lead part 4 below the hanging body 10. (See the dashed line in FIG. 1 and FIG. 2).

In this state, after continuing the blowing out of the air 8 and the vertical vibration by the vibrators 29, 29 for an appropriate period of time, the piston rod of the air cylinder in the elevating drive means 17 is retracted to lower the fluidizing tank 6. The main body 1 in is coated with synthetic resin.

When the main body 1 is immersed in the fluidized bed of the synthetic resin powder 7, the horizontal upper surface of the fluidized bed is perpendicular to the vertical direction of the substrate 2 of the main body 1. Both sides will be immersed in the fluidized bed to approximately the same depth, and
Due to the vertical vibration caused by the vibrators 29, 29, the upper surface of the fluidized bed of the fluidized tank 6 and the synthetic resin powder 7 inside thereof vibrates vertically in an oblique direction (arrow A in Fig. 2) at an angle (θ2) while remaining horizontal. Since the synthetic resin powder 7 comes into contact with the highly uneven side surface of the main body 1 immersed in this fluidized bed with a relative projected area of the angle (θ2), the part 3 is placed above the highly uneven side surface. The synthetic resin powder 7 is also spread around the sides, and the synthetic resin can be coated on both the front and back sides of the main body 1 to the same depth of the lead part 4, so that there are no uneven gaps.

Moreover, since the direction of the air 8 blowing up from below and the vertical direction of the substrate 2 are approximately parallel,
Air pockets are hardly formed between the lower surface of the component 3 projecting laterally from the substrate 2 and the substrate 2, and therefore air 8 is not accumulated in that part, so that pinholes are not generated in the finished coating.

When painting different types of electronic parts, the angle adjusting means 19 is adjusted so that the optimum painting can be done according to the size and degree of protrusion of the parts 3 attached to the board 2.
The inclination angle (θ2) of both the left and right links 15 and 16 may be changed and fixed by adjusting the movement to the left or right as appropriate.

[Effect of idea]

In summary, according to the present invention, the horizontal upper surface of the fluidized bed of synthetic resin powder 7 in the fluidized tank 6 and the substrate 2 in the vertically suspended main body 1 intersect at right angles, and the fluidized tank 6 , the upper surface of the fluidized bed of synthetic resin powder 7 inside it remains horizontal and vibrates vertically from diagonally downward, upward and in the opposite direction, so that Since the fluidized bed of the synthetic resin powder 7 contacts with a relative projected area, the synthetic resin powder 7 is well spread around the upper side of the side surface with large irregularities, and therefore, the main body 1 and the lead part are 4, both the front and back surfaces can be immersed and adhered to the synthetic resin powder 7 to approximately the same depth, so there is no variation in coating.

Moreover, since the upward flow of air 8 from the bottom of the fluidized tank is parallel to the vertical direction of the board 2 of the main body, there is no air pocket where air 8 accumulates on the lower end surface of the parts attached to the main body, and pins are attached to the painted parts. There are no holes.

Furthermore, since the pair of parallel links 15 and 16 in the elevating guide mechanism 13 can reliably define the inclination elevating angle of the fluidizing tank 6, the above-mentioned variation in coating does not occur. Moreover, the angle adjustment means 19
The inclination angle can be changed and adjusted by moving the pair of parallel links 15 and 16 together in the horizontal direction, so that the work of adjusting minute angles is also simple and stable. There is. The inclination angle, which should be changed according to the shape of the electronic component, in other words, the size of the component and the degree of unevenness in the main body, can be adjusted by simply moving and adjusting the links 15 and 16 in the elevating guide mechanism 13. Compared to the conventional work in which the bodies of many small electronic parts are tilted at a slight angle each time they are attached to a hanging body for painting work, the work of adjusting the small angle is extremely simple, and The effect is that complete powder coating can be easily performed depending on the shape, in other words, the size and degree of unevenness of the parts in the main body.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of the device of the present invention, Fig. 2 is an enlarged side sectional view of the main part of Fig. 1, Fig. 3 is a perspective view of electronic components, and Fig. 4 is a cross section taken along the line - Figure, 5th
The figure is an enlarged side sectional view of the main part of a conventional device. 1... Main body, 2... Board, 3... Parts, 4...
Lead part, 6...Fluidized tank, 7...Synthetic resin powder,
8... Air, 10... Hanging body, 11... Support table, 12... Filter, 13... Lifting guide mechanism, 15, 16... Parallel link, 17... Lifting drive means, 18... Base , 19... Angle adjustment means, 28... Anti-vibration rubber, 29... Vibrator.

Claims (1)

[Scope of utility model registration request] The main body of the electronic component is made by vertically vibrating a fluidized tank 6 with an open top surface, and fluidizes the synthetic resin powder 7 in the fluidized tank 6 with air 8 blown up from the bottom of the tank, with the board 2 suspended vertically. In a synthetic resin powder coating apparatus for electronic components, the lifting guide mechanism 13 for vertically movably supporting the fluidized tank 6 at an appropriate inclination angle with respect to the vertical direction is installed in the fluidized tank. 6, a pair of parallel links 15, 16 rotatably connected to the fluid tank 6, and an elevating drive means 17 for elevating and lowering the fluidizing tank 6 to immerse the main body 1 of the electronic component in the synthetic resin powder 7, The middle portions of the pair of parallel links 15 and 16 are rotatably and slidably supported with respect to a fixed position base 18, while the pair of parallel links 15 and 16 are provided with an angle of inclination of these axes. A synthetic resin powder coating apparatus for electronic parts, characterized in that an angle adjusting means 19 is linked for integrally changing the angle.